Heat dissipation structure for intelligent interaction panel
By setting a double-sided heat dissipation structure on both sides of the to-heat dissipation part of the intelligent interactive tablet, the problem of low heat dissipation efficiency of the chip is solved, a more efficient heat dissipation effect is achieved, and production and assembly costs are reduced.
Patent Information
- Application Number
- CN202422004216.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-16
AI Technical Summary
The heat generated by the chip during operation is difficult to effectively dissipate heat, causing the chip to rise, reduce working efficiency and reliability, and may even cause the chip to burn. The size of existing heat sinks is limited and the heat dissipation area is limited, resulting in low heat dissipation efficiency.
A double-sided heat dissipation structure is adopted, and the first heat dissipation member and the second heat dissipation member are respectively provided on both sides of the heat dissipation member to be heat dissipated, and they are installed on the heat dissipation member to be heat dissipated through a connecting post. The first heat dissipation member is thermally connected to the chip, and the second heat dissipation member is thermally connected to the PCB board to jointly improve the heat dissipation efficiency.
Through the double-sided heat dissipation structure, the heat dissipation efficiency of the heat dissipation parts to be heat dissipated is improved, the heat dissipation ability of the chip is enhanced, the efficient heat dissipation needs of the chip are met, and the production and assembly costs are reduced.
Smart Images
Figure CN223040419U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip heat dissipation technology, and in particular to a heat dissipation structure for a smart interactive tablet. Background Art
[0002] When the chip is working, it will generate a lot of heat, which will cause the chip temperature to rise. The increase in chip temperature will reduce the working efficiency and reliability of the chip, and in severe cases, it may even cause the chip to burn out. Chip heat dissipation is usually done by attaching the chip to a heat sink to remove the heat from the chip through the heat sink. Thermally conductive silicone can also be provided between the heat sink and the chip to enhance the heat conduction effect between the heat sink and the chip.
[0003] The chip is usually attached to a PCB board, on which a large number of electrical components are installed, and the PCB board also needs to be connected to external cables, which limits the length and width of the heat sink in the direction parallel to the PCB board. The installation space of the PCB board is usually in the shape of a rectangular thin plate, which limits the thickness of the heat sink in the direction perpendicular to the PCB board. Since the dimensions of the heat sink in three directions are limited, the heat dissipation area of the heat sink is limited, resulting in low heat dissipation efficiency of the heat sink, and even failing to meet the heat dissipation requirements of the chip. Utility Model Content
[0004] The embodiment of the present application aims to provide a heat dissipation structure for a smart interactive tablet, so as to at least improve the problem of low heat dissipation efficiency of the chip.
[0005] In order to solve the above technical problems, the embodiments of the present application adopt the following technical solutions:
[0006] In a first aspect, an embodiment of the present application provides a heat dissipation structure for a smart interactive tablet, which is used to dissipate heat from a heat dissipation element, wherein the heat dissipation element includes a PCB board and a chip disposed on one side of the PCB board. The heat dissipation structure for the smart interactive tablet includes a first heat dissipation element and a second heat dissipation element, wherein the first heat dissipation element is disposed on one side of the heat dissipation element, and the first heat dissipation element is at least partially thermally connected to the chip; the second heat dissipation element is disposed on the other side of the heat dissipation element, and the second heat dissipation element is thermally connected to the PCB board.
[0007] In the above technical solution, the first heat sink and the second heat sink are respectively arranged on both sides of the heat sink to be cooled, and the heat sink to be cooled is cooled on both sides of the heat sink at the same time, which is conducive to improving the heat dissipation efficiency of the heat sink to be cooled, improving the heat dissipation efficiency of the chip on the PCB board, and improving the problem of low heat dissipation efficiency of the chip. At least part of the heat of the chip can be directly discharged through the first heat sink, further improving the heat dissipation efficiency of the chip.
[0008] In some embodiments, the heat dissipation structure for the intelligent interactive tablet further includes a connecting column, which is arranged on the first heat dissipation element; the second heat dissipation element is provided with a second connecting hole, and the connecting column is passed through the second connecting hole. The first heat dissipation element and the second heat dissipation element are simultaneously installed on the heat dissipation element through the connecting column, so that the first heat dissipation element and the second heat dissipation element are easy to disassemble and assemble, and the assembly cost of the first heat dissipation element and the second heat dissipation element is reduced; the second heat dissipation element and the connecting column are detachably connected, so that the second heat dissipation element and the connecting column can be produced separately, which is conducive to reducing production costs.
