Motor driving assembly structure
By adopting a combined structure of thermally conductive metal base, DBC substrate, multi-layer PCB board and plastic shell in the motor drive assembly, the problems of large weight, poor thermal conductivity and long delivery time of existing high-power motor drive products are solved, and the effects of structural simplification, cost reduction and performance improvement are achieved.
Patent Information
- Application Number
- CN202422057064.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-23
AI Technical Summary
The steel shells of existing high-power motor drive products have problems such as high material density, large weight, poor heat conductivity, long shell delivery period, complex process, and expensive price. In particular, the long shell delivery time seriously affects the progress and competitiveness of the project.
The combined structure of thermally conductive metal base, DBC base, two PCB boards and plastic shell is adopted. Through the heat dissipation of thermally conductive metal base and the space utilization of multi-layer PCB boards, combined with the simple plastic shell design, complex process steps and material costs are reduced.
It realizes simplification of structural design and cost reduction, improves space utilization efficiency and power density, and simultaneously reduces weight and improves performance, making the input and output methods more flexible and easy to install.
Smart Images

Figure CN223040429U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit product production, and particularly relates to a structure of a motor drive component. Background Art
[0002] With the development of technology, the structural requirements for integrated circuit products are getting higher and higher, demanding higher performance, lower cost, and more convenient and efficient use.
[0003] Currently, most high-power motor drive products adopt a steel shell with side-out glass-sintered leads, and a circuit structure method with a thick-film ceramic substrate attached as the base. This type of steel shell solution has problems such as large density and weight of the shell material, poor heat conduction, long shell delivery time, complex process, and high price. In particular, the excessively long shell delivery time seriously affects the progress and competitiveness of the project; the shell packaging solution of the aluminum-silicon shell brazed insulation lead assembly can solve the problems of large weight and poor heat conduction to a certain extent, but its structure of encapsulating glass-sintered leads and then brazing cannot adapt to projects with a shorter R & D cycle and lower R & D cost to a certain extent.
[0004] Based on this, it is necessary to develop a structure of a motor drive component to overcome the above technical problems. Content of the Utility Model
[0005] The technical problem to be solved by the utility model is to provide a structure of a motor drive component, which effectively overcomes the defects of the prior art.
[0006] The technical solution of the utility model to solve the above technical problems is as follows:
[0007] A structure of a motor drive component includes a heat-conducting metal base, a DBC substrate, two PCB boards, and a plastic shell. A sunken DBC bonding and welding surface is provided on the upper end surface of the heat-conducting metal base. The DBC substrate is bonded and welded to the DBC bonding and welding surface. Surface-mounted devices, connecting pieces, and stud leads are mounted on the DBC substrate. A plurality of support columns are spaced around the upper end of the heat-conducting metal base. Through holes corresponding to the support columns one by one are respectively provided at the edges of the two PCB boards. The PCB boards are sleeved on the support columns through the through holes and are connected and fixed to the support columns. And the two PCB boards are distributed at intervals up and down. The stud leads are welded to the upper PCB board. Adjacent PCB boards are electrically connected through PCB board connection pins. The plastic shell is a shell with an open lower end and covers the two PCB boards. The lower end edge of the plastic shell is hermetically connected to the edge of the heat-conducting metal base. The plastic shell is provided with a potting hole.
[0008] On the basis of the above technical solution, the utility model can also be improved as follows.
[0009] Further, the above-mentioned heat-conducting metal base is a plate-shaped member with a rectangular body shape, and a stepped assembly groove is provided at the upper peripheral edge thereof. The above-mentioned plastic shell is a cuboid-shaped shell, and the lower edge thereof is embedded in the above-mentioned assembly groove. The above-mentioned support columns are respectively provided at the four right-angled corners of the upper end of the above-mentioned heat-conducting metal base.
[0010] Further, the lower end of the above-mentioned plastic shell and the above-mentioned assembly groove are hermetically bonded by glue.
[0011] Further, ear plates are respectively provided at the right-angled corners of the side ends of the above-mentioned heat-conducting metal base, and mounting holes penetrating through them are provided on the above-mentioned ear plates.
[0012] Further, the above-mentioned heat-conducting metal base is a steel base.
[0013] Further, the above-mentioned support column includes a first column body, a second column body, and a third column body coaxially arranged from bottom to top. The diameters of the above-mentioned first column body, the second column body, and the third column body decrease in sequence. The through hole of the lower-layer above-mentioned PCB board is sleeved on the above-mentioned second column body, and the periphery of this through hole is welded to the upper end of the above-mentioned first column body. The through hole of the upper-layer above-mentioned PCB board is sleeved on the above-mentioned third column body, and the periphery of this through hole is welded to the upper end of the above-mentioned second column body.
