Crystal bar wire cutting device
By setting a guide wheel in the crystal rod wire cutting device, the problem of increasing the winding angle of the cutting wire when cutting thicker silicon wafers is solved, the cutting stability and silicon wafer consistency are improved, and the cutting yield is achieved.
Patent Information
- Application Number
- CN202421457982.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-25
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-06-25
AI Technical Summary
With the change in the demand for cutting silicon crystal rods, the existing wire cutting technology causes the winding angle of the cutting wire to wrap on the main wheel when cutting thicker silicon wafers to increase, resulting in an increase in tension, which may lead to the problem of the cutting wire jumping out and the inconsistent thickness of the silicon wafer.
A crystal rod wire cutting device is designed, including a first main wheel, a second main wheel, a third main wheel and a guide device. A guide wheel is arranged in the guide device, and the cutting wire is wound on the main wheel through the guide wheel, avoiding the problem of increasing winding angle.
By setting up the guide wheel, the problem of increasing winding angle caused by the winding of the cutting line between different main wheels is avoided, the stability of the cutting process and the consistency of the quality of the silicon wafer are improved, and the cutting yield is effectively improved.
Smart Images
Figure CN223044868U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor manufacturing, and specifically relates to a crystal bar wire cutting device. Background Art
[0002] At present, the cutting process of semiconductor wafers mainly adopts wire cutting technology. This technology involves cutting a silicon crystal bar with a length of 100 mm to 450 mm into wafers with a thickness of 0.2 mm to 1.5 mm. However, with the change of the market demand for the wafer thickness, it is necessary to cut the silicon crystal bar into multiple wafers with a thickness of 10 mm to 100 mm. To meet this demand, the cutting process must be adjusted accordingly. Among them, the spacing between the main cutting wheels needs to be increased to 10 mm to 100 mm to adapt to thicker wafers.
[0003] However, with the increase of the spacing between the main wheels, the winding angle of the cutting wire around the main wheels also increases, resulting in an increase in the tensile force in the horizontal direction. When the tensile force exceeds a certain limit, the cutting wire may jump out of the original groove. This jumping phenomenon will cause a series of problems, such as the breakage of the cutting wire and the inconsistency of the wafer thickness. To ensure the stability of the cutting process and the consistency of the wafer quality, it is necessary to improve the existing wire cutting technology to meet the cutting requirements of thicker wafers. Summary of the Utility Model
[0004] In view of the above-mentioned disadvantages of the prior art, the utility model provides a crystal bar wire cutting device, which includes a first main wheel, a second main wheel, a third main wheel and a guiding device arranged in sequence. The side walls of the first main wheel, the second main wheel and the third main wheel have first grooves. The guiding device includes a guiding wheel, which is an inclined disc-shaped structure, and its side wall has a second groove. The cutting wire passes through the first groove and the second groove and is wound around the first main wheel, the guiding wheel, the second main wheel and the third main wheel in sequence. By arranging a guiding wheel in the crystal bar wire cutting device, the problem of the increase in the winding angle of the cutting wire between different main wheels can be avoided, thereby avoiding problems such as abnormal cutting and effectively improving the cutting yield. In addition, the spacing between adjacent guiding wheels can be adjusted according to the cutting requirements of wafers with different thicknesses, and the applicable range is relatively wide.
[0005] To achieve the above object and other related objects, the utility model provides a crystal bar wire cutting device, including:
[0006] A main wheel, the main wheel extends along a first direction, and the main wheel has a plurality of first grooves arranged at intervals along the first direction; the main wheel includes a first main wheel and a second main wheel arranged in parallel;
[0007] The guiding device, the guiding device and the first main wheel are located in a first plane, the guiding device and the second main wheel are located in a second plane, and the first plane intersects with the second plane; the guiding device includes a plurality of guiding members, the guiding member includes a guiding wheel, the guiding wheel is an inclined disc-shaped structure, and its side wall has a second groove, and the cutting wire passes through the first groove and the second groove and is sequentially wound around the first main wheel, the guiding wheel and the second main wheel.
