Aluminum alloy heat dissipation plate for notebook computer

Abstract

The aluminum alloy heat dissipation plate comprises a computer shell and a supporting groove formed in the lower half portion of the inner wall of the computer shell, a circulation groove is formed in one side of the inner wall of the computer shell, and a heat conduction mechanism is arranged on the lower half portion of the computer shell. The heat conduction mechanism comprises an aluminum alloy plate, a flow guide opening, a separation rod, a supporting frame and a flow guide groove, the flow guide opening is formed in the upper end of the aluminum alloy plate and penetrates through the upper end and the lower end of the aluminum alloy plate, and the separation rod is installed on the surface of the lower end of the aluminum alloy plate; the lower end of the separation rod is fixedly installed on the surface of the upper end of the supporting frame, the flow guide groove penetrates through the upper end and the lower end of the supporting frame, the separation rod is located in the flow guide opening and the middle of the flow guide groove, and the supporting frame is connected with the supporting groove in an inserted mode. The heat is separated by the plurality of flow guide ports and the flow guide grooves to circulate in the form of a plurality of small-volume air flows, so that the heat dissipation safety and efficiency of the aluminum alloy plate can be improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic products, and particularly relates to an aluminum alloy heat dissipation plate for a notebook computer. Background Art

[0002] A notebook computer, an electronic product, is abbreviated as a notebook. It is characterized by a small body and is more convenient to carry than a desktop computer. It is a small and portable personal computer.

[0003] After retrieval, a patent with the Chinese patent publication number CN208477466U discloses a notebook computer radiator. The main technical solution is as follows: a box body, on which an inflation / exhaust device is provided; a cold water storage area, arranged in the box body, which includes a water injection / drainage port; a pressure generation area, arranged in the box body and below the cold water storage area, which includes a pressure generation device; a pressure support device, arranged in the box body, which includes an aluminum alloy thin plate, and the aluminum alloy thin plate is located between the cold water storage area and the pressure generation area, and the pressure generation device applies an upward pressure to the aluminum alloy thin plate. The utility model is mainly used for the heat dissipation of notebook computers.

[0004] When a notebook is in use, its internal parts are in a high-speed operation state and will generate a large amount of heat. If the heat is not dissipated in time, it will cause overheating damage to the internal parts. However, the existing devices generally simply use a cooling fan for heat dissipation. Limited by its small space, the heat dissipation efficiency is not high. For example, in the above solution, although water cooling is used to improve the heat dissipation efficiency, it is not convenient for portability and safety during use. Therefore, a safe and efficient heat dissipation method is needed. Summary of the Invention

[0005] In view of the problem of low heat dissipation efficiency in the prior art, the utility model proposes the following technical solutions:

[0006] An aluminum alloy heat dissipation plate for a notebook computer, including a computer shell, and a support groove opened in the lower half of the inner wall of the lower part of the computer shell. A flow groove is opened on one side of the inner wall of the computer shell. A heat conduction mechanism is arranged in the lower half of the computer shell, including: the heat conduction mechanism includes an aluminum alloy plate, a diversion port, a partition rod, a support frame, and a diversion groove. Among them, the diversion port is opened at the upper end of the aluminum alloy plate, and the diversion port penetrates through the upper and lower ends of the aluminum alloy plate. The partition rod is installed on the lower surface of the aluminum alloy plate, and the lower end of the partition rod is fixedly installed on the upper surface of the support frame. The diversion groove penetrates through the upper and lower ends of the support frame. The partition rod is located in the middle of the diversion port and the diversion groove, and the support frame is inserted into the support groove.

[0007] Under the separation of multiple diversion openings and diversion grooves, heat is circulated in multiple small-volume airflows, which can improve the safety and efficiency of heat dissipation of the aluminum alloy plate, thereby improving the heat dissipation efficiency of the device.

[0008] As an optimization of the above technical solution, the heat conduction mechanism further includes side heat dissipation fins and a circulation port. Among them, the side heat dissipation fins are installed on the outside of the aluminum alloy plate, and the circulation port is opened in the middle of the side heat dissipation fins.

[0009] When the side heat dissipation fins and the circulation port are used in combination, the circulation efficiency of heat dissipation can be improved.

[0010] As an optimization of the above technical solution, the lower end of the side heat dissipation fins is fixedly connected to the inner wall of the computer case, and a sealing frame is installed on the upper surface of the side heat dissipation fins. The sealing frame is fixedly connected to both the aluminum alloy plate and the computer case at the same time.

[0011] With the connection between the side heat dissipation fins and the inner wall of the computer case, the heat dissipation efficiency is further improved.

[0012] As an optimization of the above technical solution, the circulation groove is located between the sealing frame and the computer case, and one side of the side heat dissipation fins is fixedly connected to the circulation groove.

[0013] Through the support of the circulation groove, the heat absorbed by the side can be circulated and dissipated to the outside of the device.

[0014] As an optimization of the above technical solution, the aluminum alloy plate is located in the middle of the computer case, and the aluminum alloy plate does not contact the four sides of the inner wall of the computer case, and the side heat dissipation fins are connected to the four sides of the inner wall of the computer case at the same time.

