High-efficiency heat dissipation coil heat dissipation device

Abstract

The utility model relates to the field of circuit board coil heat dissipation, in particular to an efficient heat dissipation coil heat dissipation device which comprises a heat dissipation plate and an air blowing plate, the heat dissipation plate is connected with a circuit board and used for conducting heat dissipation on a coil of the circuit board, heat dissipation fins are arranged on the side, away from the circuit board, of the heat dissipation plate, and the air blowing plate is connected with the heat dissipation plate. The air blowing plate is connected with an air path system and provided with air blowing holes for blowing air to the heat dissipation fins. The heat dissipation plate directly dissipates heat of the coil of the circuit board, the air blowing plate blows air to dissipate heat of the heat dissipation fins of the heat dissipation plate, and the heat dissipation plate and the air blowing plate are combined to achieve dual heat dissipation, so that the heat dissipation capacity of the coil is improved, the purpose of efficient heat dissipation is achieved, and the heat dissipation requirement of the high-load operation coil is met.

Description

Technical Field

[0001] This application relates to the field of heat dissipation for circuit board coils, and particularly to a coil heat dissipation device with efficient heat dissipation. Background Art

[0002] With the progress of electronic technology, high-power electronic devices have become increasingly common in daily life and industrial applications. Coils, as core components in these devices, generate significant heat under high-load operating conditions. To address this issue, various heat dissipation technologies have been developed in the industry, such as heat dissipation fins and cooling fans, etc. These technologies have indeed improved the heat dissipation performance under specific conditions.

[0003] Although traditional heat dissipation methods, such as natural cooling and fan cooling, can play a certain role in some cases, in the application scenarios of high-power electronic devices, these methods often seem inadequate and are difficult to effectively prevent the coils on the circuit board from being damaged due to overheating. The design of heat dissipation fins does enhance the heat dissipation effect by increasing the heat dissipation area. However, under extreme high-temperature conditions, its heat dissipation capacity is still limited and it is difficult to fully meet the heat dissipation requirements of coils operating at high loads.

[0004] Obviously, the heat dissipation performance of the current heat dissipation devices on the market needs to be improved when facing the problem of coil high temperature. Especially when the coil operates at high load for a long time, the efficiency of these traditional heat dissipation methods is particularly insufficient and it is difficult to ensure the stability and safety of the coil. Therefore, it is particularly important to develop a solution with better heat dissipation performance. Content of the Utility Model

[0005] In order to solve the problem that the heat dissipation capacity of the coil is limited and it is difficult to fully meet the heat dissipation requirements of high-load operation, this application provides a coil heat dissipation device with efficient heat dissipation.

[0006] The coil heat dissipation device with efficient heat dissipation provided by this application adopts the following technical solutions:

[0007] A coil heat dissipation device with efficient heat dissipation includes a heat dissipation plate and a blowing plate. The heat dissipation plate is connected to the circuit board and is used to dissipate heat from the coil on the circuit board. A heat dissipation fin is provided on the side of the heat dissipation plate away from the circuit board. The blowing plate is connected to the heat dissipation plate. The blowing plate is connected to an air path system, and the blowing plate is provided with blowing holes for blowing air towards the heat dissipation fin.

[0008] By adopting the above technical solutions, the heat dissipation plate is connected to the heat dissipation system, and the heat of the coil is released through the heat dissipation fin. Cooling gas is provided to the blowing plate through the air path system, and the cooling gas is blown from the blowing holes towards the heat dissipation fin, accelerating the release of the heat of the heat dissipation fin, thereby improving the heat dissipation capacity of the coil and achieving the purpose of efficient heat dissipation.

[0009] Preferably, the air blowing plate is connected to the heat dissipation plate through a bracket, and there is a certain distance between the air blowing plate and the heat dissipation plate.

[0010] By adopting the above technical solution, the gap between the air blowing plate and the heat dissipation plate is beneficial to heat dissipation.

[0011] Preferably, the air blowing plate faces the heat dissipation fins, and the air blowing holes are arranged on the surface of the air blowing plate facing the heat dissipation fins.

