Wafer bearing device for cleaning tank

Abstract

The utility model provides a wafer bearing device for a cleaning tank, and the device comprises a wafer contact assembly which is detachably connected with the lower end of a first longitudinal supporting plate and the lower end of a second longitudinal supporting plate, and is used for bearing a wafer in the cleaning tank of cleaning equipment; the wafer contact assembly comprises a first V-shaped rack, a second V-shaped rack, a first Y-shaped rack and a second Y-shaped rack. The first Y-shaped rack and the second Y-shaped rack are arranged between the first V-shaped rack and the second V-shaped rack. And when the edge of the wafer is in contact with the tooth groove of the first V-shaped rack and the tooth groove of the second V-shaped rack, the edge of the wafer is suspended in the tooth groove of the first Y-shaped rack and the tooth groove of the second Y-shaped rack. The contact points of the wafer and the contactor are reduced, the cleaning effect on the wafer is improved, the friction between the wafer and the groove is reduced, and the wafer is prevented from being scratched unnecessarily. In addition, the Y-shaped rack design has an effect of putting down the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wafer carrying device for a cleaning tank. Background Art

[0002] The main function of the Guide is to carry the wafer for cleaning. At present, the slot-type cleaning equipment mainly has two different structures: point-line contact and surface contact, which do not affect the relevant functions of the Guide itself. First, place the wafer on the integrated Guide, adjust the levelness to ensure that the wafer is vertically perpendicular. Pure water is introduced into the water tank, and a flow field flowing towards the Guide and the wafer surface is generated in the water tank, and the overflow around the tank is maintained to clean the particles on the wafer surface. Finally, a quick drain valve is installed at the side position of the water tank to quickly drain the liquid in the tank.

[0003] In the prior art, the Guide (wafer carrying device) usually integrally forms and welds the contactor for carrying the wafer and the support assembly for fixing the contactor. It needs to be formed at one time during processing and requires extremely high processing accuracy. If one of the racks in the contactor does not meet the requirements, the entire Guide is very likely to be scrapped. And if there is a tooth profile crack during use, the entire Guide needs to be replaced, resulting in huge processing costs and usage costs.

[0004] In addition, in the prior art, the contactor of the Guide (wafer carrying device) is in surface contact with the wafer. Therefore, the water flow in the spray pipe in the tank cannot wash the surface contact part, and at the same time, due to the excessive blockage of the wafer in the tooth profile inner groove, the water flow in the groove part is less, which is not conducive to cleaning the groove and the wafer surface in contact with it, thus affecting the final cleaning effect, and more Particles will be left on the wafer surface. Moreover, under the movement of the flow field, the surface contact part intensifies the friction, causing unnecessary particles and scratches on the wafer. Summary of the Utility Model

[0005] Based on the above problems, the utility model provides a wafer carrying device for a cleaning tank, aiming to solve the technical problem of poor cleaning effect when longitudinally carrying the wafer through surface contact in the prior art.

[0006] A wafer carrying device for a cleaning tank includes:

[0007] A first main support plate and a second main support plate, which are used to be fixed on the machine table of the cleaning equipment;

[0008] A first longitudinal support plate and a second longitudinal support plate;

[0009] The first horizontal support plate and the second horizontal support plate, the first horizontal support plate is respectively connected to the upper end of the first vertical support plate and the first main support plate, and the second horizontal support plate is respectively connected to the upper end of the second vertical support plate and the second main support plate;

[0010] The wafer contact assembly is detachably connected to the lower ends of the first vertical support plate and the second vertical support plate respectively, and is used for carrying the wafer in the cleaning tank of the cleaning equipment;

[0011] The wafer contact assembly includes a first V-shaped rack, a second V-shaped rack, a first Y-shaped rack and a second Y-shaped rack, and the first Y-shaped rack and the second Y-shaped rack are both arranged between the first V-shaped rack and the second V-shaped rack;

[0012] When the edge of the wafer contacts the tooth grooves of the first V-shaped rack and the second V-shaped rack, the edge of the wafer is suspended in the tooth grooves of the first Y-shaped rack and the second Y-shaped rack.