[0014] Further, the above-mentioned support column is brazed to the above-mentioned heat-conducting metal base.
[0015] Further, the above-mentioned DBC bonding and welding surface is octagonal.
[0016] Further, the above-mentioned pouring holes are respectively provided at the top and side walls of the above-mentioned plastic shell.
[0017] Further, welding terminals connected to its internal circuit are fixed on the lower-layer above-mentioned PCB board. The above-mentioned welding terminals penetrate through the upper-layer above-mentioned PCB board and extend into the first hole adapted to the top of the above-mentioned plastic shell, and / or connectors connected to its internal circuit are fixed on the upper-layer above-mentioned PCB board. The above-mentioned connectors extend into the second hole adapted to the top of the above-mentioned plastic shell.
[0018] The beneficial effects of the present utility model are as follows: The structure design is simple and reasonable. The DBC substrate and the PCB board are used in combination. The power device dissipates heat through the bottom steel base, meeting the requirements of high-power circuits, improving space utilization. The structure of this shell is single, without complex processes such as glass sintering. Assembly and repair are convenient, effectively reducing production costs. It can improve performance and power density while achieving weight reduction. The input and output methods are more flexible, and the connector and / or welding terminal methods can be selected, facilitating installation. Description of the Drawings
[0019] Figure 1 is an exploded structure diagram of the motor drive assembly structure of the present utility model;
[0020] Figure 2 is the assembly drawing of the motor drive component structure of the present utility model;
[0021] Figure 3 is the side view of the structure after the assembly of the heat-conducting metal base and the DBC substrate in the motor drive component structure of the present utility model;
[0022] Figure 4 is the plan view of the structure after the assembly of the heat-conducting metal base and the DBC substrate in the motor drive component structure of the present utility model;
[0023] Figure 5 The plan view of the heat-conducting metal base in the motor drive component structure of the present utility model.
[0024] In the attached drawings, the list of components represented by each reference numeral is as follows:
[0025] 1. Heat-conducting metal base; 2. DBC substrate; 3. PCB board; 4. Plastic housing; 11. DBC bonding and welding surface; 12. Support column; 13. Ear plate; 21. Stud lead; 31. PCB board connection pin; 32. Welding terminal; 33. Connector; 41. Glue injection hole; 121. First column; 122. Second column; 123. Third column. Detailed implementation manners
[0026] The principles and features of the present utility model will be described below with reference to the attached drawings. The examples given are only for explaining the present utility model and are not intended to limit the scope of the present utility model.
[0027] Example: As Figure 1 and 2 shown, the motor drive component structure of this embodiment includes a heat-conducting metal base 1, a DBC substrate 2, two PCB boards 3, and a plastic housing 4. The upper end surface of the heat-conducting metal base 1 is provided with a sunken DBC bonding and welding surface 11. The DBC substrate 2 is bonded and welded to the DBC bonding and welding surface 11. Surface-mounted devices, connection pieces, and stud leads 21 are mounted on the DBC substrate 2. A plurality of support columns 12 are arranged at intervals around the upper end of the heat-conducting metal base 1. Through holes corresponding to the support columns 12 one by one are respectively provided at the edges of the two PCB boards 3. The PCB boards 3 are sleeved on the support columns 12 through the through holes and are fixedly connected to the support columns 12. And the two PCB boards 3 are distributed at intervals up and down. The stud leads 21 are welded to the upper PCB board 3. Adjacent PCB boards 3 are electrically connected through PCB board connection pins 31. The plastic housing 4 is a housing with an open lower end and covers the two PCB boards 3. The lower end edge of the plastic housing 4 is hermetically connected to the edge of the heat-conducting metal base 1. The plastic housing 4 is provided with a glue injection hole 41.
[0028] In the structure of the motor drive assembly of this embodiment, the DBC substrate 2 is welded to the DBC bonding and welding surface 11 of the heat-conducting metal base 1. After printing solder paste on the DBC substrate 2, surface-mounted devices, pinhead leads 21 and connecting pieces are mounted. The pinhead leads 21 are positioned using a tooling, and then placed together with the heat-conducting metal base 1 into a vacuum soldering furnace (eutectic soldering) to complete the soldering of the connecting pieces and the surface-mounted device part, and two-layer PCB boards 3 are assembled. After the DBC substrate 2 is debugged and qualified, after connecting the DBC substrate 2 and the printed circuit board module circuit (the module circuit inside the PCB board 3), the plastic shell 4 is bonded and potted to complete the product assembly. This structure has the following advantages compared with the traditional structure: First, the DBC substrate 2 is used in combination with multiple PCB boards 3, and the heat generated by the devices will be conducted to the heat-conducting metal base 1, and then diffused to the outside of the module by the heat-conducting metal base 1, realizing heat dissipation of the devices, meeting the requirements of high-power circuits, and improving space utilization. Second, the shell of this structure is single, without complex processes such as glass sintering, convenient for assembly and repair, and effectively reduces production costs. Third, while improving performance and power density, weight reduction is achieved.
