Common mode inductor easy to dissipate heat

Abstract

The utility model discloses a common mode inductor easy to dissipate heat, which comprises an inductor body, a plurality of mutually independent coil windings are wound on the inductor body along the circumferential direction of the inductor body, the inductor body is connected with a mounting seat, the mounting seat comprises an isolation plate which is clamped on the inductor body and can separate the coil windings, and the isolation plate is connected with the inductor body. A bottom support is connected to the lower end of the isolation plate, a plurality of heat dissipation plates are detachably connected to the bottom support, heat dissipation grooves corresponding to the heat dissipation plates are formed in the bottom support, and a plurality of heat dissipation holes are formed in the heat dissipation grooves. The utility model aims to overcome the problems in the prior art, and provides the common mode inductor easy to radiate heat, which is convenient to install and has a good radiating effect.

Description

Technical Field

[0001] The utility model relates to the field of inductors, in particular to a common-mode inductor with easy heat dissipation. Background Art

[0002] A common-mode inductor, also known as a common-mode choke coil, is an electronic component commonly used in computer switching power supplies and board design. Its main function is to filter common-mode electromagnetic interference signals and suppress the electromagnetic waves generated by high-speed signal lines from radiating outward, thereby reducing electromagnetic interference.

[0003] During the actual working process, the common-mode inductor may generate a large amount of heat, especially when operating at high load. If the heat cannot be dissipated in time, it may cause damage to the common-mode inductor. Currently, the common-mode inductors on the market mainly adopt two heat dissipation methods: the whole machine fan heat dissipation and the heat conduction glue on the PCB for heat dissipation and then through the circuit board. However, the fan is mainly responsible for the heat dissipation of the entire chassis rather than for specific components. Therefore, the heat generated by the common-mode inductor cannot be quickly transferred through this method, and the heat dissipation efficiency of the circuit board is not high. Therefore, it is also difficult to quickly dissipate the heat generated by the common-mode inductor through this method.

[0004] In summary, the existing heat dissipation methods are not ideal in dealing with the high heat problem of the common-mode inductor.

[0005] The present utility model is precisely generated based on the above deficiencies. Summary of the Utility Model

[0006] The purpose of the present utility model is to overcome the problems of the prior art and provide a common-mode inductor with easy heat dissipation that is convenient to install and has good heat dissipation effect.

[0007] To achieve the above purpose, the present utility model adopts the following scheme:

[0008] A common-mode inductor with easy heat dissipation, comprising: an inductor body, on which a plurality of independent coil windings are wound along its circumferential direction, an installation seat is connected to the inductor body, the installation seat includes a partition plate that is clamped on the inductor body and can separate the coil windings, a bottom bracket is connected to the lower end of the partition plate, a plurality of heat dissipation plates are detachably connected to the bottom bracket, heat dissipation grooves corresponding to the heat dissipation plates are provided on the bottom bracket, and a plurality of heat dissipation holes are provided on the heat dissipation grooves.

[0009] The described heat dissipation plate includes a mounting frame detachably connected to the bottom bracket. The mounting frame is sequentially provided with a first heat sink group, a second heat sink group, and a third heat sink group. The first heat sink group includes a plurality of first heat sinks arranged at intervals, and a first ventilation groove for ventilation is formed between two adjacent first heat sinks. The second heat sink group is disposed between the first heat sink group and the third heat sink group. The second heat sink group includes two heat dissipation blocks spaced apart and symmetrically arranged on the mounting frame. A plurality of second heat sinks are spaced between the two heat dissipation blocks, and a second ventilation groove is formed between adjacent second heat sinks. The third heat sink group includes a plurality of third heat sinks arranged at intervals. A fourth heat sink is provided between the plurality of third heat sinks. The length of the fourth heat sink is less than that of the third heat sink. The heights of the fourth heat sink, the third heat sink, and the first heat sink are higher than those of the second heat sink and the heat dissipation blocks.

[0010] Bending plates bent inward are provided on both sides of the mounting frame.

[0011] Protrusions are provided on the bottom bracket, and clamping grooves into which the protrusions can be snapped are provided on the mounting frame.