[0013] Further, a first anti-bending block is provided on the lower end surface of the first horizontal support plate, and a second anti-bending block is provided on the lower end surface of the second horizontal support plate.

[0014] Further, a first horizontal reinforcing rib is provided on the upper end surface of the first horizontal support plate, and a second horizontal reinforcing rib is provided on the upper end surface of the second horizontal support plate.

[0015] Further, the lower end surface of the first horizontal support plate is connected to the upper end surface of the first main support plate through at least one adjustable nut assembly;

[0016] The lower end surface of the second horizontal support plate and the upper end surface of the second main support plate are connected through at least one adjustable nut assembly.

[0017] Further, a first support block is provided on the lower end surface of the first main support plate, and a second support block is provided on the lower end surface of the second main support plate;

[0018] The first support block and the second support block are respectively welded to the machine table of the cleaning equipment.

[0019] Further, the first main support plate and the first support block are connected from bottom to top through at least one adjustable nut assembly; the second main support plate and the second support block are connected from bottom to top through at least one adjustable nut assembly.

[0020] Further, a first reinforcing plate is further included;

[0021] The first main support plate is an L-shaped plate formed by connecting a horizontal plate and a vertical plate. The horizontal plate of the first main support plate is connected to the first horizontal support plate, and the lower end of the vertical plate of the first main support plate is fixed on the machine table of the cleaning equipment;

[0022] The first reinforcing plate is connected to both the horizontal plate and the vertical plate of the first main supporting plate at the same time.

[0023] Furthermore, it further includes a second reinforcing plate;

[0024] The second main supporting plate is an L-shaped plate formed by connecting a horizontal plate and a vertical plate. The horizontal plate of the second main supporting plate is connected to the second horizontal supporting plate, and the lower end of the vertical plate of the second main supporting plate is fixed on the machine table of the cleaning device;

[0025] The second reinforcing plate is connected to both the horizontal plate and the vertical plate of the second main supporting plate at the same time.

[0026] The beneficial technical effects of the present utility model are as follows: The present utility model longitudinally supports the wafer by arranging a pair of V-shaped racks with tooth grooves, and arranges a pair of Y-shaped racks not in actual contact with the wafer, only allowing the wafer to be suspended in the tooth grooves, so as to achieve line contact with the two tooth surfaces of the contactor instead of surface contact, reducing the contact points between the wafer and the contactor, thereby reducing the excessive blockage of the wafer to the grooves, being beneficial to the flow of the cleaning liquid in the grooves, improving the cleaning effect on the wafer, and less contact reducing the friction between the wafer and the grooves, thus avoiding unnecessary scratching of the wafer. In addition, the Y-shaped rack design has a laying-down effect on the wafer. Description of the Drawings

[0027] Figure 1 It is a front view structural schematic diagram of a wafer carrying device for a cleaning tank provided by the present utility model;

[0028] Figure 2 It is a three-dimensional structural schematic diagram of a wafer carrying device for a cleaning tank provided by the present utility model;

[0029] Figure 3 、 Figure 7 It is a side view structural schematic diagram of a wafer carrying device for a cleaning tank provided by the present utility model;

[0030] Figure 4 It is a structural schematic diagram of a wafer carrying device for a cleaning tank provided by the present utility model placed in a cleaning tank;

[0031] Figure 5 It is a partial structural schematic diagram of the tooth profile of the V-shaped rack of a wafer carrying device for a cleaning tank provided by the present utility model;

[0032] Figure 6 It is a partial structural schematic diagram of the tooth profile of the Y-shaped rack of a wafer carrying device for a cleaning tank provided by the present utility model.

