Heat conduction detection device for pouring sealant

Abstract

The utility model discloses a heat conduction detection device for pouring sealant, which belongs to the technical field of heat conduction instruments and comprises a heat conduction instrument body, a heating device and a heat dissipation device, the heat dissipation device is arranged on the heat conduction instrument body, a supporting rod is fixedly arranged on the heat conduction instrument body, the heating device is arranged on the supporting rod and above the heat dissipation device, and a fixing ring is arranged on the heat conduction instrument body. The heat dissipation device is arranged in the fixing ring, the supporting rod is arranged in the fixing ring, two fixing plates are fixedly arranged on the fixing ring, the two fixing plates are arranged on the fixing ring and arranged on the two sides of the fixing ring respectively, fixing holes are formed in the fixing plates, threaded holes are formed in the machine body, threaded rods are inserted into the fixing holes, and the threaded rods are connected into the threaded holes in a threaded mode. A fixing groove is formed in the fixing ring, the fixing ring is connected with a heat preservation cover, the heat preservation cover is inserted into the fixing groove, and the heating device is arranged in the heat preservation cover.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal conductivity meters, and specifically relates to a thermal conductivity detection device for potting glue. Background Technique

[0002] Potting glue can effectively pot electronic devices, protecting them from environmental influences, improving mechanical strength and providing excellent electrical insulation. Potting glue used in electronic devices has relatively high requirements for the thermal conductivity coefficient. Therefore, when producing potting glue, a thermal conductivity meter is needed to detect the thermal conductivity coefficient of the potting glue.

[0003] Common thermal conductivity meters currently include a machine body, a dial, a heating device and a heat dissipation device. Place the potting glue sample on the heat dissipation device, lower the heating device, and the sample is clamped between the heating device and the heat dissipation device. Start the heating device and the heat dissipation device on the dial, and at the same time use a temperature sensor to detect the temperature difference between the heating device and the heat dissipation device to determine the thermal conductivity coefficient of the sample.

[0004] For the above technical conditions, there are still defects that when the thermal conductivity meter is working, both the heating device and the heat dissipation device of the thermal conductivity meter are exposed to the air, resulting in part of the heat of the heating device and the heat dissipation device being lost to the air, which affects the detection result of the thermal conductivity coefficient of the potting glue.

[0005] Based on this, the utility model designs a thermal conductivity detection device for potting glue to solve the above problems. Content of the Utility Model

[0006] The purpose of the utility model is to provide a thermal conductivity detection device for potting glue to solve the above technical problems.

[0007] To achieve the above purpose, the utility model provides the following technical solution: A thermal conductivity detection device for potting glue includes the machine body, a heating device and a heat dissipation device of a thermal conductivity meter. The heat dissipation device is arranged on the machine body. A support rod is fixedly arranged on the machine body. The heating device is arranged on the support rod. The heating device is above the heat dissipation device. A fixing ring is arranged on the machine body. The heat dissipation device is in the fixing ring. The support rod is in the fixing ring. A fixing plate is fixedly arranged on the fixing ring. There are two fixing plates arranged on the fixing ring. The two fixing plates are respectively arranged on both sides of the fixing ring. A fixing hole is opened on the fixing plate. A threaded hole is opened on the machine body. A threaded rod is inserted into the fixing hole. The threaded rod is threadedly connected to the threaded hole. A fixing groove is opened on the fixing ring. The fixing ring is connected with a heat preservation cover. The heat preservation cover is inserted into the fixing groove. The heating device is in the heat preservation cover.

[0008] Preferably, the fixing ring is made of heat-insulating material.

[0009] Preferably, a tightening layer is fixedly arranged in the fixing groove, and the tightening layer presses against the heat preservation cover.

[0010] Preferably, the heat preservation cover is made of a transparent material.

[0011] Preferably, a connection hole is formed in the heat preservation cover, a first sensor is connected to the machine body, the first sensor passes through the connection hole and is connected to the heating device, a second sensor is connected to the machine body, and the second sensor passes through the connection hole and is connected to the heat dissipation device.

[0012] In summary, the present application has the following beneficial technical effects: When using the thermal conductivity meter, place the potting compound sample between the heating device and the heat dissipation device and clamp it. Place the fixing ring on the machine body, align the fixing hole with the threaded hole, thread the threaded rod into the fixing hole and the threaded hole, and the fixing ring is fixed on the machine body. Insert one end of the heat preservation cover into the fixing groove, and the tightening layer presses against the heat preservation cover, so that the heat preservation cover is stably inserted into the fixing groove. The heating device, the potting compound sample and the heat dissipation device are in the heat preservation cover. At this time, when detecting the thermal conductivity of the potting compound sample, the heat preservation cover can reduce the heat loss during detection, achieving the effect of reducing the heat loss of the thermal conductivity meter during detection. Description of the Drawings

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0014] Figure 1 Schematic installation structure diagram of the thermal conductivity meter of this embodiment;

[0015] Figure 2 Schematic structure diagram of the thermal conductivity meter of this embodiment with the heat preservation cover on;

[0016] Figure 3 Schematic structure diagram of the thermal conductivity meter of this embodiment without the heat preservation cover on;

[0017] Figure 4 Schematic installation structure diagram of the heat preservation cover and the fixing ring of this embodiment;

[0018] Figure 5 Schematic cross-sectional structure diagram of the heat preservation cover of this embodiment.

[0019] In the drawings, the list of components represented by each reference numeral is as follows:

[0020] 1. Heat preservation cover; 2. Connection hole; 3. Fixed groove; 4. Fixed ring; 5. Fixed plate; 6. Threaded rod; 7. Support rod; 8. Second sensor; 9. First sensor; 10. Machine body; 11. Threaded hole; 12. Heat dissipation device; 13. Heating device; 14. Tightening layer. Detailed implementation mode

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection scope of the present invention.

