Circuit board and photovoltaic inverter
By improving the circuit board layout, centrally placing switch tubes and driving power supplies, and evenly placing absorption capacitors, the problems of increasing area of existing photovoltaic inverter radiator and poor EMC effect are solved, and cost reduction and welding steps are achieved.
Patent Information
- Application Number
- CN202422000562.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-16
AI Technical Summary
The switching tube layout of existing photovoltaic inverters leads to an increase in the area of the radiator and an increase in cost, and the complex driving power circuit, affecting the copper paving and EMC effects of the main circuit.
Adopting an improved circuit board layout, the switching tubes that centrally place the BOOST boost circuit and the inverter circuit are placed in adjacent first and second areas, the driving power supply is centrally placed in the third area, and the absorption capacitor is evenly arranged between the switching tubes.
The area of the radiator is reduced, the cost is reduced, and the welding steps are simplified, the effective copper laying area of the circuit board is improved, and the EMC effect is optimized.
Smart Images
Figure CN223039884U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a circuit board and a photovoltaic inverter. Background Art
[0002] At present, the tube layout of various switching tube modules of a photovoltaic inverter is mostly as follows: the switching tubes of the BOOST boost circuit are on one side of the circuit board, and the switching tubes of the inverter circuit are on the other side of the circuit board. Such an arrangement will lead to an increase in the radiator area, an increase in the number of heat dissipation fins, an increase in the volume of the whole machine, and an increase in cost. The driving power supply of the switching tubes is arranged on the side of the tubes or erected, which will lead to an increase in the driving power supply loop length and affect the copper laying of the main circuit. The absorption capacitors are generally concentrated near the tubes or made into small boards and erected, so that the absorption loop is long and the EMC effect is poor.
[0003] The above information disclosed in the background art section is only used to enhance the understanding of the background of the present application. Therefore, it may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Utility Model
[0004] In order to solve the above technical problems, the utility model provides an improved circuit board and a photovoltaic inverter, which reduce the area where a radiator needs to be installed, reduce costs, and can also simplify the soldering steps during processing.
[0005] The utility model adopts the following technical solutions:
[0006] A circuit board of a photovoltaic inverter includes a substrate and a plurality of components. The substrate has a first region, a second region, and a third region; the plurality of components include a first switching tube of a BOOST boost circuit and a second switching tube of an inverter circuit. The first switching tube of the BOOST boost circuit is arranged on the front surface of the first region, and the second switching tube of the inverter circuit is arranged on the front surface of the second region. The driving power supply of each switching tube is arranged on the front surface of the third region; wherein, the first region and the second region are adjacent or connected.
[0007] In some preferred embodiments, the plurality of components further include a plurality of absorption capacitors, and the plurality of absorption capacitors are arranged on the front surface of the first region and / or the second region.
[0008] In some more preferred embodiments, the plurality of first switching tubes of the BOOST boost circuit are arranged in multiple columns in the first region, and absorption capacitors are arranged between adjacent two columns of the first switching tubes; and / or, the plurality of second switching tubes of the inverter circuit are arranged in multiple columns in the second region, and absorption capacitors are arranged between adjacent two columns of the second switching tubes.
[0009] In some further preferred embodiments, the pins of the first switching tube face the gap between the first switching tubes in adjacent two columns; the pins of the second switching tube face the gap between the second switching tubes in adjacent two columns.
[0010] In some preferred embodiments, the third region is adjacently arranged to one of the first region and the second region.
[0011] In some preferred embodiments, the first switching tube and the second switching tube include an IGBT tube, a MOS tube or a triode.
[0012] The present utility model also adopts the following technical solutions:
[0013] A photovoltaic inverter includes a box body and a radiator, and the photovoltaic inverter further includes the circuit board as described above. The radiator is arranged at a position on the back of the box body opposite to the first region and the second region.
[0014] In some preferred embodiments, the circuit board is arranged inside the box body. The radiator has a mounting surface, and the mounting surface is in direct contact with the back surfaces of the first region and the second region of the circuit board or is indirectly connected through the bottom plate of the box body.
[0015] In some more preferred embodiments, the photovoltaic inverter further includes an inductor module. The inductor module is arranged on the back of the box body, and the inductor module is located beside the radiator or the radiator is located between a plurality of the inductor modules.
[0016] In some preferred embodiments, the radiator includes a plurality of heat dissipation fins, and the heat dissipation fins are only arranged corresponding to the parts of the first region and the second region.
