Heat conduction tool, heat conduction device and single crystal furnace

Abstract

The utility model provides a heat conduction tool, a heat conduction device and a single crystal furnace. The heat conduction tool comprises a bracket and at least one heat conduction assembly, the support is of an annular or polygonal structure, the heat conduction assembly is connected with the support, and at least part of the heat conduction assembly is located on the inner side of the annular or polygonal structure of the support. The heat conduction assemblies are arranged on the inner side of the support, the manufacturing cost is reduced, meanwhile, the multiple split heat conduction assemblies are convenient to mount and dismount, and when a single heat conduction assembly is damaged, the single heat conduction assembly can be replaced in time.

Description

Technical Field

[0001] The utility model relates to the technical field of tooling, in particular to a heat conduction tooling, a heat conduction device and a single crystal furnace. Background Art

[0002] At present, heat conduction tooling is needed in many industrial productions, especially heat conduction tooling with low manufacturing or maintenance costs. For example, or especially in the photovoltaic industry, single crystal silicon is the raw material for manufacturing most solar cells. With the increase in product demand in the photovoltaic market, the demand for single crystal silicon has increased accordingly. Therefore, the capacity improvement of single crystal silicon has received extensive attention from crystal pulling manufacturers. Currently, single crystal silicon is mostly produced by a single crystal furnace. A single crystal furnace is a device that melts polycrystalline materials such as polysilicon with a graphite heater in an inert gas environment and grows dislocation-free single crystals by the Czochralski method. During the pulling and growth process of a single crystal silicon rod, it is necessary to continuously dissipate heat from the single crystal silicon rod to increase the temperature gradient of the single crystal silicon rod during growth, thereby ensuring the growth rate. In traditional single crystal furnaces, the commonly used heat conduction method is to use a water-cooled screen installed in the furnace to dissipate heat from the single crystal silicon rod. However, this heat dissipation method is non-contact heat dissipation. Since the specific heat capacity of the inert gas in the furnace is relatively low, the heat dissipation efficiency is also relatively low. Summary of the Utility Model

[0003] The utility model provides a heat conduction tooling, a heat conduction device and a single crystal furnace, which can solve the problems of cumbersome manufacturing, maintenance, difficult replacement and high cost of the current heat conduction tooling.

[0004] The utility model provides a heat conduction tooling, including a bracket and at least one heat conduction component; the bracket is in a ring-shaped or polygonal structure, the heat conduction component is connected to the bracket, and at least part of the heat conduction component is located inside the ring-shaped or polygonal structure bracket.

[0005] Specifically, taking the inside and outside of the ring-shaped or polygonal structure of the bracket as the reference directions, the heat conduction component is arranged on the bracket. When the heat conduction component is damaged, it is easy to disassemble from the bracket, so as to facilitate replacement and solve the problem of high maintenance cost.

[0006] It should be noted that when multiple heat conduction components are arranged on the bracket, multiple split heat conduction parts are more convenient for installation and disassembly.

[0007] The utility model further provides a heat conduction device, including the heat conduction tooling; the heat conduction device and the heat conduction tooling are located in a container. The part of the heat conduction component inside the bracket is used to contact the component to be heat-conducted located inside the bracket, and the part of the heat conduction component located outside the bracket is used to contact the inner wall of the container. Heat is diffused to the external environment through the inner wall of the container to achieve heat dissipation of the component to be heat-conducted.

[0008] An embodiment of the present utility model also provides a single crystal furnace, which includes a furnace body and the heat conduction tooling in the above embodiment. The furnace body has a furnace chamber for growing single crystal rods. The heat conduction tooling is arranged in the furnace chamber. The axial direction of the bracket is parallel to the axial direction of the furnace body. The part of the heat conduction component located inside the bracket is used to contact the surface of the single crystal rod, and the part of the heat conduction component located outside the bracket is used to contact the inner wall of the furnace body or the water-cooled heat dissipation structure in the furnace body. During the crystal pulling process, after the single crystal rod contacts the heat conduction component, the heat of the single crystal rod can be conducted to the heat conduction component. The heat conduction component conducts the heat to the single crystal furnace and diffuses it to the external environment through the furnace wall, so as to quickly realize the heat dissipation and cooling of the single crystal rod. In addition, the heat conduction component also contacts the single crystal rod along the circumferential direction of the single crystal rod at the same time, expanding the contact area and improving the heat dissipation uniformity.