[0033] Wherein, 1a - the first main support plate; 1b - the second main support plate; 3a - the first longitudinal support plate; 3b - the second longitudinal support plate; 4a - the first V-shaped rack; 4b - the second V-shaped rack; 4c - the first Y-shaped rack; 4d - the second Y-shaped rack; 5a - the first anti-bending block; 5b - the second anti-bending block; 6a - the first transverse reinforcing rib; 6b - the second transverse reinforcing rib; 7 - an adjustable nut assembly; 8a - the first support block; 8b - the second support block; 9a - the first reinforcing plate; 9b - the second reinforcing plate. Detailed implementation mode

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0035] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other.

[0036] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but it is not a limitation of the present invention.

[0037] See Figures 1 - 4 , the present invention provides a wafer carrying device for a cleaning tank, including:

[0038] The first main support plate (1a) and the second main support plate (1b), which are used to be fixed on the machine table of the cleaning equipment;

[0039] The first longitudinal support plate (3a) and the second longitudinal support plate (3b);

[0040] The first transverse support plate (2a) and the second transverse support plate (2b), the first transverse support plate (2a) is respectively connected to the upper end of the first longitudinal support plate (3a) and the first main support plate (1a), and the second transverse support plate (2b) is respectively connected to the upper end of the second longitudinal support plate (3b) and the second main support plate (1b);

[0041] The wafer contact assembly is detachably connected to the lower ends of the first longitudinal support plate (3a) and the second longitudinal support plate (3b) respectively, and is used to carry the wafer in the cleaning tank of the cleaning equipment;

[0042] The wafer contact assembly includes a first V-shaped rack (4a), a second V-shaped rack (4b), a first Y-shaped rack (4c) and a second Y-shaped rack (4d). The first Y-shaped rack (4c) and the second Y-shaped rack (4d) are both arranged between the first V-shaped rack (4a) and the second V-shaped rack (4b).

[0043] When the edge of the wafer contacts the tooth grooves of the first V-shaped rack (4a) and the second V-shaped rack (4b), the edge of the wafer is suspended in the tooth grooves of the first Y-shaped rack (4c) and the second Y-shaped rack (4d).

[0044] The first longitudinal support plate (3a) and the second longitudinal support plate (3b) are used as supports for the wafer contact assembly. The first main support plate (1a) and the second main support plate (1b) are used for fixed support on the coating machine platform. The first transverse support plate (2a) and the second transverse support plate (2b) are used as bridges between the longitudinal support plates and the main support plates.

[0045] The first longitudinal support plate (3a) and the second longitudinal support plate (3b) are arranged parallel and opposite to each other. Each of the first V-shaped rack, the second V-shaped rack, the first Y-shaped rack and the second Y-shaped rack is detachably fixed to the lower end of the first longitudinal support plate (3a) at one end and detachably fixed to the lower end of the second longitudinal support plate (3b) at the other end. After the first main support plate (1a) and the second main support plate (1b) are fixed on the machine table, the wafer contact assembly is in the cleaning tank. Seen from the cross-section, the first Y-shaped rack (4c) and the second Y-shaped rack (4d) are arranged in the middle, the first V-shaped rack (4a) and the second V-shaped rack (4b) are arranged on both sides, and the four racks are arranged in a shape similar to an arc. The wafer stands vertically on the arc surfaces at the left and right ends of the two V-shaped racks, and the contact points are the tangent points of the wafer and the V-shaped racks. The V-shaped rack has a V-shaped tooth profile, which is mainly used to lift the wafer, so as to minimize the abrasion on the wafer surface. The wafer is longitudinally inserted into the tooth grooves of the first V-shaped rack (4a) and the second V-shaped rack (4b), and the wafer does not actually contact the first Y-shaped rack (4c) and the second Y-shaped rack (4d), but is suspended in their grooves. For example, there is a 0.1mm gap between them. If the wafer tilts in the tooth grooves of the V-shaped rack, the Y-shaped teeth of the two Y-shaped racks can just block the wafer to prevent further tilting, playing a role in preventing the wafer from falling, and can avoid wafer edge abrasion and prevent the phenomenon of wafer top patch.