[0012] By adopting the above technical solution, the air blowing holes are aimed at the heat dissipation fins, which can shorten the distance between the air blowing holes and the heat dissipation fins and improve the heat dissipation effect.

[0013] As a further improvement of the above technical solution, the heat dissipation plate is connected to the gas path system, and air dispersion holes are arranged on the surface of the heat dissipation plate facing the circuit board.

[0014] By adopting the above technical solution, the heat dissipation plate uses gas for heat dissipation, and can share a set of gas path system with the air blowing plate, thus simplifying the structure and reducing the cost.

[0015] Preferably, a transition plate is arranged between the heat dissipation plate and the circuit board. One side of the transition plate is provided with a coil accommodation hole, the coil is located in the coil accommodation hole, the other side of the transition plate is provided with a docking hole, the docking hole corresponds to the air dispersion hole, and the air dispersion hole, the docking hole and the coil accommodation hole are communicated in sequence.

[0016] By adopting the above technical solution, the setting of the transition plate and the docking hole and the coil accommodation hole thereon can ensure that the cooling gas of the heat dissipation plate is basically used to blow towards the coil to dissipate heat from the coil and improve the utilization efficiency of the cooling gas.

[0017] Preferably, an air chamber is arranged in the heat dissipation plate, the air chamber is connected to the gas path system through a pipeline, and a plurality of air dispersion holes are arranged, and the plurality of air dispersion holes are all communicated with the air chamber.

[0018] By adopting the above technical solution, the air chamber ensures that the cooling gas of the gas path system can be distributed to each air dispersion hole.

[0019] Preferably, the air blowing plate is provided with a plurality of air blowing channels, each air blowing channel is connected to the gas path system, and a plurality of the air blowing holes are evenly arranged on each air blowing channel.

[0020] By adopting the above technical solution, the setting of the air blowing channels can avoid opening cavities on the air blowing plate, thereby improving the strength of the air blowing plate and preventing the air blowing plate from deforming due to heat.

[0021] Preferably, the heat dissipation plate is provided with a liquid cooling channel, and the liquid cooling channel is connected to a liquid cooling system.

[0022] By adopting the above technical solution, the heat dissipation plate can be in the form of a cooling liquid. The liquid cooling of the heat dissipation plate and the air cooling of the air blowing plate are such that the liquid cooling is not prone to leakage, thereby further improving the heat dissipation and cooling effect of the coil.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. The heat dissipation plate directly dissipates heat from the coil of the circuit board, and the air blowing plate blows air to the heat dissipation fins of the heat dissipation plate. The combination of the heat dissipation plate and the air blowing plate provides dual heat dissipation, thereby improving the heat dissipation capacity of the coil, achieving the purpose of efficient heat dissipation, and meeting the heat dissipation requirements of the coil operating under high load.

[0025] 2. The heat dissipation plate selects gas heat dissipation and shares a set of gas path systems with the air blowing plate, which is economical and practical and reduces costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a coil heat dissipation device with efficient heat dissipation according to an embodiment of the present application.

[0027] Figure 2 is a schematic structural diagram of the heat dissipation plate in an embodiment of the present application.

[0028] Figure 3 is a schematic structural diagram of the transition plate from one perspective in an embodiment of the present application.

[0029] Figure 4 is a schematic structural diagram of the transition plate from another perspective in an embodiment of the present application.

[0030] Figure 5 is a schematic structural diagram of the air blowing plate in an embodiment of the present application.

[0031] Description of the reference numerals: 1, heat dissipation plate; 11, air dispersion holes; 2, air blowing plate; 21, air blowing holes; 22, air blowing channels; 3, circuit board; 4, heat dissipation fins; 5, bracket; 6, transition plate; 61, coil accommodation holes; 62, docking holes. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] The following further elaborates on the present application in conjunction with the attached Figures 1-5 for a more detailed description of the present application.