[0009] The heat conduction tooling provided by the embodiment of the present utility model sets the heat conduction component on a ring-shaped or polygonal structure bracket, which reduces the material cost and improves the convenience of manufacturing, installation and maintenance. In a preferred embodiment, multiple heat conduction components or heat conduction parts are convenient for installation and disassembly. When a single heat conduction component or heat conduction part is damaged, it can be replaced in time. The working principle and advantages of the heat conduction tooling conceived in this application in the process of photovoltaic crystal pulling are as follows: The single crystal rod formed by crystal pulling rises through the bracket of the heat conduction tooling. The heat conduction component arranged on the bracket contacts the silicon rod. The heat of the single crystal rod can be conducted to the heat conduction component. The heat conduction component diffuses the heat to the external environment through the contacted single crystal furnace wall in the form of heat conduction, so as to quickly realize the heat dissipation and cooling of the single crystal rod, change the temperature gradient of the single crystal rod, further reduce the temperature of the solid-liquid interface, and improve the crystal growth rate. During the above-mentioned silicon rod pulling process, a driving member can be introduced to drive the heat conduction tooling to move in the same or opposite direction according to the rotation speed of the silicon rod to cooperate with the smooth progress of the silicon rod pulling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments of the present utility model will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0011] Figure 1 FIG. shows the structural schematic diagram of the heat conduction tooling provided by the embodiment of the present utility model;

[0012] Figure 2 FIG. shows the structural schematic diagram of a heat conduction component in the embodiment of the present utility model;

[0013] Figure 3Shows a schematic structural diagram of another heat conduction component in an embodiment of the present utility model;

[0014] Figure 4 Shows a schematic structural diagram of a single crystal furnace provided by an embodiment of the present utility model;

[0015] Figure 5 Shows an embodiment of the present utility model Figure 4 Schematic diagram along direction A;

[0016] Figure 6 Shows an embodiment of the present utility model Figure 4 Schematic diagram along direction B;

[0017] Figure 7 Shows a schematic diagram of the internal structure of a single crystal furnace in an embodiment of the present utility model.

[0018] Explanation of reference numerals:

[0019] 1 - Bracket, 11 - Protrusion, 2 - Heat conduction component, 21 - Heat conduction element, 211 - First heat conduction part, 212 - Second heat conduction part, 21a - First heat conduction element, 21b - Second heat conduction element, 22 - Connection structure, 221 - Support member, 222 - Connecting member, 2221 - Groove, 23 - Limiting member, 231 - Limiting protrusion, 24 - Mounting hole, 3 - Furnace body, 31 - Main chamber of the furnace body, 311 - Throat of the main chamber, 32 - Auxiliary chamber of the furnace body, 41 - Outer stator, 42 - Inner rotor, 5 - Single crystal rod, 6 - Lifting member. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the protection scope of the present utility model.

[0021] The present utility model provides a heat conduction tooling, including a bracket 1 and at least one heat conduction component 2; the bracket 1 is in a ring or polygon structure, the heat conduction component 2 is connected to the bracket 1, and at least part of the heat conduction component 2 is located inside the ring structure or polygon structure bracket 1. Within the technical solution concept of this heat conduction tooling, the bracket 1 can be a closed ring structure or polygon structure, or a non - closed ring - like structure formed by one or more arcs, or a non - closed polygon structure composed of multiple sides. The inside of the bracket 1 is hollow, and the height of the bracket 1 in the longitudinal direction can be freely set, preferably a flat - type structure with a smaller height. In a preferred embodiment, the bracket 1 is in a flat - type ring - shaped closed structure, and the bracket 1 is made of a hard material that is not easily bent and deformed.

[0022] Referring to Figure 1 , taking the bracket 1 as an example of a ring structure, with the inside and outside of the ring structure as the reference directions, the heat conduction component 2 is arranged on the bracket of the ring structure. When the heat conduction component 2 is damaged, it is easy to disassemble from the ring structure, thus facilitating replacement and solving the problem of high maintenance cost.

[0023] In some embodiments, the heat conduction component 2 can be formed by assembling multiple components with heat conduction performance into one body or directly manufacturing multiple components with heat conduction performance integrally.

[0024] In some alternative embodiments, referring to Figure 1 , specifically, the heat conduction component 2 can also be at least two or more independent components arranged on the bracket 1. This split deployment method is more convenient for installation and disassembly. Based on this embodiment, the preferred solution is that two heat conduction components 2 are arranged at intervals along the circumferential direction of the bracket 1. Compared with the form of an integral ring-shaped heat conduction component or the form where multiple heat conduction components are connected end to end, it reduces the material cost and is convenient for installation and disassembly.

[0025] In alternative embodiments, referring to Figures 1 to 2 , the heat conduction component 2 can include a heat conduction member 21, and the heat conduction member 21 extends along the axial direction Z of the bracket. In some alternative embodiments, it can be connected to the bracket 1 through a connection structure 22. The heat conduction member 21 of the present application is preferably made of a material with good heat conduction performance and good wear resistance, and can include but is not limited to carbon-carbon material, graphite material or silicone grease material.

[0026] Referring to Figure 2 , in some preferred embodiments, the heat conduction member 21 adopts a sheet-like structure or multiple filamentous structures, that is, the heat conduction member can be a fibrous filamentous structure or a fin structure. In the corresponding embodiments, the filaments in the fibrous filamentous structure are distributed along the axial direction Z of the bracket 1; the length of the fin structure also extends along the axial direction Z of the bracket 1. In comparison, the fin structure has greater strength and stiffness, while the fibrous filamentous structure has stronger heat conduction performance.

