Inverter and energy storage power supply

Abstract

The utility model belongs to the technical field of energy storage, and discloses an inverter and an energy storage power supply, the inverter is used for the energy storage power supply, the energy storage power supply comprises a heat dissipation substrate, a circuit board and a heat conduction member, the heat dissipation substrate defines an installation cavity, the bottom wall of the installation cavity is provided with at least one heat dissipation member, the circuit board is installed in the installation cavity, and the circuit board is provided with a power component. The heat conduction piece is arranged corresponding to the power component and abuts against the bottom wall of the installation cavity. The heat dissipation substrate of the inverter is not only a supporting plate of the whole inverter, but also a heat dissipation plate of the whole inverter, can meet mechanical properties and thermal properties, and does not need to use a heat dissipation fan in the prior art while ensuring that the whole inverter has good heat dissipation capability. And the lightweight and miniaturized design of the energy storage power supply is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of energy storage, in particular to an inverter and an energy storage power supply. Background Art

[0002] In an energy storage power supply, the inverter has become one of the core components in the energy storage power supply due to its advantages of easy installation, high conversion efficiency, and low-voltage safety. During the operation of the energy storage power supply, the heat generated by the inverter is an important source of the heat generated by the energy storage power supply. Therefore, the heat dissipation efficiency of the inverter is an important operating parameter of the energy storage power supply. In the existing energy storage power supplies, the inverter is usually installed on a heat dissipation bracket, and then cooled by a fan installed on the heat dissipation bracket. Although this method can achieve heat dissipation of the inverter, the overall volume is large and the protection level is low, which is not conducive to the lightweight and miniaturized design of the energy storage power supply. Summary of the Utility Model

[0003] The first object of the utility model is to provide an inverter with high heat dissipation efficiency and small volume, which is conducive to the lightweight and miniaturized design of the energy storage power supply.

[0004] The second object of the utility model is to provide an energy storage power supply with high heat dissipation efficiency, light weight, and small volume.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] The utility model discloses an inverter for an energy storage power supply, including: a heat dissipation substrate defining an installation cavity, and at least one heat dissipation member is provided on the bottom wall of the installation cavity; a circuit board installed in the installation cavity, with power components provided on the circuit board, and a heat conduction member corresponding to the power components and abutting against the bottom wall of the installation cavity.

[0007] In some embodiments, the power components include at least one transformer passing through the circuit board, and the heat conduction member is clamped between the transformer and the bottom wall of the installation cavity.

[0008] In some embodiments, the power components include at least one inductor passing through the circuit board, and the heat conduction member is clamped between the inductor and the bottom wall of the installation cavity.

[0009] In some embodiments, the power components include a plurality of surface-mounted MOS transistors installed on one side of the circuit board facing away from the bottom wall of the installation cavity; the heat conduction member is installed on the side of the circuit board facing the bottom wall of the installation cavity and is arranged in one-to-one correspondence with the plurality of surface-mounted MOS transistors.

[0010] In some embodiments, the power components include a plurality of packaged MOS transistors disposed adjacent to the side wall of the installation cavity, and the plurality of packaged MOS transistors are installed on one side of the circuit board facing away from the bottom wall of the installation cavity; a plurality of heat dissipation sleeves are further provided on the circuit board, and the plurality of heat dissipation sleeves are sleeved on the packaged MOS transistors one by one.

[0011] In some specific embodiments, the inverter further includes a heat dissipation fixing plate, the heat dissipation fixing plate is spaced apart from the side wall of the installation cavity and is connected by a fixing member, and the heat dissipation fixing plate abuts against one side of the heat dissipation sleeve away from the side wall of the installation cavity to press one side of the heat dissipation sleeve close to the side wall of the installation cavity against the side wall of the installation cavity.

[0012] In some embodiments, at least one installation groove is provided on the bottom wall of the installation cavity, and a heat dissipation member is provided in each installation groove, the heat dissipation member abuts against the heat conduction member, and the heat conduction coefficient of the heat dissipation member is greater than the heat dissipation coefficient of the heat dissipation substrate.

[0013] In some embodiments, the heat dissipation substrate includes a bottom plate and two side plates, the two side plates are respectively connected to opposite sides of the bottom plate, and heat dissipation fins are provided on one sides of the two side plates facing away from each other.

[0014] In some embodiments, the inverter further includes an insulating member, the insulating member is installed in the installation cavity, and the insulating member is located between the circuit board and the bottom wall of the installation cavity, and an avoidance hole for avoiding the heat conduction member is provided on the insulating member.