[0009] In some embodiments, a stop arm is provided at one end of the connecting column adjacent to the second heat sink, and the stop arm abuts against a side of the second heat sink facing away from the first heat sink. The stop arm prevents the connecting column from being separated from the second connecting hole, so as to clamp the heat sink between the first heat sink and the second heat sink, and can improve the stability of the connection between the connecting column and the second connecting hole.
[0010] In some embodiments, the end of the stop arm extends toward the first heat sink, and the end of the stop arm abuts against a side of the second heat sink that is away from the first heat sink; wherein the stop arm is flexible, and when the connecting column passes through the second connecting hole, the stop arm is used to deform to avoid the second heat sink. When installing the connecting column, it is only necessary to insert the connecting column into the first connecting hole and the second connecting hole, and to make the stop arm completely pass through the second connecting hole, so that the connecting column is easy to install.
[0011] In some embodiments, the first heat sink is provided with a first connection hole, and the connection column is passed through the first connection hole. The first heat sink and the connection column can be produced separately, which is conducive to reducing production costs.
[0012] In some embodiments, an enlarged head is provided at one end of the connection column adjacent to the first heat sink; the heat dissipation structure for the intelligent interactive tablet further comprises an elastic member, the two ends of which are respectively against the first heat sink and the head. The elastic member can provide a stable pressure between the first heat sink and the second heat sink and the heat sink to be cooled, so that the thermal connection between the first heat sink and the second heat sink and the heat sink to be cooled is more stable; and the thickness tolerance of the heat sink to be cooled can be enhanced.
[0013] In some embodiments, a first heat conducting member is disposed between the first heat dissipating member and the chip, which is beneficial to enhancing the heat conduction effect between the chip and the first heat dissipating member.
[0014] In some embodiments, a second heat conducting member is disposed between the second heat dissipating member and the PCB board, which is beneficial to enhancing the heat conduction effect between the PCB board and the second heat dissipating member.
[0015] In some embodiments, the first heat dissipation member is provided with heat dissipation fins, which increases the heat dissipation area of the first heat dissipation member.
[0016] In some embodiments, the second heat dissipation member is provided with heat dissipation fins, which increases the heat dissipation area of the second heat dissipation member.
[0017] In some embodiments, a second boss is provided on a side of the first heat dissipation member facing the second heat dissipation member, and the second boss is in thermal connection with the chip, which improves the problem of interference between the electrical components and pins on the PCB board and the first heat dissipation member, and makes the contact between the first heat dissipation member and the chip closer.
[0018] In some embodiments, a first boss is provided on a side of the second heat dissipation member facing the first heat dissipation member, and the first boss is in thermal connection with the PCB board, which improves the problem of interference between the electrical components and pins on the PCB board and the second heat dissipation member, and makes the contact between the second heat dissipation member and the PCB board closer.
[0019] In some embodiments, when observed in a direction perpendicular to the PCB board, the projection of the portion of the second heat dissipation member in thermal connection with the PCB board at least partially overlaps with the projection of the chip, which shortens the distance of heat conduction in the PCB board for a part of the heat and improves the efficiency of heat conduction from the chip to the second heat dissipation member.
[0020] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the following specifically illustrates the specific embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] One or more embodiments are exemplarily illustrated by corresponding drawings. These exemplary illustrations do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, and the drawings in the figures do not constitute a proportional limitation.
[0022] Figure 1 is a schematic structural diagram of a heat dissipation structure for an intelligent interactive flat panel according to an embodiment of the present application;
[0023] Figure 2 is an exploded view of a heat dissipation structure for an intelligent interactive flat panel according to an embodiment of the present application;
[0024] Figure 3 is Figure 1 a partial enlarged view of part A in
[0025] Figure 4 is Figure 3 a schematic structural diagram of a connecting column in
[0026] The reference numerals in the specific embodiments are as follows:
[0027] 100, heat dissipation structure for intelligent interactive flat panel;
[0028] 1, first heat dissipation member; 11, heat sink; 12, first connection hole;
[0029] 2, second heat dissipation member; 21, first boss; 22, second connection hole;
[0030] 3, first heat conducting member;
[0031] 4, second heat conducting member;
[0032] 5, connecting column; 51, head; 52, stop arm; 53, connecting arm;
[0033] 6, elastic member;
[0034] 200, member to be heat dissipated; 201, PCB board; 202, chip; 203, avoidance hole. Specific embodiments
[0035] For the convenience of understanding the present application, the present application will be described in more detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween.
