Circuit board, image generation unit and electronic equipment

Abstract

The utility model discloses a circuit board, an image generation unit and electronic equipment, and the circuit board comprises a circuit board main body which is provided with at least one negative electrode connection part; the first elastic part comprises at least one first elastic piece, the first elastic piece is flexibly connected to the negative electrode connecting part, the first elastic piece is used for establishing electric connection of the circuit board main body, the at least one first elastic piece is arranged on the circuit board main body according to a first rule, and the first rule is determined based on the circuit board main body; the first elastic piece is flexibly connected with the negative electrode connecting part, can adapt to different installation conditions and spatial layouts, is arranged according to a first rule, can ensure the consistency of the circuit board in different installation environments, facilitates large-scale production and standardized manufacturing, and improves the production efficiency. The flexible characteristic of the first elastic piece enables the assembly process of the circuit board to be more flexible, reduces the assembly difficulty of the circuit board, and improves the assembly efficiency.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and more particularly, to a circuit board, an image generation unit, and an electronic device. Background Art

[0002] The rapid development of electronic technology is an important feature of modern society. Electronic technology covers many aspects, from the manufacture of basic electronic components to complex information processing systems and the application of various intelligent devices. For example, in daily travel, intelligent transportation systems, autonomous driving cars, and electronic navigation devices make travel more convenient, efficient, and safe; in the home environment, smart home appliances, intelligent security systems, and intelligent lighting improve the comfort and convenience of life, and at the same time make the home environment more intelligent and automated; in work and study, computers, the Internet, office software, and online education platforms greatly improve work efficiency and learning effects, changing the traditional work and learning models; in social entertainment, social media platforms, video calls, online games, and smart wearable devices enrich people's social and entertainment lives.

[0003] With the rapid development of electronic technology, the demand for electronic devices has also increased significantly. The assembly efficiency of electronic devices is closely related to the manufacturing cost and also affects the performance of electronic devices in the sales market. Therefore, how to improve the assembly efficiency of electronic devices is an urgent problem to be solved at present. Summary of the Utility Model

[0004] One object of the present application is to provide a circuit board that is easy to install and reduces the assembly difficulty.

[0005] Another object of the present application is to provide an image generation unit and an electronic device.

[0006] To achieve the above object, the technical solution adopted in the present application is: a circuit board, the circuit board includes: a circuit board main body, at least one negative connection portion is provided on the circuit board main body; a first elastic portion, the first elastic portion includes at least one first elastic member, the first elastic member is flexibly connected to the negative connection portion, the first elastic member is used to establish an electrical connection of the circuit board main body, and at least one first elastic member is arranged on the circuit board main body according to a first rule, and the first rule is determined based on the circuit board main body.

[0007] In the existing technical solutions, the electrical connection of the circuit board body is usually established by means of flying wires, bolts, etc. This connection method usually requires welding or adding additional components, resulting in a very complex process of establishing an electrical connection between the circuit board and other devices, causing problems such as high assembly difficulty and low assembly efficiency. However, in the circuit board provided in the present application, the negative connection part of the circuit board body is flexibly connected to the first elastic member, so that the circuit board body can conveniently establish an electrical connection with other devices. In addition, the first elastic member in the first elastic part is arranged on the circuit board body according to a first rule, and the first rule is determined based on the circuit board body, which can make the setting method of the first elastic member on the circuit board body have a better adaptability to the circuit board, so as to improve the assembly speed of the circuit board and meet specific assembly requirements. Further, the first elastic member is a component with a certain elasticity, which can adapt to the tolerance existing in the assembly process of the circuit board, so as to reduce the assembly difficulty of the circuit board and improve the assembly efficiency.

[0008] As a preference, the first rule is determined based on one or more of the shape, function, area or installation position of the circuit board body.

[0009] As a preference, the circuit board includes m first elastic members arranged along the first direction of the circuit board body, and the m first elastic members are evenly distributed along the first direction, where m > 1.

[0010] As a preference, the circuit board includes n first elastic members arranged along the second direction of the circuit board body, and the n first elastic members are evenly distributed along the second direction, where n > 1.

[0011] As a preference, the included angle θ between the first direction and the second direction satisfies the following relationship: 0° ≤ θ ≤ 90°.

[0012] As a preference, the distance L of the m first elastic members in the first direction satisfies L ≥ 1 mm.

[0013] As a preference, the first elastic member includes: a first conductive layer and a first elastic layer. The first elastic layer is built in the first conductive layer. The material of the first elastic layer has thermal conductivity and elasticity. The material of the first conductive layer includes one or more of the following: aluminum, copper, aluminum alloy or stainless steel.

[0014] As a preference, the value range of the original height d1 of the first elastic member satisfies 1 mm ≤ d1 ≤ 5 mm, and / or, the value range of the compression ratio q of the first elastic member satisfies 40% ≤ q ≤ 90%.

[0015] As a preference, the circuit board further includes a radiator; the first elastic part is used for electrically connecting the radiator and the circuit board body, and the first elastic part is arranged in the gap between the circuit board body and the radiator.

[0016] As a preference, the circuit board further includes: a second elastic part, the second elastic part includes at least one second elastic member, the second elastic member is flexibly connected to the surface of the radiator according to a second rule, the second rule is determined based on the radiator, and the second elastic member has a heat conduction function.

[0017] As a preference, the circuit board includes: a circuit board main body, at least one negative connection part is arranged on the circuit board main body; a first connection part, the first connection part is used to establish an electrical connection between the circuit board main body and the radiator; a second elastic part, the second elastic part includes at least one second elastic member, the second elastic member is flexibly connected to the surface of the radiator according to a second rule, the second rule is determined based on the radiator, and the second elastic member has a heat conduction function.

