Semiconductor wafer ultrasonic cleaning device with drying mechanism

Abstract

The utility model relates to the technical field of semiconductor wafer processing, in particular to a semiconductor wafer ultrasonic cleaning device with a drying mechanism, which comprises a base, a cleaning tank is arranged at the upper end of the base, and a plurality of holes are equidistantly arranged in two sides of the base; a movable frame is slidably connected between the inner walls of the two sides of the support, and a bearing frame is slidably connected to one side of the movable frame in a penetrating mode. A proper amount of cleaning liquid is stored in the cleaning tank, the cleaning liquid flows into the bearing frame through the multiple through holes, the semiconductor wafer in the bearing frame is cleaned in cooperation with the ultrasonic generator, the semiconductor wafer is cleaned through ultrasonic waves, particles, metal impurities, organic matter and other pollutants on the surface of a wafer body can be thoroughly removed, and the service life of the semiconductor wafer is prolonged. The movable frame drives the bearing frame to slide upwards, the hot air flow is sprayed out from the multiple holes, and the sprayed hot air flow flows into the bearing frame through the multiple through holes to dry the semiconductor wafers in the bearing frame.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to a semiconductor chip ultrasonic cleaning device with a drying mechanism. Background Art

[0002] Semiconductor wafers are the basic materials for manufacturing semiconductor products such as integrated circuits and microelectronic devices, and their quality directly affects the performance and reliability of semiconductor products. Wafers are widely used in fields such as computers, communications, consumer electronics, automotive electronics, and aerospace, and are the cornerstone of the modern electronics industry. The semiconductor chip ultrasonic cleaning device uses the cavitation effect, acceleration effect, and rectilinear flow effect of ultrasonic waves in liquids to efficiently and thoroughly clean the surface of the wafer, removing surface particles, metal impurities, organic substances, and other contaminants, ensuring that the cleanliness of the wafer reaches high standards.

[0003] After retrieval, the utility model patent with the Chinese patent publication number CN220781583U discloses an ultrasonic cleaning device, belonging to the general cleaning technology field. An ultrasonic cleaning device provided by the utility model includes an ultrasonic cleaning machine and a cleaning rack. The cleaning rack is arranged inside the ultrasonic cleaning machine. The cleaning rack includes multiple groups of cleaning frames. Each cleaning frame includes a cleaning column, a filtering side plate, a filtering bottom plate, and a lifting assembly. The lifting assembly includes a lifting sliding column and a lifting cross beam. The upper part of the cleaning column is provided with an upper sliding groove and a lower sliding groove. The width of the upper sliding groove is smaller than that of the lower sliding groove. The lower end of the lifting sliding column is provided with a sliding clamping block. The sliding clamping block is slidably arranged in the lower sliding groove. The lifting sliding column is slidably arranged in the upper sliding groove. The upper top wall of the lower sliding groove limits the sliding of the sliding clamping block. The lifting cross beam is erected on the upper ends of two adjacent groups of lifting sliding columns in the front and back. The ultrasonic cleaning device provided by the utility model places parts in the cleaning frame, avoiding stacking, expanding the cleaning area, improving the cleaning efficiency, and facilitating the taking and placing of the cleaning frame.

[0004] After retrieval, the above patent processes the cleaning of materials, but the device fails to process the drying after the cleaning of materials, which is likely to cause moisture to remain on the surface of the cleaned materials. If these moisture is not removed in time, new contaminants such as dust and particles may be introduced in subsequent processes, thereby reducing the cleanliness of the materials. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a semiconductor chip ultrasonic cleaning device with a drying mechanism, and through this device, the effect of facilitating the cleaning and drying of semiconductor chips is achieved, so as to solve the problem that it is not convenient to clean and dry semiconductor chips in the prior art.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A semiconductor chip ultrasonic cleaning device with a drying mechanism, comprising a base, a cleaning tank is arranged at the upper end of the base, a cavity is arranged inside the base, a plurality of heating wires are fixedly connected inside the cavity, a plurality of holes are equidistantly arranged inside both sides of the base, the holes are inclined, and the holes communicate with the cavity; a bracket, the bracket is arranged at the upper end of the base, a movable frame is slidably connected between the inner walls on both sides of the bracket, a bearing frame is slidably connected through one side of the movable frame, and a plurality of through holes are arranged on the side wall of the bearing frame.

[0008] Preferably, a groove is arranged on the side wall of the base, and an air pump is fixedly connected inside the groove through bolts.