[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion.
[0037] In the description of the embodiments of the present application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation on the embodiments of the present application.
[0038] In the description of the embodiments of the present application, the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Without additional statements, the above terms have no special meanings, and therefore cannot be construed as a limitation on the protection scope of the present application. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically defined.
[0039] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not used to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.
[0040] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0041] When the chip is working, a large amount of heat is generated, resulting in an increase in the chip temperature. The increase in the chip temperature will reduce the working efficiency and reliability of the chip, and in severe cases, it may even cause the chip to burn out. Chip heat dissipation usually involves attaching the chip to a heat sink to take away the heat of the chip through the heat sink. A thermal silicone grease can also be provided between the heat sink and the chip to enhance the heat conduction effect between the heat sink and the chip.
[0042] The chip is usually attached to the PCB board. A large number of electrical components are installed on the PCB board, and the PCB board also needs to be connected to external cables. Therefore, the length and width dimensions of the heat sink in the direction parallel to the PCB board will be limited. The installation space of the PCB board is usually in the shape of a rectangular thin plate, so the thickness dimension of the heat sink in the direction perpendicular to the PCB board will be limited. Since the dimensions of the heat sink in all three directions are limited, the heat dissipation area of the heat sink is limited, resulting in a low heat dissipation efficiency of the heat sink and even not meeting the heat dissipation requirements of the chip.
[0043] Specifically, when the chip power is large and the heat dissipation effect cannot meet the requirements, the heat sink needs to have a higher heat dissipation area, and the height of the heat sink needs to be increased. However, the overall structure of the intelligent interactive flat panel has a limited height requirement for the heat sink, and the height cannot be increased. If the length and width of the heat sink are increased, it will affect the layout of other devices on the PCB board and the PCB wiring method. There are many limiting factors.
[0044] To improve the above problems, as Figure 1 shown, an embodiment of the present application provides a heat dissipation structure 100 for an intelligent interactive flat panel, which is used to dissipate heat from the component to be dissipated 200. The heat dissipation structure 100 for an intelligent interactive flat panel includes a first heat dissipation component 1 and a second heat dissipation component 2. The first heat dissipation component 1 is disposed on one side of the component to be dissipated 200, and the first heat dissipation component 1 is thermally connected to the component to be dissipated 200; the second heat dissipation component 2 is disposed on the other side of the component to be dissipated 200, and the second heat dissipation component 2 is thermally connected to the component to be dissipated 200. Among them, the thermal connection means that heat can be conducted between the two, that is, heat can be conducted between the component to be dissipated 200 and the first heat dissipation component 1 and the second heat dissipation component 2.
[0045] In this embodiment, the first heat dissipation component 1 and the second heat dissipation component 2 are respectively disposed on both sides of the component to be dissipated 200, and the component to be dissipated 200 is dissipated on both sides at the same time, which is beneficial to improving the heat dissipation efficiency of the component to be dissipated 200.
[0046] For the above-mentioned component to be dissipated 200, as Figure 1 and Figure 2 shown, in some embodiments, the component to be dissipated 200 includes a PCB board 201 and a chip 202 disposed on one side of the PCB board 201. The PCB board 201 can be a copper-clad laminate, and the overall shape can be a rectangular sheet. The chip 202 can be a storage chip 202, a CPU chip 202, etc., and the overall shape can be a rectangular sheet. Among them, the chip 202 can be soldered to the PCB board 201 or adhered to the PCB board 201 with glue. The heat dissipation structure 100 for an intelligent interactive flat panel can dissipate heat from the component to be dissipated 200 on both sides at the same time, which is beneficial to improving the heat dissipation efficiency of the chip 202 on the PCB board 201 and improving the problem of low heat dissipation efficiency of the chip 202.