[0015] Through the conduction and dissipation of heat on the aluminum alloy plate by the side heat dissipation fins, the heat dissipation effect of the aluminum alloy plate itself is further improved.

[0016] As an optimization of the above technical solution, the four circulation ports are communicated with the circulation groove, and the space between the support frame and the aluminum alloy plate is communicated with the circulation groove.

[0017] The space below the aluminum alloy plate is set to be communicated with the side heat dissipation space, providing multi-directionality for the heat dissipation of the aluminum alloy plate.

[0018] The beneficial effects of the present utility model are as follows:

[0019] (1) It can disperse and circulate the heat generated inside the computer case multiple times. Under the separation of multiple diversion openings and diversion grooves, heat is circulated in multiple small-volume airflows, improving the safety and efficiency of heat dissipation of the aluminum alloy plate, thereby improving the heat dissipation efficiency of the device;

[0020] (2) Under the sealing of the top of the side heat dissipation fins on the opposite sides of the sealing frame and the interconnection of multiple circulation ports, the heat between the side heat dissipation fins can be dissipated to the outside through the circulation grooves, thereby improving the rapid and efficient heat transfer of the side heat dissipation fins to the heat of the aluminum alloy plate itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Fig. shows an exploded view of the heat conduction mechanism;

[0022] Figure 2 Fig. shows a front view of the heat conduction mechanism;

[0023] Figure 3 Fig. shows a bottom view of the heat conduction mechanism;

[0024] Figure 4 Fig. shows a three-dimensional view of the whole device;

[0025] Figure 5 Fig. shows a diagram of the circulation mode of the lower half of the device.

[0026] In the figure: 1, computer case; 101, support groove; 102, circulation groove; 2, aluminum alloy plate; 201, diversion port; 202, partition rod; 203, support frame; 204, diversion groove; 3, side heat dissipation fins; 301, circulation port; 302, sealing frame. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] In order to make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below in conjunction with the embodiments.

[0028] Embodiment 1

[0029] Figures 1 - 5 Fig. shows a schematic diagram of the overall structure as a specific embodiment of the present utility model. Figures 1 - 5 Among them, it includes a computer case 1, and a support groove 101 opened in the lower half of the inner wall of the computer case 1. A circulation groove 102 is opened on one side of the inner wall of the computer case 1, and a heat conduction mechanism is arranged in the lower half of the computer case 1.

[0030] The heat conduction mechanism includes an aluminum alloy plate 2, a diversion port 201, a partition rod 202, a support frame 203, and a diversion groove 204. Among them, a diversion port 201 is opened at the upper end of the aluminum alloy plate 2, and the diversion port 201 penetrates through the upper and lower ends of the aluminum alloy plate 2. The partition rod 202 is installed on the lower surface of the aluminum alloy plate 2, and the lower end of the partition rod 202 is fixedly installed on the upper surface of the support frame 203. The diversion groove 204 penetrates through the upper and lower ends of the support frame 203. The partition rod 202 is located in the middle of the diversion port 201 and the diversion groove 204, and the support frame 203 is inserted into the support groove 101.

[0031] Through the connection between the diversion port 201 and the diversion groove 204, the heat generated inside the computer casing 1 can flow downward. At the same time, under the division of the heat flow by the partition rod 202, the heat flow is further split, enabling it to fully contact the inner wall of the diversion groove 204 and then flow out below the computer casing 1. While the heat flow is flowing, with the support of the aluminum alloy plate 2, the partition rod 202, and the support frame 203 itself for heat dissipation, as well as the support of the cooling fan inside the existing device, the heat generated inside the computer casing 1 can be dispersed and circulated multiple times. Under the division of the multiple diversion ports 201 and the diversion groove 204, the heat is circulated in multiple small-volume airflows, which can improve the safety and efficiency of heat dissipation of the aluminum alloy plate 2, thereby improving the heat dissipation efficiency of the device.

[0032] Figures 1 - 3 The figure shows a three-dimensional structural schematic diagram of the heat conduction mechanism as a specific embodiment of the present invention. Figures 1 - 3 In it, the heat conduction mechanism further includes side heat dissipation fins 3 and circulation ports 301. Among them, the side heat dissipation fins 3 are installed on the outside of the aluminum alloy plate 2, and the circulation ports 301 are opened in the middle of the side heat dissipation fins 3.

[0033] The lower end of the side heat dissipation fins 3 is fixedly connected to the inner wall of the computer casing 1, and a sealing frame 302 is installed on the upper surface of the side heat dissipation fins 3. The sealing frame 302 is simultaneously fixedly connected to both the aluminum alloy plate 2 and the computer casing 1.

[0034] The circulation groove 102 is located between the sealing frame 302 and the computer casing 1, and one side of the side heat dissipation fins 3 is fixedly connected to the circulation groove 102.