[0017] The above solutions adopted by the present utility model have the following advantages:
[0018] For the circuit board of the present utility model, the switching tubes of the BOOST circuit are centrally placed in the first region, and the switching tubes of the inverter circuit are centrally placed in the second region. Moreover, the first region and the second region are adjacent or connected, which can reduce the area of the radiator to be installed, lower the cost, and can also simplify the soldering steps during processing; the drive power supplies of each switching tube are centrally placed in the third region, without affecting the copper laying and electrical performance of the first region and the second region.
[0019] In some preferred solutions, the absorption capacitors of the absorption circuit of the photovoltaic inverter are evenly distributed between adjacent two columns of the first switching tubes or the second switching tubes, and the pins can be directly connected to the main circuit of the switching tubes, and the absorption effect is better.
[0020] The photovoltaic inverter adopting this circuit board can reduce the coverage area of the heat dissipation fins, make full use of the space of the box body, reduce the weight of the box body, and lower the cost; increase the effective copper plating area on the circuit board to reduce the thermal resistance; shorten the power drive signal, reduce the loop, and optimize the EMC. Description of the Drawings
[0021] In order to more clearly illustrate the technical solutions of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0022] Figure 1 It is a layout diagram of the front side of a circuit board according to an embodiment of the present invention.
[0023] Figure 2 It is a three-dimensional view of a circuit board according to an embodiment of the present invention.
[0024] Figure 3 It is a three-dimensional view of a photovoltaic inverter from one perspective according to an embodiment of the present invention.
[0025] Figure 4 It is a three-dimensional view of a photovoltaic inverter from another perspective according to an embodiment of the present invention.
[0026] Figure 5 It is a side view of a photovoltaic inverter according to an embodiment of the present invention, where the box body is not shown.
[0027] Among them,
[0028] 100, circuit board; 101, first area; 102, second area; 103, third area; 110, substrate; 121, first switching tube; 121a, pin; 122, second switching tube; 122a, pin; 123, absorption capacitor; 130, drive power supply; 131, transformer;
[0029] 200, box body; 201, bottom plate;
[0030] 300, radiator; 301, heat dissipation fin;
[0031] 400, inductance module. Detailed Embodiments
[0032] The following elaborates on the preferred embodiments of the present utility model in conjunction with the accompanying drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art. It should be noted here that the description of these embodiments is used to help understand the present utility model, but does not constitute a limitation on the present utility model. In addition, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.
[0033] Figures 2 to 5 The diagrams are drawn to actual scale. To maintain the brevity of the specification, the proportions of each component are not listed one by one, but the proportions and positions of each component should be regarded as part of the content of this specification.
[0034] Figure 1 and Figure 2 show a circuit board 100 according to an embodiment of the present utility model. Referring to Figure 1 and Figure 2 shown, the circuit board 100 includes a substrate 110 and a plurality of components. The substrate 110 is a surface copper-clad board, and the plurality of components are arranged on the substrate 110 and are electrically connected through tin plating or wires on the substrate 110. The substrate 110 has a first region 101, a second region 102, and a third region 103. The above-mentioned plurality of components include a first switching tube 121 of a BOOST boost circuit and a second switching tube 122 of an inverter circuit. The first switching tube 121 of the BOOST boost circuit is arranged on the front surface of the first region 101, and the second switching tube 122 of the inverter circuit is arranged on the front surface of the second region 102. The drive power supply 130 of each switching tube is arranged on the front surface of the third region 103. Among them, the first region 101 and the second region 102 are adjacent or connected; further, the first region 101 and the second region 102 are located on the same board. The third region 103 is adjacent to one of the first region 101 and the second region 102. As in the specific example shown in Figure 1 shown, the first region 101, the second region 102, and the third region 103 are arranged in sequence, and the second region 102 is located between the first region 101 and the third region 103. In some other embodiments, the first region 101 can also be arranged between the second region 102 and the third region 103.
