Wafer defect detection platform

Abstract

The utility model discloses a wafer defect detection platform, which belongs to the technical field of wafer detection equipment and comprises a mounting platform deck, a wafer adsorption platform deck is arranged on the mounting platform deck, and a first driving component is arranged between the mounting platform deck and the wafer adsorption platform deck; a portal frame is further arranged on the mounting platform deck, a detection assembly is arranged on the portal frame, and a second driving assembly is arranged between the portal frame and the detection assembly; supporting columns are arranged at the four corners of the installation carrying table, air floating assemblies are arranged between the supporting columns and the installation carrying table, and the air pressure of the air floating assemblies is adjustable. According to the wafer defect detection platform, movement and rotation of the wafer adsorption carrying table in a three-dimensional space relative to the detection assembly are completed through the first driving assembly and the second driving assembly, and omnibearing detection of the wafer is facilitated; and the air floating assembly is arranged between the supporting column and the mounting platform deck, so that external environment vibration is prevented from being transmitted to the mounting platform deck, the accuracy and stability of wafer detection are ensured, and the overall detection precision of the wafer defect detection platform is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer detection equipment, and particularly relates to a wafer defect detection platform. Background Art

[0002] With the rapid development of the semiconductor and new display industries, and the wafer being the core material of the semiconductor device and new display industries, the manufacturing and detection of the wafer are directly related to the performance of subsequent products.

[0003] Generally, wafers are mainly detected by optical instruments to detect their surface optical properties, whether the products are regular, and whether there are defects on the surface. When detecting the wafer surface, in addition to the performance of the optical detection instrument itself, the stability of the detection platform itself is also a key factor in detection accuracy. When the detection platform vibrates during the detection process, the detection error will gradually increase. The existing technology mainly improves the transmission accuracy of the mechanical transmission structure and the sensitivity of the control system to improve the stability of the detection platform, but it cannot solve the vibration conduction of the external environment. At the same time, external temperature changes, air flow, etc. will all cause an increase in the detection error of the wafer, thereby affecting the overall quality assessment of the wafer. Summary of the Utility Model

[0004] In view of one or more of the above defects or improvement requirements in the prior art, the utility model provides a wafer defect detection platform to solve the problem of detection error caused by the vibration of the external environment that cannot be avoided by the existing detection platform.

[0005] To achieve the above object, the utility model provides a wafer defect detection platform, which includes:

[0006] An installation stage, on which a wafer adsorption stage is provided. A first driving component is provided between the wafer adsorption stage and the installation stage, and the first driving component is used to drive the installation stage to move and rotate in a horizontal plane;

[0007] A gantry is further provided on the installation stage, and a detection component is provided on the gantry. A second driving component is provided between the detection component and the gantry, and the second driving component is used to drive the detection component to lift vertically;

[0008] Support columns are provided at the four corners of the installation stage, and air floating components are provided between each support column and the installation stage, and the air pressures of each air floating component are adjustable respectively.

[0009] As a further improvement of the present utility model, a locking stage is further provided below the mounting stage. The locking stage is fixedly connected to each of the support columns. A fixing plate is connected between the mounting stage and the locking stage, and at least one end of the fixing plate is detachably connected to the mounting stage or the locking stage.

[0010] As a further improvement of the present utility model, the mounting stage and the gantry are made of marble structure; each of the air floating components extends a receiving plate towards the center of the mounting stage, and the mounting stage is placed on the receiving plate.

[0011] As a further improvement of the present utility model, an installation plate extends vertically at the connection between the gantry and the second driving component. The second driving component is installed on the installation plate, and the vertical length of the installation plate is greater than the vertical length of the second driving component.

[0012] As a further improvement of the present utility model, a plurality of weight-reducing holes are formed on the gantry, and the plurality of weight-reducing holes are symmetrically arranged on both sides with the second driving component as the center.

[0013] As a further improvement of the present utility model, the first driving component includes a first slide rail arranged in a first direction, and the first slide rail is arranged on the mounting stage;

[0014] A second slide rail is slidably matched with the first slide rail. The second slide rail is arranged in a second direction, and a sliding seat is slidably matched with the second slide rail;

[0015] The wafer adsorption stage is arranged on the sliding seat, and a rotating stage is arranged between the sliding seat and the wafer adsorption stage.