[0012] A plurality of horizontally penetrating heat dissipation through grooves are provided on the mounting frame.

[0013] A circular mounting groove is provided on the bottom bracket. A mounting seat is further connected between the mounting seat and the isolation plate. The mounting seat further includes a clamping block that is snapped into the mounting groove and forms a gap with the inner wall of the mounting groove. Positioning portions extending upward and arranged at intervals are provided on the clamping block. A receiving groove capable of accommodating the inductor body is provided on the positioning portion.

[0014] Leads extending outward are provided on the coil winding. A protrusion protruding upward is provided on the bottom bracket. A through hole passing through the protrusion and the bottom bracket is provided on the protrusion.

[0015] A positioning frame is connected to the bottom bracket. A positioning groove with an opening facing the lead is provided on the positioning frame. A abutting wall capable of abutting against the lead and guiding the bending of the lead is provided in the positioning groove.

[0016] The isolation plate and the bottom bracket are made of aluminum oxide heat-conducting ceramics.

[0017] The cross-sectional shape of the heat dissipation hole is a regular hexagon, and the heat dissipation hole penetrates to the inside of the bottom bracket.

[0018] Compared with the existing technology, the present utility model has the following advantages:

[0019] 1. When adopting this structure, by setting a detachable heat dissipation plate, heat dissipation grooves, and heat dissipation holes on the bottom bracket, the heat dissipation area can be effectively increased, the heat dissipation speed can be improved, and the heat generated by the coil winding can be further dissipated. At the same time, the isolation plate separates the coil windings, and the bottom bracket is connected to the heat dissipation plate, forming a direct heat conduction path from the inductor body to the heat dissipation plate, which helps to quickly transfer heat to the connection between the bottom bracket and the heat dissipation plate. At the same time, the combination of the isolation plate and the bottom bracket provides stable support for the coil windings, reduces structural deformation caused by thermal expansion, and the detachable design of the heat dissipation plate makes maintenance and replacement more convenient, which helps to improve the maintenance efficiency and service life of the product.

[0020] 2. By setting the first heat sink, the second heat sink, the third heat sink, the fourth heat sink, and the heat dissipation block, the heat dissipation area is increased, which helps to dissipate heat more effectively. The design of the first ventilation groove and the second ventilation groove promotes the flow of air inside each heat dissipation plate, further improving the heat dissipation effect. The design of the first heat sink, the second heat sink, the third heat sink, the fourth heat sink, and the heat dissipation block at different heights forms a heat dissipation gradient, with a structure that is high on both sides and low in the middle, which helps to disperse heat more evenly and avoid local overheating. The heat dissipation block and the second heat sink, due to their lower height, can be closer to the heat source, thus absorbing and dissipating heat more effectively. Description of the Drawings

[0021] Figure 1 is a schematic structural diagram of the common mode inductor with easy heat dissipation of the present utility model;

[0022] Figure 2 is a side view of the common mode inductor with easy heat dissipation of the present utility model;

[0023] Figure 3 is an exploded view of the common mode inductor with easy heat dissipation of the present utility model;

[0024] Figure 4 is an exploded view of the mounting bracket and the heat dissipation plate in the common mode inductor with easy heat dissipation of the present utility model;

[0025] Figure 5 is a side view of the heat dissipation plate in the common mode inductor with easy heat dissipation of the present utility model.

[0026] Reference numerals: inductance body 1; coil windings 2, pins 21; mounting base 3, partition plate 31, bottom bracket 32, heat dissipation grooves 321, heat dissipation holes 322, bumps 323, mounting grooves 324, protrusions 325, through holes 3251, positioning frames 326, positioning grooves 3261, abutting walls 3262, heat dissipation plates 33, mounting frames 331, card slots 3311, heat dissipation through grooves 3312, first heat sink group 332, first heat sinks 3321, first ventilation grooves 3322, second heat sink group 333, heat dissipation blocks 3331, second heat sinks 3332, second ventilation grooves 3333, third heat sink group 334, third heat sinks 3341, fourth heat sinks 3342, bending plates 335, latch blocks 34, positioning parts 341, accommodating grooves 3411. Detailed implementation manners

