Double-row packaging semiconductor laser

Abstract

The utility model provides a double-row packaged semiconductor laser, which belongs to the technical field of semiconductor lasers, and comprises a water channel, a water inlet and a water outlet are arranged at the bottom of the water channel, and a water inlet channel and a water outlet channel are arranged inside the water channel; the heat sink is fixedly arranged on one side of the water channel, and a plurality of heat dissipation teeth are arranged in each heat dissipation channel in the length direction of the channel; the lower ends of the two heat dissipation channels communicate with the water inlet channel, and the upper ends of the two heat dissipation channels communicate with the water outlet channel. Two laser chip sets; the two laser chips at the top end are connected in series; the two laser chip sets are packaged on one side of the heat sink and are respectively matched with the two heat dissipation channels; laser chips at the tail ends of the two laser chip sets are externally connected with a power supply through two lead electrodes; the front cover sleeves the outer sides of the heat sink and the two laser chip sets, and one end of the front cover is fixedly connected with the water channel; and the lens and the light guide crystal are sequentially and fixedly arranged on the two positioning steps respectively. The double-row packaged semiconductor laser can effectively solve the problems of poor heat dissipation and light spot homogenization.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor lasers, and particularly relates to a double-row packaged semiconductor laser. Background Art

[0002] With the change of the market, the requirements for lasers in the market are also increasing. There is a current demand for a large spot area, which has met the requirements of being fast and efficient during treatment, and the efficiency has been effectively improved. Therefore, a double-row packaged laser has been developed, which has a higher power, a larger spot area, and a larger energy density. However, the electrical parameters cannot be changed compared with conventional products, which requires the product to be improved in terms of heat dissipation. Moreover, on the basis of the double-row large spot area, the two spots of the double row need to be combined into one, without strong and weak spots.

[0003] The existing double-row packaged products use single-channel water flow for heat dissipation. The heat dissipation cavity has a large area, which is prone to form stagnant water and cavities. The heat dissipation management is not very ideal, and the heat exchange is poor. Moreover, due to the large cavity area, the water flow impact on the heat sink is prone to generate mechanical stress problems, resulting in the failure of the laser chip. In addition, for the double-row laser chips of the double-row product to emit light, a weak light area will be formed in the middle of the spot, and the spot homogenization is generally average. Summary of the Utility Model

[0004] To solve the above technical problems, the utility model proposes a double-row packaged semiconductor laser, which can effectively solve the problems of poor heat dissipation and spot homogenization.

[0005] The utility model provides the following technical solutions:

[0006] A double-row packaged semiconductor laser, comprising:

[0007] A water channel, having a water inlet and a water outlet at the bottom, and having a water inlet channel and a water outlet channel inside;

[0008] A heat sink, fixedly arranged on one side of the water channel; the heat sink has two heat dissipation channels, and a plurality of heat dissipation teeth are arranged along the channel length direction in each heat dissipation channel; the lower ends of the two heat dissipation channels are both communicated with the water inlet channel, and the upper ends of the two heat dissipation channels are both communicated with the water outlet channel;

[0009] Two laser chip groups, including a plurality of serially connected laser chips; the two laser chips at the top are serially connected; the two laser chip groups are both packaged on one side of the heat sink and are respectively matched with the two heat dissipation channels; the laser chips at the tails of the two laser chip groups are externally connected to a power supply through two lead electrodes;

[0010] A front cover, sleeved outside the heat sink and the two laser chip groups, with one end fixedly connected to the water channel and the other end provided with two circumferential positioning steps in sequence;

[0011] A lens and a light guide crystal are respectively and sequentially fixedly arranged on two positioning steps; the lens is located on one side close to the laser chip group;

[0012] Preferably, the water inlet channel and the water outlet channel are both of a flared shape at the joints with the two heat dissipation tooth channels.

[0013] Preferably, a reinforcing rib is arranged between two groups of heat dissipation teeth of the two heat dissipation channels.

[0014] Preferably, the lead electrode is arranged on the other side of the water channel.

[0015] Preferably, the lens and the light guide crystal are a quartz glass lens and a quartz glass light guide crystal; antireflection films corresponding to the wavelengths are coated on both sides of the lens and the light guide crystal.

[0016] Preferably, the matching gap between the water channel and the heat sink is sealed by a sealing ring.

[0017] Preferably, the lens and the light guide crystal are bonded to the front cover by an optical adhesive.

[0018] Preferably, the front cover is fixed to the water channel by screws.