[0015] The present utility model also discloses an energy storage power supply, including a housing, a battery module and the inverter described above, the inverter and the battery module are both installed inside the housing, and the inverter is electrically connected to the battery module.

[0016] The beneficial effects of the inverter of the present utility model: During actual operation, the heat generated by the power components on the circuit board during operation can be conducted to the bottom wall of the installation cavity through the circuit board and the heat conduction member. The heat dissipation substrate itself has good heat dissipation ability, and at least one heat dissipation member is provided on the bottom wall of the installation cavity. Through the heat dissipation of the heat dissipation substrate and the heat dissipation member, the heat generated when the power components work can be dissipated into the environment. Thus, the heat dissipation substrate of the inverter in this embodiment is both the support plate of the entire inverter and the heat dissipation plate of the entire inverter, which can not only meet the mechanical properties but also meet the thermal properties. While ensuring that the entire inverter has good heat dissipation ability, there is no need to use a heat dissipation fan in the prior art, which is beneficial to the lightweight and miniaturized design of the energy storage power supply.

[0017] Advantages of the energy storage power supply of the present utility model: Due to having the inverter described above, the energy storage power supply has relatively high heat dissipation efficiency, light weight, and small volume.

[0018] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present utility model. Description of the Drawings

[0019] Figure 1 is a schematic structural diagram of the inverter according to an embodiment of the present utility model;

[0020] Figure 2 is an exploded schematic diagram of a form of the inverter according to an embodiment of the present utility model;

[0021] Figure 3 is an exploded schematic diagram of another form of the inverter according to an embodiment of the present utility model;

[0022] Figure 4 is an exploded schematic diagram of the heat dissipation substrate of the inverter according to an embodiment of the present utility model;

[0023] Reference Numerals:

[0024] 100, heat dissipation substrate; 110, bottom plate; 111, mounting groove; 112, heat dissipation member; 120, side plate; 121, heat dissipation fin;

[0025] 200, circuit board; 201, transformer; 202, inductor; 203, surface mount MOS transistor; 204, packaged MOS transistor; 205, heat dissipation sleeve;

[0026] 300, heat conducting member; 400, heat dissipation fixing plate; 500, fixing member;

[0027] 600, insulating member; 610, avoidance hole. Detailed Embodiments

[0028] The present utility model will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the sake of description, only parts related to the present utility model are shown in the drawings, rather than all the structures.

[0029] In the description of the present utility model, unless otherwise clearly specified and defined, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath", and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0031] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0032] The following describes the specific structure of the inverter according to the embodiments of the present utility model with reference to the drawings.

[0033] The present utility model discloses an inverter, which is used for an energy storage power supply. Refer to Figure 1 and Figure 3As shown in the figure, the energy storage power supply includes a heat dissipation substrate 100, a circuit board 200, and a heat conducting member 300. The heat dissipation substrate 100 defines an installation cavity, and at least one heat dissipation member 112 is provided on the bottom wall of the installation cavity. The circuit board 200 is installed in the installation cavity, and power components are provided on the circuit board 200. The heat conducting member 300 is correspondingly arranged with the power components and abuts against the bottom wall of the installation cavity. It can be understood that during the actual working process, the heat generated by the power components on the circuit board 200 can be conducted to the bottom wall of the installation cavity through the circuit board 200 and the heat conducting member 300. The heat dissipation substrate 100 itself has good heat dissipation ability, and at least one heat dissipation member 112 is provided on the bottom wall of the installation cavity. Through the heat dissipation of the heat dissipation substrate 100 and the heat dissipation member 112, the heat generated when the power components work can be dissipated into the environment. Thus, the heat dissipation substrate 100 of the inverter in this embodiment is both the support plate of the entire inverter and the heat dissipation plate of the entire inverter, which can meet both mechanical properties and thermal properties. While ensuring that the entire inverter has good heat dissipation ability, there is no need to use a heat dissipation fan in the prior art, which is beneficial to the lightweight and miniaturization design of the energy storage power supply.

[0034] Optionally, the heat conducting member 300 is a silicone member. It can be understood that by using a silicone member as the heat dissipation member 112, the power components can transfer heat to the bottom heat dissipation substrate 100 through the silicone member, and at the same time, it can ensure the insulation between the power components and the heat dissipation substrate 100, thus ensuring the working stability of the inverter.

[0035] Optionally, the heat dissipation substrate 100 can be processed by a profile machining machine and does not need to be formed by die casting. The processing is simple and the manufacturing cost is relatively low.