[0018] As a preference, the cross-sectional shape of the second elastic member is determined based on the radiator.

[0019] As a preference, an image generation unit includes a circuit board.

[0020] As a preference, an electronic device includes a circuit board.

[0021] As a preference, the electronic device includes a housing, the housing has conductivity; the second elastic part of the circuit board is used to establish an electrical connection between the radiator of the circuit board and the housing.

[0022] As a preference, the electronic device includes a head-up display device or a computer.

[0023] As a preference, the housing has a first inner side wall and a second inner side wall, the radiator has a first outer side wall and a second outer side wall, a first gap along the width direction of the radiator is formed between the first inner side wall of the housing and the first outer side wall of the radiator arranged opposite to the first inner side wall, a second gap along the length direction of the radiator is formed between the second inner side wall of the housing and the second outer side wall of the radiator arranged opposite to the second inner side wall, and the second elastic part is arranged in the first gap and / or the second gap.

[0024] Compared with the prior art, the beneficial effects of the present application are as follows:

[0025] (1) The first elastic member is flexibly connected to the negative connection part, which can adapt to different installation situations and space layouts. Moreover, the first elastic member is arranged on the circuit board main body according to the first rule, which can ensure the consistency of the circuit board in different installation environments, facilitate large-scale production and standardized manufacturing. At the same time, the flexible characteristic of the first elastic member can compensate for the assembly tolerance, making the process of assembling the circuit board simpler and more convenient, reducing the assembly difficulty and time cost of the circuit board, and improving the production efficiency of the circuit board.

[0026] (2) The first elastic member has elasticity and conductivity, and can effectively cope with mechanical stress and external vibration during the connection process between the circuit board and other devices. Compared with traditional solder connections, it reduces the risk of fracture at the fixed connection due to stress concentration.

[0027] (3) When the circuit board is connected to the radiator, on the one hand, it can timely transfer the heat generated by the circuit board during operation to the radiator. On the other hand, it can also achieve the ground balance between the radiator and the negative pole of the circuit board. In addition, due to the elasticity of the first elastic member, it can better compensate for the assembly tolerance, enabling a better electrical connection to be established between the circuit board and the radiator, thus better achieving the ground balance between the radiator and the accessories of the circuit board, and thereby achieving a better ElectroMagnetic Compatibility (EMC) protection effect.

[0028] (4) On the basis of establishing an electrical connection between the circuit board and the radiator, the radiator is then connected to the housing through the second elastic part. On the one hand, it can transfer the heat on the radiator to the housing through the second elastic part, achieving the effect of the housing assisting in heat dissipation. On the other hand, it can also establish an electrical connection between the radiator and the housing through the second elastic component, thereby achieving the ground balance among the negative pole of the circuit board, the radiator, and the housing to better achieve the EMC protection effect.

[0029] (5) The connection method between the radiator and the housing established through the second elastic part can also reduce the assembly difficulty and improve the assembly efficiency. In addition, the second elastic component can better compensate for the tolerance between the radiator and the housing, while reducing the assembly difficulty, it can also better establish the heat conduction channel and the electrical conduction channel between the radiator and the housing. Description of the Drawings

[0030] Figure 1 is the first schematic structural diagram of the circuit board according to some embodiments of the present application.

[0031] Figure 2 is the second schematic structural diagram of the circuit board according to some embodiments of the present application.

[0032] Figure 3 is the third schematic structural diagram of the circuit board according to some embodiments of the present application.

[0033] Figure 4 is the schematic structural diagram of the second elastic member.

[0034] Figure 5 is of the present application Figure 4 cross-sectional view along the A - A direction.

[0035] Figure 6 is the schematic structural diagram of the electronic device according to some embodiments of the present application.

[0036] Figure 7 It is a schematic structural diagram of another electronic device according to some embodiments of the present application.

[0037] Figure 8 It is a fourth schematic structural diagram of a circuit board according to some embodiments of the present application.

[0038] Figure 9 It is a schematic structural diagram of another electronic device according to some embodiments of the present application.

[0039] Figure 10 In the present application Figure 9 An enlarged schematic diagram of the local area A.

[0040] Figure 11 It is a schematic diagram of the composition of an electronic device in the prior art.

[0041] Figure 12 It is a schematic diagram of the composition of an electronic device according to some embodiments of the present application.

[0042] Figure 13 It is a schematic diagram of the composition of another electronic device in the prior art.

[0043] Figure 14 It is a schematic diagram of the composition of another electronic device according to some embodiments of the present application.

[0044] Figure 15 It is the experimental data of the EMC protection experiment conducted on an electronic device according to the prior art.

[0045] Figure 16 It is the experimental data of the EMC protection experiment conducted according to some embodiments of the present application.

[0046] In the figure:

[0047] 10. Electronic device; 11. Housing; 111. First inner wall; 112. Second inner wall; 12. Circuit board; 121. Circuit board main body; 122. First elastic member; 1221. First support end; 1222. Second support end; 123. Radiator; 1232. First outer wall; 124. Second elastic member; 1241. Second elastic layer; 1242. Second conductive layer. Specific embodiments

[0048] Next, in combination with specific embodiments, the present application will be further described. It should be noted that, on the premise of no conflict, any combination of the following-described embodiments or technical features can form a new embodiment.

[0049] In the description of the present application, it should be noted that for orientation terms, such as the terms "center", "horizontal", "vertical", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present application.