[0019] Advantages of the present utility model:

[0020] The present utility model provides a double-row packaged semiconductor laser. Before the light spot enters the light guide crystal, a lens is added to first perform overall compression on the light spot of the slow axis, reduce the weak light area in the middle thereof, then perform homogenization through the light guide crystal, and finally output. This method can effectively solve the problem of light spot two-in-one, and can also ensure the homogenization of the light spot and the application of a large light spot. The light spot in the fast axis direction is naturally transitioned by the light guide crystal, and the homogenization is better. The semiconductor laser is provided with a double-channel water flow, and the heat dissipation effect is better. Description of the drawings

[0021] Figure 1 is an overall assembly drawing of the double-row packaged semiconductor laser according to an embodiment of the present utility model;

[0022] Figure 2 is a schematic structural diagram of the water and electricity design of the double-row packaged semiconductor laser according to an embodiment of the present utility model, wherein, Figure 2 (a) is a sectional view under a top view, Figure 2 (b) is a three-dimensional view, Figure 2 (c) is a sectional view under a side view, Figure 2 (d) is a front view;

[0023] Figure 3It is the back waterway diagram of the double-row packaged semiconductor laser in the embodiment of the present utility model;

[0024] Figure 4 It is the schematic diagram of the optical structure of the double-row packaged semiconductor laser in the embodiment of the present utility model.

[0025] In the figure, 101 is the water channel; 102 is the heat sink; 103 is the lead electrode; 104 is the laser chip; 201 is the front cover; 202 is the lens; 203 is the light guide crystal. Specific embodiments

[0026] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model, and are not used to limit the present utility model.

[0027] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

[0028] The terms "first" and "second" are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features; in the description of the present utility model, unless otherwise specified, the meaning of "plurality" is two or more.

[0029] Embodiment 1

[0030] For the existing double-row packaged products, they are single-channel water flow for heat dissipation. The heat dissipation cavity has a large area, which is prone to form dead water and cavities. The heat dissipation management is not very ideal, the heat exchange is poor, and due to the large cavity area, the water flow impact on the heat sink is likely to cause mechanical stress problems, resulting in the failure of the laser chip. Moreover, for the double-row laser chips of the double-row products to emit light, a weak light area will be formed in the middle of the light spot, and the light spot uniformity is average. Therefore, this embodiment proposes a double-row packaged semiconductor laser, as Figure 1 shown Figure 1It is a schematic diagram of the overall structure. In this embodiment, the double-row structure has undergone professional thermodynamic simulation and optical simulation to meet the usage requirements and improve the product's usage quality. It is mainly reflected in two parts: the hydroelectric design of the semiconductor laser and the optical structure.

[0031] As Figure 2 and Figure 3 shown, Figure 2 It is a schematic diagram of the hydroelectric design structure of the semiconductor laser. Among them, Figure 2 (a) of it is a sectional view from above, Figure 2 (b) of it is a three-dimensional view, Figure 2 (c) of it is a sectional view from the side, Figure 2 (d) of it is a front view; Figure 3 It is a back waterway diagram.

[0032] Among them, water flows in from the water inlet (in) of the water channel 101, and then divides into two when flowing into the water inlet (in) of the heat sink 102. The heat sink 102 is divided into two chambers for double-row parallel water cooling. After heat exchange, it then flows out from the water outlet (out) of the heat sink 102, and then converges into the water channel 101 to form a channel, and finally flows out from the water outlet (out) of the water channel 101. For double-row parallel water cooling, there is a reinforcing rib designed in the middle of the heat dissipation tooth structure, making the packaging of the heat sink 102 more firm and reducing the problem of stress deformation generated after power-on operation and high water pressure. And the positions of the water inlet and outlet holes where the water channel 101 and the heat sink 102 are docked are set as flared shapes, which evenly diverts the water in the double row, and there will be no problem of more water on one side and less water on the other side. It also effectively solves the problem of the formation of cavities and stagnant water in the water flow in the heat dissipation cavity of the heat sink 102, resulting in poor heat exchange. This structure also makes the water flow smoother, and the double-row heat dissipation teeth dissipate heat independently without affecting each other, and the heat dissipation performance is better.

[0033] In terms of the circuit, current is input from the positive electrode of the lead electrode 103, flows through the laser chip 104, and the double-row power-on working mode is circuit series. As Figure 2 the arrow indicates the current direction, and then it is output from the negative electrode of the lead electrode 103 to light up all the laser chips 104 for normal operation.