[0036] Optionally, the heat dissipation substrate 100 is a metal member. Thus, the heat dissipation substrate 100 has good heat dissipation ability, thereby ensuring a high heat dissipation efficiency of the entire inverter.

[0037] Reference Figure 3 As shown in the figure, the power components include at least one transformer 201. The transformer 201 penetrates through the circuit board 200, and the heat conducting member 300 is clamped between the transformer 201 and the bottom wall of the installation cavity. It can be understood that during the actual working process, the transformer 201 generates a large amount of heat. If the transformer 201 is directly installed on the surface of the circuit board 200, it may reduce the heat dissipation effect of the heat conducting member 300 on the transformer 201. In this embodiment, the transformer 201 penetrates through the circuit board 200, and the heat conducting member 300 directly abuts against the transformer 201. The heat generated by the transformer 201 during operation does not need to pass through the circuit board 200 and can directly pass through the heat conducting member 300 to be transferred to the bottom wall of the installation cavity and then dissipated, which is beneficial to ensuring the heat dissipation effect on the transformer 201.

[0038] ReferenceFigure 3 As shown, the power component includes at least one inductor 202. The inductor 202 is passed through the circuit board 200, and the heat conducting member 300 is clamped between the inductor 202 and the bottom wall of the installation cavity. It can be understood that during the actual working process, the inductor 202 generates a large amount of heat. If the inductor 202 is directly installed on the surface of the circuit board 200, it may reduce the heat dissipation effect of the heat conducting member 300 on the inductor 202. In this embodiment, the inductor 202 is passed through the circuit board 200, and the heat conducting member 300 directly abuts against the inductor 202. The heat generated by the inductor 202 during operation does not need to pass through the circuit board 200 and can directly pass through the heat conducting member 300 to the bottom wall of the installation cavity and then dissipate, which is beneficial to ensuring the heat dissipation effect of the inductor 202.

[0039] Reference Figure 3 As shown, the power component includes a plurality of surface-mounted MOS transistors 203. The plurality of surface-mounted MOS transistors 203 are installed on one side of the circuit board 200 facing away from the bottom wall of the installation cavity; the heat conducting member 300 is installed on one side of the circuit board 200 facing the bottom wall of the installation cavity and is arranged in one-to-one correspondence with the plurality of surface-mounted MOS transistors 203. It can be understood that due to the characteristics of the surface-mounted MOS transistor 203, the surface-mounted MOS transistor 203 must be attached to the circuit board 200. The surface-mounted MOS transistor 203 and the heat conducting member 300 are respectively arranged at both ends of the circuit board 200, and the surface-mounted MOS transistor 203 and the heat conducting member 300 are arranged corresponding to each other. During the actual working process, the heat generated by the surface-mounted MOS transistor 203 during operation can pass through the circuit board 200 and the heat conducting member 300 to the bottom wall of the installation cavity, thereby improving the heat dissipation efficiency of the surface-mounted MOS transistor 203.

[0040] Optionally, the heat conducting member 300 is a structure such as a silicone gasket or silicone gel with a thermal conductivity greater than 2 W / m·K and in contact with the bottom wall of the installation cavity. Thus, the heat generated by the transformer 201, the inductor 202, and the surface-mounted MOS transistor 203 during operation can be quickly transferred to the bottom wall of the installation cavity, thereby improving the heat dissipation effect of the transformer 201.

[0041] Optionally, the position where the surface-mounted MOS transistor 203 contacts the circuit board 200 can be covered with copper on a large area to improve the transfer efficiency of heat from the surface-mounted MOS transistor 203 to the heat conducting member 300.

[0042] Reference Figure 2As shown, the power component further includes a plurality of packaged MOS transistors 204 disposed adjacent to the sidewall of the installation cavity. The plurality of packaged MOS transistors 204 are installed on one side of the bottom wall of the circuit board 200 facing away from the installation cavity. A plurality of heat dissipation sleeves 205 are further provided on the circuit board 200, and the plurality of heat dissipation sleeves 205 are sleeved on the packaged MOS transistors 204 in a one-to-one correspondence. It can be understood that the plurality of heat dissipation sleeves 205 sleeved on the packaged MOS transistors 204 in a one-to-one correspondence can achieve double-sided heat dissipation of the packaged MOS transistors 204, thereby improving the heat dissipation effect of the packaged MOS transistors 204.