[0050] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence.

[0051] The terms "comprising" and "having" in the description and claims of the present application, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that comprises a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0052] The functions of electronic devices are becoming more and more powerful, and more and more electronic components need to be involved, resulting in a significant reduction in assembly efficiency during the assembly process. Based on the above analysis, the present application provides an easily assembled circuit board 12, an image generation unit and an electronic device 10, which reduce the assembly difficulty and improve the assembly efficiency.

[0053] In this embodiment, as Figure 1As shown in the figure, the present application provides a circuit board 12, which includes a circuit board main body 121 and a first elastic part. At least one negative electrode connection part is provided on the circuit board main body 121. The first elastic part includes at least one first elastic member 122, and the first elastic member 122 is flexibly connected to the negative electrode connection part. The first elastic member 122 is used to establish the electrical connection of the circuit board main body 121. At least one first elastic member 122 is arranged on the circuit board main body 121 according to a first rule, and the first rule is determined based on the circuit board main body 121. The first elastic member 122 is conductively and flexibly connected to the negative electrode connection part through conductive adhesive. Combining with the elasticity of the first elastic member 122, the circuit board 12 can effectively absorb the stress caused by vibration, impact or thermal expansion, thereby improving the stability of the circuit board 12 in a complex environment, effectively increasing the service life of the circuit board 12, and also enabling the circuit board 12 to adapt to mechanical deformation to a certain extent, so as to reduce the damage caused by assembly errors or mechanical stress. During the assembly process of the circuit board 12, the first elastic member 122 reduces complex welding or mechanical fixing steps, reduces the assembly difficulty, and greatly improves the assembly efficiency.

[0054] Optionally, the circuit board main body 121 can also be directly electrically connected to other conductive devices through conductive adhesive. For example, conductive adhesive is applied to at least one negative electrode connection part to establish the electrical connection between the circuit board main body 121 and other conductive devices.

[0055] The first elastic member 122 is used to establish the electrical connection between the circuit board main body 121 and other conductors, such as components like a radiator 123 and a housing 11, for electrostatic discharge, electromagnetic shielding, heat dissipation, fixing or forming a complete circuit. If there are differences in the materials of the negative electrode connection part and the first elastic member 122, flexible connection through conductive adhesive can achieve reliable electrical connection between different materials.

[0056] Supplementary description, as Figure 1 As shown in the figure, the first elastic members 122 are spaced apart and have the same height protruding from the surface where the circuit board main body 121 is located. This not only avoids the problem of poor contact, but also enables the circuit board 12 to better adapt to negative electrode connection parts or other connection components with different thicknesses, enhancing the versatility and interchangeability of the circuit board 12.

[0057] In some embodiments, the first elastic members 122 can be scattered and distributed away from the center point of the circuit board main body 121 with the center point of the circuit board main body 121 as the reference. The scattered and distributed first elastic members 122 can provide buffering and elastic support in multiple directions simultaneously, reducing connection looseness or damage caused by external force impact or vibration. At the same time, the scattered distribution of the first elastic members 122 reduces the accumulation of heat, lowers the temperature of the circuit board 12, and avoids thermal damage to the circuit board 12.

[0058] Supplementary description: The surface area where the first elastic member 122 can contact other components is greater than or equal to 1 mm 2 , and it can be 2 mm 2 , 3 mm 2 . When the surface area of the first elastic member 122 is larger, the area where the first elastic member 122 can contact the negative electrode connection part is larger, thereby reducing the contact resistance, improving the electrical conductivity of the first elastic member 122, and also being able to reduce the problem of unstable conductivity caused by poor contact. Especially in a vibrating or dynamic environment, a more stable electrical connection can be maintained. Increasing the surface area where the first elastic member 122 contacts other components can provide more uniform stress, and the stress distribution is also more uniform, reducing local stress concentration, enhancing the reliability of the flexible connection between the first elastic member 122 and the negative electrode connection part. At the same time, the larger the surface area of the first elastic member 122, the stronger the heat dissipation performance, reducing the heat accumulation on the circuit board 12, lowering the temperature of the circuit board 12, and maintaining the thermal stability of the circuit board 12.

[0059] Supplementary description: The negative electrode connection part can be arranged on the front side and / or the negative side of the circuit board main body 121. The setting position of the negative electrode connection part is not limited here and can be set according to actual needs. At the same time, the negative electrode connection part can be divided into multiple access points, enabling the negative electrode connection part to be flexibly connected to the first elastic member 122 sufficiently, ensuring the reliability of the electrical connection between the two. The setting positions of the respective access points of the negative electrode connection part need to be determined according to the functions of the circuit, the layout principle, and the electrical performance requirements, and are not limited here.

[0060] In some embodiments, the conductive adhesive is applied between the bottom surface of the circuit board main body 121 and the first elastic member 122, enabling the first elastic member 122 to be conductively fixed to the negative electrode connection part. That is to say, the negative electrode connection part and the first elastic member 122 are deformably connected through the conductive adhesive. By bonding with the conductive adhesive, the solder joints on the circuit board 12 can be reduced. Assembly personnel can establish a connection between the first elastic member 122 and the negative electrode connection part without the need for soldering. Only pasting is required to achieve the connection, reducing the assembly difficulty of the circuit board 12, improving the compatibility and expandability of the circuit board 12. Moreover, the curing temperature of the conductive adhesive is relatively low, generally lower than 200 °C, far lower than the melting temperature of traditional solder. The melting temperature of traditional solder is generally higher than 230 °C. The low curing temperature can reduce the thermal damage to the substrate and the circuit board 12.