[0027] The following further elaborates on the present utility model in conjunction with embodiments:

[0028] The following further elaborates on the specific implementation manners of the present utility model in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0029] As Figures 1 to 5 shown, a common mode inductor with easy heat dissipation includes: an inductance body 1, on which a plurality of mutually independent coil windings 2 are wound along its circumferential direction, an installation base 3 is connected to the inductance body 1, the installation base 3 includes a partition plate 31 clamped on the inductance body 1 and capable of separating the coil windings 2, the lower end of the partition plate 31 is connected to a bottom bracket 32, a plurality of heat dissipation plates 33 are detachably connected to the bottom bracket 32, heat dissipation grooves 321 corresponding to the heat dissipation plates 33 are provided on the bottom bracket 32, and a plurality of heat dissipation holes 322 are provided on the heat dissipation grooves 321.

[0030] When adopting this structure, by providing detachable heat dissipation plates 33, heat dissipation grooves 321, and heat dissipation holes 322 on the bottom bracket 32, the heat dissipation area can be effectively increased, the heat dissipation speed can be improved, the heat generated by the coil windings 2 can be further dissipated. At the same time, the partition plate 31 separates the coil windings 2, and the bottom bracket 32 is connected to the heat dissipation plates 33, forming a direct heat conduction path from the inductance body 1 to the heat dissipation plates, which helps to quickly transfer the heat to the connection between the bottom bracket 32 and the heat dissipation plates 33. At the same time, the combination of the partition plate 31 and the bottom bracket 32 provides stable support for the coil windings 2, reducing the structural deformation caused by thermal expansion. The detachable design of the heat dissipation plates 33 makes maintenance and replacement more convenient, which helps to improve the maintenance efficiency and service life of the product.

[0031] The described heat dissipation plate 33 includes a mounting frame 331 detachably connected to the bottom bracket 32. On the mounting frame 331, a first heat sink group 332, a second heat sink group 333, and a third heat sink group 334 are sequentially provided. The first heat sink group 332 includes a plurality of first heat sinks 3321 arranged at intervals, and a first ventilation groove 3322 for ventilation is formed between two adjacent first heat sinks 3321. The second heat sink group 333 is disposed between the first heat sink group 332 and the third heat sink group 334. The second heat sink group 333 includes two heat dissipation blocks 3331 spaced apart and symmetrically arranged on the mounting frame 331. A plurality of second heat sinks 3332 are spaced between the two heat dissipation blocks 3331, and a second ventilation groove 3333 is formed between adjacent second heat sinks 3332. The third heat sink group 334 includes a plurality of third heat sinks 3341 arranged at intervals. A fourth heat sink 3342 is provided between the plurality of third heat sinks 3341. The length of the fourth heat sink 3342 is less than the length of the third heat sink 3341. The heights of the fourth heat sink 3342, the third heat sink 3341, and the first heat sink 3321 are higher than the heights of the second heat sink 3332 and the heat dissipation blocks 3331. By providing the first heat sink 3321, the second heat sink 3332, the third heat sink 3341, the fourth heat sink 3342, and the heat dissipation blocks 3331, the heat dissipation area is increased, which helps to dissipate heat more effectively. The design of the first ventilation groove 3322 and the second ventilation groove 3333 promotes the flow of air inside each heat dissipation plate, further improving the heat dissipation effect. The design of the first heat sink 3321, the second heat sink 3332, the third heat sink 3341, the fourth heat sink 3342, and the heat dissipation blocks 3331 with different heights forms a heat dissipation gradient, showing a structure with higher sides and lower middle, which helps to disperse heat more evenly and avoid local overheating. The heat dissipation blocks 3331 and the second heat sinks 3332, due to their lower heights, can be closer to the heat source, thereby absorbing and dissipating heat more effectively. The mounting frame 331 is detachably connected to the bottom bracket 32, facilitating installation.