[0027] Referring to Figure 3 , in some alternative embodiments, the heat conduction member 21 has a filamentous structure, and the length direction of the filamentous structure is along the radial direction of the mounting member. Specifically, the heat conduction member 21 has a filamentous structure, including but not limited to a fibrous filamentous structure or a single filamentous structure.

[0028] Referring to Figures 1 to 2In some optional embodiments, at least two heat-conducting members 21 are spaced apart along the axial direction of the bracket 1, i.e., the Z direction. There is a gap between two adjacent heat-conducting members 21 in the same heat-conducting component 2. The number of heat-conducting members 21 in the heat-conducting component 2 can be set to two, three or more. Those skilled in the art can reasonably set the number of heat-conducting members 21 in the heat-conducting component 2 according to factors such as heat conduction requirements and processing costs. Based on this embodiment, refer to Figure 1 At least two heat conducting members 21 are spaced apart or symmetrically distributed above and below the bracket, that is, in the axial Z direction of the bracket.

[0029] In some embodiments based on the above embodiments or in the present application, refer to the attached Figures 1 to 2 , taking the inside and outside of the annular structure of the bracket 1 as reference directions, the heat conducting member 21 includes a first heat conducting portion 211 and a second heat conducting portion 212; the first heat conducting portion 211 is located inside the bracket 1, and the second heat conducting portion 212 is located outside the bracket 1. When the heat conducting member contacts the first heat conducting portion 211, the heat is conducted to the second heat conducting portion 212, and then discharged by the second heat conducting portion 212.

[0030] Reference Figures 1 to 2 In some optional embodiments, the heat-conducting tooling further includes a connecting structure 22, which connects the heat-conducting component to the bracket. The connecting structure 22 connects the heat-conducting component 21 to the bracket 1 and plays a role in fixing and supporting the heat-conducting component 21.

[0031] On the basis of the above embodiment, the connection structure 22 can be arranged on the bracket or the heat-conducting component. The connection structure can be an integral structure or a split structure composed of at least two connecting parts. A person skilled in the art can select a split structure composed of two, three or more connecting parts according to the processing cost and structural strength requirements. The integral structure has greater strength and rigidity, but is not convenient for disassembly and maintenance. The split structure is more convenient for disassembling the heat-conducting component 21 from the bracket 1 for maintenance and replacement.

[0032] Reference Figures 1 to 2 In some optional embodiments, the heat conducting tooling includes a support member 221 . The support member 221 extends along the axial direction of the bracket 1 ; the first heat conducting portion 211 is connected to one side of the support member 221 , and the second heat conducting portion 212 is connected to the other side of the support member 221 .

[0033] Based on the above embodiment, the support member 221 serves as a supporting structure of the heat conducting member 21, and the heat conducting member 21 is installed on the bracket 1, wherein the first heat conducting portion 211 is connected to one side of the support member 221 and is located on the inner side of the bracket 1, and the second heat conducting portion 212 is connected to the other side of the support member 221 and is located on the outer side of the bracket 1.

[0034] Reference Figures 1 to 2, in some alternative embodiments, the connection structure 22 further includes a connecting member 222; one end of the connecting member 222 is connected to the support member 221, the other end of the connecting member 222 is connected to the bracket 1, and the extending direction of the connecting member 222 intersects with the extending direction of the support member 221. The connecting member 222 can be disposed on the annular bracket 1 to connect the heat conduction assembly 2 to the annular bracket 1.

[0035] Based on the above embodiments, the connection structure 22 is a split structure, composed of the support member 221 and the connecting member 222. Refer to Figures 1 to 3 , one end of the connecting member 222 is connected to the support member 221, the other end of the connecting member 222 is connected to the bracket 1, and the extending direction of the connecting member 222 intersects with the extending direction of the support member 221. In some specific embodiments, the connecting member 222 is located between at least two adjacent heat conduction members 21, and the connecting member 222 is in a plate shape or a strip shape. Combining Figure 1 with the schematic illustration, one end of the connecting member 222 is connected to the support member 221, and the other end is connected to the bracket 1, fixing the entire heat conduction assembly 2 to the bracket 1. The connection methods that can be adopted between the connecting member 222 and the support member 221, and between the connecting member 222 and the bracket 1 include but are not limited to riveting, screwing or mechanical connection. Exemplarily, in this embodiment, a screwing method is adopted to fix between the connecting member 222 and the support member 221. By passing a screw through the mounting hole 24, the connecting member 222 and the support member 221 are fixed. And a combination of screwing and mortise and tenon connection is adopted to fix the connecting member 222 and the bracket 1. The extending direction of the connecting member 222 intersects with the extending direction Z of the support member 221, and the included angle formed therebetween can be 60°, 70°, 80° or 90°. In a specific embodiment, the length direction of the connecting member 222 can be set along the X direction, that is, the extending direction of the connecting member 222 is perpendicular to the extending direction of the support member 221, which is convenient for effectively utilizing the installation space.

