Heat conduction structure and electronic equipment
By designing the edge wrapping parts in the thermally conductive structure to wrap around the four peripheral edges of the thermally conductive parts, and combining the overall installation of the connecting layer, the problem of inseparable processing efficiency caused by the insemination of processing efficiency of multiple chips corresponding to multiple thermally conductive gaskets in the prior art is solved, and more efficient processing and more reliable electronic equipment are achieved.
Patent Information
- Application Number
- CN202421816599.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-29
AI Technical Summary
In the prior art, since there are multiple chips in the electronic device, each thermally conductive gasket corresponds to one chip, it needs to be wrapped separately, resulting in low processing efficiency.
A thermally conductive structure is designed, including a thermally conductive assembly and a edging member. The thermal conductivity assembly consists of a plurality of thermal conductivity parts arranged spaced apart in a vertical thickness direction. The edge member includes a edge layer and a connecting layer. The edge layer wraps around the four peripheral edges of the thermal conductivity member. The connection layer connects each edge layer to realize the overall edge of the multiple thermal conductivity members.
Through the overall edge-covering structure, the powder on the side of the heat conducting parts is avoided, the reliability and processing efficiency of the electronic equipment are improved, and the need for individual edge-covering of each heat conducting part is reduced.
Smart Images
Figure CN223040222U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic devices, and particularly to a heat conduction structure and an electronic device. Background Art
[0002] Thermal interface materials are a general term for materials used to coat between heat dissipation devices and heat generating devices to reduce the contact thermal resistance between them. Traditional thermal interface materials mainly include graphite films, graphene films, silicone grease, silica gel, phase change metal sheets, thermal conductive adhesives, and acrylic resins, etc. As an application form of thermal interface materials, thermal conductive gaskets are favored in the selection of thermal conductive materials for electronic devices because of their high compressibility, softness and elasticity, and the ability to provide various thickness and size options. Graphene, as a thermal interface material with excellent thermal conductivity, is one of the ideal materials for preparing thermal conductive gaskets.
[0003] For thermal conductive gaskets prepared with carbon materials such as graphene films as the base material, a process of laminating and then slicing is mostly used. During the cutting process of graphene thermal conductive gaskets, there will be a phenomenon of powder falling due to damage on the side edges. This powder has good electrical conductivity and is likely to cause short circuits if it falls on the circuit board, resulting in damage to electronic products. Since there are multiple chips in an electronic device, each thermal conductive gasket corresponds to one chip, that is, each thermal conductive gasket needs to be individually edge-bonded, leading to low processing efficiency. Summary of the Utility Model
[0004] In view of this, the purpose of the present application is to overcome the deficiencies in the prior art and provide a heat conduction structure and an electronic device to solve the technical problem in the prior art that since there are multiple chips in an electronic device, each thermal conductive gasket corresponds to one chip, that is, each thermal conductive gasket needs to be individually edge-bonded, resulting in low processing efficiency.
[0005] To solve the above technical problems, the present application provides:
[0006] A heat conduction structure, comprising:
[0007] A heat conduction component, the heat conduction component includes a plurality of heat conduction elements, and the plurality of heat conduction elements are arranged at intervals in a direction perpendicular to their thickness;
[0008] An edge-bonding component, the edge-bonding component includes an edge-bonding layer and a connecting layer. The edge-bonding layer is provided at the four peripheral edge positions of each heat conduction element. The edge-bonding layer includes a first edge-bonding portion located on the side edge of the heat conduction element and a second edge-bonding portion extending from the first edge-bonding portion to one side in the thickness direction of the heat conduction element. The connecting layer connects each first edge-bonding portion.
[0009] In addition, according to the heat conduction structure of the present application, the following additional technical features may also be provided:
[0010] In some embodiments of the present application, the heat conduction structure further includes a connecting member, which is disposed on a side of the heat conducting member away from the second edge portion and connects each of the heat conducting members.
[0011] In some embodiments of the present application, the connecting member is provided with avoidance holes at positions corresponding to each of the heat conducting members.
[0012] In some embodiments of the present application, the connecting member and the plurality of heat conducting members are integrally formed.
[0013] In some embodiments of the present application, the connecting layer, the first edge portion, and the second edge portion are integrally formed.