[0016] As a further improvement of the present utility model, the second slide rail is driven by a first driving mechanism, and a first dust-free drag chain is arranged on the mounting stage. The first driving mechanism is slidably matched with the first dust-free drag chain;

[0017] The sliding seat is driven by a second driving mechanism, and a second dust-free drag chain is further arranged on the mounting stage. The second driving mechanism is slidably matched with the second dust-free drag chain.

[0018] As a further improvement of the present utility model, the first slide rails are arranged in pairs, and linear guide rails are arranged side by side on both sides of the two first slide rails. The second slide rail is respectively slidably matched with the first slide rail and the linear guide rail.

[0019] As a further improvement of the present utility model, a plurality of dust exhaust holes are further formed on the locking stage.

[0020] As a further improvement of the present utility model, a foot cup is further provided at the bottom of the support column. The vertical height of the foot cup is adjustable, and a plurality of pulleys are further provided below the locking stage.

[0021] As long as the above-mentioned improved technical features do not conflict with each other, they can be combined with each other.

[0022] Generally speaking, compared with the prior art, the beneficial effects of the above technical solutions conceived by the present utility model include:

[0023] (1) For the wafer defect detection platform of the present utility model, the first driving component and the second driving component are used to realize the movement of the detection component and the wafer adsorption stage in three-dimensional directions, and the rotation of the wafer on the horizontal plane, so as to complete the detection work of the wafer through the detection component; secondly, a support column is arranged below the mounting stage of the present application, and an air floating component is arranged between the support column and the mounting stage. By adjusting the air pressure of the air floating component, the horizontal setting of the mounting stage is realized. The air floating component can avoid the transmission of external environmental vibrations to the mounting stage, ensure the accuracy of wafer detection, and the air floating component itself can absorb the working vibrations of the first driving component and the second driving component itself, reduce the vibration of the wafer adsorption stage, and improve the overall detection accuracy of the wafer defect detection platform.

[0024] (2) For the wafer defect detection platform of the present utility model, a locking stage is arranged below the mounting stage, and a fixing plate is arranged between the mounting stage and the locking stage. The relative locking and separation of the mounting stage and the locking stage are realized through the detachable form of the fixing plate, so that the wafer defect detection platform is supported by the air floating component during work to ensure its stability; during transportation, the mounting stage is locked by the fixing plate, which is convenient for the overall transportation of the wafer defect detection platform.

[0025] (3) For the wafer defect detection platform of the present utility model, both the mounting stage and the gantry are made of marble structures, so that both the mounting stage and the gantry have good rigidity and stability, provide stable support for the wafer defect detection platform, and reduce the influence of the external environment on the stability of the mounting stage. Secondly, weight-reducing holes are correspondingly opened on the gantry to reduce the overall weight of the gantry and facilitate the handling of the wafer defect detection platform. Description of the Drawings

[0026] Figure 1 is the overall structural schematic diagram of the wafer defect detection platform in the embodiment of the present utility model.

[0027] In all the drawings, the same reference numerals represent the same technical features, specifically:

[0028] 1. Install the carrier; 2. Wafer adsorption carrier; 3. Gantry; 4. Detection component; 5. Second drive component; 6. Support column; 7. Air flotation component; 8. Lock the carrier; 9. Fixing plate; 10. Receiver plate; 11. Mounting plate; 12. Weight reduction hole; 13. First slide rail; 14. Second slide rail; 15. Sliding seat; 16. First dust-free drag chain; 17. Second dust-free drag chain; 18. Dust exhaust hole; 19. Foot cup; 20. Pulley; 21. Frequency modulation valve. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0030] In the description of the present invention, it should be understood that, unless otherwise specified, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0031] In addition, unless otherwise specified, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0034] Embodiment:

[0035] Please refer to Figure 1 , the wafer defect detection platform in the preferred embodiment of the present utility model includes a mounting stage 1, on which a wafer adsorption stage 2 is provided. A first driving component is provided between the wafer adsorption stage 2 and the mounting stage 1, and this first driving component is used to drive the wafer adsorption stage 2 to move and rotate in a horizontal plane. At the same time, a gantry 3 is also provided on the mounting stage 1, a detection component 4 is provided on the gantry 3, and a second driving component 5 is provided between the detection component 4 and the gantry 3. This second driving component 5 is used to drive the detection component 4 to lift vertically. Support columns 6 are provided at the four corners of the mounting stage 1, and an air floating component 7 is provided between each support column 6 and the mounting stage 1, and the air pressure of each air floating component 7 is adjustable respectively.