[0033] The orientation terms such as "upper", "lower", "left", "right", "front", and "rear" in the present application only represent the relative positions in the drawings, which are for the convenience of describing the present application and do not represent the absolute positions of the products, and should not be construed as limitations on the present application.

[0034] An embodiment of the present application discloses a coil heat dissipation device with efficient heat dissipation. As Figure 1As shown in the figure, the coil heat dissipation device with high efficiency heat dissipation includes a heat dissipation plate 1 and a blowing plate 2. The heat dissipation plate 1 is connected to the circuit board 3 and is used to dissipate the heat of the coil on the circuit board 3. On the side of the heat dissipation plate 1 away from the circuit board 3, there are heat dissipation fins 4. The heat dissipation plate 1 is connected to a heat dissipation system, and the heat of the coil is released through the heat dissipation fins 4. The blowing plate 2 is connected to the heat dissipation plate 1. There are air blowing holes 21 on the blowing plate 2 for blowing air towards the heat dissipation fins 4. The blowing plate 2 is connected to an air path system, and cooling gas is provided to the blowing plate through the air path system. The cooling gas is blown from the air blowing holes 21 towards the heat dissipation fins 4, accelerating the release of the heat of the heat dissipation fins 4, thereby improving the heat dissipation capacity of the coil and achieving the purpose of high efficiency heat dissipation.

[0035] In this embodiment, the heat dissipation plate 1 is preferably gas-cooled, that is, the heat dissipation plate 1 is also connected to an air path system, as Figure 2 shown. There are air dispersion holes 11 on the surface of the heat dissipation plate 1 facing the circuit board 3. The cooling gas is blown towards the circuit board 3 through the air dispersion holes 11, and then the coil on the circuit board 3 is cooled. The heat dissipation plate 1 and the blowing plate 2 share a set of air path systems, which is beneficial to simplifying the structure and reducing costs.

[0036] Specifically, an air chamber is provided inside the heat dissipation plate 1. The air chamber is connected to the air path system through a pipeline. A plurality of air dispersion holes 11 are provided, and all the plurality of air dispersion holes 11 are communicated with the air chamber. As Figure 3 and Figure 4 shown, a transition plate 6 is provided between the circuit board 3 and the heat dissipation plate 1. One side of the transition plate 6 is provided with a coil accommodation hole 61, and the coil is located inside the coil accommodation hole 61. The other side of the transition plate 6 is provided with a docking hole 62, and the docking hole 62 corresponds to the air dispersion holes 11. The air dispersion holes 11, the docking hole 62, and the coil accommodation hole 61 are communicated in sequence.

[0037] After the cooling gas enters the air chamber of the heat dissipation plate 1, it enters the docking hole 62 through the air dispersion holes 11, enters the coil accommodation hole 61 through the docking hole 62, and then dissipates the heat of the coil located inside the coil accommodation hole 61. The setting of the transition plate 6 and the docking hole 62 and the coil accommodation hole 61 thereon can ensure that the cooling gas of the heat dissipation plate 1 is basically used for dissipating the heat of the coil, improving the utilization efficiency of the cooling gas.

[0038] It should be noted that except for this embodiment, in other embodiments, the heat dissipation plate 1 can adopt a liquid cooling method, that is, the heat dissipation plate 1 is provided with a liquid cooling channel, and the liquid cooling channel is connected to a liquid cooling system, or it can also be a combination of gas cooling and liquid cooling.

[0039] As Figure 5As shown in the figure, in this embodiment, the air blowing plate 2 is provided with a plurality of air blowing channels 22. Each air blowing channel 22 is connected to the air path system, and a plurality of air blowing holes 21 are evenly arranged on each air blowing channel 22. The air blowing plate 2 faces the heat dissipation fins 4, and the air blowing holes 21 are arranged on the surface of the air blowing plate 2 facing the heat dissipation fins 4. The arrangement of the air blowing channels 22 does not require a large cavity to be provided on the air blowing plate 2, thereby improving the strength of the air blowing plate 2 and preventing the air blowing plate from being deformed by heat.