[0047] For the above-mentioned first heat dissipation component 1, as Figure 1 and Figure 2As shown, the first heat sink 1 can be in the shape of a rectangular sheet. The first heat sink 1 is in contact with the component to be cooled 200, that is, thermally connected to the component to be cooled 200, and can conduct the heat of the PCB 201 and the chip 202 to dissipate the heat of the PCB 201 and the chip 202. Among them, in the contact between the first heat sink 1 and the component to be cooled 200, the first heat sink 1 can be in contact with the PCB 201, and the heat of the PCB 201 is directly conducted out through the first heat sink 1, and the heat of the chip 202 is indirectly conducted out through the PCB 201.
[0048] In some embodiments, at least part of the first heat sink 1 is thermally connected to the chip 202. At least part of the heat of the chip 202 can be directly conducted out through the first heat sink 1, further improving the heat dissipation efficiency of the chip 202. Among them, at least part of the first heat sink 1 being thermally connected to the chip 202 means that while the first heat sink 1 is thermally connected to the chip 202, it can also be thermally connected to other parts of the component to be cooled 200. For example, the first heat sink 1 is in contact with the PCB 201 and the chip 202 at the same time, that is, the first heat sink 1 is thermally connected to the PCB 201 and the chip 202 at the same time to directly conduct out the heat of the PCB 201 and the chip 202. Another example is that the first heat sink 1 is only thermally connected to the chip 202 to concentrate on cooling the chip 202, which is beneficial to improving the heat dissipation efficiency of the chip 202.
[0049] The first heat sink 1 can be made of a metal material, such as copper, aluminum, stainless steel, etc., which has good thermal conductivity and is beneficial to improving the heat dissipation efficiency of the chip 202. Similarly, the second heat sink 2 can also be made of a metal material, such as copper, aluminum, stainless steel, etc., which has good thermal conductivity and is beneficial to improving the heat dissipation efficiency of the chip 202
[0050] In some embodiments, such as Figure 1 and Figure 2 As shown, in some embodiments, the first heat sink 1 is provided with heat dissipation fins 11. The heat dissipation fins 11 can increase the contact area between the first heat sink 1 and the air, increase the heat dissipation area of the first heat sink 1, and thus improve the heat dissipation efficiency of the chip 202. Optionally, the number of the heat dissipation fins 11 can be multiple, and the multiple heat dissipation fins 11 are arranged at intervals to further increase the heat dissipation area and improve the heat dissipation efficiency of the chip 202. Optionally, the heat dissipation fins 11 are heat dissipation fins.
[0051] In some embodiments, the heat sink 11 is in the shape of a rectangular sheet, and the heat sink 11 is perpendicular to the main body portion of the first heat dissipation member 1, which is beneficial to reducing the manufacturing difficulty of the first heat dissipation member 1 and thus reducing the production cost of the first heat dissipation member 1. Herein, the main body portion of the first heat dissipation member 1 refers to the portion of the first heat dissipation member 1 other than the heat sink 11. Optionally, the first heat dissipation member 1 is integrally formed, such as by casting, which is beneficial to reducing the production cost of the first heat dissipation member 1. When the first heat dissipation member 1 is formed by casting, the heat sink 11 is perpendicular to the main body portion of the first heat dissipation member 1, facilitating the demolding of the first heat dissipation member 1 and reducing the manufacturing difficulty.
[0052] Similarly, in some embodiments, the second heat dissipation member 2 is provided with a heat sink 11, increasing the heat dissipation area of the second heat dissipation member 2 and improving the heat dissipation efficiency of the second heat dissipation member 2 for the heat dissipation target member 200. Herein, the heat sink 11 on the second heat dissipation member 2 may have the same or similar structure and arrangement as the heat sink 11 on the first heat dissipation member 1, which will not be elaborated herein.
[0053] In some embodiments, as Figure 1 and Figure 2 shown, a first heat conducting member 3 is provided between the first heat dissipation member 1 and the heat dissipation target member 200. The first heat conducting member 3 can be thermal grease, silicone thermal pad, etc., which is beneficial to enhancing the heat conduction effect between the heat dissipation target member 200 and the first heat dissipation member 1. Herein, when the first heat dissipation member 1 is in contact with the chip 202, the first heat conducting member 3 can be disposed between the chip 202 and the first heat dissipation member 1 to enhance the heat conduction effect between the chip 202 and the first heat dissipation member 1.