[0009] Preferably, the output end of the air pump is fixedly connected with a pipeline, and the pipeline communicates with the cavity.

[0010] Preferably, two motors are fixedly connected to the upper end of the bracket, and screw rods are rotatably connected inside both sides of the bracket, and the output end of the motor is fixedly connected with the end of the screw rod.

[0011] Preferably, sliding grooves are arranged on the inner walls on both sides of the bracket, sliding blocks are fixedly connected to both sides of the movable frame, and the sliding blocks are slidably connected with the sliding grooves.

[0012] Preferably, the screw rod is rotatably connected with the sliding groove, and the screw rod is in threaded rotation connection with the sliding block.

[0013] Compared with the prior art, the advantages of the present utility model are as follows:

[0014] 1. The operator places the semiconductor chip inside the bearing frame, then slides the bearing frame into the movable frame, and the movable frame drives the bearing frame to slide into the cleaning tank. An appropriate amount of cleaning liquid is stored inside the cleaning tank, and the liquid level of the cleaning liquid is below the holes. The cleaning liquid flows into the bearing frame through a plurality of through holes, and then cooperates with an ultrasonic generator to clean the semiconductor chip inside the bearing frame, so as to facilitate the cleaning of the semiconductor chip. Cleaning the semiconductor chip by ultrasonic waves can thoroughly remove particles, metal impurities, organic substances and other pollutants on the surface of the wafer body, and ensure the cleanliness of the wafer.

[0015] 2. After the semiconductor chip is cleaned, the movable frame drives the bearing frame to slide upward. An air flow flows inside the cavity, the air flow is heated by the heating wire, and then the hot air flow sprays out from a plurality of holes. The sprayed hot air flow flows into the bearing frame through a plurality of through holes to dry the semiconductor chip inside the bearing frame, so as to facilitate the drying of the semiconductor chip. By drying the semiconductor chip, the residual moisture on the surface of the semiconductor chip can be effectively removed, and the possible pollution or damage to the chip caused by moisture in subsequent processes can be avoided. Description of the Drawings

[0016] Figure 1 The front view external structure schematic diagram of a semiconductor chip ultrasonic cleaning device with a drying mechanism proposed by the present utility model.

[0017] Figure 2 The front view sectional structure schematic diagram of a semiconductor chip ultrasonic cleaning device with a drying mechanism proposed by the present utility model.

[0018] Figure 3 The side view sectional structure schematic diagram of a semiconductor chip ultrasonic cleaning device with a drying mechanism proposed by the present utility model.

[0019] In the figure: 1 base, 2 cleaning tank, 3 cavity, 4 heating wire, 5 hole, 6 groove, 7 air pump, 8 pipeline, 9 bracket, 10 motor, 11 screw, 12 chute, 13 slider, 14 movable frame, 15 carrying frame, 16 through hole. Specific embodiments

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0021] Referring to Figures 1-3 , a semiconductor chip ultrasonic cleaning device with a drying mechanism includes a base 1. A cleaning tank 2 is provided at the upper end of the base 1. A cavity 3 is provided inside the base 1. A plurality of heating wires 4 are fixedly connected inside the cavity 3. A plurality of holes 5 are equidistantly provided inside both sides of the base 1. The holes 5 are inclined and communicate with the cavity 3. A bracket 9 is provided at the upper end of the base 1. A movable frame 14 is slidably connected between the inner walls on both sides of the bracket 9. A carrying frame 15 is slidably connected through one side of the movable frame 14. A plurality of through holes 16 are provided on the side wall of the carrying frame 15. An ultrasonic generator is installed inside the base 1. The vibration plate of the ultrasonic generator is located inside the cleaning tank 2. An operator places the semiconductor chip inside the carrying frame 15, and then slides the carrying frame 15 into the movable frame 14. The movable frame 14 drives the carrying frame 15 to slide into the cleaning tank 2. An appropriate amount of cleaning liquid is stored inside the cleaning tank 2. The liquid level of the cleaning liquid is below the holes 5. The cleaning liquid flows into the carrying frame 15 through the plurality of through holes 16, and then cooperates with the ultrasonic generator to clean the semiconductor chip inside the carrying frame 15. After the semiconductor chip is cleaned, the movable frame 14 drives the carrying frame 15 to slide upward. An air flow flows inside the cavity 3. The air flow is heated by the heating wire, and then the hot air flow is ejected from the plurality of holes 5. The ejected hot air flow flows into the carrying frame 15 through the plurality of through holes 16, thereby drying the semiconductor chip inside the carrying frame 15.