[0046] As Figures 5 - 7 shown, since the thickness of the wafer Wafer is 775 ± 25um, the bottom width D of the grooves of the first V-shaped rack (4a) and the second V-shaped rack (4b) can be designed to be 0.8mm. The cross-section of the bottoms of the grooves of the first Y-shaped rack (4c) and the second Y-shaped rack (4d) is semi-circular, and the dimension radius R is designed to be 0.4mm. The V-shaped tooth profile supports the wafer, and the Y-shaped tooth profile fixes and positions the wafer.

[0047] In the present utility model, a pair of V-shaped racks are provided with tooth grooves to longitudinally support a wafer, and a pair of Y-shaped racks are arranged not to actually contact the wafer but only to suspend the wafer in the tooth grooves. The entire wafer only contacts two V-shaped racks, and the rest is hollowed out, rather than the surface-to-surface contact in the prior art, reducing the contact points between the wafer and the contactor, thereby reducing the excessive blockage of the wafer to the grooves, facilitating the flow of the cleaning liquid in the grooves, improving the cleaning effect on the wafer, and less contact reducing the friction between the wafer and the grooves, thus avoiding unnecessary scratches on the wafer. In addition, the Y-shaped rack design has a laying-down effect on the wafer.

[0048] The wafer contact assembly is detachably fixed between the first longitudinal support plate (3a) and the second longitudinal support plate (3b), and can be connected by bolts, rather than the integral non-detachable type in the prior art. When there is a rack that does not meet the conditions or a rack with a broken tooth profile, it can be replaced individually in time, avoiding the scrapping of the entire device and reducing the processing cost and usage cost.

[0049] Furthermore, the first V-shaped rack, the second V-shaped rack, the first Y-shaped rack, and the second Y-shaped rack are round rod-shaped, and the material is polychlorotrifluoroethylene PCTFE, which is smoother, provides additional protection for the wafer surface, and is not prone to generating particles.

[0050] Furthermore, a first anti-bending block (5a) is provided on the lower end surface of the first transverse support plate (2a), and a second anti-bending block (5b) is provided on the lower end surface of the second transverse support plate (2b).

[0051] An anti-bending block is provided at the right angle formed by the connection between the lower end surface of the first transverse support plate (2a) and the first longitudinal support plate (3a), and an anti-bending block is provided at the right angle formed by the connection between the lower end surface of the second transverse support plate (2b) and the second longitudinal support plate (3b), avoiding excessive stress concentration between the transverse support plate and the longitudinal support plate due to wafer loading and unloading, and generating bending deformation.

[0052] Furthermore, a first transverse reinforcing rib (6a) is provided on the upper end surface of the first transverse support plate (2a), and a second transverse reinforcing rib (6b) is provided on the upper end surface of the second transverse support plate (2b).

[0053] A transverse reinforcing rib is provided on the upper end surface of each transverse support plate to bear the longitudinal tension, which can avoid excessive stress concentration between the connected transverse support plate and longitudinal support plate due to wafer loading and unloading, and generate bending deformation.

[0054] Such as Figure 1As shown, in the present utility model, the first longitudinal support plate (3a) and the second longitudinal support plate (3b) are spaced apart in the longitudinal direction, the first transverse support plate (2a) and the second transverse support plate (2b) are horizontally placed in the transverse direction, the connection between the first transverse support plate (2a) and the first longitudinal support plate (3a) extends in the depth direction, and the connection between the second transverse support plate (2b) and the second longitudinal support plate (3b) extends in the depth direction. The length direction of the second anti-bending block (5b) and the first anti-bending block (5a) is arranged along the depth direction. The length direction of the first transverse reinforcing rib (6a) and the second transverse reinforcing rib (6b) extends along the transverse direction. The longitudinal direction refers to the up-and-down direction, the transverse direction refers to the left-and-right direction, and the depth direction refers to the front-and-back direction.