[0036] In this embodiment, the connecting member 222 can be made of a material with good strength and stiffness properties and having a certain heat conduction performance. For example, it can be ferrous alloy or carbon steel. The support member 221 is used to support and connect a plurality of heat conduction members 21, and at the same time conduct heat between different heat conduction members 21. It needs to have a certain heat conductivity while having strong strength and stiffness properties. The support member 221 can be integrally formed with the heat conduction member using the same material as the heat conduction member, or made of ferrous alloy or carbon steel material.

[0037] Based on the above embodiments, the heat conduction tooling in some embodiments may further include at least one limiting member 23. Optionally, the limiting member 23 is disposed on the heat conduction assembly 2. Refer to the attached Figure 2, both ends of the limiting member 23 are provided with limiting protrusions 231. The limiting member 23 is connected to the support member 221, so that the heat conduction assembly 2 or the heat conduction member 21 is connected between the limiting protrusions 231 at both ends of the limiting member 23. In a specific solution of this embodiment, the extending direction of the limiting member 23 is along the Z direction, and the limiting member 23 is connected to the support member 221. The connection methods include but are not limited to riveting, screwing or mechanical connection. The end of the limiting member 23 has a clamping groove to fix the support member 221. Both ends of the limiting member 23 can be provided with limiting protrusions 231. After connecting the limiting member 23 and the support member 221, the heat conduction assembly 2 or the heat conduction member 21 is clamped and fixed between the limiting protrusions 231 at both ends of the limiting member 23, avoiding the shaking displacement of the heat conduction member 21 during the heat conduction process. Exemplarily, in an embodiment provided with two heat conduction members 21, each heat conduction member 21 can be correspondingly provided with a limiting member 23.

[0038] Based on the above embodiments, as shown in the appendix Figure 1 , in some embodiments, at least two protrusions 11 are circumferentially arranged on the upper surface of the bracket 1 along the Z direction. The number of the protrusions 11 is the same as the number of the heat conduction assemblies 2, that is, each protrusion 11 is fixedly connected to a heat conduction assembly 2. A groove 2221 is arranged at the lower part of the connecting member 222 along the Z direction. The groove 2221 embeds the connecting member on the protrusion 11, so that the connecting member 222 is fixed to the bracket 1. In this way, the groove 2221 and the protrusion 11 form a mortise and tenon plug-in fixing structure, and cooperate with screws inserted in the mounting holes 24 to strengthen the reliability of the fixation between the connecting member 222 and the bracket 1, and can effectively fix and connect the heat conduction assembly 2 to the bracket 1. It should be noted that Figure 1 , in order to facilitate the distinction between the structures of the groove 2221 and the protrusion 11, the positions of the groove 2221 and the protrusion 11 are shown staggered. During the actual assembly process, the protrusion 11 is embedded in the groove 2221.

[0039] It should be noted that the present invention does not limit the field of the above heat conduction tooling. Those skilled in the art can make many form transformations to the heat conduction tooling of the present invention according to the characteristics of different heat conduction objects for adaptation, and these all belong to the protection scope of the heat conduction tooling scheme concept of the present invention.

[0040] The present application also discloses a heat conduction device including the heat conduction tooling of the above embodiments. The heat conduction device and the heat conduction tooling are located inside a container. The part inside the bracket 1 is used to contact the component to be heat-conducted located inside the bracket 1. The part of the heat conduction component 2 located outside the bracket 1 is used to contact the inside of the container, so as to conduct the heat of the component to be heat-conducted to the inner wall of the container through the heat conduction component, and realize the conduction of the heat of the component to be heat-conducted. In a preferred solution of this embodiment, the bracket 1 is an annular structure. In some embodiments, the heat conduction device may further include a driver, including but not limited to a motor or a matching motor, to drive the heat conduction tooling to perform rotational motion, helical motion, lifting motion, etc. around the component to be heat-conducted inside the container, which are coordinated with the motion mode of the heat-conducted component to improve the heat conduction efficiency of the component to be heat-conducted.

[0041] The present application also discloses a single crystal furnace applying the heat conduction tooling of the above embodiments. The single crystal furnace includes a furnace body 3 having a furnace chamber for growing a single crystal rod 5. The heat conduction tooling in the above embodiments is arranged inside the furnace chamber. The axial direction of the bracket 1 of the heat conduction tooling is parallel to the axial direction of the furnace body 3. The part of the heat conduction component 2 located inside the bracket 1 is used to contact the surface of the single crystal rod 5. The part of the heat conduction component 2 located outside the bracket 1 is used to contact the inner wall of the furnace body 3 or the water-cooled heat dissipation structure inside the furnace body 3. In the single crystal furnace disclosed in the present application, the bracket 1 of the heat conduction tooling is preferably an annular structure. In a specific embodiment, the heat conduction component 2 includes a heat conduction member 21. The heat conduction member 21 includes a first heat conduction portion 211 located inside the annular bracket 1 and a second heat conduction portion 212 located outside the annular bracket 1. The first heat conduction portion 211 is used to contact the surface of the single crystal rod 5. One end of the second heat conduction portion 212 can contact the inner wall of the furnace body 3, and the other end can contact the water-cooled heat dissipation structure inside the furnace body 3.