[0061] In this embodiment, the first rule is determined based on one or more of the shape, function, area, or installation position of the circuit board body 121. The design of the circuit board 12 can be optimized and improved according to specific application scenarios and requirements. For example, for a device with a complex shape, the design can be based on the shape to ensure that the circuit board 12 can be adapted to different types of devices. Or, when the circuit board 12 needs to have multiple functions, such as control, power supply, or signal transmission, the layout of the first elastic member 122 can be optimized through the first rule, so that the circuit board 12 can fully meet the requirements. Or for circuit boards 12 in different installation positions, the requirements for heat dissipation, fixing, and EMC protection are also different. Therefore, the layout method of the first elastic member 122 can be determined according to the specific installation position of the circuit board 12, thereby increasing the practicality of the circuit board 12 and meeting different usage requirements.

[0062] Supplementary note, the first rule can be the layout method of the first elastic member 122, such as uniform distribution or scattered distribution; it can also be the specific parameters of the first elastic member 122, such as the material, compression ratio, conductivity, maximum height, and minimum height of the first elastic member 122.

[0063] In this embodiment, the circuit board 12 includes m first elastic members 122 arranged along the first direction of the circuit board body 121, and the m first elastic members 122 are evenly distributed along the first direction. Among them, the first direction can be the length direction, width direction, or diagonal direction of the circuit board body 121. The number of first elastic members 122 arranged in the first direction, m, is greater than 1, and the number of first elastic members 122 is set according to actual needs and is not limited here. For example, m = 2, 3, or 4, etc.

[0064] In this embodiment, the circuit board 12 includes n first elastic members 122 arranged along the second direction of the circuit board body 121, and the n first elastic members 122 are evenly distributed along the second direction. Among them, the second direction can be the length direction, width direction, or diagonal direction of the circuit board body 121. The number of first elastic members 122 arranged in the second direction, n, is greater than 1 and is set according to actual needs. The number of settings is not limited here. For example, n = 2, 3, or 4, etc.

[0065] Supplementary note, the first direction and the second direction are on the same horizontal plane. For example, the first direction can be the length direction of the circuit board body 121, the second direction can be the width direction of the circuit board body 121 perpendicular to the first direction, or another length direction parallel to the first direction, or a diagonal direction intersecting the first direction. The first direction and the second direction can be determined according to the assembly habits of the assembly personnel or the specific installation environment and are not limited here.

[0066] In this embodiment, the angle θ between the first direction and the second direction satisfies the following relationship: 0°≤θ≤90°. When the first direction and the second direction are both diagonal directions of the circuit board body 121, there is an angle between the first direction and the second direction, and the angle is an acute angle. When the first direction is the length direction of the circuit board body 121 and the second direction is the width direction of the circuit board body 121, the angle between the first direction and the second direction is 90°. When the first direction is the length direction of the circuit board body 121 and the second direction is another length direction of the circuit board body 121, the first direction and the second direction are parallel to each other, and the angle is 0°.

[0067] Optionally, the circuit board 12 further includes q first elastic members 122 arranged along a third direction of the circuit board body 121, and the third direction is different from the first direction and the second direction. q is greater than 1, for example, q=2, 3 or 4. Of course, the circuit board 12 may also include a plurality of first elastic members 122 arranged along a fourth direction of the circuit board body 121, and the present application does not limit this.

[0068] In this embodiment, the distance between m first elastic members 122 in the first direction is L, L≥1mm, that is, in the first direction, the distance L between the first elastic members 122 satisfies L≥1mm. The first elastic members 122 are used for support or buffering, maintaining a certain spacing L≥1mm, thereby ensuring the stability of the structure when subjected to force. The evenly distributed first elastic members 122 can better disperse stress and avoid local overload; it can also prevent the first elastic members 122 from contacting or interfering with each other during operation, thereby improving the reliability of the first elastic members 122.

[0069] In this embodiment, the first elastic member 122 includes: a first conductive layer and a first elastic layer, the first elastic layer is embedded in the first conductive layer, the material of the first elastic layer has thermal conductivity and elasticity, and the material of the first conductive layer includes one or more of the following: aluminum, copper, aluminum alloy or stainless steel; specifically, the first conductive layers are arranged in pairs, the first elastic layer can be deformably fixed between the first conductive layers, and the two first conductive layers can cover the first elastic layer; the first elastic layer can make the first elastic member 122 adapt to mechanical deformation to a certain extent, such as bending, twisting or vibration, thereby improving the connection reliability between the circuit board 12 and the negative electrode connection part, and can also effectively reduce the loosening or breakage of the connection caused by external force impact or thermal expansion, thereby ensuring the reliability of the connection between the first elastic member 122 and the circuit board 12.

[0070] The first conductive layer on one side is electrically connected to the negative connection part, and the first conductive layer on the other side is bonded to the outer surface of the first elastic layer and bonded to other components, which not only improves the connection reliability between the circuit board 12 and the first elastic member 122, but also enables the first elastic layer to undergo elastic deformation when subjected to external forces, so that the first conductive layers can approach each other to relieve the impact or vibration of the external forces.

[0071] Moreover, the first elastic layer is made of a heat-conducting material, which can effectively conduct the heat generated by the circuit board 12 to the outside. In high-power or high-density electronic devices 10, a good heat dissipation function can extend the service life of the circuit board 12 and improve the stability and reliability of the device; copper, aluminum alloy, and stainless steel all have certain heat-conducting and electrical-conducting properties, which can conduct the heat generated by the circuit board 12, avoid heat concentration on the circuit board 12, increase the thermal stability of the circuit board 12, and can also maintain electrical connection with the negative connection part.