[0014] In some embodiments of the present application, a first adhesive layer is provided on a side of each of the first edge portion and the second edge portion facing the heat conducting member.
[0015] In some embodiments of the present application, the heat conduction structure further includes a circuit board, on which a plurality of chips are provided. The plurality of chips are arranged at intervals in a direction perpendicular to their thickness, and one heat conducting member is disposed on one chip.
[0016] In some embodiments of the present application, the heat conduction structure further includes a heat dissipation member, which is disposed on a side of the heat conducting member away from the chip, and the heat conducting member is in contact with the chip and the heat dissipation member respectively.
[0017] In some embodiments of the present application, a second adhesive layer is provided on a side of the heat conducting member facing the chip.
[0018] In a second aspect, the present application further provides an electronic device, including the heat conduction structure described in any of the above embodiments.
[0019] Compared with the prior art, the beneficial effects of the present application are as follows:
[0020] The present application provides a heat conduction structure, which includes a heat conduction component and a edge wrapping member. The heat conduction component includes a plurality of heat conducting members arranged at intervals in a direction perpendicular to their thickness, and the edge wrapping member includes an edge wrapping layer and a connecting layer. By providing an edge wrapping layer at the four peripheral edge positions of each heat conducting member, the four sides of the heat conducting member are wrapped and sealed under the action of the edge wrapping layer, so as to prevent the powder on the side of the heat conducting member from falling onto the circuit board and causing short - circuit damage to the electronic device.
[0021] The edge wrapping layer includes a first edge wrapping part and a second edge wrapping part. The side of the heat conducting part is wrapped and sealed by the first edge wrapping part to prevent powder from falling off. The second edge wrapping part extends from the first edge wrapping part to one side in the thickness direction of the heat conducting part. The connection stability between the edge wrapping layer and the heat conducting part is improved by the second edge wrapping part, and the second edge wrapping part can further wrap and seal the periphery of the heat conducting part, further preventing the powder on the side of the heat conducting part from falling onto the circuit board and causing short - circuit damage to the electronic device.
[0022] Meanwhile, by connecting the connection layer to each first edge wrapping part, the connection layer, multiple first edge wrapping parts and multiple second edge wrapping parts are connected into a whole. In this way, by installing the edge wrapping part as a whole on the heat conducting component, edge wrapping for multiple heat conducting parts can be achieved, thus eliminating the need to separately edge - wrap each heat conducting part, effectively improving the processing, installation and disassembly efficiency. Brief Description of the Drawings
[0023] To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without creative efforts.
[0024] Figure 1 Shows a top - view schematic diagram of the heat conducting structure in some embodiments of the present application;
[0025] Figure 2 Shows an exploded schematic diagram of the heat conducting structure from one perspective in some embodiments of the present application;
[0026] Figure 3 Shows an exploded schematic diagram of the heat conducting structure from another perspective in some embodiments of the present application;
[0027] Figure 4 Shows a cross - sectional schematic diagram of the heat conducting structure in some embodiments of the present application;
[0028] Figure 5 Shows Figure 4 An enlarged schematic diagram of the structure of part A in
[0029] Main Element Symbol Explanation:
[0030] 100 - Heat Conducting Structure;
[0031] 110 - Heat Conducting Component; 111 - Heat Conducting Part;
[0032] 120 - Edge Wrapping Part; 121 - Edge Wrapping Layer; 1211 - First Edge Wrapping Part; 1212 - Second Edge Wrapping Part; 122 - Connection Layer;
[0033] 130 - Connector; 131 - Avoidance hole. Detailed implementation manner
[0034] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application.
[0035] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.
[0036] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.
[0037] In the present application, unless otherwise clearly specified and limited, the terms "install", "connect", "connection", "fix", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0038] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.
[0039] Embodiment 1
[0040] As Figure 1 and Figure 2 shown, an embodiment of the present application provides a heat conduction structure 100, which is mainly applied to electronic devices. The heat conduction structure 100 includes a heat conduction component 110 and a side wrapping member 120.