[0042] The effective drawing process of the silicon rod in the single crystal furnace provided in the embodiments of the present application is as follows: At the start of the silicon rod drawing or at a certain node, the driver can be used to adjust the heat conduction tooling of the embodiment to the target position. At the target position, the upper end of the silicon rod enters the hollow inside the bracket 1 of the heat conduction tooling and contacts the heat conduction component 2. During the silicon rod drawing process, the silicon rod passes through the hollow of the bracket 1 and contacts the heat conduction component 2, and the heat of the silicon rod is conducted to the heat conduction component. The heat conduction component conducts the heat to the single crystal furnace, and the furnace wall of the single crystal furnace diffuses the heat to the external environment, thereby realizing the heat dissipation and temperature reduction of the single crystal silicon rod. In some embodiments, during the silicon rod drawing process, a driver such as a motor can be used to drive the heat conduction tooling to perform synchronous motion with the same rotation speed and direction as the silicon rod.

[0043] Now, in combination with the accompanying drawings, the technical solution of the heat conduction of the silicon rod during the drawing process of the single crystal furnace by applying the heat conduction tooling disclosed in the above embodiments, and the single crystal furnace solution including the heat conduction device of the above embodiments will be introduced:

[0044] In some embodiments, as Figure 1 shown, the heat conduction tooling includes a bracket 1 and a heat conduction component 2. Preferably, the bracket 1 has an annular structure to match the shape of the furnace wall of the single crystal furnace. The outer diameter of the bracket 1 is smaller than the inner diameter of the furnace body 3 of the single crystal furnace, which facilitates the installation and fixation of the heat conduction tooling and enables the heat conduction component 2 to be in full contact with the furnace wall to enhance the heat conduction performance.

[0045] Each heat conduction component 2 can be evenly arranged in the circumferential direction of the bracket 1, which is convenient for processing and can ensure uniform heat conduction when the heat conduction component 2 contacts the single crystal rod 5. Exemplarily, in this embodiment, twenty-four heat conduction components 2 are provided, and the central angle formed between two adjacent heat conduction components 2 is 15°. The connection manner between the heat conduction component 2 and the bracket 1 includes but is not limited to riveting, screwing, bonding or mechanical connection, and this embodiment does not limit this. At least part of the heat conduction component 2 is located inside the annular structure of the bracket 1 so as to contact the single crystal rod 5 and transfer the heat of the single crystal rod 5 to the furnace wall of the single crystal furnace. Moreover, compared with the case where the heat conduction component 2 is completely arranged outside the bracket 1, the material cost is reduced.

[0046] In some embodiments, the heat conduction tooling is placed in the furnace body 3 of the single crystal furnace during the crystal pulling process. In the initial stage of crystal pulling, since the single crystal rod 5 is short, the single crystal rod 5 has not yet contacted the heat conduction component 2. As Figure 7 shown, as the crystal pulling process continues, the lifting member 6 gradually lifts, and the single crystal rod 5 gradually grows and contacts the heat conduction component 2. The part of the heat conduction component 2 located inside the annular structure of the bracket 1 abuts against the single crystal rod 5. The heat of the single crystal rod 5 is conducted to the heat conduction component 2, and the heat conduction component 2 conducts the heat to the furnace body 3 of the single crystal furnace by relying on its own fixed heat conduction method, and the furnace wall diffuses the heat to the external environment, thereby realizing the heat dissipation and temperature reduction of the single crystal rod 5. The lifting member 6 uses a lifting tungsten wire rope. In addition, since each heat conduction component 2 is arranged along the circumferential direction of the bracket 1, during the crystal pulling process, each heat conduction component 2 also contacts the single crystal rod 5 along the circumferential direction of the single crystal rod 5 at the same time, expanding the heat dissipation contact area and improving the heat dissipation uniformity, uniformly dissipating heat and reducing the temperature of the circumferential direction of the single crystal rod 5, which is beneficial to forming a temperature gradient in the axial direction of the single crystal rod 5 and ensuring the crystal growth rate.

[0047] When the heat conduction tooling provided by the embodiment of the present utility model is placed in the furnace body 3 of the single crystal furnace during the crystal pulling process, the part of the heat conduction component 2 located inside the annular structure of the support 1 abuts against the single crystal rod 5, and the heat of the single crystal rod 5 is conducted to the heat conduction component 2. The heat conduction component 2 conducts the heat to the furnace body 3 of the single crystal furnace by means of its own heat conduction, and the furnace wall diffuses the heat to the external environment, thereby realizing the heat dissipation and temperature reduction of the single crystal rod 5. Moreover, the heat conduction component 2 is distributed along the circumferential direction of the single crystal rod 5 and contacts the single crystal rod 5 simultaneously, expanding the heat dissipation contact area, improving the heat dissipation uniformity, ensuring the heat dissipation effect, and avoiding the phenomenon that the growth rate of the single crystal rod 5 is slow due to too high temperature. That is, by means of contact heat dissipation and temperature reduction, the temperature gradient of the single crystal rod 5 is changed, the temperature of the solid-liquid interface is further reduced, and the growth rate of the single crystal rod 5 is increased. And at least part of the heat conduction component 2 is located inside the annular structure, reducing the material cost. At the same time, the multiple split heat conduction components 2 are convenient for installation and disassembly. When a single heat conduction component is damaged, it can be replaced in time, reducing the maintenance cost.