[0022] The following is further described in conjunction with the attached Figures 1-5 This application is further described in detail.

[0023] A thermal conductivity detection device for potting glue includes the machine body 10 of a thermal conductivity meter, a heating device 13 and a heat dissipation device 12. The heat dissipation device 12 is arranged on the machine body 10. A support rod 7 is fixedly arranged on the machine body 10. The heating device 13 is connected to the support rod 7, and the heating device 13 is above the heat dissipation device 12.

[0024] A fixed ring 4 is arranged on the machine body 10. The heat dissipation device 12 is in the fixed ring 4, and the support rod 7 is in the fixed ring 4. A fixed plate 5 is fixedly arranged on the fixed ring 4. There are two fixed plates 5 arranged on the fixed ring 4, and the two fixed plates 5 are respectively arranged on both sides of the fixed ring 4.

[0025] A fixing hole is opened on the fixed plate 5, and a threaded hole 11 is opened on the machine body 10. The threaded hole 11 communicates with the fixing hole. A threaded rod 6 is inserted into the fixing hole, and the threaded rod 6 is threadedly connected to the threaded hole 11. The fixed ring 4 is fixed on the machine body 10. The fixed ring 4 is connected with a heat preservation cover 1. A fixed groove 3 is opened on the side of the fixed ring 4 away from the machine body 10. The heat preservation cover 1 is inserted into the fixed groove 3. The heating device 13 is in the heat preservation cover 1. When the heating device 13 works, the heat preservation cover 1 can reduce the heat loss of the heating device 13.

[0026] The fixed ring 4 is made of heat-insulating material to enhance the heat preservation effect. A tightening layer 14 is fixedly arranged in the fixed groove 3. When one side of the heat preservation cover 1 is inserted into the fixed groove 3, the tightening layer 14 tightens the heat preservation cover 1 to ensure the stability of the heat preservation cover 1 in the fixed groove 3.

[0027] The heat preservation cover 1 is made of transparent material, which is convenient for observing the condition of the test sample. One end of the heat preservation cover 1 close to the fixing ring 4 is provided with a connection hole 2. A first sensor 9 is connected to the body 10. The first sensor 9 passes through the connection hole 2 and is connected to the heating device 13. A second sensor 8 is connected to the body 10. The second sensor 8 passes through the connection hole 2 and is connected to the heat dissipation device 12.

[0028] The implementation principle of this embodiment is as follows: When using the thermal conductivity meter, place the potting compound sample between the heating device 13 and the heat dissipation device 12 and clamp it. Place the fixing ring 4 on the body 10, align the fixing hole with the threaded hole 11, thread the threaded rod 6 into the fixing hole and the threaded hole 11, and fix the fixing ring 4 on the body 10. Insert one end of the heat preservation cover 1 into the fixing groove 3, and the abutting layer 14 abuts against the heat preservation cover 1, so that the heat preservation cover 1 is stably inserted into the fixing groove 3. The heating device 13, the potting compound sample and the heat dissipation device 12 are in the heat preservation cover 1. At this time, when detecting the thermal conductivity of the potting compound sample, the heat preservation cover 1 can reduce the heat loss during detection, achieving the effect of reducing the heat loss of the thermal conductivity meter during detection.

[0029] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "center", "both ends", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0030] In the present invention, unless otherwise clearly defined and limited, the terms "installation", "setting", "connection", "fixation", "swivel connection", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0031] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat conductivity detection device for potting glue, comprising a body (10) of a heat conductivity meter, a heating device (13) and a heat dissipation device (12), characterized in that: The heat dissipation device (12) is arranged on the machine body (10), a support rod (7) is fixedly arranged on the machine body (10), the heating device (13) is arranged on the support rod (7), the heating device (13) is above the heat dissipation device (12), a fixing ring (4) is arranged on the machine body (10), the heat dissipation device (12) is in the fixing ring (4), the support rod (7) is in the fixing ring (4), a fixing plate (5) is fixedly arranged on the fixing ring (4), and the fixing plate (5) is in the fixing ring (4). ) are provided on the fixing ring (4), the two fixing plates (5) are respectively provided on both sides of the fixing ring (4), the fixing plates (5) are provided with fixing holes, the machine body (10) is provided with threaded holes (11), the fixing holes are plugged with threaded rods (6), the threaded rods (6) are threadedly connected in the threaded holes (11), the fixing ring (4) is provided with fixing grooves (3), the fixing ring (4) is connected with a heat preservation cover (1), the heat preservation cover (1) is plugged in the fixing grooves (3), and the heating device (13) is in the heat preservation cover (1).

2. The thermal conductivity detection device of potting glue according to claim 1, characterized in that: The fixing ring (4) is made of heat-insulating material.

3. The thermal conductivity detection device of potting glue according to claim 1, characterized in that: A pressing layer (14) is fixedly arranged in the fixing groove (3), and the pressing layer (14) presses against the heat-insulating cover (1).

4. The thermal conductivity detection device of potting glue according to claim 1, characterized in that: The heat-insulating cover (1) is made of a transparent material.

5. The thermal conductivity detection device of potting glue according to claim 1, characterized in that: The heat-insulating cover (1) is provided with a connection hole (2); the machine body (10) is connected with a first sensor (9); the first sensor (9) passes through the connection hole (2) and is connected to the heating device (13); the machine body (10) is connected with a second sensor (8); the second sensor (8) passes through the connection hole (2) and is connected to the heat dissipation device (12).

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