[0054] Similarly, in some embodiments, a second heat conducting member 4 is provided between the second heat dissipation member 2 and the heat dissipation target member 200, which is beneficial to enhancing the heat conduction effect between the heat dissipation target member 200 and the second heat dissipation member 2. Herein, the second heat conducting member 4 can be specifically disposed between the PCB board 201 and the second heat dissipation member 2 to enhance the heat conduction effect between the PCB board 201 and the second heat dissipation member 2.
[0055] For the above-mentioned second heat dissipation member 2, as Figure 1 and Figure 2 shown, the second heat dissipation member 2 can be in the shape of a rectangular sheet. The second heat dissipation member 2 is in contact with the heat dissipation target member 200, that is, thermally connected to the heat dissipation target member 200, and can conduct out the heat of the PCB board 201 and the chip 202 to dissipate heat from the PCB board 201 and the chip 202. Herein, the second heat dissipation member 2 is in contact with the heat dissipation target member 200, specifically, the second heat dissipation member 2 is in contact with the PCB board 201, that is, the second heat dissipation member 2 is thermally connected to the PCB board 201, and the heat of the PCB board 201 is directly conducted out through the second heat dissipation member 2, and the heat of the chip 202 is indirectly conducted out through the PCB board 201.
[0056] In some embodiments, when observed in a direction perpendicular to the PCB board 201, the projection of the portion of the second heat sink 2 in thermal connection with the PCB board 201 at least partially overlaps with the projection of the chip 202. Taking Figure 1 and Figure 2 the orientation shown in as an example, at least a part of the portion of the second heat sink 2 in thermal connection with the PCB board 201 is located at least partially below the chip 202, that is, part of the heat of the chip 202 can be conducted from the PCB board 201 to the second heat sink 2 in a direction perpendicular to the PCB board 201, shortening the conduction distance of this part of the heat in the PCB board 201, improving the efficiency of the heat of the chip 202 being conducted to the second heat sink 2, and improving the heat dissipation efficiency of the second heat sink 2 for the chip 202.
[0057] In some embodiments, as Figure 1 and Figure 2 shown, a first boss 21 is provided on the side of the second heat sink 2 facing the first heat sink 1, and the first boss 21 is in thermal connection with the PCB board 201. The second heat sink 2 is in thermal connection with the PCB board 201 through the first boss 21, which can increase the distance between other parts of the second heat sink 2 except the first boss 21 and the PCB board 201, so as to avoid electrical components, pins, etc. on the PCB board 201, improve the problem of interference between the electrical components and pins on the PCB board 201 and the second heat sink 2, and improve the problem of short circuit of the electrical components and pins on the PCB board 201 due to contact with the second heat sink 2. The contact area between the second heat sink 2 and the PCB board 201 can be reduced, the pressure of the contact part between the second heat sink 2 and the PCB board 201 can be increased, so that the contact between the second heat sink 2 and the PCB board 201 is closer, and the stability of the thermal connection between the second heat sink 2 and the PCB board 201 is increased. Optionally, the first boss 21 is formed by stamping the second heat sink 2, which is beneficial to reducing the production cost of the second heat sink 2.
[0058] In some embodiments, as Figure 1 and Figure 2 shown, the position of the first boss 21 corresponds to that of the chip 202. Exemplarily, as Figure 1 and Figure 2As shown in the figure, when observing along the direction perpendicular to the PCB board 201, the projection of the chip 202 coincides with the projection of the first boss 21, and the projection of the part of the second heat sink 2 thermally connected to the PCB board 201 at least partially coincides. Part of the heat can be conducted from the PCB board 201 to the first boss 21 along the direction perpendicular to the PCB board 201, shortening the conduction distance of this part of the heat in the PCB board 201 and improving the efficiency of the heat conduction of the chip 202 to the first boss 21; and the projection of the chip 202 coincides with the projection of the first boss 21, which can increase the heat conducted from the PCB board 201 to the first boss 21 along the direction perpendicular to the PCB board 201, further improving the efficiency of the heat conduction of the chip 202 to the first boss 21.