[0032] On both sides of the described mounting frame 331, there are bending plates 335 bent inward. The presence of the bending plates 335 can increase the rigidity and stability of the mounting frame 331, improve the load-bearing capacity of the mounting frame 331. The bending plates 335 can serve as additional heat dissipation surfaces, helping to dissipate heat more effectively. The bending plates 335 can guide the air flow, optimize the air flow around the heat dissipation plate 33, and improve the heat dissipation efficiency. The bending plates 335 can serve as lateral supports for the mounting frame 331, making the mounting frame 331 more stable when installed.

[0033] The described mounting bracket 331 is provided with a plurality of laterally penetrating heat dissipation through grooves 3312. The heat dissipation through grooves 3312 allow air to circulate inside the mounting bracket 331, thereby taking away more heat and improving the overall heat dissipation efficiency.

[0034] The described bottom bracket 32 is provided with a circular mounting groove 324. There is also a mounting seat 3 connected between the mounting seat 3 and the isolation plate 31. The mounting seat 3 further includes a clamping block 34 that is snapped into the mounting groove 324 and forms a gap with the inner wall of the mounting groove 324. The clamping block 34 is provided with upwardly extending and spaced positioning portions 341. The positioning portions 341 are provided with receiving grooves 3411 that can accommodate the inductor body 1. The positioning portions 341 and the receiving grooves 3411 on the clamping block 34 provide precise positioning for the inductor body 1, ensuring the accurate position of the inductor body 1 on the mounting bracket, which helps to maintain the performance and stability of the inductor. The clamping block 34 is designed to be snapped into the mounting groove 324, simplifying the installation process and making the installation of the inductor body 1 more convenient and fast. The gap formed between the clamping block 34 and the inner wall of the mounting groove 324 can be used for potting, making the connection more stable. The design of the circular mounting groove 324 and the clamping block 34 enables the mounting groove 324 to adapt to inductor bodies of different sizes, with a wider range of adaptability. At the same time, for the stability of the connection, glue is applied between the positioning portion 341 and the lower end of the isolation plate 31 during connection, and glue is also applied in the gap between the clamping block 34 and the inner wall of the mounting groove 324, thereby making the connection between the isolation plate 31, the bottom bracket 32, and the clamping block 34 more firm.

[0035] The described coil winding 2 is provided with outwardly extending pins 21. The bottom bracket 32 is provided with an upwardly protruding protrusion 325. The protrusion 325 is provided with a through hole 3251 that penetrates the protrusion 325 and the bottom bracket 32. The pin 21 passes through the through hole 3251 to the lower side of the bottom bracket 32. The through hole 3251 is used to guide the setting of the pin 21, facilitating the positioning of the pin 21 and making the connection more convenient.

[0036] The bottom bracket 32 is connected with a positioning bracket 326. The positioning bracket 326 is provided with a positioning groove 3261 with an opening facing the pin 21. The positioning groove 3261 is provided with a abutting wall 3262 that can abut against the pin 21 and guide the bending of the pin 21. The setting of the abutting wall 3262 is used for support and also facilitates potting at the bending position to fix the pin 21 to the abutting wall 3262, making the connection more stable. And the positioning groove 3261 can protect the bending position and prevent the bending position from breaking, which is safer.

[0037] The isolation plate 31 and the bottom bracket 32 are made of alumina heat-conducting ceramics. Alumina heat-conducting ceramics have the advantages of high thermal conductivity, high mechanical strength and high temperature resistance, which are convenient for processing and at the same time make the isolation plate 31 and the bottom bracket 32 have high strength.

[0038] The cross-sectional shape of the heat dissipation hole 322 is a regular hexagon, and the heat dissipation hole 322 penetrates into the interior of the bottom bracket 32, thereby further increasing the contact area between the bottom bracket 32 and the air and between the air and the mounting bracket 331, and improving the heat dissipation performance.