[0072] It should be added that the material of the first conductive layer needs to have the property of conductivity, which can be optimized according to specific usage scenarios, and the material selection is more flexible. For example, in cases where high conductivity is required, copper can be selected as the first conductive layer, as copper has stronger conductivity; in cases where light weight is required, the material of the first conductive layer can be selected as aluminum alloy. Under the same volume, aluminum alloy is lighter and more suitable for devices with weight requirements. In harsh usage environments, in order to extend the service life of the first elastic member 122, the material of the first conductive layer can be selected as corrosion-resistant stainless steel.

[0073] In this embodiment, the value range of the original height d1 of the first elastic member 122 satisfies 1 mm ≤ d1 ≤ 5 mm, and / or, the value range of the compression ratio q of the first elastic member 122 satisfies 40% ≤ q ≤ 90%.

[0074] Specifically, the original height d1 of the first elastic member 122 is 1 mm. If the compression ratio q is 50%, then the height of the first elastic member 122 after compression is 0.5 mm. If the compression ratio q is 90%, then the compressed height is 0.9 mm; the original height d1 of the first elastic member 122 is 5 mm. If the compression ratio q is 40%, then the compressed height is 2 mm. If the compression ratio is 90%, then the compressed height is 4.5 mm.

[0075] In this embodiment, as Figure 2As shown, the circuit board 12 further includes a heat sink 123; the first elastic part is used for electrically connecting the heat sink 123 and the circuit board main body 121, and the first elastic member 122 is disposed in the gap between the circuit board main body 121 and the heat sink 123 to fill the gap between the circuit board main body 121 and the heat sink 123. The first elastic member 122 is located between the heat sink 123 and the circuit board 12, enabling the heat sink 123 to be in closer contact with the circuit board 12, thereby improving the heat dissipation efficiency and avoiding overheating of the circuit board 12; the first elastic member 122 is elastically connected to the heat sink 123, so that when the heat sink 123 is subjected to an external force, it can buffer through the elastic deformation of the first elastic member 122, reducing the mechanical stress on the circuit board 12 and the heat sink 123. Moreover, the first elastic member 122 can also prevent the heat sink 123 from exerting excessive pressure on the components on the lower circuit board 12, preventing component damage, and thus protecting the sensitive components on the circuit board 12.

[0076] In this embodiment, as Figure 3 shown, the circuit board 12 further includes: a second elastic part, the second elastic part includes at least one second elastic member 124, the second elastic member 124 is flexibly connected to the surface of the heat sink 123 according to a second rule, the second rule is determined based on the heat sink 123, and the second elastic member 124 has a heat conduction function.

[0077] Specifically, as Figure 3 shown, the second elastic member 124 is flexibly connected to the first outer side wall 1232 of the heat sink 123 through a conductive adhesive. Among them, the second elastic member 124 is made of a heat-conducting material and can conduct the heat of the heat sink 123 outward, thereby reducing the temperature of the heat sink 123. The connection method between the heat sink 123 and the second elastic member 124 is more flexible, and the installation position and angle of the second elastic member 124 can be quickly adjusted according to the second rule to adapt to the irregular shape of the surface of the heat sink 123, so that the circuit board 12 provided by the present application can be applied to the heat dissipation of a variety of electronic devices 10, with stronger versatility.

[0078] The connection between the second elastic member 124 and the heat sink 123 enables the second elastic member 124 to better compensate for the tolerance between the heat sink 123 and other devices during the assembly process. Combining the elastic characteristics of the second elastic member 124 can also reduce the assembly difficulty and improve the assembly efficiency. In addition, while compensating for the tolerance between the heat sink 123 and other devices, the second elastic member 124 can also achieve good electrical connection between the heat sink 123 and other devices.

[0079] In a possible implementation, the internal structure of the second elastic member 124 is the same as that of the first elastic member 122, as Figure 4 and Figure 5As shown, the second elastic member 124 includes a second elastic layer 1241 and a pair of second conductive layers 1242. The second elastic layer 1241 is deformably disposed between the two second conductive layers 1242. One of the second conductive layers 1242 is flexibly connected to the heat sink 123 through a conductive adhesive, and the other second conductive layer 1242 can be flexibly connected to any cooperating component through a conductive adhesive.

[0080] Supplementary note, the material of the first elastic layer of the first elastic member 122 and the second elastic layer 1241 can be any one of the following or a combination thereof: polyurethane foam, polyethylene foam, ethylene-vinyl acetate copolymer foam, ethylene propylene diene monomer foam material, or any other material that can meet the usage requirements. The specific material is not limited herein.

[0081] This application also provides another circuit board 12. The circuit board 12 includes: a circuit board main body 121, a first connection portion, and a second elastic portion. At least one negative electrode connection portion is provided on the circuit board main body 121. The first connection portion is used to establish an electrical connection between the circuit board main body 121 and the heat sink 123; the second elastic portion includes at least one second elastic member 124. The second elastic member 124 is flexibly connected to the surface of the heat sink 123 according to a second rule, and the second rule is determined based on the heat sink 123. The second elastic member 124 has a heat conduction function. Specifically, the first connection portion is rigidly connected to the circuit board main body 121. The first connection portion is a metal rod, and the circuit board main body 121 and the heat sink 123 are electrically connected by welding or threaded connection.

