Wafer transmission detection jig
By designing a wafer transmission detection fixture for semiconductor film forming equipment, the problem of difficulty in accurately detecting the position deviation of the wafer transmission device in the prior art is solved, and the effect of improving detection efficiency and reducing errors is achieved.
Patent Information
- Application Number
- CN202422261296.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-14
AI Technical Summary
During maintenance of existing semiconductor film forming equipment, it is difficult to accurately detect the position deviation of the wafer transmission device, resulting in artificial errors and reference point errors, affecting the working efficiency of the machine.
A wafer transmission detection fixture is designed, including a fixture body and a detection channel. The detection channel extends in the first direction and penetrates the fixture body. It has two detection side walls arranged in parallel for detection of wafer position deviation as reference marks.
Through this detection fixture, the efficiency of wafer position deviation detection can be improved, human error and reference point error can be reduced, and the normal operation and efficient operation of the machine can be ensured.
Smart Images
Figure CN223037128U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, and particularly relates to a wafer transfer detection fixture. Background Art
[0002] When a semiconductor film forming device is maintained, it is necessary to detect the position deviation of the wafer transfer device to ensure that the transfer device accurately transports the wafer along the transfer path. This detection process mainly detects the position deviation of the wafer transfer during the conveying process. For example, during the wafer conveying process, the horizontal position deviation of the wafer can be detected in the horizontal direction to ensure that the deviation is within an appropriate range, so that during the wafer transfer process, the wafer will not interfere with other components due to excessive position deviation, and will not affect the normal operation of the machine tool, thereby improving the efficiency of the machine tool.
[0003] In the existing machine tool maintenance, usually a caliper is used to manually measure the height and left - right position of the wafer located in the Load Lock chamber (a load lock chamber located on the common path with a static and cooling function). Since there is no obvious reference object in the Load Lock chamber and it is restricted by space and measurement tools, this measurement method is difficult, and it is easy to cause human error and reference point error, resulting in a large deviation between the measurement result and the actual situation, thereby affecting the working efficiency of the machine tool.
[0004] To solve the above problems, the utility model provides a wafer transfer detection fixture. By using this fixture as a reference object to detect the position deviation of the wafer, it helps to improve the detection efficiency and can improve the human detection error caused by the restrictions of space and detection tools in the actual process. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a wafer transfer detection fixture. By using this fixture as a reference object to detect the position deviation of the wafer, it helps to improve the detection efficiency and can improve the human detection error caused by the restrictions of space and detection tools in the actual process.
[0006] The utility model provides a wafer transfer detection fixture, including: a fixture body;
[0007] The fixture body is provided with a detection channel, and the detection channel extends along a first direction and is opened through the fixture body.
[0008] The detection channel has two first detection side walls arranged in parallel, and the two first detection side walls are arranged opposite to each other along a second direction, and the second direction is perpendicular to the first direction.
[0009] Optionally, the detection channel is divided into a first channel area and a second channel area along a third direction, which is perpendicular to the first direction and the second direction;
[0010] The first channel area is for a part of the transfer device and the wafer carried by the transfer device to pass through, and the second channel area is for another part of the transfer device to pass through.
[0011] Optionally, the size of the first channel area along the second direction is larger than the size of the second channel area along the second direction.
[0012] Optionally, the second channel area has two second detection side walls arranged in parallel, and the two second detection side walls are arranged opposite to each other along the second direction.
[0013] Optionally, the detection channel penetrates through one side of the jig body along a third direction, which is perpendicular to the first direction and the second direction.
[0014] Optionally, when the detection channel is divided into a first channel area and a second channel area along a third direction, the side of the first channel area away from the second channel area along the third direction penetrates through the jig body.
[0015] Optionally, the jig body is made of a transparent material.
[0016] Optionally, along the second direction, the distance between the two first detection side walls is W; the diameter of the wafer to pass through the detection channel is R; W = (1 + 0.8%)R to (1 + 1.6%)R.
[0017] Optionally, the size of the detection channel along the first direction is larger than the diameter of the wafer to pass through.
[0018] Optionally, the jig body has a symmetric structure centered on a reference plane, and the reference plane is perpendicular to the second direction.
[0019] With such a configuration, the above-mentioned wafer transfer and detection jig is placed on the wafer conveying path, providing a detection channel and two first detection side walls as reference targets, facilitating the detection of the position deviation of the wafer, helping to improve the detection efficiency, and can improve the human detection error caused by the constraints of space and detection tools in the actual process; moreover, the structure of the wafer transfer and detection jig is simple, can be flexibly arranged, and has a wide range of applications, such as being applicable to the Load Lock chamber or other scenarios of the wafer conveying path. Description of the Drawings
[0020] Figure 1 It is a front view structural schematic diagram of the wafer transfer and detection jig according to some embodiments of the present invention;
[0021] Figure 2 A top view structural schematic diagram of a wafer transfer detection jig according to some embodiments of the present utility model;
[0022] Figure 3 A side view structural schematic diagram of a wafer transfer detection jig according to some embodiments of the present utility model.