[0036] Specifically, in the present application, the first driving component and the second driving component 5 are used to realize the movement of the relative position of the detection component 4 and the wafer adsorption stage 2 in three-dimensional directions and the rotation of the wafer adsorption stage 2 in a horizontal plane, so as to complete the detection work of the wafer by the detection component 4. Secondly, in the present application, support columns 6 are correspondingly provided below the mounting stage 1, air floating components 7 are provided between the support columns 6 and the mounting stage 1, and by adjusting the air pressure of each air floating component 7 respectively, the horizontal setting of the mounting stage 1 on the support columns 6 is realized. On the one hand, the air floating component 7 can prevent vibrations in the surrounding environment and the like from being transmitted to the mounting stage 1 to ensure the accuracy of wafer detection; on the other hand, it can absorb the movement vibrations of the first driving component and the second driving component 5 on the mounting stage 1 itself, reduce the vibration of the wafer adsorption stage 2 itself, and improve the detection accuracy of the detection component 4; it can also, when the mounting stage 1 is tilted or unstable, realize the horizontal setting of the mounting stage 1 by adjusting one or more air floating components 7 on the support columns 6 to realize the high-precision detection of the wafer.

[0037] Further, as a preferred embodiment of the present utility model, a locking stage 8 is further provided below the mounting stage 1 in this application. The locking stage 8 is fixedly connected to each support column 6, and a fixing plate 9 is also connected between the mounting stage 1 and the locking stage 8. At least one end of the fixing plate 9 is detachably connected to the mounting stage 1 or the locking stage 8. Specifically, when the air floating assembly 7 supports the mounting stage 1 in this application, the mounting stage 1 is in a dynamic balance state; when it is necessary to move the wafer defect detection platform, the mounting stage 1 will shake randomly, which is not convenient for the handling work; and the air floating assembly 7 needs to adjust the air pressure of the air floating assembly 7 through the frequency modulation valve 21. When it is necessary to move the mounting stage 1, the frequency modulation valve 21 cannot supply pressure normally, and the air floating assembly 7 cannot work, resulting in the mounting stage 1 being in an unstable state. In order to facilitate the handling of the wafer defect detection platform, a locking stage 8 and a fixing plate 9 are correspondingly provided in this application. When it is necessary to carry out the handling work, the mounting stage 1 and the locking stage 8 are stably connected through the fixing plate 9, and the two are locked relative to each other, and the wafer defect detection platform is an integral structure as a whole; when it is necessary to carry out the detection work, the connection end of the fixing plate 9 and the mounting stage 1 or the locking stage 8 is disassembled, and the mounting stage 1 is lifted by the air floating assembly 7. The mounting stage 1 is in a dynamic balance state, and external vibrations cannot be transmitted to the mounting stage 1 through the support columns 6, so as to improve the detection accuracy of the detection component 4 for the wafer.

[0038] Preferably, both the mounting stage 1 and the locking stage 8 in this application are square structures, and the fixing plates 9 are arranged in pairs at two opposite side edges of the mounting stage 1 and the locking stage 8 to form a stable support for the mounting stage 1.

[0039] Further preferably, both the mounting stage 1 and the gantry 3 in this application are made of marble structure, and the above-mentioned air floating assemblies 7 all horizontally extend a receiving plate 10 towards the center of the mounting stage 1, and the mounting stage 1 is placed on the receiving plate 10. The mounting stage 1 and the gantry 3 made of marble structure have good rigidity and stability, which can provide stable support for the wafer defect detection platform, and at the same time can reduce the influence of the external environment on the stability of the mounting stage 1. Correspondingly, in order to ensure the stable support placement of the mounting stage 1 on the support columns 6, notches are correspondingly provided at the four corners of the mounting stage 1. The air floating assemblies 7 are placed at the notches, and the air floating assemblies 7 extend the receiving plate 10 towards the center or both side edges of the mounting stage 1 for supporting the mounting stage 1. The receiving plates 10 on the four air floating assemblies 7 jointly constrain and receive the mounting stage 1.

[0040] Preferably, the gantry 3 in this application is assembled by two columns on the mounting stage 1 as a base structure, and trusses are arranged on the two columns to form the gantry 3. The columns, trusses and the mounting stage 1 are fixedly connected by screws.