[0059] Similarly, in some embodiments, a second boss (not shown) is provided on the side of the first heat sink 1 facing the second heat sink 2, and the second boss is thermally connected to the chip 202. The second boss on the first heat sink 1 may have the same or similar structure as the first boss 21 on the second heat sink 2, which will not be elaborated here. It can be understood that other parts of the first heat sink 1 except the second boss can avoid electrical components, pins, etc. on the PCB board 201, improving the problem of interference between the electrical components and pins on the PCB board 201 and the first heat sink 1, and improving the problem of short circuit of the electrical components and pins on the PCB board 201 due to contact with the first heat sink 1; it can make the contact between the first heat sink 1 and the chip 202 closer, increasing the stability of the thermal connection between the first heat sink 1 and the chip 202; the first heat sink 1 can avoid the electrical components around the chip 202 and also avoid the pins of the chip 202.
[0060] For the installation of the first heat sink 1 and the second heat sink 2, the first heat sink 1 and the second heat sink 2 can be detachably installed on the component to be cooled 200 by screws or bolts, or pasted on the component to be cooled 200 by adhesive, or pressed on the component to be cooled 200 by an external component.
[0061] In some embodiments, such as Figure 2 and Figure 3As shown, the heat dissipation structure 100 for the intelligent interactive flat panel further includes a connecting column 5. The two ends of the connecting column 5 are respectively connected to the first heat dissipation member 1 and the second heat dissipation member 2, so as to clamp the member to be dissipated 200 between the first heat dissipation member 1 and the second heat dissipation member 2. Furthermore, the first heat dissipation member 1 and the second heat dissipation member 2 are simultaneously installed on the member to be dissipated 200, making the disassembly and assembly of the first heat dissipation member 1 and the second heat dissipation member 2 simple, reducing the assembly cost of the first heat dissipation member 1 and the second heat dissipation member 2; without using screws or bolts, reducing the production cost of the heat dissipation structure 100 for the intelligent interactive flat panel. Optionally, the number of the connecting columns 5 is multiple, for example, four, to enhance the connection strength and stability between the first heat dissipation member 1 and the second heat dissipation member 2. Optionally, when the first heat dissipation member 1 and the second heat dissipation member 2 are in the shape of rectangular sheets, the four connecting columns 5 are respectively arranged adjacent to the four corners of the first heat dissipation member 1 or the second heat dissipation member 2. Optionally, the connecting column 5 is cylindrical.
[0062] As Figure 1 and Figure 2 shown, when the size of the member to be dissipated 200 is larger than the size of the first heat dissipation member 1 or the second heat dissipation member 2, that is, when observing in the direction perpendicular to the PCB board 201, the projection of the first heat dissipation member 1 or the second heat dissipation member 2 coincides with the projection of the member to be dissipated 200, interference will occur between the member to be dissipated 200 and the connecting column 5. To improve this problem, in some embodiments, the member to be dissipated 200 is provided with an avoidance hole 203, and the position of the avoidance hole 203 corresponds to that of the connecting column 5. The connecting column 5 passes through the avoidance hole 203 to avoid the member to be dissipated 200. The avoidance hole 203 can also limit the position of the connecting column 5 relative to the member to be dissipated 200, and further limit the positions of the first heat dissipation member 1 and the second heat dissipation member 2 relative to the member to be dissipated 200, which is beneficial to quickly install the first heat dissipation member 1 and the second heat dissipation member 2 to the preset positions on the member to be dissipated 200 and improve the installation efficiency. It can be understood that the avoidance hole 203 is located on the PCB board 201.
[0063] In some embodiments, as Figure 2 and Figure 3 shown, the first heat dissipation member 1 is provided with a first connection hole 12, and the connecting column 5 passes through the first connection hole 12. The first heat dissipation member 1 and the connecting column 5 are detachably connected, so that the first heat dissipation member 1 and the connecting column 5 can be produced separately, which is beneficial to reducing the production cost. Among them, the connecting column 5 can be in interference fit with the first connection hole 12 to connect the first heat dissipation member 1 and the connecting column 5 by relying on friction; or the connecting column 5 is threadedly connected to the inner wall of the first connection hole 12. Optionally, the first connection hole 12 is circular.