[0035] The above-mentioned plurality of components also include a plurality of absorption capacitors 123 (such as the 6 shown in Figure 1 and Figure 2 shown), and the plurality of absorption capacitors 123 are arranged on the front surface of the first region 101 and / or the second region 102. Specifically, the plurality of first switching tubes 121 of the BOOST boost circuit (such as Figure 1The four (as shown) are arranged in multiple columns in the first area 101, and an absorption capacitor 123 is provided between the first switching tubes 121 in adjacent columns. The multiple second switching tubes 122 (such as Figure 1 the twelve (as shown) are arranged in multiple columns in the second area 102, and an absorption capacitor 123 is provided between the second switching tubes 122 in adjacent columns. The pin 121a of the first switching tube 121 faces the gap between the first switching tubes 121 in adjacent columns; the pin 122a of the second switching tube 122 faces the gap between the second switching tubes 122 in adjacent columns. In Figure 1 the specific example shown, the multiple first switching tubes 121 are arranged in pairs in the first area 101, and the multiple second switching tubes 122 are arranged in pairs in the second area 102, and their respective pins face the middle gap or the absorption capacitor 123. Such an arrangement will result in a larger effective copper plating area than when they are scattered, a smaller overall electrical circuit, and a good EMC effect.
[0036] The first switching tube 121 and the second switching tube 122 include an IGBT tube, a MOS tube, or a triode. The absorption capacitor 123 is a component of the absorption circuit of the photovoltaic inverter and is used as the absorption capacitor. It can be a thin film capacitor or other types of capacitors. The drive power supply 130 includes multiple transformers 131 and peripheral circuits, and the signals of the drive power supply 130 are transmitted to the corresponding first switching tube 121 or second switching tube 122 nearby through soldering or wires.
[0037] Figures 3 to 5 shows a photovoltaic inverter according to an embodiment of the present invention. Refer to Figures 3 to 5 as shown, the photovoltaic inverter includes the above-mentioned circuit board 100, the box body 200, and the radiator 300. The radiator 300 is arranged at a position on the back of the box body 200 opposite to the first area 101 and the second area 102 of the circuit board 100.
[0038] The circuit board 100 is disposed within the box body 200. The radiator 300 has a mounting surface, and the mounting surface is in direct contact with the back surfaces of the first region 101 and the second region 102 of the circuit board 100 or is indirectly connected through the bottom plate 201 of the box body 200. In the specific example shown in the drawings, the circuit board 100 is located within the box body 200, the radiator 300 is located outside the box body 200, the bottom plate 201 of the box body 200 is therebetween, and through holes may be formed in the bottom plate 201 of the box body 200 to facilitate the contact between the circuit board 100 and the radiator 300 and improve the heat dissipation efficiency. In some other embodiments, the bottom plate 201 of the box body 200 may be closely attached to the first region 101 and the second region 102 of the circuit board 100, for example, by means of heat-conducting glue; the mounting surface of the radiator 300 is closely attached to the bottom plate 201, for example, by means of heat-conducting glue; the heat generated by the switching tubes on the first region 101 and the second region 102 is conducted to the radiator 300 through the bottom plate 201, and is dissipated in time through the radiator 300. A radiator 300 may not be provided below the third region 103 of the circuit board 100.
[0039] This photovoltaic inverter further includes an inductor module 400. The inductor module 400 is disposed on the back surface of the box body 200. The inductor module 400 is located beside the radiator 300 or the radiator 300 is located between a plurality of inductor modules 400. The radiator 300 includes a plurality of heat sinks 301, and the heat sinks 301 are provided only corresponding to a part of the first region 101 and the second region 102. Specifically in the example shown in the drawings, the radiator 300 is disposed in the middle of the bottom plate 201, and one or more inductor modules 400 are respectively disposed on both sides of the radiator 300. The inductor module 400 is detachably connected to the bottom plate 201 of the box body 200 through a fastener. A power inductor is disposed within the inductor module 400, and the inductor module 400 may be provided with heat dissipation fins by itself.
[0040] In this embodiment, the switching tubes of the BOOST boost circuit and the switching tubes of the inverter circuit are respectively placed pairwise opposite to each other in two rows. The absorption capacitor 123 is placed between the two columns of switching tubes, and the drive power supplies 130 of the respective switching tubes are centrally placed in the third region 103. Thus, the area of the radiator 300 is reduced, the cost is lowered, and the soldering steps can also be simplified during processing. The drive power supplies 130 do not affect the copper laying and electrical performance of the main circuit of the switching tubes; the absorption capacitor 123 is evenly distributed between the two columns of switching tubes, and the pins are directly connected to the main circuit, and the absorption effect is good. For the photovoltaic inverter using this circuit board 100, the required heat sink coverage area is relatively small, the space of the box body 200 can be fully utilized, the weight of the box body 200 is reduced, and the cost is lowered; the effective copper laying area on the PCB board is increased, and the thermal resistance is reduced; the power drive signal is shortened, the loop is reduced, and the EMC is optimized.