[0035] While the aluminum alloy plate 2 dissipates heat, under the conduction of multiple side heat dissipation fins 3 on its outside, the heat of the aluminum alloy plate 2 itself can be dissipated to the four sides, further improving the heat dissipation efficiency of the aluminum alloy plate 2 itself. At the same time, under the sealing of the sealing frame 302 at the top of the side heat dissipation fins 3 and the mutual connection of multiple circulation ports 301, the heat between the side heat dissipation fins 3 can be dissipated to the outside through the circulation groove 102, thereby improving the rapid and efficient heat transfer of the side heat dissipation fins 3 to the heat of the aluminum alloy plate 2 itself, and further improving the effect of the aluminum alloy plate 2 during heat dissipation use.

[0036] Figure 1 and Figure 4 The figure shows a partial structural schematic diagram of the heat conduction mechanism as a specific embodiment of the present invention. Figure 1 and Figure 4 In it, the aluminum alloy plate 2 is located in the middle of the computer casing 1, and the aluminum alloy plate 2 does not contact the four sides of the inner wall of the computer casing 1, and the side heat dissipation fins 3 are simultaneously connected to the four sides of the inner wall of the computer casing 1.

[0037] The four-side flow-through port 301 is communicated with the flow-through groove 102, and the support frame 203 and between the aluminum alloy plate 2 are communicated with the flow-through groove 102.

[0038] Under the contact of the side heat dissipation fins 3 and the computer casing 1, the heat of the aluminum alloy plate 2 can be first transferred to the computer casing 1 and then transferred to the outside of the device through the computer casing 1, further improving the heat dissipation efficiency of the aluminum alloy plate 2 on the side. At the same time, the space below the aluminum alloy plate 2 is set to be communicated with the side heat dissipation space, providing multi-directionality for the heat dissipation of the aluminum alloy plate 2, thereby improving its overall heat dissipation efficiency.

[0039] Working principle: When heat is generated inside the device, through the communication between the diversion port 201 and the diversion groove 204, and under the division of the heat flow by the partition rod 202, the heat inside the computer casing 1 can be split and flowed downward, making it fully contact with the inner wall of the diversion groove 204 to improve the heat dissipation effect. At the same time, under the conduction of multiple side heat dissipation fins 3 on the outside, the heat of the aluminum alloy plate 2 itself can be dissipated to the four sides, further improving the heat dissipation efficiency of the aluminum alloy plate 2 itself. And under the sealing of the top of the side heat dissipation fins 3 by the sealing frame 302, the sealing frame 302 and the flow-through groove 102 form an outward flow channel. By setting the space below the aluminum alloy plate 2 to be communicated with the side heat dissipation space, the multi-directionality of the heat dissipation is ensured, and the overall heat dissipation efficiency of the device is improved.

[0040] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it.

Claims

1. A notebook computer aluminum alloy heat sink, comprising a computer housing (1), and a support groove (101) provided on the lower half of the inner wall of the computer housing (1), characterized in that: A circulation groove (102) is provided on one side of the inner wall of the computer housing (1), and a heat conduction mechanism is provided on the lower half of the computer housing (1), comprising: The heat conduction mechanism comprises an aluminum alloy plate (2), a guide port (201), a partition rod (202), a support frame (203), and a guide groove (204), wherein the guide port (201) is provided at the upper end of the aluminum alloy plate (2), and the guide port (201) runs through the upper and lower ends of the aluminum alloy plate (2), the partition rod (202) is mounted on the lower end surface of the aluminum alloy plate (2), and the lower end of the partition rod (202) is fixedly mounted on the upper end surface of the support frame (203), the guide groove (204) runs through the upper and lower ends of the support frame (203), the partition rod (202) is located in the middle of the guide port (201) and the guide groove (204), and the support frame (203) is plugged into the support groove (101).

2. The aluminum alloy heat sink for notebook computers according to claim 1, characterized in that: The heat conduction mechanism further comprises a side heat dissipation fin (3) and a flow port (301), wherein the side heat dissipation fin (3) is installed on the outside of the aluminum alloy plate (2), and the flow port (301) is opened in the middle of the side heat dissipation fin (3).

3. The aluminum alloy heat sink for notebook computers according to claim 2, characterized in that: The lower end of the side heat dissipation fin (3) is fixedly connected to the inner wall of the computer housing (1), and a sealing frame (302) is installed on the upper surface of the side heat dissipation fin (3). The sealing frame (302) is fixedly connected to the aluminum alloy plate (2) and the computer housing (1) at the same time.

4. The aluminum alloy heat sink for notebook computer according to claim 3, characterized in that: The circulation groove (102) is located between the sealing frame (302) and the computer housing (1), and the side heat dissipation fin (3) on one side is fixedly connected to the circulation groove (102).

5. The aluminum alloy heat sink for notebook computers according to claim 2, characterized in that: The aluminum alloy plate (2) is located in the middle of the computer housing (1), and the aluminum alloy plate (2) does not contact the four sides of the inner wall of the computer housing (1), and the side heat dissipation fins (3) are simultaneously connected to the four sides of the inner wall of the computer housing (1).

6. The aluminum alloy heat sink for notebook computers according to claim 2, characterized in that: The flow ports (301) on the four sides are in communication with the flow groove (102), and the support frame (203) and the aluminum alloy plate (2) are in communication with the flow groove (102).

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