[0041] Further, as a preferred embodiment of the utility model, a mounting plate 11 is vertically extended from the junction of the gantry 3 and the second drive assembly 5 in the present application, and the second drive assembly 5 is mounted on the mounting plate 11, and the vertical length of the mounting plate 11 is greater than the vertical length of the second drive assembly 5. The second drive assembly 5 is mainly composed of a driving body and a driving part. The driving body is connected to the mounting plate 11 to form a base structure, and the driving part is connected to the detection assembly 4. The driving part and the driving body can move relatively to realize the vertical lifting of the detection assembly 4; by adjusting the vertical length of the mounting plate 11, the driving body of the second drive assembly 5 is completely attached to the mounting plate 11 to cover the vertical movement process of the second drive assembly 5, ensuring the stability of the second drive assembly 5 when driving the detection assembly 4 to move, so as to improve the movement accuracy of the second drive assembly 5.

[0042] Further preferably, a plurality of weight-reducing holes 12 are correspondingly provided on the gantry 3, and the plurality of weight-reducing holes 12 are symmetrically arranged on both sides with the second drive assembly 5 as the center. The wafer defect detection platform in the present application should not only utilize the rigidity and stability of the marble structure, but also reduce the overall weight of the gantry 3 as much as possible, so as to facilitate the handling and movement of the wafer defect detection platform. Therefore, the present application corresponds to opening weight-reducing holes 12 on the gantry 3 to reduce the overall weight of the gantry 3, and the weight-reducing holes 12 are symmetrically distributed with the second drive assembly 5 as the center, which can ensure that the overall weight distribution of the gantry 3 is balanced, so that the installation platform 1 can evenly apply force to each air flotation assembly 7 below it, which is convenient for the installation of the horizontal arrangement of the platform 1. Correspondingly, in order to further reduce the overall weight of the wafer defect detection platform, notches or gaps can be opened on the column structure of the gantry 3, and through holes can be opened on the installation platform 1.

[0043] Further, as a preferred embodiment of the utility model, the first driving component in the present application includes a first slide rail 13 arranged along the first direction, and the first slide rail 13 is arranged on the mounting platform 1; the first slide rail 13 is slidably matched with a second slide rail 14, and the second slide rail 14 is arranged along the second direction, and the second slide rail 14 is slidably matched with a sliding seat 15; and the sliding seat 15 is provided with a wafer adsorption platform 2, and a rotating table is provided between the sliding seat 15 and the wafer adsorption platform 2. Specifically, the second slide rail 14 is slidably provided on the first slide rail 13 to drive the second slide rail 14 to move along the first direction; the sliding seat 15 is slidably provided on the second slide rail 14 to drive the sliding seat 15 to move along the second direction, and a rotating table is provided between the sliding seat 15 and the wafer adsorption platform 2, and the wafer adsorption platform 2 is driven to rotate by the rotating table to realize the movement and rotation of the wafer adsorption platform 2 in the horizontal direction. Preferably, the first direction and the second direction are perpendicular to each other.

[0044] Further preferably, the second slide rail 14 is driven by a first driving mechanism, and a first dust-free cable carrier 16 is arranged on the mounting stage 1, and the first driving mechanism is slidably matched with the first dust-free cable carrier 16; the sliding seat 15 is driven by a second driving mechanism, and a second dust-free cable carrier 17 is correspondingly arranged on the mounting stage 1, and the second driving mechanism is slidably matched with the second dust-free cable carrier 17. The first dust-free cable carrier 16 and the second dust-free cable carrier 17 are respectively used to drive the second slide rail 14 and the sliding seat 15 to move along the first direction and the second direction. The dust-free cable carrier as a whole has properties such as wear resistance, non-gassing, non-dust accumulation, acid and alkali resistance, and anti-aging, etc., which can ensure the high-precision movement of the wafer adsorption stage 2 on the mounting stage 1.

[0045] Further preferably, grating scales are also correspondingly arranged at the first slide rail 13 and the second slide rail 14 in this application, so as to improve the displacement capture accuracy of the wafer adsorption stage 2.

[0046] Further preferably, the first slide rails 13 in this application are arranged in pairs, and linear guide rails are also arranged side by side on both sides of the two first slide rails 13, and the second slide rail 14 is respectively matched with the first slide rail 13 and the linear guide rail. In order to increase the matching accuracy between the second slide rail 14 and the first slide rail 13 and ensure the stable movement of the second slide rail 14 on the first slide rail 13. Two groups of first slide rails 13 are correspondingly arranged in this application, and linear guide rails are arranged side by side beside the first slide rails 13 to limit the movement direction of the second slide rail 14, so as to further ensure the displacement accuracy of the wafer adsorption stage 2.