[0055] Further, the lower end surface of the first transverse support plate (2a) and the upper end surface of the first main support plate (1a) are connected by at least one adjustable nut assembly (7);

[0056] The lower end surface of the second transverse support plate (2b) and the upper end surface of the second main support plate (1b) are connected by at least one adjustable nut assembly (7).

[0057] The adjustable nut assembly (7) connects the lower end surface of the first transverse support plate (2a) and the upper end surface of the first main support plate (1a) from top to bottom, and connects the lower end surface of the second transverse support plate (2b) and the upper end surface of the second main support plate (1b) from top to bottom.

[0058] For example, the lower end surface of the first transverse support plate (2a) and the upper end surface of the first main support plate (1a) are connected at four points by 4 adjustable nut assemblies (7), and the lower end surface of the second transverse support plate (2b) and the upper end surface of the second main support plate (1b) are connected at four points by 4 adjustable nut assemblies (7).

[0059] The adjustable nut assembly includes a locking nut and an adjusting bolt. To ensure that each wafer on the wafer contact assembly of this device can stand at the same height, after all the support members are installed, the transverse support plate and the main support plate are adjusted in height at four points in the front-back and left-right directions by the adjustable nut assembly composed of the locking nut and the adjusting bolt, so as to keep the transverse support plate placed as horizontally as possible, so that the four positions at the top of the longitudinal support plate are all at the same horizontal plane.

[0060] Further, a first support block (8a) is provided on the lower end surface of the first main support plate (1a), and a second support block (8b) is provided on the lower end surface of the second main support plate (1b);

[0061] The first support block (8a) and the second support block (8b) are respectively welded to the machine table of the cleaning equipment.

[0062] The first main support plate (1a) and the second main support plate (1b) are fixed to the machine table by means of bolt fixation to support the entire device. On the other hand, support blocks on the lower end surfaces are welded to the machine table to further play a supporting role.

[0063] Furthermore, the first main support plate (1a) and the first support block (8a) are connected from bottom to top by at least one adjustable nut assembly (7); the second main support plate (2b) and the second support block (8b) are connected from bottom to top by at least one adjustable nut assembly.

[0064] When necessary, the first support block (8a) and the second support block (8b) are welded to the machine table to play a supporting role. At least two adjustable nut assemblies (7) are respectively arranged below, which can play a role in supporting and adjusting to keep horizontal.

[0065] Furthermore, it also includes a first reinforcing plate (9a);

[0066] The first main support plate (1a) is an L-shaped plate formed by connecting a horizontal plate and a vertical plate. The horizontal plate of the first main support plate (1a) is connected to the first horizontal support plate (2a), and the lower end of the vertical plate of the first main support plate (1a) is fixed to the machine table of the cleaning equipment;

[0067] The first reinforcing plate (9a) is connected to both the horizontal plate and the vertical plate of the first main support plate (1a) at the same time. Furthermore, it also includes a second reinforcing plate (9b);

[0068] The second main support plate (1b) is an L-shaped plate formed by connecting a horizontal plate and a vertical plate. The horizontal plate of the second main support plate (1b) is connected to the second horizontal support plate (2b), and the lower end of the vertical plate of the second main support plate (1b) is fixed to the machine table of the cleaning equipment;

[0069] The second reinforcing plate (9b) is connected to both the horizontal plate and the vertical plate of the second main support plate (1b) at the same time.

[0070] The two main support plates are of L-shaped structure. The longitudinal stress of wafer loading and unloading is transmitted to the main support plates. By setting the reinforcing plates, further bending deformation between the vertical plate and the horizontal plate due to stress can be prevented.