[0043] Optionally, the inverter further includes a heat dissipation fixing plate 400. The heat dissipation fixing plate 400 is disposed at an interval from the sidewall of the installation cavity and is connected by a fixing member 500. The heat dissipation fixing plate 400 abuts against the side of the heat dissipation sleeve 205 away from the sidewall of the installation cavity to press the side of the heat dissipation sleeve 205 close to the sidewall of the installation cavity against the sidewall of the installation cavity. It can be understood that the added heat dissipation fixing plate 400 and the fixing member 500 can press the heat dissipation sleeve 205 against the sidewall of the installation cavity, and the heat generated when the packaged MOS transistor 204 works can be quickly transmitted to the sidewall of the installation cavity through the heat dissipation sleeve 205, thereby being beneficial to improving the heat dissipation effect of the packaged MOS transistor 204.

[0044] It should be additionally noted that in the prior art, TO-type MOSs (equivalent to the packaged MOS transistors 204 in this embodiment) are locked on both sides of the circuit board of the inverter. However, in the actual assembly process, when one side is locked, the other side will be deformed, making it very difficult to install the TO-type MOS on the other side. In this embodiment, both packaged MOS transistors 204 and surface-mounted MOS transistors 203 are used. Only the packaged MOS transistors 204 are provided on one side of the circuit board 200, and not on the other side, which will neither cause deformation of the circuit board 200 nor affect the circuit design of the inverter.

[0045] Reference Figure 4As shown, at least one mounting groove 111 is provided on the bottom wall of the mounting cavity. A heat dissipation member 112 is provided in each mounting groove 111. The heat dissipation member 112 is in contact with the heat conducting member 300. The heat conduction coefficient of the heat dissipation member 112 is greater than that of the heat dissipation substrate 100. It can be understood that since the power components (inductor 202, transformer 201) are relatively concentrated and the heat density is high, if the first heat conducting member 300 corresponding to the transformer 201 and the second heat conducting member 300 corresponding to the inductor 202 are directly in contact with the bottom wall of the mounting cavity, it will cause local hot spots on the heat dissipation substrate 100, thereby reducing the utilization efficiency of the heat dissipation substrate 100. In this embodiment, mounting grooves 111 are machined on the bottom wall of the heat dissipation substrate 100, and heat dissipation members 112 are arranged in the mounting grooves 111. The heat conduction coefficient of the heat dissipation members 112 can reach 5000 W / m·K - 20000 W / m·K. The heat conduction coefficient is much greater than that of metal, which can ensure the uniform heat of the entire bottom wall of the heat dissipation substrate 100, avoid the occurrence of local hot spots, and greatly improve the heat dissipation efficiency of the heat dissipation substrate 100.

[0046] Optionally, the heat dissipation member 112 is a heat pipe and is ultrasonically welded in the mounting groove 111. Thus, the installation of the heat dissipation member 112 can be facilitated, and the heat dissipation of the heat dissipation substrate 100 can be further improved.

[0047] Optionally, there are two heat dissipation members 112, and each heat dissipation member 112 forms a U-shaped structure. The openings of the two U-shaped structures are arranged back to back. Thus, the uniform heat of the entire bottom wall of the heat dissipation substrate 100 can be further ensured, the occurrence of local hot spots can be avoided, and the heat dissipation efficiency of the heat dissipation substrate 100 can be greatly improved. Of course, in other embodiments of the present utility model, the number, shape, and arrangement mode of the heat dissipation members 112 can be selected according to actual needs and are not limited to the above limitations.

[0048] Reference Figure 4 As shown, the heat dissipation substrate 100 includes a bottom plate 110 and two side plates 120. The two side plates 120 are respectively connected to two opposite sides of the bottom plate 110, and heat dissipation fins 121 are provided on the sides of the two side plates 120 facing away from each other. It can be understood that the heat dissipation substrate 100 is formed into a U-shaped structure, which can facilitate the airflow to pass through the power components provided on the circuit board 200, thereby being beneficial to improving the heat dissipation efficiency of the inverter. Heat dissipation fins 121 are provided on the sides of the two side plates 120 facing away from each other. The heat dissipation fins 121 can improve the heat dissipation efficiency of the heat dissipation substrate 100, thereby being beneficial to improving the heat dissipation efficiency of the inverter. It should be noted that according to the foregoing, a packaged MOS tube 204 is locked on one side wall of the mounting cavity. For the convenience of heat dissipation, the heat dissipation fins 121 on the side plate 120 of the packaged MOS tube 204 can be made larger in size, and the heat dissipation fins 121 on the other side without power components can be made smaller in size, so as to meet the lightweight design requirements of the heat dissipation fins 121.