[0008] Optionally, the main wheel further includes a third main wheel, the first main wheel and the third main wheel are horizontally spaced apart in a second direction perpendicular to the first direction, the second main wheel is located below the first main wheel and the third main wheel, and the three are arranged in parallel and equidistantly.
[0009] Optionally, the guiding device further includes a guiding rod, the guiding rod extends along the first direction, and a plurality of the guiding members are evenly spaced on the guiding rod.
[0010] Optionally, the guiding member further includes:
[0011] A slider located on the guiding rod;
[0012] A support member, one end of the support member is fixed on the slider, and the other end is fixed on the bottom surface of the guiding wheel.
[0013] Optionally, a scale is provided on the surface of the guiding rod, and the scale extends along the first direction.
[0014] Optionally, the surface of the guiding rod has two grooves extending along the first direction.
[0015] Optionally, the slider has two fixing grooves, the fixing grooves penetrate the upper surface and the lower surface of the slider, the fixing grooves are arc-shaped on the surface of the slider, and the openings of the two fixing grooves face each other.
[0016] Optionally, a fixing member passes through the fixing groove and the groove to fixedly connect the slider and the guiding rod.
[0017] Optionally, the interval between adjacent first grooves is 10 mm to 100 mm.
[0018] Optionally, the cutting wire passes through the first groove and the second groove and is sequentially wound around the first main wheel, the guiding wheel, the second main wheel and the third main wheel.
[0019] The ingot wire cutting device provided by the present utility model has at least the following beneficial effects:
[0020] The utility model can avoid the problem of increasing winding angle caused by the winding of the cutting wire between different main wheels by arranging guide wheels in the crystal bar wire cutting device, thereby avoiding problems such as abnormal cutting and effectively improving the cutting yield. In addition, the distance between adjacent guide wheels can be adjusted according to the cutting requirements of silicon wafers with different thicknesses, and the applicable range is relatively wide. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It shows a schematic structural diagram of the crystal bar wire cutting device provided by the embodiment.
[0022] Figure 2 It shows a partial schematic diagram of the guiding device provided by the embodiment.
[0023] DESCRIPTION OF REFERENCE NUMERALS
[0024] 11 First main wheel
[0025] 12 Second main wheel
[0026] 13 Third main wheel
[0027] 2 Guide rod
[0028] 21 Scale
[0029] 22 Groove
[0030] 3 Guide member
[0031] 31 Guide wheel
[0032] 32 Slide block
[0033] 33 Support member
[0034] 34 Fixing member
[0035] 320 Fixing groove
[0036] 4 Cutting wire
[0037] 100 First groove
[0038] 200 Second groove
[0039] 201 Inlet end
[0040] 202 Outlet end DETAILED DESCRIPTION OF THE EMBODIMENT
[0041] The following uses specific and concrete examples to illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model.
[0042] It should be noted that the illustrations provided in this embodiment only schematically illustrate the basic concept of the present utility model. Although only the components related to the present utility model are shown in the illustrations and are not drawn according to the number, shape, and size of the components in actual implementation, the form, quantity, positional relationship, and proportion of each component in actual implementation can be arbitrarily changed on the premise of implementing the technical solution of the present invention, and the component layout form may also be more complex.
[0043] Embodiment
[0044] This embodiment provides a crystal bar wire cutting device, as Figure 1 shown, including a main wheel and a guiding device.
[0045] As Figure 1 shown, the main wheel includes a first main wheel 11, a second main wheel 12, and a third main wheel 13 arranged at equal intervals. Among them, the first main wheel 11 and the third main wheel 13 are horizontally spaced apart in the second direction ( Figure 1 the Y-axis direction shown), and the second main wheel 12 is located below the first main wheel 11 and the third main wheel 13. That is to say, in the Figure 1 shown Y-Z plane, the first main wheel 11, the second main wheel 12, and the third main wheel 13 are arranged in an equilateral triangle.