[0082] Supplementary note, the second rule is determined based on one or more of the end face shape of the heat sink 123, the installation position of the heat sink 123, and the heat dissipation capacity of the heat sink 123. Among them, the end face shape of the heat sink 123 refers to the face obtained by observing along the extension direction of the heat sink 123. If the heat sink 123 is a cuboid, when observing along the length direction of the heat sink 123, the end face of the heat sink 123 is the end face of the cuboid, and the shape of the second elastic member 124 is adapted to the end face of the heat sink 123.

[0083] In this embodiment, the cross-sectional shape of the second elastic member 124 is determined based on the shape of the end face of the heat sink 123. The second elastic member 124 can be any one of a circle, a sector, and a polygon, such as Figure 3As shown, the shape of the second elastic member 124 can be trapezoidal, which is adapted to the cross-section of the radiator 123. If the second elastic member 124 adopts a circular structure, stress is evenly distributed in all directions, which can provide uniform elastic support, making the force on the side of the radiator 123 more uniform; if the second elastic member 124 adopts a sector structure, it can be customized according to the local shape of the radiator 123, better fitting the specific area of the radiator 123 to meet the requirements in different usage scenarios; if the second elastic member 124 adopts a polygonal structure, it can be optimized according to the edge shape of the radiator 123 to provide more stable support.

[0084] The present application also provides an image generation unit, and the image generation unit includes a circuit board 12. Therefore, the image generation unit has all the beneficial effects of any technical solution of the circuit board 12, which will not be elaborated here.

[0085] The image generation unit can be applied in a HUD (Head-Up Display system for vehicles), and it is the core component of the HUD system. The main function of the image generation unit is to generate high-brightness and high-quality image information, and the image information includes vehicle driving data such as vehicle speed, fuel consumption, tire pressure, etc., navigation information, assisted driving information, etc. The image is projected onto the windshield in front of the driver through the principle of optical reflection to form a virtual image, enabling the driver to directly obtain relevant information without having to look down at the instrument panel or the central control screen, thereby improving driving safety and convenience.

[0086] As Figure 6 and Figure 7 As shown, the present application also provides an electronic device 10, and the electronic device 10 includes a housing 11. The housing 11 has electrical conductivity, and the second elastic portion of the circuit board 12 is used to establish an electrical connection between the radiator 123 of the circuit board 12 and the housing 11.

[0087] Specifically, the interior of the housing 11 is a hollow structure, and the circuit board 12 is disposed inside the housing 11. The hollow housing 11 inside can protect the circuit board 12 from external impacts, and at the same time can, to a certain extent, prevent dust and liquid from affecting the circuit board 12 and avoid the entry of liquid and dust, which may cause damage to the electronic components of the circuit board 12; the hollow interior of the housing 11 is not only conducive to air circulation to avoid heat accumulation in the image generation unit, but also provides sufficient installation space for the circuit board 12 and other components, facilitating the modular design and assembly of the electronic device 10.

[0088] As Figure 9 As shown, in this embodiment, the electronic device 10 includes a head-up display device or a computer.

[0089] Supplementary description: The electronic device 10 may further include: a smart phone, which has various functions such as communication, text messaging, Internet access, photography, and entertainment; it is easy to carry, a notebook computer integrating functions such as computing, storage, and display, which can meet various needs such as office work, entertainment, and study, or smart home devices: such as smart door locks, smart cameras, smart speakers, smart curtains, etc., which can be controlled by a mobile phone or other devices, providing convenience and security for people's lives; or medical electronics, such as: an electrocardiograph, which is used to record the electrical activities of the heart and assist doctors in diagnosing heart diseases, and a B-ultrasound machine: which uses ultrasonic waves to image the internal organs of the human body and can be used for prenatal examinations, abdominal examinations, etc., providing important basis for disease diagnosis.

[0090] In this embodiment, as Figure 6 shown, the housing 11 has a first inner wall 111 and a second inner wall 112. As Figure 3 shown, the radiator 123 has a first outer wall 1232 and a second outer wall. A first gap along the width direction of the radiator 123 is formed between the first inner wall 111 of the housing 11 and the first outer wall 1232 of the radiator 123 disposed opposite to the first inner wall 111. As Figure 6 shown, the second elastic member 124 is disposed in the first gap and can conduct the heat of the radiator 123 to the housing 11, and then from the housing 11 to the outside of the housing 11, thereby reducing the temperature inside the housing 11.

[0091] Supplementary description: The second outer wall of the radiator 123 and the first outer wall 1232 are adjacent surfaces, and the first outer wall 1232 and the second outer wall are connected by the height edge of the radiator 123; a second gap along the length direction of the radiator 123 is formed between the second inner wall 112 of the housing 11 and the second outer wall of the radiator 123 disposed opposite to the second inner wall 112, and the second elastic member 124 is disposed in the second gap.

[0092] Supplementary description: The second elastic member 124 can be disposed on any outer surface of the radiator 123 that cooperates with the inner surface of the housing 11, so as to protect the circuit board 12 from any direction and prevent the electronic components from being damaged due to impact on the circuit board 12. And the second elastic member 124 is conductively electrically connected to the housing 11, so that the second elastic member 124 can transfer the heat of the radiator 123 to the housing 11 and be conducted from the housing 11 to the outside of the housing 11, reducing the temperature inside the housing 11.