[0049] Reference Figure 2 As shown, the inverter further includes an insulator 600. The insulator 600 is installed in the installation cavity, and the insulator 600 is located between the circuit board 200 and the bottom wall of the installation cavity. The insulator 600 is provided with an avoidance hole 610 for avoiding the heat conducting member 300. It can be understood that in order to improve the heat dissipation efficiency of the heat dissipation substrate 100, the heat dissipation substrate 100 can be made of a metal material with high thermal conductivity and has no insulation performance. In this embodiment, an insulator 600 is added below the circuit board 200 to ensure the insulation between the circuit board 200 and the heat dissipation substrate 100, thereby improving the working reliability of the inverter.

[0050] The present utility model also discloses an energy storage power supply, which includes a housing, a battery module and the aforementioned inverter. The inverter and the battery module are both installed inside the housing, and the inverter is electrically connected to the battery module. Due to the presence of the aforementioned inverter, the energy storage power supply has relatively high heat dissipation efficiency, light weight and small volume.

[0051] In the description of this specification, the descriptions with reference to terms such as "some embodiments", "other embodiments", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0052] Obviously, the above embodiments of the present utility model are merely examples for clearly explaining the present utility model, rather than limitations on the implementation manners of the present utility model. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present utility model. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present utility model shall be included in the protection scope of the claims of the present utility model.

Claims

1. An inverter, the inverter is used for energy storage power supply, characterized in that: include: A heat dissipation substrate, wherein the heat dissipation substrate defines a mounting cavity, and at least one heat dissipation element is disposed on a bottom wall of the mounting cavity; A circuit board is installed in the installation cavity, and power components are arranged on the circuit board. A heat conducting member, the heat conducting member is arranged corresponding to the power component and stops at the bottom wall of the mounting cavity; wherein, At least one mounting groove is provided on the bottom wall of the mounting cavity, and a heat sink is provided in each mounting groove. The heat sink abuts against the heat conducting element, and the heat conductivity of the heat sink is greater than the heat dissipation coefficient of the heat dissipation substrate.

2. The inverter according to claim 1, characterized in that: The power component comprises at least one transformer, the transformer is inserted through the circuit board, and the heat conducting member is sandwiched between the transformer and the bottom wall of the installation cavity.

3. The inverter according to claim 1, characterized in that: The power component comprises at least one inductor, the inductor is arranged through the circuit board, and the heat conducting member is sandwiched between the inductor and the bottom wall of the installation cavity.

4. The inverter according to claim 1, characterized in that: The power components include a plurality of SMD MOS tubes, which are installed on a side of the circuit board away from the bottom wall of the installation cavity; the heat conductor is installed on a side of the circuit board facing the bottom wall of the installation cavity and is arranged one-to-one with the plurality of SMD MOS tubes.

5. The inverter according to claim 1, characterized in that: The power components include a plurality of packaged MOS tubes arranged adjacent to a side wall of the mounting cavity, and the plurality of packaged MOS tubes are installed on a side of the circuit board away from the bottom wall of the mounting cavity; a plurality of heat dissipation sleeves are also provided on the circuit board, and the plurality of heat dissipation sleeves are sleeved on the packaged MOS tubes in a one-to-one correspondence.

6. The inverter according to claim 5, characterized in that: The inverter also includes a heat dissipation fixing plate, which is spaced apart from the side wall of the installation cavity and connected via a fixing member, and the heat dissipation fixing plate abuts against a side of the heat dissipation sleeve away from the side wall of the installation cavity to press a side of the heat dissipation sleeve close to the side wall of the installation cavity against the side wall of the installation cavity.

7. The inverter according to any one of claims 1 to 6, characterized in that: The heat dissipation substrate comprises a bottom plate and two side plates, the two side plates are respectively connected to two oppositely arranged sides of the bottom plate, and heat dissipation fins are arranged on the sides of the two side plates facing away from each other.

8. The inverter according to any one of claims 1 to 6, characterized in that: The inverter further includes an insulating member, which is installed in the installation cavity and located between the circuit board and the bottom wall of the installation cavity. The insulating member is provided with an avoidance hole for avoiding the heat conducting member.

9. An energy storage power supply, characterized in that: It comprises a housing, a battery module and an inverter as described in any one of claims 1 to 8, wherein the inverter and the battery module are both installed inside the housing, and the inverter is electrically connected to the battery module.

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