[0048] Specifically, Figure 2 and Figure 3 shows the structure of a single heat conduction component 2. Each heat conduction component 2 includes a support 221 and a heat conduction member 21. Combining Figures 4 to 7 as shown, the support 221 is a long strip structure, and its extending direction, that is, the length direction, is along the Z direction, and the Z direction is the axis of the furnace body 3, that is, the growth direction of the single crystal rod 5. The heat conduction member 21 is connected to the support 221. The heat conduction member 21 is used for contacting the single crystal rod 5 to conduct heat, and the support 221 is used for supporting and fixing the heat conduction member 21. The inner side of the heat conduction member 21 is used for contacting the single crystal rod 5, and the outer sides of the heat conduction members 21 are used for contacting the inner wall of the furnace body 3 or the water-cooled heat dissipation mechanism fixed on the inner wall of the furnace body 3, so that during the crystal pulling process, the heat generated on the surface of the single crystal rod 5 is conducted to the inner wall of the furnace body 3, and the furnace wall diffuses the heat to the external environment.

[0049] Optionally, referring to Figures 1 to 3 , the heat conduction component 2 includes a heat conduction member 21, and the heat conduction member 21 extends along the axial direction of the support 1; when there are at least two heat conduction members 21, at least two heat conduction members 21 are distributed separately above and below the support 1.

[0050] Specifically, at least two heat conducting members 21 are distributed at intervals along the axial direction of the bracket 1, i.e., the Z direction. There is a gap between two adjacent heat conducting members 21 within the same heat conducting assembly 2. The number of heat conducting members 21 in a single heat conducting assembly 2 can be set to two, three or more. Those skilled in the art can reasonably set the number of heat conducting members 21 in a single heat conducting assembly 2 according to factors such as the heat conduction requirements of the single crystal silicon rod 5 and processing costs. Taking the inside and outside of the annular structure of the bracket 1 as the reference directions, at least two spaced-apart heat conducting members 21 are provided. On the one hand, the contact range with the single crystal silicon rod 5 is expanded. On the other hand, compared with the heat conducting member of a cylindrical structure, the material cost is reduced. At the same time, the multiple split heat conducting members 21 are more convenient for installation and disassembly.

[0051] In addition, the support member 221, the heat conducting member 21 and the bracket 1 can be made of different materials. Among them, the heat conducting member 21 needs to be in direct contact with the single crystal silicon rod 5 and use its good heat conduction performance to conduct heat to the single crystal furnace wall. Therefore, materials with good heat conduction performance and good wear resistance are selected, including but not limited to carbon-carbon materials, graphite materials or silicone grease. The support member 221 is used to support and connect multiple heat conducting members 21 and conduct heat between different heat conducting members 21 at the same time. It needs to have a certain heat conductivity while having strong strength and stiffness performance. The support member 221 can be integrally formed with the heat conducting member using the same material as the heat conducting member, or made of iron-carbon alloy or carbon steel. The bracket 1 is used to connect multiple heat conducting assemblies 2 and is fixedly connected to the furnace body. Therefore, the bracket 1 needs to be made of materials with good strength and stiffness performance, and can also have a certain heat conductivity. However, this embodiment does not make a limitation in this regard. Exemplarily, the materials that the bracket 1 can adopt include but are not limited to iron-carbon alloy or carbon steel.

[0052] Specifically, as Figures 1 to 7 shown, two heat conducting members 21 are arranged along the Z direction on each heat conducting assembly 2 in this embodiment, which are the first heat conducting member 21a and the second heat conducting member 21b respectively. Among them, the first heat conducting member 21a is located above the connecting member 222, and the second heat conducting member 21b is located below the connecting member 222. When the heat conducting device is placed in the furnace body of the single crystal furnace for the crystal pulling process, the inner side of the second heat conducting member 21b is in direct contact with the single crystal silicon rod 5, the outer side of the second heat conducting member 21b is in contact with the water-cooled heat dissipation structure in the furnace body 3, the inner side of the first heat conducting member 21a is in direct contact with the single crystal silicon rod 5, and the outer side of the first heat conducting member 21a is in contact with the inner wall of the furnace body 3. For the first heat conducting member 21a, the heat on the surface of the single crystal silicon rod 5 is conducted by the first heat conducting member 21a to the inner wall of the furnace body 3. For the second heat conducting member 21b, the heat on the surface of the single crystal silicon rod 5 is conducted by the second heat conducting member 21b to the water-cooled heat dissipation structure in the furnace body 3. And the heat can be conducted between different heat conducting members 21 through the support member 221. At the same time, the heat can be conducted between different heat conducting assemblies 2 through the bracket 1.