[0041] Referring jointly to Figure 3 、 Figure 4 and Figure 5 , wherein, the heat conduction component 110 includes a plurality of heat conduction members 111, and the plurality of heat conduction members 111 are arranged at intervals in a direction perpendicular to their thickness. The side wrapping member 120 includes a side wrapping layer 121 and a connecting layer 122. The side wrapping layer 121 is provided at the peripheral edge position of each heat conduction member 111. The side wrapping layer 121 includes a first side wrapping portion 1211 located on the side of the heat conduction member 111 and a second side wrapping portion 1212 extending from the first side wrapping portion 1211 to one side in the thickness direction of the heat conduction member 111, and the connecting layer 122 connects each first side wrapping portion 1211.
[0042] For the heat conduction structure 100 provided by the embodiment of the present application, by providing the side wrapping layer 121 at the peripheral edge position of each heat conduction member 111, the heat conduction member 111 is wrapped and sealed around under the action of the side wrapping layer 121, so as to prevent the powder on the side of the heat conduction member 111 from falling onto the circuit board and causing short - circuit damage to the electronic device.
[0043] The side wrapping layer 121 includes a first side wrapping portion 1211 and a second side wrapping portion 1212. The side of the heat conduction member 111 is wrapped and sealed by the first side wrapping portion 1211 to prevent powder from falling; the second side wrapping portion 1212 extends from the first side wrapping portion 1211 to one side in the thickness direction of the heat conduction member 111. The connection stability between the side wrapping layer 121 and the heat conduction member 111 is improved through the second side wrapping portion 1212, and the second side wrapping portion 1212 can further wrap and seal the periphery of the heat conduction member 111, further preventing the powder on the side of the heat conduction member 111 from falling onto the circuit board and causing short - circuit damage to the electronic device.
[0044] Meanwhile, by connecting the connecting layer 122 to each first edge-wrapping part 1211, the connecting layer 122, the multiple first edge-wrapping parts 1211, and the multiple second edge-wrapping parts 1212 are connected into a whole. In this way, by integrally installing the edge-wrapping part 120 on the heat-conducting component 110, edge-wrapping of the multiple heat-conducting parts 111 can be achieved, so that it is not necessary to perform edge-wrapping on each heat-conducting part 111 separately, effectively improving the processing, installation, and disassembly efficiency. This avoids the technical problem in the prior art that since there are multiple chips in an electronic device and each heat-conducting gasket corresponds to one chip, that is, edge-wrapping needs to be performed on each heat-conducting gasket separately, resulting in low processing efficiency.
[0045] Exemplarily, the heat-conducting part 111 can be a graphene heat-conducting gasket, and the material of the edge-wrapping part 120 can be acrylic resin, epoxy resin, silicone rubber, polyurethane, or the like.
[0046] As Figure 2 , Figure 3 and Figure 5 shown, in an embodiment of the present application, optionally, the heat-conducting structure 100 further includes a connecting piece 130, and the connecting piece 130 is disposed on a side of the heat-conducting part 111 away from the second edge-wrapping part 1212 and connects each heat-conducting part 111.
[0047] In this embodiment, by disposing the connecting piece 130 on a side of the heat-conducting part 111 away from the second edge-wrapping part 1212 and connecting each heat-conducting part 111, the connecting piece 130 and the multiple heat-conducting parts 111 are connected into a whole. In this way, by integrally installing the connecting piece 130 and the multiple heat-conducting parts 111 on multiple chips, it is not necessary to separately install each heat-conducting part 111 on the corresponding chip, effectively improving the processing, installation, and disassembly efficiency.
[0048] As Figure 3 and Figure 5 shown, in the above embodiment of the present application, optionally, the connecting piece 130 is provided with avoidance holes 131 at positions corresponding to each heat-conducting part 111.
[0049] In this embodiment, by providing avoidance holes 131 at positions corresponding to each heat-conducting part 111 on the connecting piece 130 to play a role of avoidance, it is convenient for the heat-conducting part 111 to directly contact the chip, and further transfer the heat generated by the chip operation to the heat sink to achieve the heat dissipation function of the chip.
[0050] As Figure 2 and Figure 3 shown, in the above embodiment of the present application, optionally, the connecting piece 130 and the multiple heat-conducting parts 111 are integrally formed.