[0023] Among them, in the drawings:
[0024] 10 - Jig body; 11 - Detection channel; 111 - First channel area; 112 - Second channel area; 12 - First detection side wall; 13 - Second detection side wall;
[0025] 20 - Transfer device;
[0026] 30 - Wafer;
[0027] a - First direction; b - Second direction; c - Third direction. Detailed implementation manners
[0028] The following further elaborates on the wafer transfer detection jig proposed by the present utility model in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present utility model will be clearer. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise scales, only for the purpose of facilitating and clearly assisting in explaining the purpose of the embodiments of the present utility model.
[0029] As used in the present utility model, the singular forms "a", "an" and "the" include plural objects. The term "or" is generally used in the sense of including "and / or". The term "several" is generally used in the sense of including "at least one". The term "at least two" or "plural" is generally used in the sense of including "two or more". In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third" may explicitly or implicitly include one or at least two of such features. In addition, as used in the present utility model, "mounted", "connected", "coupled", an element "disposed" on another element should be understood in a broad sense, generally only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the two elements can be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate element, rather than being construed as indicating or implying the spatial position relationship between the two elements, that is, an element can be in any position such as inside, outside, above, below or on one side of another element, unless otherwise explicitly specified in the content. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right are used relative to the exemplary embodiments as shown in the figures, and the upward or upper direction is towards the top of the corresponding figure, and the downward or lower direction is towards the bottom of the corresponding figure.
[0030] In this embodiment, the first direction a, the second direction b and the third direction c are three mutually perpendicular directions.
[0031] Please refer to Figures 1 to 3 As shown, this embodiment provides a wafer transfer detection jig, including: a jig body 10.
[0032] The jig body 10 is provided with a detection channel 11, and the detection channel 11 extends along the first direction a and is throughly opened in the jig body 10;
[0033] Combined with Figure 1 As shown, the first direction a corresponds to the length direction of the jig body 10, and the detection channel 11 is arranged throughly along the length direction of the jig body 10. The jig body 10 is installed on the path of wafer transfer so that the transfer device 20 (such as a transfer arm) can pass through the detection channel 11 during the process of carrying the wafer 30 on its transfer path. The setting of the detection channel 11 provides a reference object for the position detection of the wafer, and the purpose of detecting the position of the wafer is achieved by referring to the relative position relationship between the wafer and the detection channel 11.
[0034] Specifically, the detection channel 11 has two first detection sidewalls 12 arranged in parallel. The first detection sidewalls 12 are arranged parallel to the first direction a. The two first detection sidewalls 12 are arranged opposite to each other along the second direction b, that is, the first detection sidewalls 12 are perpendicular to the second direction b, and the second direction b is perpendicular to the first direction a. As shown in combination with Figure 1 shown, the second direction b corresponds to the width direction of the fixture body 10.
[0035] Please continue to refer to Figure 1 shown. The transfer device 20 carries the wafer 30 and runs along the first direction a and passes through the detection channel 11. When the wafer 30 is in the standard position, the center of the wafer 30 is located at the center of the detection channel 11 along the second direction b. That is, when the wafer 30 is in the standard position, the minimum distances from the edges of the wafer 30 to the two first detection sidewalls 12 along the second direction b should be equal. Therefore, it is only necessary to judge the gap sizes between the wafer 30 and the two first detection sidewalls 12 to determine whether there is a deviation in the position of the wafer 30 on its transfer path. For example, when the gap sizes between the wafer 30 and the two first detection sidewalls 12 are significantly different or the edge of the wafer 30 contacts one of the first detection sidewalls 12, it can be determined that the position of the wafer 30 on its transfer path is deviated.
[0036] The above-mentioned wafer transfer detection fixture is placed on the conveying path of the wafer. The wafer transfer detection fixture provides a detection channel 11 and provides two first detection sidewalls 12 as reference targets, which is convenient for detecting the position deviation of the wafer, helps to improve the detection efficiency, and can reduce the human detection error caused by the constraints of space and detection tools in the actual process; moreover, the structure of the wafer transfer detection fixture is simple, can be flexibly arranged, and has a wide range of applications. For example, it can be applied to the wafer conveying path in the LoadLock chamber or other scenarios.