[0093] The present application also provides a second structure of the first elastic member 122. As Figure 8 and Figure 9As shown, the first elastic member 122 is disposed at the gap between the heat sink 123 and the circuit board main body 121. The material of the first elastic member 122 is a conductive metal, such as Figure 10 As shown, the first elastic member 122 includes: a first support end 1221 and a second support end 1222. The first support end 1221 is deformably connected to the negative electrode connection portion in a conductive manner. Even when the first elastic member 122 is deformed, electrical connection can still be maintained, preventing poor electrical contact caused by mechanical vibration or external force. There is an included angle between the extending direction of the second support end 1222 and the extending direction of the first support end 1221, and the included angle is an acute angle, which can better disperse stress when stressed, avoid stress concentration, and further enhance the stability of the circuit board 12; when the second support end 1222 is subjected to an external force, the second support end 1222 can move closer to the direction where the first support end 1221 is located, so as to fill the gap between the heat sink 123 and the circuit board main body 121; when the external force disappears, the second support end 1222 can move away from the direction where the first support end 1221 is located. The elastic deformation ability of the first elastic member 122 can effectively buffer the external force impact, reduce the structural damage caused by the external force, and thus improve the stability and reliability of the circuit board 12.

[0094] During the operation of the device, due to the working principle and design of its internal circuit, electromagnetic interference will be generated, and the external electromagnetic environment will also generate electromagnetic interference on the device. The electromagnetic interference may be transmitted through conduction, radiation or coupling, affecting the normal operation of the device. Therefore, EMC protection is particularly important in the design and application of electronic devices 10. At the same time, with the rapid development of various fields, higher requirements are also put forward for EMC protection. For example, in the medical field, electromagnetic interference may cause medical devices, such as electrocardiogram monitors and defibrillators, to malfunction or fail, thus endangering the lives of patients.

[0095] Therefore, based on the above analysis, the circuit board 12, the image generation unit and the electronic device 10 provided by the present application have good EMC protection effects. On the one hand, the intensity of the generated electromagnetic interference is effectively reduced, and on the other hand, it can also cope with a complex electromagnetic environment.

[0096] such as Figure 11 As shown, in the prior art, there are parasitic capacitances between the circuit board 12 and the heat sink 123, and between the heat sink 123 and the housing 11. However, the parasitic capacitances will generate common-mode noise and differential-mode noise, and these two types of noises will cause the grounding voltages of each component to be inconsistent, generating a ground potential difference, and finally radiating electromagnetic waves to the outside of the housing 11, thereby affecting the electromagnetic compatibility of the device.

[0097] Therefore, based on the above problems, the present application makes improvements to the existing solutions, cancels the parasitic capacitance between components, disrupts the common-mode noise and differential-mode noise paths, connects both noise sources to the housing 11, enables all components to have the same ground potential reference equipotential body, maintains the balance of the reference ground, eliminates the noise return path of the parasitic capacitance, and improves the electromagnetic compatibility of the device. According to the above solution, the improved solution obtained is as follows Figure 12 shown in Figure 12 Figure [not provided in the original, so this might need to be adjusted based on the actual figure reference]. The circuit board 12 is electrically connected to the heat sink 123 through a first elastic member 122, and the heat sink 123 is electrically connected to the housing 11 through a second elastic member 124, so as to eliminate the parasitic capacitance between the circuit board 12 and the heat sink 123, and between the heat sink 123 and the housing 11, making the negative electrode of the circuit board 12, the heat sink 123, and the housing 11 at the same potential, thereby eliminating the noise return path of the parasitic capacitance and improving the electromagnetic compatibility of the electronic device 10.

[0098] In another solution in the prior art, there are parasitic capacitances electrically connected between the circuit board 12 and the heat sink 123, between the heat sink 123 and the housing 11, and between the circuit board 12 and the housing 11. As Figure 13 shown, the above parasitic capacitances will seriously affect the electromagnetic compatibility of the device.

[0099] Therefore, on the basis of the above solution, the present application makes improvements according to the technical solution shown in Figure 13 Figure [not provided in the original, so this might need to be adjusted based on the actual figure reference], and obtains the improved solution shown in Figure 14 Figure [not provided in the original, so this might need to be adjusted based on the actual figure reference]. An electrical connection is established between the circuit board 12 and the housing 11 to eliminate the parasitic capacitance between the circuit board 12 and the housing 11, thereby improving the electromagnetic compatibility of the electronic device 10. Specifically, as Figure 14 shown in Figure [not provided in the original, so this might need to be adjusted based on the actual figure reference], electrical connections are established between the circuit board 12 and the heat sink 123, between the heat sink 123 and the housing 11, and between the circuit board 12 and the housing 11. Regarding the way of establishing the electrical connection between the circuit board 12 and the heat sink 123, and between the heat sink 123 and the housing 11, reference can be made to the above Figure 12 description. The circuit board 12 and the housing 11 can be electrically connected by means such as welding, bolts, flying wires, the first elastic member 122, or the second elastic member 124.

[0100] The solution provided in this application is tested according to the experimental standard "Electromagnetic Compatibility (EMC) of Vehicles, Ships and Internal Combustion Engine Driven Equipment - Part 25: Tests for Vehicle Electronic / Electrical Components" (CISPR25). This experimental standard is an international standard formulated by the International Special Committee on Radio Interference under the International Electrotechnical Commission. The standard strictly stipulates the test requirements for electromagnetic interference and electromagnetic immunity, which can ensure that the electronic device 10 operates normally in a complex electromagnetic environment, guarantee the stability of the operation of the electronic device 10. Moreover, the standard provides unified test methods and limit requirements for the electromagnetic compatibility of the electronic device 10, which helps to regulate the market and reduce potential safety hazards caused by electromagnetic interference. Therefore, the experimental data provided in this application is obtained by testing according to international standards, which further guarantees the validity of the experimental data.