[0046] As Figure 1 shown, the first main wheel 11 extends in the first direction ( Figure 1 the X-axis direction shown). The first main wheel 11 has a plurality of first grooves 100 evenly spaced along the first direction ( Figure 1 the X-axis direction shown). The first grooves 100 are used for winding the cutting wire 4. As an example, the interval between adjacent first grooves 100 is set according to the thickness of the required silicon wafer. In this embodiment, the interval between adjacent first grooves 100 is 10 mm to 100 mm.
[0047] As an example, the first main wheel 11, the second main wheel 12, and the third main wheel 13 have the same structure. The structures of the second main wheel 12 and the third main wheel 13 can refer to the above description of the first main wheel 11.
[0048] As an example, the guiding device and the first main wheel 11 are located in a first plane, and the guiding device and the second main wheel 12 are located in a second plane. The first plane intersects the second plane. Preferably, the first plane is perpendicular to the second plane. In this embodiment, the guiding device and the first main wheel 11 are located in Figure 1 the X-Z plane shown, and the guiding device and the second main wheel 12 are located in Figure 1 the X-Y plane shown. Specifically, the guiding device is located below the first main wheel 11 and is on the same horizontal plane as the second main wheel 12. As an example, the guiding device includes a guiding rod 2 and a plurality of guiding members 3. Among them, the guiding rod 2 extends along a first direction ( Figure 1 the X-axis direction shown), and the plurality of guiding members 3 are evenly spaced on the guiding rod 2, and the interval between adjacent guiding members 3 depends on the interval between the first grooves 100.
[0049] As Figure 2 shown, a scale 21 is provided on the surface of the guiding rod 2. The scale 21 is located at the center of the guiding rod 2 and extends along the first direction ( Figure 1 the X-axis direction shown), which is used to accurately adjust the position of the guiding member 3 on the guiding rod 2, enabling the operator to intuitively and accurately read the position of the guiding member 3 on the guiding rod 2 and the distance between adjacent guiding members 3.
[0050] As Figure 2 shown, the surface of the guiding rod 2 has two grooves 22 extending along the first direction ( Figure 1 the X-axis direction shown). The two grooves 22 are respectively located on both sides of the scale 21 and are used to adjust the position of the guiding member 3 on the guiding rod 2.
[0051] As Figure 2 shown, the guiding member 3 includes a guiding wheel 31, a slider 32, and a support member 33. The guiding wheel 31 and the slider 32 are fixedly connected through the support member 33.
[0052] As an example, the guiding wheel 31 is an inclined disc-shaped structure, and its side wall has a second groove 200 for winding the cutting line 4. The second groove 200 has an inlet end 201 and an outlet end 202. Among them, the inlet end 201 is the highest point of the second groove 200, and the outlet end 202 is the lowest point of the second groove 200. Combining Figure 1 shown, the cutting line 4 passes through the first groove 100 and the second groove 200 and is wound around the first main wheel 11, the guiding wheel 31, the second main wheel 12, and the third main wheel 13 in sequence. Among them, when winding around the guiding wheel 31, the cutting line 4 passes through the first main wheel 11, the inlet end 201, the second groove 200, the outlet end 202, and the second main wheel 12 in sequence; in this embodiment, in the first direction ( Figure 1In the X-axis direction shown, the distance difference between the first groove 100 on the first main wheel 11 and the wire inlet end 201 is less than or equal to 3 mm, and the distance difference between the first groove 100 on the second main wheel 12 and the wire outlet end 202 is less than or equal to 3 mm, so that the cutting wire 4 between the first main wheel 11 and the guide wheel 31 is nearly vertical ( Figure 1 in the Z-axis direction shown), and the cutting wire 4 between the second main wheel 12 and the guide wheel 31 is nearly in the second direction ( Figure 1 in the Y-axis direction shown). By arranging the guide wheel 31 between the first main wheel 11 and the second main wheel 12, the problem of the increase in the winding angle caused by the winding of the cutting wire 4 between different main wheels is avoided, thus avoiding the increase in the tensile force in the horizontal direction.