[0064] Similarly, as Figure 2 and Figure 3As shown, the connecting column 5 is arranged on the first heat sink 1; the second heat sink 2 is provided with a second connecting hole 22, and the connecting column 5 is penetrated through the second connecting hole 22. The second heat sink 2 and the connecting column 5 are detachably connected, so that the second heat sink 2 and the connecting column 5 can be produced separately, which is conducive to reducing production costs. Among them, the connecting column 5 can be interference fit with the second connecting hole 22 to connect the second heat sink 2 and the connecting column 5 by friction; or the connecting column 5 is threadedly connected to the inner wall of the second connecting hole 22. Optionally, the second connecting hole 22 is circular.
[0065] In some embodiments, Figure 3 and Figure 4 As shown, an enlarged head 51 is provided at one end of the connecting column 5 adjacent to the first heat sink 1; the heat dissipation structure 100 for the smart interactive tablet also includes an elastic member 6, and the two ends of the elastic member 6 are respectively against the first heat sink 1 and the head 51. The elastic member 6 can provide a stable pressure between the first heat sink 1 and the second heat sink 2 and the heat sink 200 to be cooled, so that the thermal connection between the first heat sink 1 and the second heat sink 2 and the heat sink 200 to be cooled is more stable. When the thickness of the heat sink 200 to be cooled is slightly thicker or thinner, under the elastic force of the elastic member 6, the first heat sink 1 and the second heat sink 2 can still contact and thermally connect with the heat sink 200 to be cooled, that is, the thickness tolerance of the heat sink 200 to be cooled can be enhanced. Optionally, the elastic member 6 is a straight spring.
[0066] It can be understood that, in some embodiments, the heat dissipation structure 100 for the smart interactive tablet may not include the elastic member 6, and the head 51 directly abuts against the side of the first heat sink 1 facing away from the second heat sink 2, which can still prevent the connecting column 5 from detaching from the first connecting hole 12 and clamp the heat dissipation member 200 between the first heat sink 1 and the second heat sink 2.
[0067] In some embodiments, Figure 3 and Figure 4 As shown, a stop arm 52 is provided at one end of the connecting column 5 adjacent to the second heat sink 2, and the stop arm 52 abuts against a side of the second heat sink 2 facing away from the first heat sink 1. The stop arm 52 prevents the connecting column 5 from being separated from the second connecting hole 22, so as to clamp the heat sink 200 between the first heat sink 1 and the second heat sink 2, and can improve the stability of the connection between the connecting column 5 and the second connecting hole 22.
[0068] In some embodiments, Figure 3 and Figure 4As shown, the end of the stop arm 52 extends towards the first heat dissipation member 1, and the end of the stop arm 52 abuts against the side of the second heat dissipation member 2 facing away from the first heat dissipation member 1. That is, the angle between the stop arm 52 and the main body portion of the connecting column 5 is less than 90 degrees, and the main body portion of the connecting column 5 is the portion of the connecting column 5 other than the stop wall. Among them, the stop arm 52 is flexible, so when the connecting column 5 passes through the second connection hole 22, the stop arm 52 will deform and shrink into the second connection hole 22 under the extrusion of the edge of the second connection hole 22, that is, the stop arm 52 is used for deformation to avoid the second heat dissipation member 2; when the stop arm 52 completely passes through the second connection hole 22, the stop arm 52 resumes deformation to abut against the side of the second heat dissipation member 2 facing away from the first heat dissipation member 1. Then when installing the connecting column 5, only need to insert the connecting column 5 into the first connection hole 12 and the second connection hole 22, and make the stop arm 52 completely pass through the second connection hole 22, which makes the installation of the connecting column 5 convenient.
[0069] In some embodiments, as Figure 4 shown, a connecting arm 53 is provided at one end of the connecting column 5 adjacent to the second heat dissipation member 2, and the end of the connecting arm 53 is connected to the end of the stop arm 52; the connecting arm 53 is flexible. The connecting arm 53 can promote the stop arm 52 to resume deformation and improve the problem that the stop arm 52 does not correctly abut against the second heat dissipation member 2 after passing through the second connection hole 22; the connecting arm 53 can also increase the maximum preset pressure of the stop arm 52 abutting against the second heat dissipation member 2 and improve the problem that the stop arm 52 is damaged due to excessive pressure between the stop arm 52 and the second heat dissipation member 2.