[0051] In this embodiment, the connecting member 130 and the plurality of heat conducting members 111 are integrally formed, so that the connecting member 130 and the plurality of heat conducting members 111 form a whole. Thus, the connecting member 130 and the plurality of heat conducting members 111 can be integrally mounted on the plurality of chips, and further, it is not necessary to separately mount each heat conducting member 111 on the corresponding chip, effectively improving the processing, installation and disassembly efficiency.
[0052] As Figure 2 and Figure 3 shown, in an embodiment of the present application, optionally, the connection layer 122, the first edge wrapping portion 1211 and the second edge wrapping portion 1212 are integrally formed.
[0053] In this embodiment, by integrally forming the connection layer 122, the first edge wrapping portion 1211 and the second edge wrapping portion 1212, the connection layer 122, the plurality of first edge wrapping portions 1211 and the plurality of second edge wrapping portions 1212 form a whole. Thus, by integrally mounting the edge wrapping member 120 on the heat conducting assembly 110, edge wrapping of the plurality of heat conducting members 111 can be realized, and further, it is not necessary to separately perform edge wrapping on each heat conducting member 111, effectively improving the processing, installation and disassembly efficiency.
[0054] In an embodiment of the present application, optionally, a first adhesive layer is provided on one side of the first edge wrapping portion 1211 and the second edge wrapping portion 1212 facing the heat conducting member 111.
[0055] In this embodiment, by providing a first adhesive layer on one side of the first edge wrapping portion 1211 and the second edge wrapping portion 1212 facing the heat conducting member 111, the first edge wrapping portion 1211 and the second edge wrapping portion 1212 are firmly adhered to the heat conducting member 111 under the adhesion of the first adhesive layer, thereby ensuring the connection stability between the edge wrapping layer 121 and the heat conducting member 111, and further reducing the probability that the powder on the side of the heat conducting member 111 falls onto the circuit board and causes short - circuit damage to the electronic device.
[0056] In any of the above - mentioned embodiments of the present application, optionally, the heat conducting structure 100 further includes a circuit board, and a plurality of chips are provided on the circuit board. The plurality of chips are spaced apart in a direction perpendicular to their thickness, and one heat conducting member 111 is disposed on one chip.
[0057] In this embodiment, by spacing a plurality of chips apart in a direction perpendicular to the thickness of the circuit board and disposing one heat conducting member 111 on one chip, the heat generated by each chip during operation can be transferred to the heat dissipating member through the heat conducting member 111, realizing the heat dissipation function for the plurality of chips.
[0058] In the above embodiments of the present application, optionally, the heat conduction structure 100 further includes a heat dissipation member, the heat dissipation member is disposed on a side of the heat conduction member 111 away from the chip, and the heat conduction member 111 is in contact with the chip and the heat dissipation member respectively.
[0059] In this embodiment, by disposing a heat dissipation member on a side of the heat conduction member 111 away from the chip, and making the heat conduction member 111 in contact with the chip and the heat dissipation member respectively, the heat conduction member 111 can transfer the heat generated by the chip during operation to the heat dissipation member, thereby realizing the heat dissipation function of the chip.
[0060] In the above embodiments of the present application, optionally, a second adhesive layer is disposed on a side of the heat conduction member 111 facing the chip.
[0061] In this embodiment, by disposing a second adhesive layer on a side of the heat conduction member 111 facing the chip, under the bonding action of the second adhesive layer, the heat conduction member 111 is firmly attached to the chip, ensuring the connection stability between the heat conduction member 111 and the chip, preventing the heat conduction member 111 from detaching from the chip, thereby ensuring the stability of heat transfer, further ensuring the stability of the heat dissipation function of the chip, ensuring the normal operation of the chip, and effectively extending the service life of the chip.
[0062] Embodiment Two
[0063] The embodiment of the present application further provides an electronic device, including the heat conduction structure 100 described in the above embodiments.
[0064] The electronic device has the heat conduction structure 100 in any of the above embodiments, and thus has all the beneficial effects of the heat conduction structure 100, which will not be elaborated here one by one.