[0041] The layout of the circuit board 100 in this embodiment allows for a larger effective copper plating area between the switching transistors, enabling more current to flow within the same PCB area. The current thermal resistance is small, and the heat dissipation effect of the copper foil is improved by 10% - 15%. The absorption capacitor 123 can absorb the spike voltage in the circuit, suppress the instantaneous high and low voltage transformation, reduce the impact of interference and noise on the circuit, stabilize and balance the voltage, thereby avoiding damage to the switching transistors. The closer the absorption capacitor 123 is placed to the switching transistors, the better the effect. In this embodiment, the absorption capacitor 123 is placed in the middle of the switching transistors, achieving the optimal effect of the absorption capacitor and better EMC effect of the circuit. From the perspective of the heat sink 300, if the switching transistors are placed in the middle of the housing 200, the heat sink 300 can add heat sinks only in the middle, making the production of the heat sink 300 simpler and the cost lower. Power inductors or other components are placed on both sides of the heat sink, thereby achieving higher space utilization, smaller overall dimensions, and lighter weight of the whole machine. The drive power supply 130 of the switching transistors is centrally placed in the third region 103, so that the wiring distance of the drive power supply 130 is short, the loop is small, and the EMC effect is good.
[0042] As shown in this specification and the claims, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. The term "and / or" used herein includes any combination of one or more of the related listed items.
[0043] It should be noted that unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. In addition, the up, down, left, and right descriptions used in the present invention are only relative to the mutual positional relationship of the components of the present invention in the drawings.
[0044] The above embodiments are only for illustrating the technical concept and features of the present invention, and are a preferred embodiment. The purpose is to enable those familiar with this technology to understand the content of the present invention and implement it accordingly, and it cannot be used to limit the protection scope of the present invention. Any equivalent transformation or modification made according to the principle of the present invention should be covered within the protection scope of the present invention.
Claims
1. A circuit board, comprising a substrate and a plurality of components, characterized in that: The substrate has a first area, a second area and a third area; the multiple components include a first switch tube of a BOOST boost circuit and a second switch tube of an inverter circuit, the first switch tube of the BOOST boost circuit is arranged on the front side of the first area, the second switch tube of the inverter circuit is arranged on the front side of the second area, and the driving power supply of each of the switch tubes is arranged on the front side of the third area; wherein the first area and the second area are arranged adjacent to or connected to each other.
2. The circuit board according to claim 1, characterized in that: The plurality of components further include a plurality of absorption capacitors, and the plurality of absorption capacitors are arranged on the front side of the first region and / or the second region.
3. The circuit board according to claim 2, characterized in that: The multiple first switch tubes of the BOOST boost circuit are arranged in multiple columns in the first area, and the absorption capacitor is arranged between two adjacent columns of the first switch tubes; and / or, the multiple second switch tubes of the inverter circuit are arranged in multiple columns in the second area, and the absorption capacitor is arranged between two adjacent columns of the second switch tubes.
4. The circuit board according to claim 3, characterized in that: The pins of the first switch tubes face the gap between the first switch tubes in two adjacent columns; the pins of the second switch tubes face the gap between the second switch tubes in two adjacent columns.
5. The circuit board according to claim 1, characterized in that: The third region is disposed adjacent to one of the first region and the second region.
6. The circuit board according to claim 1, characterized in that: The first switch tube and the second switch tube include an IGBT tube, a MOS tube or a triode.
7. A photovoltaic inverter, comprising a box and a radiator, characterized in that: The photovoltaic inverter further comprises the circuit board according to any one of claims 1 to 6, and the heat sink is arranged at a position on the back side of the box body opposite to the first area and the second area.
8. The photovoltaic inverter according to claim 7, characterized in that: The circuit board is arranged in the box body, and the heat sink has a mounting surface. The mounting surface is in direct contact with the back surfaces of the first area and the second area of the circuit board or is indirectly connected with the back surface through the bottom plate of the box body.
9. The photovoltaic inverter according to claim 8, characterized in that: The photovoltaic inverter further includes an inductor module, which is disposed on the back of the box body. The inductor module is located beside the radiator or the radiator is located between a plurality of the inductor modules.
10. The photovoltaic inverter according to claim 7, characterized in that: The heat sink includes a plurality of heat sinks, and the heat sinks are disposed only in portions corresponding to the first area and the second area.