[0101] A detection device is set outside the device, and the electromagnetic interference situation around the outside of the device is judged through the detection device, thereby obtaining the experimental data shown in Table 1 and Table 2. Among them, Table 1 is the experimental data of the electronic device 10 when the negative connection terminal is electrically connected to the radiator 123, but the radiator 123 is not electrically connected to the housing 11. According to Table 1, the Figure 15 variation diagram is obtained. Table 2 is the experimental data of the electronic device 10 provided in this application (as Figure 12 shown). According to Table 2, the Figure 16 variation diagram is obtained.

[0102] According to Figure 15 the curve, it can be known that when the radiator 123 is not electrically connected to the housing 11, there is a situation where the peak value of the measured electromagnetic interference signal (hereinafter referred to as the PK value) exceeds the electromagnetic interference limit value (hereinafter referred to as the PK limit value). That is to say, the electromagnetic interference signal transmitted by the electronic device 10 to the outside of the device exceeds the standard. During the operation of the operator on the electronic device 10, the operator will still be affected by electromagnetic radiation, which poses a potential hazard to the health of the operator. According to Figure 16 the curve, it can be known that the electronic device 10 provided in this application has a good EMC protection effect and meets the requirements of CISPR25. Therefore, the electronic device 10 provided in this application has more application scenarios and a better market prospect.

[0103] Table 1

[0104]

[0105] Table 2

[0106]

[0107] The basic principles, main features and advantages of the present application have been described above. Those skilled in the art should understand that the present application is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present application. Without departing from the spirit and scope of the present application, various changes and improvements will occur to the present application, and these changes and improvements all fall within the scope of the present application claimed. The scope of protection required by the present application is defined by the appended claims and their equivalents.

Claims

1. A circuit board, characterized in that: The circuit board comprises: A circuit board body, wherein at least one negative electrode connecting portion is provided on the circuit board body; A first elastic part, the first elastic part includes at least one first elastic member, the first elastic member is flexibly connected to the negative electrode connecting part, the first elastic member is used to establish an electrical connection with the circuit board body, and the at least one first elastic member is arranged on the circuit board body according to a first rule, and the first rule is determined based on the circuit board body.

2. The circuit board according to claim 1, characterized in that: The first rule is determined based on one or more of a shape, a function, an area, or an installation position of the circuit board body.

3. The circuit board according to claim 1, characterized in that: The circuit board includes m first elastic members arranged along a first direction of the circuit board body, and the m first elastic members are evenly distributed along the first direction, where m>1.

4. The circuit board according to claim 3, characterized in that: The circuit board includes n first elastic members arranged along a second direction of the circuit board body, and the n first elastic members are evenly distributed along the second direction, where n>1.

5. The circuit board according to claim 4, characterized in that: An angle θ between the first direction and the second direction satisfies the following relationship: 0°≤θ≤90°.

6. The circuit board according to any one of claims 3 to 5, characterized in that: The distance between the m first elastic members in the first direction is L, where L≥1 mm.

7. The circuit board according to any one of claims 1 to 5, characterized in that: The first elastic member comprises: A first conductive layer and a first elastic layer, wherein the first elastic layer is built into the first conductive layer, the material of the first elastic layer has thermal conductivity and elasticity, and the material of the first conductive layer includes one or more of the following: aluminum, copper, aluminum alloy or stainless steel.

8. The circuit board according to any one of claims 1 to 5, characterized in that: The value range of the original height d1 of the first elastic member satisfies 1mm≤d1≤5mm, and / or the value range of the compression rate q of the first elastic member satisfies 40%≤q≤90%.

9. The circuit board according to any one of claims 1 to 5, characterized in that: The circuit board also includes a heat sink; the first elastic portion is used to electrically connect the heat sink and the circuit board body, and the first elastic portion is arranged in a gap between the circuit board body and the heat sink.

10. The circuit board according to claim 9, characterized in that: The circuit board also includes: The second elastic part includes at least one second elastic member, the second elastic member is flexibly connected to the surface of the heat sink according to a second rule, the second rule is determined based on the heat sink, and the second elastic member has a heat conduction function.

11. A circuit board, characterized in that: The circuit board comprises: A circuit board body, wherein at least one negative electrode connecting portion is provided on the circuit board body; A first connection portion, the first connection portion is used to establish an electrical connection between the circuit board body and the heat sink; The second elastic part includes at least one second elastic member, the second elastic member is flexibly connected to the surface of the heat sink according to a second rule, the second rule is determined based on the heat sink, and the second elastic member has a heat conduction function.

12. The circuit board according to claim 11, characterized in that: A cross-sectional shape of the second elastic member is determined based on the heat sink.

13. An image generation unit, characterized in that: Includes the circuit board as described in any one of claims 1-10, or includes the circuit board as described in claim 11 or 12.

14. An electronic device, characterized in that: Comprising a circuit board as described in any one of claims 10-12.

15. The electronic device according to claim 14, characterized in that: The electronic device comprises a shell, which is conductive; the second elastic portion of the circuit board is used to establish an electrical connection between the heat sink of the circuit board and the shell.

16. The electronic device according to claim 14 or 15, characterized in that: The electronic device includes a head-up display device or a computer.

17. The electronic device according to claim 15, characterized in that: The shell has a first inner wall and a second inner wall, and the radiator has a first outer wall and a second outer wall. A first gap along the width direction of the radiator is formed between the first inner wall of the shell and the first outer wall of the radiator arranged opposite to the first inner wall. A second gap along the length direction of the radiator is formed between the second inner wall of the shell and the second outer wall of the radiator arranged opposite to the second inner wall. The second elastic part is arranged in the first gap and / or the second gap.

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