[0029] In this embodiment, the heat-conducting metal base 1 is machined by CNC milling and undergoes surface multi-layer nickel plating treatment. The heat-conducting metal base 1 has good thermal conductivity, good mechanical flatness and mechanical consistency. In addition, devices with small PCB board 3 size and small heat generation are mostly distributed here, and the structure of the double-layer PCB board 3 greatly expands the space utilization area and increases the module power density.
[0030] This structure has the following advantages compared with the traditional structure: First, the DBC substrate is used in combination with multiple PCB printed circuit boards, and the power devices dissipate heat through the bottom steel base, meeting the requirements of high-power circuits and improving space utilization. Second, the shell of this structure is single, without complex processes such as glass sintering, convenient for assembly and repair, and effectively reduces production costs. Third, while improving performance and power density, weight reduction is achieved. Fourth, the input and output methods are more flexible, and multiple methods such as connectors and welding terminals can be selected, which is convenient for installation.
[0031] As a preferred embodiment, as Figure 5 shown, the above-mentioned heat-conducting metal base 1 is a plate-shaped member with a rectangular body shape, and a stepped assembly groove (designated as a in the figure) is provided at the upper peripheral edge thereof. The above-mentioned plastic shell 4 is a cuboid-shaped shell, and the lower edge thereof is embedded in the above-mentioned assembly groove. Support columns 12 are respectively provided at the four right-angled corners at the upper end of the above-mentioned heat-conducting metal base 1.
[0032] In the above-mentioned implementation scheme, the design of the assembly groove limits the position where the plastic shell 4 is buckled, enabling the plastic shell 4 to achieve precise positioning and assembly. At the same time, the stepped assembly groove helps to improve the sealing performance at the connection between the plastic shell 4 and the heat-conducting metal base 1.
[0033] As a preferred embodiment, the lower end of the plastic housing 4 and the assembly groove are hermetically bonded by glue.
[0034] In the above-mentioned embodiment, when assembling the lower end of the plastic housing 4 and the assembly groove, glue is applied to the edges of the plastic housing 4 and the heat-conducting metal base 1 to ensure that when the plastic housing 4 is buckled, the glue evenly fills the gaps and edges. At the same time, glue is injected into the plastic housing 4 through the glue injection hole 41 to complete the assembly of the product with this structural method.
[0035] In this embodiment, ear plates 13 are respectively provided at the right-angle corners of the side ends of the heat-conducting metal base 1, and mounting holes penetrating through them are provided on the ear plates 13. By setting parts such as bolts in the ear plates 13, it is convenient for assembly on other products or components.
[0036] In this embodiment, the heat-conducting metal base 1 is a steel base. It has good heat-conducting performance and can withstand a higher power density. The production cycle of the steel base material is also greatly shortened compared with that of a conventional steel housing.
[0037] As a preferred embodiment, as Figure 1 , 3 , shown in Figure 4, the support column 12 includes a first column body 121, a second column body 122, and a third column body 123 coaxially arranged from bottom to top. The diameters of the first column body 121, the second column body 122, and the third column body 123 decrease in sequence. The through hole of the lower-layer PCB board 3 is sleeved on the second column body 122, and the periphery of the through hole is welded to the upper end of the first column body 121. The through hole of the upper-layer PCB board 3 is sleeved on the third column body 123, and the periphery of the through hole is welded to the upper end of the second column body 122.
[0038] In the above-mentioned embodiment, the support column 12 adopts a multi-segment variable-diameter column body, and a step surface is formed at the upper end of each column body, which can facilitate the positioning and installation of the corresponding layer of PCB board 3, ensure the assembly gap of the multi-layer PCB board 3, and is also beneficial to subsequent welding operations.
[0039] It should be added that: align the through holes of the PCB board 3 with the stud leads 21 on the DBC substrate 2 and the support column 12 on the heat-conducting metal base 1 and sleeve them. First, weld the PCB board 3 and the support column 12 together, and then weld the stud leads 21 on the PCB board 3.
[0040] In this embodiment, the support column 12 is brazed to the heat-conducting metal base 1.