[0053] Optionally, referring toFigure 2 and Figure 3 , the heat conduction component 2 further includes at least one limiting member 23; both ends of the limiting member 23 are provided with limiting protrusions 231, and the limiting member 23 is connected to the support member 221, so that at least one heat conduction member 21 is connected between the limiting protrusions 231 at both ends of the limiting member 23.

[0054] Specifically, as Figure 2 and Figure 3 shown, the extending direction of the limiting member 23 is along the Z direction, and the limiting member 23 is connected to the support member 221. The connection methods include but are not limited to riveting, screwing or mechanical connection. The end of the limiting member 23 has a card slot to fix the support member 221. And both ends of the limiting member 23 are provided with limiting protrusions 231. After connecting the limiting member 23 and the support member 221, at least one heat conduction member 21 is clamped and fixed between the limiting protrusions 231 at both ends of the limiting member 23, avoiding the shaking displacement of the heat conduction member 21 during the crystal pulling process. Exemplarily, in this embodiment, since two heat conduction members 21 are provided, each heat conduction member 21 is correspondingly provided with a limiting member 23.

[0055] Referring to Figures 4 to 7 , an embodiment of the present invention further provides a single crystal furnace, including a furnace body 3 and the heat conduction tooling described in any one of the above embodiments; the furnace body 3 has a furnace chamber for growing a single crystal rod 5, the heat conduction tooling is arranged in the furnace chamber, the axial direction of the bracket 1 is parallel to the axial direction of the furnace body 3, and the heat conduction component 2 is in contact with the surface of the single crystal rod 5.

[0056] Specifically, as Figures 4 to 7 shown, the single crystal furnace is a crystal pulling device used in the manufacture of the single crystal rod 5. The single crystal raw material is arranged at the bottom of the furnace chamber. Under the action of the pulling member 6, a cylindrical single crystal rod 5 is gradually pulled. During the pulling and growing process of the single crystal rod 5, the single crystal rod 5 gradually contacts the heat conduction member 21, the heat of the single crystal rod 5 is conducted to the heat conduction member 21, the heat conduction member 21 conducts the heat to the furnace body 3 of the single crystal furnace, and the heat is diffused to the external environment by the furnace wall, thereby realizing the heat dissipation and temperature reduction of the single crystal rod 5. The axial direction of the bracket 1 is parallel to the axial direction of the furnace body 3, and the heat conduction members 21 of multiple heat conduction components 2 are distributed along the circumferential direction of the single crystal rod 5 and are in contact with and abutted against the single crystal rod 5.

[0057] Specifically, as Figure 7As shown in the figure, both the outer stator 41 and the inner rotor 42 are annular structures. The outer side of the outer stator 41 is fixedly connected to the furnace body 3, and the inner rotor 42 is embedded inside. The inner rotor 42 is rotatably connected to the outer stator 41. A bracket 1 is fixed inside the inner rotor 42. Driven by a water-cooled motor, the inner rotor 42 rotates relative to the furnace body 3 to drive the heat conduction component 2 to rotate relative to the furnace body 3. Since the single crystal silicon rod 5 rotates during the pulling and growth process, the rotation speed of the inner rotor 42 is the same as that of the single crystal silicon rod 5, so that the rotation speed of the heat conduction component 2 is the same as that of the single crystal silicon rod 5, avoiding the phenomenon of crystal arc or shaking of the single crystal silicon rod 5 due to uneven force when there is relative rotation between the heat conduction component 2 and the single crystal silicon rod 5, and reducing the contact wear between the single crystal silicon rod 5 and the heat conduction component 2.

[0058] Specifically, as Figure 7 shown, at least one of the outer stator 41 and the inner rotor 42 is provided with a water-cooled heat dissipation structure. During the crystal pulling process, when the outer side of the second heat conduction member 21b located at the lower part contacts the inner rotor 42, heat can be conducted to the water-cooled heat dissipation structure, improving the cooling and heat dissipation effect. In this embodiment, water-cooled channels are provided on both the outer stator 41 and the inner rotor 42.

[0059] Optionally, referring to Figure 7 , the furnace body 3 has a main furnace chamber 31 and a secondary furnace chamber 32; the main furnace chamber 31 and the secondary furnace chamber 32 are distributed along the axis of the furnace body 3. Specifically, as Figure 7 shown, the main furnace chamber 31 is used to form the single crystal silicon rod 5 and conduct the preliminary growth of the single crystal silicon rod 5. During the continuous growth process, the single crystal silicon rod 5 will extend into the secondary furnace chamber 32 for secondary growth. The outer stator 41 is arranged between the main furnace chamber 31 and the secondary furnace chamber 32 and is located at the upper end of the main chamber throat 311.