[0040] In this embodiment, the air blowing plate 2 is connected to the heat dissipation plate 1 through a bracket 5. There is a certain distance between the air blowing plate 2 and the heat dissipation plate 1, and the gap can improve the heat dissipation effect and facilitate the dissipation of heat. The bracket 5 is preferably four vertical rods.

[0041] The implementation principle of the highly efficient heat dissipation coil heat dissipation device in this embodiment is as follows:

[0042] Assemble and connect the air blowing plate 2, the heat dissipation plate 1 and the transition plate 6, and connect the transition plate 6 to the circuit board 3. During operation, turn on the air path system. The cooling gas is divided into two paths. One path enters the heat dissipation plate 1, enters the docking hole 62 and the coil accommodating hole 61 through the air dispersion holes 11 of the heat dissipation plate 1, and dissipates heat from the coil of the circuit board 3. At the same time, the fins of the heat dissipation plate 1 also transfer and dissipate the heat of the coil; the other path enters the air blowing plate 2 and is blown from the air blowing holes 21 of the air blowing plate 2 to the heat dissipation fins of the heat dissipation plate 1 to cool the heat dissipation fins, thereby reducing the temperature of the coil.

[0043] The above are all the preferred embodiments of this application. The protection scope of this application is not limited by this. Therefore, all equivalent changes made according to the structure, shape and principle of this application should be covered within the protection scope of this application.

Claims

1. A coil heat dissipation device with high heat dissipation efficiency, characterized by: The invention comprises a heat sink (1) and an air blowing plate (2); the heat sink (1) is connected to a circuit board (3) and is used to dissipate heat from a coil of the circuit board (3); a heat sink (1) is provided with heat sink fins (4) on a side of the heat sink (1) away from the circuit board (3); the air blowing plate (2) is connected to the heat sink (1); the air blowing plate (2) is connected to an air path system; and the air blowing plate (2) is provided with air blowing holes (21) for blowing air toward the heat sink fins (4).

2. The coil heat dissipation device with high efficiency heat dissipation according to claim 1, characterized in that: The air blowing plate (2) is connected to the heat dissipation plate (1) via a bracket (5), and there is a certain distance between the air blowing plate (2) and the heat dissipation plate (1).

3. The coil heat dissipation device with high efficiency heat dissipation according to claim 2, characterized in that: The air blowing plate (2) faces the heat dissipation fins (4), and the air blowing holes (21) are arranged on the surface of the air blowing plate (2) facing the heat dissipation fins (4).

4. The coil heat dissipation device with high efficiency according to any one of claims 1 to 3, characterized in that: The heat dissipation plate (1) is connected to the air circuit system, and a surface of the heat dissipation plate (1) facing the circuit board (3) is provided with air diffusion holes (11).

5. The coil heat dissipation device with high efficiency heat dissipation according to claim 4, characterized in that: A transition plate (6) is provided between the heat dissipation plate (1) and the circuit board (3); a coil accommodating hole (61) is provided on one side of the transition plate (6); the coil is located in the coil accommodating hole (61); a docking hole (62) is provided on the other side of the transition plate (6); the docking hole (62) corresponds to the air diffusion hole (11); the air diffusion hole (11), the docking hole (62) and the coil accommodating hole (61) are connected in sequence.

6. The coil heat dissipation device with high efficiency heat dissipation according to claim 4, characterized in that: An air chamber is provided in the heat dissipation plate (1), the air chamber is connected to an air circuit system via a pipeline, a plurality of air diffusion holes (11) are provided, and the plurality of air diffusion holes (11) are all in communication with the air chamber.

7. The coil heat dissipation device with high efficiency according to any one of claims 1 to 3, characterized in that: The blowing plate (2) is provided with a plurality of blowing channels (22), each blowing channel (22) is connected to the air path system, and each blowing channel (22) is evenly provided with a plurality of blowing holes (21).

8. The coil heat dissipation device with high efficiency according to any one of claims 1 to 3, characterized in that: The heat sink (1) is provided with a liquid cooling channel, and the liquid cooling channel is connected to a liquid cooling system.

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