[0041] In this embodiment, the DBC bonding and welding surface 11 is designed as an octagon.
[0042] In this embodiment, the top and side walls of the plastic housing 4 are respectively provided with the potting holes 41. Only one potting hole 41 can be provided at the top, and multiple potting holes can be provided on the side.
[0043] As a preferred embodiment, as Figure 1 shown, a welding terminal 32 connected to its internal circuit is fixed on the lower PCB board 3, and the welding terminal 32 penetrates through the upper PCB board 3 and extends into the first hole adapted to the top of the plastic housing 4, and / or a connector 33 connected to its internal circuit is fixed on the upper PCB board 3, and the connector 33 extends into the second hole adapted to the top of the plastic housing 4.
[0044] In the above embodiments, in actual production, according to the target product model, a single welding terminal 32 is selected, or a connector 33 is provided alone, or both the connector 33 and the welding terminal 32 are provided. Among them, the welding terminal 32 is a conventional device in the PCB board, and the connector 33 is also a conventional electrical component in the PCB board, which will not be elaborated here.
[0045] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.
[0046] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0047] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0048] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0049] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0050] Although the embodiments of the present utility model have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present utility model. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present utility model.
Claims
1. A motor drive assembly structure, characterized in that: The invention comprises a heat-conducting metal base (1), a DBC substrate (2), two PCB boards (3) and a plastic shell (4); the upper end surface of the heat-conducting metal base (1) is provided with a recessed DBC bonding welding surface (11); the DBC substrate (2) is bonded and welded on the DBC bonding welding surface (11); a surface-mounted device, a connecting sheet and a nail head lead (21) are mounted on the DBC substrate (2); a plurality of support columns (12) are spaced around the upper end of the heat-conducting metal base (1); the edges of the two PCB boards (3) are respectively provided with through holes corresponding to the support columns (12); The CB board (3) is sleeved on the support column (12) through a through hole and is connected and fixed to the support column (12), and the two PCB boards (3) are spaced apart from each other. The nail head lead (21) is welded to the upper PCB board (3), and the adjacent PCB boards (3) are electrically connected via PCB board connection pins (31). The plastic shell (4) is a shell with an open lower end and is covered outside the two PCB boards (3). The lower edge of the plastic shell (4) is sealed and connected to the edge of the heat-conducting metal base (1), and the plastic shell (4) is provided with a glue injection hole (41).
2. A motor drive assembly structure according to claim 1, characterized in that: The heat-conducting metal base (1) is a rectangular plate-shaped component, and the edges around the upper end thereof are provided with stepped assembly grooves. The plastic shell (4) is a rectangular shell, and the lower end edge thereof is embedded in the assembly groove. The support columns (12) are respectively provided at the four right angles of the upper end of the heat-conducting metal base (1).
3. A motor drive assembly structure according to claim 2, characterized in that: The lower end of the plastic shell (4) is sealed and bonded to the assembly groove by glue.
4. The motor drive assembly structure according to claim 2, characterized in that: Ear plates (13) are respectively provided at right angles on the side ends of the heat-conducting metal base (1), and mounting holes are provided on the ear plates (13) passing through them.
5. The motor drive assembly structure according to claim 1, characterized in that: The heat-conducting metal base (1) is a steel base.
6. The motor drive assembly structure according to claim 1, characterized in that: The support column (12) comprises a first column (121), a second column (122) and a third column (123) which are coaxially arranged from bottom to top, the diameters of the first column (121), the second column (122) and the third column (123) are successively reduced, the through hole of the lower layer of the PCB board (3) is sleeved on the second column (122), and the periphery of the through hole is welded to the upper end of the first column (121), and the through hole of the upper layer of the PCB board (3) is sleeved on the third column (123), and the periphery of the through hole is welded to the upper end of the second column (122).
7. The motor drive assembly structure according to claim 1, characterized in that: The support column (12) is brazed on the heat-conducting metal base (1).
8. The motor drive assembly structure according to claim 1, characterized in that: The DBC bonding welding surface (11) is octagonal.
9. The motor drive assembly structure according to claim 1, characterized in that: The top and side walls of the plastic shell (4) are respectively provided with the glue injection holes (41).
10. A motor drive assembly structure according to any one of claims 1 to 9, characterized in that: A welding terminal (32) connected to its internal circuit is fixed on the PCB board (3) of the lower layer, and the welding terminal (32) passes through the PCB board (3) of the upper layer and extends into a first hole adapted at the top of the plastic shell (4), and / or a connector (33) connected to its internal circuit is fixed on the PCB board (3) of the upper layer, and the connector (33) extends into a second hole adapted at the top of the plastic shell (4).