[0060] Specifically, as Figure 7 shown, during the crystal pulling process, the first heat conduction part 211 of the second heat conduction member 21b contacts the single crystal silicon rod 5, and the second heat conduction part 212 of the second heat conduction member 21b contacts the inner rotor 42. The heat on the surface of the single crystal silicon rod 5 is conducted by the second heat conduction member 21b to the inner wall of the inner rotor 42. The first heat conduction part 211 of the first heat conduction member 21a contacts the single crystal silicon rod 5, and the second heat conduction part 212 of the first heat conduction member 21a contacts the inner wall of the secondary furnace chamber 32. The heat on the surface of the single crystal silicon rod 5 is conducted by the first heat conduction member 21a to the inner wall of the secondary furnace chamber 32.

[0061] Specifically, the side wall of the secondary furnace chamber 32 is composed of an inner wall and an outer wall, and a cooling medium is filled between the inner wall and the outer wall. After the heat conducted by the first heat conduction member 21a is absorbed by the side wall of the secondary furnace chamber 32, the heat dissipation effect can be further improved.

[0062] It should be noted that in this text, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent in such a process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including such an element.

[0063] The embodiments of the present invention have been described above in conjunction with the accompanying drawings. However, the present invention is not limited to the above specific embodiments. The above specific embodiments are merely illustrative rather than restrictive. Under the inspiration of the present invention, those of ordinary skill in the art can also make many forms without departing from the spirit and scope protected by the claims of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A thermal conductive tooling, characterized in that: comprising a bracket and at least one heat conducting component; The bracket is in an annular or polygonal structure, the heat-conducting component is connected to the bracket, and the heat-conducting component is at least partially located on the inner side of the bracket.

2. The heat conducting tooling according to claim 1, characterized in that: The heat-conducting assembly includes a heat-conducting member, and the heat-conducting member extends along the axial direction of the bracket.

3. The heat conducting tooling according to claim 2, characterized in that: The heat-conducting assembly includes at least two heat-conducting parts, and the at least two heat-conducting parts are distributed at intervals on the upper and lower sides of the bracket.

4. The heat conducting tooling according to claim 2 or 3, characterized in that: The heat conducting member includes a first heat conducting portion and a second heat conducting portion; the first heat conducting portion is located inside the bracket, and the second heat conducting portion is located outside the bracket.

5. The heat conducting tooling according to claim 4, characterized in that: The at least two heat-conducting components are distributed at intervals along the circumference of the bracket.

6. The heat conducting tooling according to claim 4, characterized in that: The heat-conducting tooling also includes a connecting structure, which connects the heat-conducting component to the bracket.

7. The heat conducting tooling according to claim 6, characterized in that: The heat-conducting tooling includes a support member; The support member extends along the axial direction of the bracket; the first heat conducting portion is connected to one side of the support member, and the second heat conducting portion is connected to the other side of the support member.

8. The heat conducting tooling according to claim 7, characterized in that: The connection structure also includes a connection piece; One end of the connecting member is connected to the supporting member, and the other end of the connecting member is connected to the bracket. The extending direction of the connecting member intersects with the extending direction of the supporting member.

9. The heat conducting tooling according to claim 8, characterized in that: The bracket is provided with at least two protrusions along the circumferential direction; The connecting piece is provided with a groove, and the protrusion is embedded in the groove to fix the connecting piece and the bracket.

10. The heat conducting tooling according to claim 7 or 8, characterized in that: The heat conducting tooling further comprises at least one limiting member; Both ends of the limiting member are provided with limiting protrusions, and the limiting member is connected to the supporting member, so that the heat conducting member is connected between the limiting protrusions at both ends of the limiting member.

11. A heat conduction device, characterized in that: A heat-conducting tool comprising any one of claims 1 to 10; The portion of the heat-conducting component located on the inner side of the bracket is used to contact the component to be heat-conducted located in the bracket, and the portion of the heat-conducting component located on the outer side of the bracket is used to contact the inside of the container; wherein the heat-conducting device and the component to be heat-conducted are located in the container.

12. A single crystal furnace, characterized in that: It comprises a furnace body and the heat-conducting tooling according to any one of claims 1 to 10, wherein the furnace body has a furnace chamber, the furnace chamber is used for growing single crystal silicon rods, the heat-conducting tooling is arranged in the furnace chamber, the axial direction of the bracket is parallel to the axial direction of the furnace body, the part of the heat-conducting component located on the inner side of the bracket is used to contact the surface of the single crystal silicon rod, and the part of the heat-conducting component located on the outer side of the bracket is used to contact the inner wall of the furnace body or the water-cooling heat dissipation structure in the furnace body.

13. The single crystal furnace according to claim 12, characterized in that: The heat-conducting assembly includes a heat-conducting member, and the heat-conducting member includes a first heat-conducting portion located inside the bracket and a second heat-conducting portion located outside the bracket; The first heat conducting portion is used to contact the surface of the single crystal silicon rod; One end of the second heat conducting portion may be in contact with the inner wall of the furnace body, and the other end may be in contact with the water cooling and heat dissipation structure in the furnace body.

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