[0053] As an example, the slider 32 is arranged on the guide rod 2. The slider 32 has two fixing grooves 320 which penetrate the upper surface and the lower surface of the slider 32. The fixing member 34 passes through the fixing groove 320 and the groove 22 to fixedly connect the slider 32 with the guide rod 2. In this embodiment, the distance between adjacent guide members 3 can be adjusted by adjusting the position of the slider 32 on the guide rod 2, so as to meet the cutting requirements of silicon wafers with different thicknesses; in addition, the fixing groove 320 is arc-shaped on the surface of the slider 32, and the openings of the two fixing grooves 320 are opposite and can be spliced to form a circle. Therefore, the slider 32 can rotate 180° clockwise or 180° counterclockwise around its center, so as to adjust the turning direction of the guide wheel 31 to meet the cutting requirements of silicon wafers with different thicknesses.
[0054] In this embodiment, by arranging the guide wheel in the ingot wire cutting device, the problem of the increase in the winding angle caused by the winding of the cutting wire between different main wheels can be avoided, thus avoiding problems such as abnormal cutting, and effectively improving the cutting yield; in addition, the distance between adjacent guide wheels can be adjusted according to the cutting requirements of silicon wafers with different thicknesses, and the applicable range is relatively wide.
[0055] The above embodiments are only illustrative of the principles and effects of the present invention, and are not used to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.
Claims
1. A crystal ingot wire cutting device, characterized in that: include: A main wheel, the main wheel extending along a first direction, the main wheel having a plurality of first grooves arranged at intervals along the first direction; the main wheel comprising a first main wheel and a second main wheel arranged in parallel; a guide device, wherein the guide device and the first main wheel are located in a first plane, the guide device and the second main wheel are located in a second plane, and the first plane intersects the second plane; The guide device includes a plurality of guide members, wherein the guide members include a guide wheel, and the guide wheel is an inclined disc-shaped structure, and a side wall thereof has a second groove. The cutting line passes through the first groove and the second groove, and is sequentially wound around the first main wheel, the guide wheel and the second main wheel.
2. The crystal ingot wire cutting device according to claim 1, characterized in that: The main wheels also include a third main wheel. The first main wheel and the third main wheel are horizontally spaced apart in a second direction perpendicular to the first direction. The second main wheel is located below the first main wheel and the third main wheel, and the three are arranged in parallel and equidistantly.
3. The crystal ingot wire cutting device according to claim 1, characterized in that: The guide device further comprises a guide rod extending along the first direction, and a plurality of guide members are evenly spaced and arranged on the guide rod.
4. The crystal ingot wire cutting device according to claim 3, characterized in that: The guide member also includes: A slider, located on the guide rod; A support member, one end of which is fixed on the sliding block, and the other end of which is fixed on the bottom surface of the guide wheel.
5. The crystal ingot wire cutting device according to claim 3, characterized in that: A scale is disposed on the surface of the guide rod, and the scale extends along the first direction.
6. The crystal ingot wire cutting device according to claim 4, characterized in that: The surface of the guide rod has two grooves extending along the first direction.
7. The crystal ingot wire cutting device according to claim 6, characterized in that: The slider has two fixing grooves, which penetrate the upper surface and the lower surface of the slider. The fixing grooves are in an arc shape on the surface of the slider, and the openings of the two fixing grooves are opposite to each other.
8. The crystal ingot wire cutting device according to claim 7, characterized in that: The fixing member passes through the fixing slot and the groove to fix the sliding block to the guide rod.
9. The crystal ingot wire cutting device according to claim 1, characterized in that: The interval between adjacent first grooves is 10 mm to 100 mm.
10. The crystal ingot wire cutting device according to claim 2, characterized in that: The cutting line passes through the first groove and the second groove, and is sequentially wound around the first main wheel, the guide wheel, the second main wheel and the third main wheel.