[0039] The present invention has been generally described in detail above, but based on the present invention, some modifications or improvements can be made, which are obvious to those of ordinary skill in the art. Therefore, modifications or improvements made without departing from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. A common mode inductor that is easy to dissipate heat, characterized in that: include: An inductor body (1), wherein a plurality of mutually independent coil windings (2) are wound on the inductor body (1) along its circumferential direction, the inductor body (1) is connected to a mounting seat (3), the mounting seat (3) comprises an isolation plate (31) which is snap-fitted to the inductor body (1) and capable of separating the coil windings (2), the lower end of the isolation plate (31) is connected to a bottom bracket (32), a plurality of heat dissipation plates (33) are detachably connected to the bottom bracket (32), the bottom bracket (32) is provided with heat dissipation grooves (321) corresponding to the heat dissipation plates (33), and the heat dissipation grooves (321) are provided with a plurality of heat dissipation holes (322).

2. The common mode inductor with easy heat dissipation according to claim 1, characterized in that: The heat sink (33) comprises a mounting frame (331) detachably connected to the bottom bracket (32); a first heat sink group (332), a second heat sink group (333) and a third heat sink group (334) are sequentially arranged on the mounting frame (331); the first heat sink group (332) comprises a plurality of first heat sinks (3321) arranged at intervals; a first ventilation slot (3322) capable of providing ventilation is formed between two adjacent first heat sinks (3321); the second heat sink group (333) is arranged between the first heat sink group (332) and the third heat sink group (334); the second heat sink group (333) comprises two heat sinks (332) arranged at intervals and symmetrically on the mounting frame (331); A heat sink (3331), a plurality of second heat sinks (3332) are arranged between two of the heat sinks (3331), a second ventilation slot (3333) is formed between adjacent second heat sinks (3332), the third heat sink group (334) comprises a plurality of third heat sinks (3341) arranged at intervals, a fourth heat sink (3342) is arranged between the plurality of third heat sinks (3341), the length of the fourth heat sink (3342) is less than the length of the third heat sink (3341), the height of the fourth heat sink (3342), the third heat sink (3341) and the first heat sink (3321) is higher than the height of the second heat sink (3332) and the heat sink (3331).

3. The common mode inductor with easy heat dissipation according to claim 2, characterized in that: Both sides of the mounting frame (331) are provided with inwardly bent plates (335).

4. The common mode inductor with easy heat dissipation according to claim 2, characterized in that: The bottom bracket (32) is provided with a protrusion (323), and the mounting frame (331) is provided with a slot (3311) into which the protrusion (323) can be inserted.

5. The common mode inductor with easy heat dissipation according to claim 2, characterized in that: The mounting frame (331) is provided with a plurality of heat dissipation slots (3312) extending transversely therethrough.

6. The common mode inductor with easy heat dissipation according to claim 1, characterized in that: The bottom bracket (32) is provided with a circular mounting groove (324); a mounting base (3) is further connected between the mounting base (3) and the isolation plate (31); the mounting base (3) further comprises a clamping block (34) which is inserted into the mounting groove (324) and forms a gap with the inner wall of the mounting groove (324); the clamping block (34) is provided with a positioning portion (341) extending upward and arranged at intervals; the positioning portion (341) is provided with a receiving groove (3411) capable of receiving the inductor body (1).

7. The common mode inductor with easy heat dissipation according to claim 1, characterized in that: The coil winding (2) is provided with a pin (21) extending outward, the bottom bracket (32) is provided with a protrusion (325) protruding upward, and the protrusion (325) is provided with a through hole (3251) penetrating the protrusion (325) and the bottom bracket (32).

8. The common mode inductor with easy heat dissipation according to claim 7, characterized in that: The bottom bracket (32) is connected to a positioning frame (326), the positioning frame (326) is provided with a positioning groove (3261) opening toward the pin (21), and the positioning groove (3261) is provided with a supporting wall (3262) capable of supporting the pin (21) and guiding the pin (21) to bend.

9. The common mode inductor with easy heat dissipation according to claim 1, characterized in that: The isolation plate (31) and the bottom bracket (32) are made of alumina thermal conductive ceramics.

10. The common mode inductor with easy heat dissipation according to claim 1, characterized in that: The cross-sectional shape of the heat dissipation hole (322) is a regular hexagon, and the heat dissipation hole (322) penetrates into the interior of the bottom bracket (32).

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