[0037] Further, please continue to refer to Figure 1 shown. Along the second direction b, the distance between the two first detection sidewalls 12 is W; the diameter of the wafer 30 passing through the detection channel 11 is R; W = (1 + 0.8%)R to (1 + 1.6%)R. The above limitation makes the gap S between the wafer and the first detection sidewall 12 located between 0.4%R and 0.8%R when the wafer is in the standard position. Preferably, the gap S can be further controlled to be less than 0.5%R, and the position of the wafer can be detected more accurately by determining this gap.
[0038] In other alternative embodiments, the setting of the gap S can be adjusted adaptively based on actual usage requirements.
[0039] In this embodiment, by defining the sizes of W and R, it can be ensured that by visually comparing the size of the gap between the wafer 30 and the two first detection sidewalls 12 by a person, it can be determined whether there is a deviation in the position of the wafer. In other alternative embodiments, a distance sensor can be integrated inside the detection channel 11 to detect the exact distance between the two first detection sidewalls 12 and the edge of the wafer, and then determine the size of the gap between the wafer and the two first detection sidewalls 12, so as to accurately determine whether there is a deviation in the position of the wafer.
[0040] In addition, please continue to refer to Figure 2 As shown, the size L of the detection channel 11 in the first direction a is greater than the diameter R of the wafer to be passed. Taking a wafer with a diameter of 300 mm as an example, the size L of the detection channel 11 in the first direction a can be set to about 350 mm. By defining the length size of the detection channel 11, it can be ensured that the wafer 30 can completely enter the detection channel 11 when passing through the detection channel 11, so that the detection channel 11 provides a more accurate reference for the position of the wafer 30.
[0041] Please continue to refer to Figure 1 As shown, in this embodiment, the fixture body 10 adopts a thin-walled plate-like structure. Further, in order to facilitate observing the relative position relationship between the wafer 30 in the detection channel 11 and the first detection sidewall 12, the fixture body 10 is made of a transparent material. For example, the material of the fixture body 10 is at least one of quartz glass, ceramic, and polytetrafluoroethylene. The material of the fixture body 10 is preferably a high-temperature resistant material, and the material can be selected adaptively based on its actual high-temperature resistance requirements.
[0042] In other alternative embodiments, if a distance sensor is integrated in the detection channel 11, the fixture body 10 can also be made of an opaque material. In addition, the fixture body 10 can also adopt a non-thin-walled structure. The specific material and structural form of the fixture body 10 can be adjusted adaptively based on actual usage requirements.
[0043] Please continue to refer to Figure 1 As shown, the detection channel 11 is divided into a first channel area 111 and a second channel area 112 in the third direction c, and the third direction c is perpendicular to the first direction a and the second direction b; the third direction c corresponds to the height direction of the detection channel 11.
[0044] The first channel area 111 is used for a part of the transmission device 20 and the wafer 30 carried by the transmission device 20 to pass through, and the second channel area 112 is used for another part of the transmission device 20 to pass through.
[0045] The fixture body 10 has a symmetric structure centered on the reference plane A, and the reference plane A is perpendicular to the second direction b, that is, the fixture body 10 is in Figure 1The middle is a left-right symmetric structure, and similarly, the detection channel 11 is also a left-right symmetric structure.
[0046] By partitioning the detection channel 11, when the transfer device 20 and the carried wafer 30 pass through the detection channel 11, the wafer 30 is located in the first channel area 111, and the transfer device 20 is mainly located in the second channel area 112. This ensures that each component is in the corresponding interval and reduces the mutual interference between components.
[0047] Please continue to refer to Figure 1 As shown, the dimension of the first channel area 111 along the second direction b is greater than the dimension of the second channel area 112 along the second direction b. This setting method can adapt to the structure of the existing transfer device 20. Moreover, due to the dimensional difference between the first channel area 111 and the second channel area 112 in the second direction b, a step structure is formed at the connection position between the first channel area 111 and the second channel area 112. This step structure can also be used as a reference mark to detect the height position of the wafer 30, thereby meeting the detection of the height positions of the transfer device 20 and the wafer 30.
[0048] Wherein the second channel area 112 has two second detection sidewalls 13 arranged in parallel, and the two second detection sidewalls 13 are arranged opposite to each other along the second direction b. The two second detection sidewalls 13 are perpendicular to the second direction b, and the second detection sidewalls 13 are parallel to the first detection sidewall 12.