[0071] This utility model mainly supports the wafer by a pair of V-shaped racks and positions the wafer by a pair of Y-shaped racks, which can maximize the contact between the wafer and the racks. In this way, both scratch damage can be reduced and particle aggregation on the wafer can be reduced. The liquid in the spray tube in the groove sprays out through small holes to form a characteristic flow field, enabling the clean liquid flow to flow through the wafer surface at the maximum flow rate, taking away particles, and thus completing the cleaning of the wafer surface.

[0072] The above are only the preferred embodiments of the present utility model, and do not limit the implementation manners and protection scope of the present utility model. For those skilled in the art, it should be realized that any equivalent replacements and obvious changes made by using the description and illustrations of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A wafer carrier for a cleaning tank, characterized in that: include: The first main support plate and the second main support plate are used to be fixed on the machine table of the cleaning equipment; a first longitudinal support plate and a second longitudinal support plate; a first transverse support plate and a second transverse support plate, wherein the first transverse support plate is respectively connected to the upper end of the first longitudinal support plate and the first main support plate, and the second transverse support plate is respectively connected to the upper end of the second longitudinal support plate and the second main support plate; A wafer contact assembly, detachably connected to the lower end of the first longitudinal support plate and the lower end of the second longitudinal support plate, respectively, and used for carrying a wafer and placing it in a cleaning tank of the cleaning device; The wafer contact assembly includes a first V-shaped rack, a second V-shaped rack, a first Y-shaped rack and a second Y-shaped rack, wherein the first Y-shaped rack and the second Y-shaped rack are both disposed between the first V-shaped rack and the second V-shaped rack; When the edge of the wafer contacts the tooth grooves of the first V-shaped rack and the second V-shaped rack, the edge of the wafer is suspended in the tooth grooves of the first Y-shaped rack and the second Y-shaped rack.

2. A wafer carrier for a cleaning tank as claimed in claim 1, characterized in that: A first anti-bending block is disposed on the lower end surface of the first transverse support plate, and a second anti-bending block is disposed on the lower end surface of the second transverse support plate.

3. A wafer carrier for a cleaning tank as claimed in claim 1, characterized in that: The upper end surface of the first transverse support plate is provided with a first transverse reinforcing rib, and the upper end surface of the second transverse support plate is provided with a second transverse reinforcing rib.

4. A wafer carrier for a cleaning tank as claimed in claim 1, characterized in that: The lower end surface of the first transverse support plate is connected to the upper end surface of the first main support plate via at least one adjustable nut assembly; The lower end surface of the second transverse support plate and the upper end surface of the second main support plate are connected by at least one adjustable nut assembly.

5. A wafer carrier for a cleaning tank as claimed in claim 1, characterized in that: A first support block is disposed on the lower end surface of the first main support plate, and a second support block is disposed on the lower end surface of the second main support plate; The first supporting block and the second supporting block are respectively welded on the platform of the cleaning equipment.

6. A wafer carrier for a cleaning tank as claimed in claim 5, characterized in that: The first main support plate and the first support block are connected from bottom to top through at least one adjustable nut assembly; the second main support plate and the second support block are connected from bottom to top through at least one adjustable nut assembly.

7. A wafer carrier for a cleaning tank as claimed in claim 1, characterized in that: Also included is a first reinforcement plate; The first main support plate is an L-shaped plate formed by connecting a horizontal plate and a vertical plate, the horizontal plate of the first main support plate is connected to the first horizontal support plate, and the lower end of the vertical plate of the first main support plate is fixed on the machine table of the cleaning equipment; The first reinforcing plate is connected to both the horizontal plate and the vertical plate of the first main supporting plate.

8. A wafer carrier for a cleaning tank as claimed in claim 1, characterized in that: Also included is a second reinforcement plate; The second main support plate is an L-shaped plate formed by connecting a horizontal plate and a vertical plate, the horizontal plate of the second main support plate is connected to the second horizontal support plate, and the lower end of the vertical plate of the second main support plate is fixed on the machine table of the cleaning equipment; The second reinforcing plate is connected to both the horizontal plate and the vertical plate of the second main supporting plate.

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