[0022] A groove 6 is provided on the side wall of the base 1, and an air pump 7 is fixedly connected inside the groove 6 by bolts. By installing the air pump 7 inside the groove 6, it is convenient to inspect and repair the air pump 7.

[0023] The output end of the air pump 7 is fixedly connected with a pipeline 8, and the pipeline 8 is communicated with the cavity 3. External air flow is transported into the cavity 3 through the air pump 7 and the pipeline 8.

[0024] Two motors 10 are fixedly connected to the upper end of the bracket 9. Screws 11 are rotatably connected inside both sides of the bracket 9. The output end of the motor 10 is fixedly connected with the end of the screw 11. The screw 11 is driven to rotate by the motor 10.

[0025] Chute 12 is provided on the inner walls of both sides of the bracket 9. Sliders 13 are fixedly connected to both sides of the movable frame 14. The sliders 13 are slidably connected with the chute 12. The sliding of the sliders 13 is limited by the chute 12.

[0026] The screw 11 is rotatably connected with the chute 12 and is in threaded rotation connection with the slider 13. When the screw 11 rotates, the slider 13 drives the movable frame 14 to slide up and down.

[0027] In the present utility model, an operator places the semiconductor wafer inside the carrier frame 15, and then slides the carrier frame 15 into the movable frame 14. The movable frame 14 drives the carrier frame 15 to slide into the cleaning tank 2. An appropriate amount of cleaning liquid is stored inside the cleaning tank 2. The liquid level of the cleaning liquid is below the holes 5. The cleaning liquid flows into the carrier frame 15 through a plurality of through holes 16, and then cooperates with the ultrasonic generator to clean the semiconductor wafer inside the carrier frame 15, thereby facilitating the cleaning of the semiconductor wafer.

[0028] After the semiconductor wafer is cleaned, the movable frame 14 drives the carrier frame 15 to slide upward. Air flow flows inside the cavity 3. The air flow is heated by the heating wire, and then the hot air flow sprays out from a plurality of holes 5. The sprayed hot air flow flows into the carrier frame 15 through a plurality of through holes 16, thereby drying the semiconductor wafer inside the carrier frame 15, and thus facilitating the drying of the semiconductor wafer.

[0029] The above is only a preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent replacements or changes, and should be covered within the protection scope of the present utility model.

Claims

1. A semiconductor wafer ultrasonic cleaning device with a drying mechanism, characterized in that: include A base (1), wherein a cleaning tank (2) is arranged at the upper end of the base (1), a cavity (3) is arranged inside the base (1), a plurality of heating wires (4) are fixedly connected inside the cavity (3), and a plurality of holes (5) are arranged at equal distances inside both sides of the base (1), the holes (5) are arranged obliquely, and the holes (5) are connected to the cavity (3); A bracket (9), the bracket (9) being arranged at the upper end of the base (1), a movable frame (14) being slidably connected between the inner walls on both sides of the bracket (9), a carrying frame (15) being slidably connected through one side of the movable frame (14), and a plurality of through holes (16) being arranged on the side wall of the carrying frame (15).

2. A semiconductor wafer ultrasonic cleaning device with a drying mechanism according to claim 1, characterized in that: The side wall of the base (1) is provided with a groove (6), and an air pump (7) is fixedly connected to the inside of the groove (6) by means of bolts.

3. A semiconductor wafer ultrasonic cleaning device with a drying mechanism according to claim 2, characterized in that: The output end of the air pump (7) is fixedly connected to a pipeline (8), and the pipeline (8) is in communication with the cavity (3).

4. The semiconductor wafer ultrasonic cleaning device with a drying mechanism according to claim 1, characterized in that: Two motors (10) are fixedly connected to the upper end of the bracket (9), and screw rods (11) are rotatably connected inside both sides of the bracket (9), and the output end of the motor (10) is fixedly connected to the end of the screw rod (11).

5. The semiconductor wafer ultrasonic cleaning device with a drying mechanism according to claim 4, characterized in that: The inner walls on both sides of the bracket (9) are provided with sliding grooves (12), and the two sides of the movable frame (14) are fixedly connected with sliding blocks (13), and the sliding blocks (13) are slidably connected to the sliding grooves (12).

6. The semiconductor wafer ultrasonic cleaning device with a drying mechanism according to claim 5, characterized in that: The screw rod (11) is rotationally connected to the slide groove (12), and the screw rod (11) is threadedly rotationally connected to the slider (13).

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