[0034] The optical structure is as Figure 4 shown.

[0035] The laser module works normally and emits light. However, since it is packaged in a double-row package, the slow-axis light-emitting mode also consists of two juxtaposed light spots. A weak light region will form between the two slow-axis light spots, which affects the treatment and the customer experience. However, simply relying on the light guide crystal 203 to converge the two slow-axis light spots will not solve this problem, and there will still be a weak light region in the middle part. Therefore, a lens 202 is added before the light spots enter the light guide crystal 203 to first compress the slow-axis light spots as a whole, reducing the weak light region in the middle. Then, it undergoes homogenization through the light guide crystal 203 and is finally output. This method can effectively solve the problem of combining two light spots and also ensure the homogenization of the light spots and the application of large light spots. The light spots in the fast-axis direction are naturally transitioned by the light guide crystal 203, and the homogenization is better.

[0036] In addition, the lens 202 and the light guide crystal 203 are made of high-transparency quartz glass and are double-sided coated with an antireflection film corresponding to the wavelength to increase the light transmittance. The front cover 201 has two steps for positioning respectively. The lens 202 and the light guide crystal 203 are positioned at the steps of the front cover 201 and are bonded with optical glue. The first step fixes the lens 202, and the second step fixes the light guide crystal 203. The front cover 201 and the water channel 101 are locked with screws.

[0037] The present utility model provides a double-row packaged semiconductor laser. Before the light spots enter the light guide crystal, a lens is added to first compress the slow-axis light spots as a whole, reducing the weak light region in the middle. Then, it undergoes homogenization through the light guide crystal and is finally output. This method can effectively solve the problem of combining two light spots and also ensure the homogenization of the light spots and the application of large light spots. The light spots in the fast-axis direction are naturally transitioned by the light guide crystal, and the homogenization is better. The semiconductor laser is provided with a dual-channel water flow, and the heat dissipation effect is better.

[0038] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A double-row packaged semiconductor laser, characterized in that: include: A water channel (101) is provided with a water inlet and a water outlet at the bottom thereof, and has a water inlet channel and a water outlet channel inside thereof; A heat sink (102) is fixedly arranged on one side of the water channel (101); the heat sink (102) has two heat dissipation channels, each of which is provided with a plurality of heat dissipation teeth along the length direction of the channel; the lower ends of the two heat dissipation channels are both connected to the water inlet channel, and the upper ends thereof are both connected to the water outlet channel; Two laser chip groups, comprising a plurality of laser chips (104) connected in series; the two laser chips (104) at the top are connected in series; the two laser chip groups are both packaged on one side of the heat sink (102) and respectively cooperate with the two heat dissipation channels; the laser chips (104) at the rear ends of the two laser chip groups are externally connected to a power source via two lead electrodes (103); A front cover (201) is sleeved on the outside of the heat sink (102) and the two laser chip groups, one end of which is fixedly connected to the water channel (101), and the other end of which is sequentially provided with two circumferential positioning steps; The lens (202) and the light-guiding crystal (203) are respectively and sequentially fixedly arranged on the two positioning steps, and the lens (202) is located on a side close to the laser chip group.

2. The double-row packaged semiconductor laser according to claim 1, characterized in that: The connection parts between the water inlet channel and the water outlet channel and the two heat dissipation tooth channels are all bell-mouth shaped.

3. The double-row packaged semiconductor laser according to claim 1, characterized in that: Reinforcing ribs are arranged between the two groups of heat dissipation teeth of the two heat dissipation channels.

4. The double-row packaged semiconductor laser according to claim 1, characterized in that: The lead electrode (103) is arranged on the other side of the water channel (101).

5. The double-row packaged semiconductor laser according to claim 1, characterized in that: The lens (202) and the light-guiding crystal (203) are quartz glass lenses and quartz glass light-guiding crystals; both sides of the lens (202) and the light-guiding crystal (203) are coated with anti-reflection films of corresponding wavelengths.

6. The double-row packaged semiconductor laser according to claim 1, characterized in that: The matching gap between the water channel (101) and the heat sink (102) is sealed by a sealing ring.

7. The double-row packaged semiconductor laser according to claim 1, characterized in that: The lens (202) and the light-guiding crystal (203) are bonded to the front cover (201) by optical glue.

8. The double-row packaged semiconductor laser according to claim 1, characterized in that: The front cover (201) and the water channel (101) are fixed by screws.

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