[0047] Further preferably, a plurality of dust discharge holes 18 are also formed in the locking stage 8 in this application. The wafer itself will generate dust and debris during the processing process. In order to prevent the dust and debris from affecting the movement of the wafer adsorption stage 2 and the detection component 4, an air blowing structure is correspondingly arranged above the wafer defect detection platform to blow the dust and debris, etc. under the mounting stage 1, and the dust discharge holes 18 on the locking stage 8 can correspondingly discharge the dust and debris, etc., to ensure the overall cleanliness of the wafer defect detection platform.

[0048] Further preferably, a foot cup 19 is also provided at the bottom of the support column 6 in this application, the vertical height of the foot cup 19 is adjustable, and a plurality of pulleys 20 are also provided under the locking stage 8. When the wafer defect detection platform is in a stable detection state, the support column 6 is supported by the foot cup 19, and the detection platform is stably set on the ground; when the wafer defect detection platform needs to be moved, the mounting stage 1 and the locking stage 8 are locked by the fixing plate 9, and then the foot cup 19 is lifted, and the entire wafer defect detection platform is supported by the pulleys 20 under the locking stage 8, and the wafer defect detection platform can slide correspondingly.

[0049] Those skilled in the art can easily understand that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A wafer defect detection platform, characterized in that: include: A mounting platform, wherein a wafer adsorption platform is disposed on the mounting platform, and a first driving component is disposed between the wafer adsorption platform and the mounting platform, wherein the first driving component is used to drive the mounting platform to move and rotate in a horizontal plane; The mounting platform is further provided with a gantry, the gantry is provided with a detection component, a second driving component is provided between the detection component and the gantry, and the second driving component is used to drive the detection component to rise and fall vertically; Support columns are arranged at the four corners of the installation platform, and air floating components are arranged between each of the support columns and the installation platform, and the air pressure of each of the air floating components is adjustable.

2. The wafer defect detection platform according to claim 1, characterized in that: A locking platform is also provided below the mounting platform, and the locking platform is fixedly connected to each of the support columns. A fixing plate is connected between the mounting platform and the locking platform, and at least one end of the fixing plate is detachably connected to the mounting platform or the locking platform.

3. The wafer defect detection platform according to claim 1 or 2, characterized in that: The mounting platform and the gantry are made of marble; Each of the air floating components has a receiving plate horizontally extending toward the center of the mounting platform, and the mounting platform falls on the receiving plate.

4. The wafer defect detection platform according to claim 3, characterized in that: A mounting plate extends vertically from the junction of the gantry and the second drive assembly, the second drive assembly is mounted on the mounting plate, and the vertical length of the mounting plate is greater than the vertical length of the second drive assembly.

5. The wafer defect detection platform according to claim 4, characterized in that: The gantry is provided with a plurality of weight-reducing holes, and the plurality of weight-reducing holes are symmetrically arranged on both sides with the second driving assembly as the center.

6. The wafer defect detection platform according to claim 1, characterized in that: The first driving assembly comprises a first slide rail arranged along a first direction, and the first slide rail is provided on the mounting platform; The first slide rail is slidably matched with a second slide rail, the second slide rail is arranged along a second direction, and the second slide rail is slidably matched with a slide seat; The wafer adsorption platform is arranged on the sliding seat, and a rotating platform is arranged between the sliding seat and the wafer adsorption platform.

7. The wafer defect detection platform according to claim 6, characterized in that: The second slide rail is driven by a first driving mechanism, a first dust-free drag chain is provided on the mounting platform, and the first driving mechanism slidably matches the first dust-free drag chain; The sliding seat is driven by a second driving mechanism, and a second dust-free drag chain is also provided on the mounting platform, and the second driving mechanism is slidably matched with the second dust-free drag chain.

8. The wafer defect detection platform according to claim 6, characterized in that: The first slide rails are arranged in pairs, and linear guide rails are arranged side by side on both sides of the first slide rails. The second slide rails are respectively slidably matched with the first slide rails and the linear guide rails.

9. The wafer defect detection platform according to claim 2, characterized in that: The locking platform is also provided with a plurality of dust exhaust holes.

10. The wafer defect detection platform according to claim 2, characterized in that: A foot cup is also provided at the bottom of the support column, and the vertical height of the foot cup is adjustable, and a plurality of pulleys are also provided under the locking platform.

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