[0049] Please continue to refer to Figure 1 As shown, the first channel area 111 is located above the second channel area 112 in Figure 1 Then, when the transfer device 20 and the carried wafer 30 pass through the detection channel 11, the wafer 30 can calibrate its position with the first detection sidewall 12 as a reference mark, and the transfer device 20 can calibrate its position with the second detection sidewall 13 as a reference mark. Through the above calibration method, the position deviation of the transfer device 20 and the position deviation of the wafer 30 can be detected. By mutually verifying the positions of the two, the detection effect and detection efficiency can be improved.
[0050] Please continue to refer to Figure 1As shown, the overall fixture body 10 is approximately in an inverted "convex" shape structure, that is, the position where the first detection side wall 12 and the second detection side wall 13 are connected is perpendicular to the third direction c, and the bottom of the second channel area 112 is also perpendicular to the third direction c. Therefore, the cross-sections of both the first channel area 111 and the second channel area 112 are in a rectangular structure. In other alternative embodiments, for example, the bottom of the second channel area 112 can be adjusted to an arc surface or other special-shaped structures based on the need to avoid the transfer device 20. Similarly, the position where the first detection side wall 12 and the second detection side wall 13 are connected can also be set as an inclined structure. The shape of the position where the first detection side wall 12 and the second detection side wall 13 are connected and the shape of the bottom of the second channel area 112 can be adjusted adaptively according to actual usage requirements, which will not be elaborated here.
[0051] Please continue to refer to Figure 1 As shown, the detection channel 11 penetrates through one side of the fixture body 10 along the third direction c. Specifically, the first channel area 111 penetrates through the fixture body 10 along the side away from the second channel area 112 in the third direction c. That is, the first channel area 111 is in an open structure above Figure 1 . This setting method, on the one hand, facilitates the transfer device 20 and the carried wafer 30 to pass through the detection channel 11, reducing mutual interference; on the other hand, it also facilitates observing the position of the wafer 30 from the outside, and at the same time, it is convenient for the transfer device 20 and the carried wafer 30 to move from the opening side of the detection channel 11 ( Figure 1 above) to the outside of the detection channel 11 in case of emergency, so as to facilitate the flexible movement of the transfer device 20.
[0052] The above wafer transfer and detection fixture can be applied to the Load Lock chamber. It can make corresponding detection fixtures for different models of Load Lock chambers, and quickly and accurately detect the position deviation of the wafer during machine maintenance operations.
[0053] In this specification, each embodiment is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.
[0054] The above description is only a description of the preferred embodiments of the present invention, and does not limit the scope of the present invention in any way. Any changes and modifications made by those of ordinary skill in the art of the present invention according to the above disclosure fall within the protection scope of the claims.
Claims
1. A wafer transmission and detection fixture, characterized in that: include: Fixture body; The fixture body has a detection channel, which extends along a first direction and is opened through the fixture body; The detection channel has two first detection side walls arranged in parallel, and the two first detection side walls are arranged opposite to each other along a second direction, and the second direction is perpendicular to the first direction.
2. The wafer transfer and detection jig according to claim 1, characterized in that: The detection channel is divided into a first channel area and a second channel area along a third direction, and the third direction is perpendicular to the first direction and the second direction; The first channel area is used for allowing a part of the transmission device and the wafers carried by the transmission device to pass through, and the second channel area is used for allowing another part of the transmission device to pass through.
3. The wafer transfer and detection jig according to claim 2, characterized in that: A size of the first channel region along the second direction is greater than a size of the second channel region along the second direction.
4. The wafer transfer and detection jig according to claim 2, characterized in that: The second channel area has two second detection side walls arranged in parallel, and the two second detection side walls are arranged opposite to each other along the second direction.
5. The wafer transfer and inspection jig according to any one of claims 1 to 4, characterized in that: The detection channel passes through one side of the fixture body along a third direction, and the third direction is perpendicular to the first direction and the second direction.
6. The wafer transfer and detection jig according to claim 5, characterized in that: When the detection channel is divided into a first channel area and a second channel area along the third direction, a side of the first channel area away from the second channel area along the third direction passes through the fixture body.
7. The wafer transfer and detection jig according to claim 1, characterized in that: The fixture body is made of transparent material.
8. The wafer transfer and detection jig according to claim 1, characterized in that: Along the second direction, the distance between the two first detection side walls is W; the diameter of the wafer to be passed through the detection channel is R; W=(1+0.8%)R~(1+1.6%)R.
9. The wafer transfer and inspection jig according to claim 1, characterized in that: The dimension of the detection channel along the first direction is larger than the diameter of the wafer to be passed through.
10. The wafer transfer and inspection jig according to claim 1, characterized in that: The fixture body is symmetrically structured with the reference surface as the center, and the reference surface is perpendicular to the second direction.