[0070] In the heat dissipation structure 100 for the intelligent interaction flat panel according to the embodiment of the present application, the first heat dissipation member 1 and the second heat dissipation member 2 are respectively arranged on both sides of the member to be heat dissipated 200, and the member to be heat dissipated 200 is heat dissipated on both sides at the same time, which is beneficial to improving the heat dissipation efficiency of the member to be heat dissipated 200, improving the heat dissipation efficiency of the chip 202 on the PCB board 201, and improving the problem of low heat dissipation efficiency of the chip 202. At least part of the first heat dissipation member 1 is thermally connected to the chip 202, further improving the heat dissipation efficiency of the chip 202. The connecting column 5 is detachably connected to the first heat dissipation member 1 and the second heat dissipation member 2, and the first heat dissipation member 1 and the second heat dissipation member 2 are simultaneously installed on the member to be heat dissipated 200, so that the first heat dissipation member 1 and the second heat dissipation member 2 are simple to disassemble and assemble, reducing the assembly cost of the first heat dissipation member 1 and the second heat dissipation member 2, and reducing the production cost of the heat dissipation structure 100 for the intelligent interaction flat panel.
[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; under the idea of the present application, the technical features in the above embodiments or different embodiments can also be combined, and the steps can be implemented in any order, and there are many other changes in different aspects of the present application as described above. For the sake of brevity, they are not provided in detail; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the present application.
Claims
1. A heat dissipation structure for a smart interactive tablet, used to dissipate heat from a heat dissipation element, wherein the heat dissipation element comprises a PCB board and a chip disposed on one side of the PCB board, characterized in that: The heat dissipation structure for the intelligent interactive flat panel includes: A first heat sink is disposed on one side of the heat sink to be cooled, wherein at least a portion of the first heat sink is thermally connected to the chip; The second heat sink is arranged on the other side of the heat sink to be cooled, and the second heat sink is thermally connected to the PCB board.
2. The heat dissipation structure for the intelligent interactive tablet according to claim 1, characterized in that: The heat dissipation structure for the intelligent interactive tablet further includes a connecting column, and the connecting column is arranged on the first heat dissipation member; The second heat sink is provided with a second connection hole, and the connection column is passed through the second connection hole.
3. The heat dissipation structure for the intelligent interactive tablet according to claim 2, characterized in that: A stop arm is disposed at one end of the connecting column adjacent to the second heat sink, and the stop arm abuts against a side of the second heat sink facing away from the first heat sink.
4. The heat dissipation structure for the intelligent interactive tablet according to claim 3, characterized in that: The end of the stop arm extends toward the first heat sink, and the end of the stop arm abuts against a side of the second heat sink facing away from the first heat sink; Wherein, the stop arm is flexible, and when the connecting column passes through the second connecting hole, the stop arm is used to deform to avoid the second heat sink.
5. The heat dissipation structure for a smart interactive tablet according to claim 2, characterized in that: The first heat sink is provided with a first connection hole, and the connection column is passed through the first connection hole.
6. The heat dissipation structure for a smart interactive tablet according to claim 5, characterized in that: An enlarged head is provided at one end of the connecting column adjacent to the first heat sink; The heat dissipation structure for the intelligent interactive tablet further includes an elastic member, and two ends of the elastic member are respectively supported against the first heat dissipation member and the head.
7. The heat dissipation structure for a smart interactive tablet according to claim 1, characterized in that: A first heat conducting member is provided between the first heat sink and the chip; And / or, a second heat conducting member is arranged between the second heat dissipating member and the PCB board.
8. The heat dissipation structure for a smart interactive tablet according to claim 1, characterized in that: The first heat sink and / or the second heat sink are provided with heat sinks.
9. The heat dissipation structure for a smart interactive tablet according to claim 1, characterized in that: A second boss is disposed on one side of the first heat sink facing the second heat sink, and the second boss is thermally connected to the chip; And / or, a first boss is provided on a side of the second heat sink facing the first heat sink, and the first boss is thermally connected to the PCB board.
10. The heat dissipation structure for a smart interactive tablet according to any one of claims 1 to 9, characterized in that: When viewed in a direction perpendicular to the PCB, a projection of a portion of the second heat sink that is thermally connected to the PCB at least partially overlaps with a projection of the chip.