[0065] In summary, the present application provides a heat conduction structure 100. The heat conduction structure 100 includes a heat conduction component 110 and a edge wrapping member 120. The heat conduction component 110 includes a plurality of heat conduction elements 111 spaced apart along the direction perpendicular to its thickness. The edge wrapping member 120 includes an edge wrapping layer 121 and a connection layer 122. By providing the edge wrapping layer 121 at the peripheral edge position of each heat conduction element 111, the periphery of the heat conduction element 111 is wrapped and sealed under the action of the edge wrapping layer 121, preventing the powder on the side of the heat conduction element 111 from falling onto the circuit board and causing short - circuit damage to the electronic device. The edge wrapping layer 121 includes a first edge wrapping portion 1211 and a second edge wrapping portion 1212. The side of the heat conduction element 111 is wrapped and sealed by the first edge wrapping portion 1211 to prevent the powder from falling. The second edge wrapping portion 1212 extends from the first edge wrapping portion 1211 to one side in the thickness direction of the heat conduction element 111. By the second edge wrapping portion 1212, the connection stability between the edge wrapping layer 121 and the heat conduction element 111 is improved, and the second edge wrapping portion 1212 can further wrap and seal the periphery of the heat conduction element 111, further preventing the powder on the side of the heat conduction element 111 from falling onto the circuit board and causing short - circuit damage to the electronic device. At the same time, by connecting the connection layer 122 to each first edge wrapping portion 1211, the connection layer 122, a plurality of first edge wrapping portions 1211 and a plurality of second edge wrapping portions 1212 are connected into a whole. In this way, by integrally mounting the edge wrapping member 120 on the heat conduction component 110, edge wrapping of a plurality of heat conduction elements 111 can be achieved, thus eliminating the need for edge wrapping each heat conduction element 111 separately, effectively improving the processing, installation and disassembly efficiency. This avoids the technical problem in the prior art that since there are multiple chips in an electronic device and each heat conduction gasket corresponds to one chip, that is, edge wrapping needs to be carried out separately for each heat conduction gasket, resulting in low processing efficiency.
[0066] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above - mentioned terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0067] Although the embodiments of the present application have been shown and described above, it can be understood that the above - mentioned embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above - mentioned embodiments within the scope of the present application.
Claims
1. A heat-conducting structure, characterized in that: include: A heat-conducting assembly, the heat-conducting assembly comprising a plurality of heat-conducting members, wherein the plurality of heat-conducting members are arranged at intervals along a direction perpendicular to the thickness thereof; The edging piece includes an edging layer and a connecting layer. The edging layer is arranged on the four edges of each of the heat-conducting parts. The edging layer includes a first edging portion located on the side of the heat-conducting part, and a second edging portion extending from the first edging portion to one side of the thickness direction of the heat-conducting part. The connecting layer connects each of the first edging portions.
2. The heat conducting structure according to claim 1, characterized in that: The heat-conducting structure further includes a connecting member, which is disposed on a side of the heat-conducting member away from the second edge-wrapping portion and connects each of the heat-conducting members.
3. The heat-conducting structure according to claim 2, characterized in that: The connection member is provided with an avoidance hole at a position corresponding to each of the heat conducting members.
4. The heat conducting structure according to claim 2, characterized in that: The connecting member and the plurality of heat conducting members are integrally formed.
5. The heat conducting structure according to claim 1, characterized in that: The connecting layer, the first edge-wrapping portion and the second edge-wrapping portion are integrally formed.
6. The heat conducting structure according to claim 1, characterized in that: A first adhesive layer is disposed on one side of the first edge-wrapped portion and the second edge-wrapped portion facing the heat conducting component.
7. The heat conducting structure according to any one of claims 1 to 6, characterized in that: The heat-conducting structure further comprises a circuit board, on which a plurality of chips are arranged, the plurality of chips are arranged at intervals along a direction perpendicular to the thickness thereof, and one heat-conducting member is arranged on one of the chips.
8. The heat-conducting structure according to claim 7, characterized in that: The heat-conducting structure further comprises a heat sink, which is arranged on a side of the heat-conducting member away from the chip, and the heat-conducting member is in contact with the chip and the heat sink respectively.
9. The heat-conducting structure according to claim 7, characterized in that: A second adhesive layer is disposed on a side of the heat conducting member facing the chip.
10. An electronic device, characterized in that: The thermally conductive structure comprises the thermally conductive structure according to any one of claims 1 to 9.