Film tearing operation table for processing thinned silicon wafer

Abstract

The utility model relates to the technical field of thinned silicon wafer processing, and provides a film tearing operation table for thinned silicon wafer processing, which comprises a bottom plate, a plurality of electric push rods fixedly connected to the top of the outer surface of the bottom plate, a workbench fixedly connected to the top ends of the electric push rods, a connecting plate fixedly connected to the outer surface of the workbench, and a film tearing device fixedly connected to the connecting plate. The outer surface of the connecting plate is fixedly connected with a fan, the outer surface of the connecting plate is fixedly connected with a lighting lamp, the fan and the lighting lamp are located over the workbench, a second threaded rod is movably embedded in the center of the workbench, and the top end of the second threaded rod is fixedly connected with a containing disc. The illuminating lamp is turned on to irradiate the upper surface of the silicon wafer, after irradiation, a worker can tear off the film above the silicon wafer through the groove, dust in the air enters the upper surface after tearing off, and the fan is started through an external power supply to blow away the dust on the surface of the silicon wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of thinning silicon wafer processing, in particular to a film tearing operation table for thinning silicon wafer processing. Background Art

[0002] When thinning a silicon wafer, it is necessary to frequently transfer the silicon wafer to different operating platforms to complete various processing technologies; since a photosensitive structure has been prefabricated on the front side of the silicon wafer, in order to avoid scratching the photosensitive structure during the transfer and operation processes, a protective film is usually attached to the front side of the silicon wafer, and the protective film is torn off after the thinning process is completed.

[0003] The existing publicly disclosed patent number: CN217100807U discloses a film tearing operation table for a liquid crystal screen of a display, including: a bracket, a lifting frame installed on the bracket, a connecting rod, and two rotating table tops; the rotating table top includes: a damping rotating shaft, a support frame, and a panel, the two ends of the damping rotating shaft are respectively connected to the lifting frame and the support frame, and the panel is installed on the support frame; the two support frames are connected by a connecting rod, the two panels are separated, and the two panels are in the same plane.

[0004] The above solution can adjust the height of the panel through the lifting frame, and the damping rotating shaft can adjust the angle of the panel. Therefore, it greatly facilitates the operation of employees, reduces the labor intensity of employees, reduces the sub-healthy problem of employees' cervical spondylosis, is convenient for discovering foreign objects and dust spots, reduces foreign object residues. After film tearing, there will be fine dust in the air staying on the outer surface of the silicon wafer or the liquid crystal screen, and it is necessary to timely clean the tiny dust on the surface. When cleaning, since the dust is difficult to observe with the naked eye, a magnifying glass needs to be used to observe to reduce the dust on the surface of the silicon wafer. Summary of the Utility Model

[0005] In order to achieve the above object, the utility model adopts the following technical scheme: a film tearing operation table for thinning silicon wafer processing, including: a bottom plate, a plurality of electric push rods are fixedly connected to the top of the outer surface of the bottom plate, the tops of the plurality of electric push rods are fixedly connected to a workbench, a connecting plate is fixedly connected to the outer surface of the workbench, a fan is fixedly connected to the outer surface of the connecting plate, a lighting lamp is fixedly connected to the outer surface of the connecting plate, the fan and the lighting lamp are located directly above the workbench, a second threaded rod is movably embedded in the center of the workbench, the top of the second threaded rod is fixedly connected to a placement tray, and the placement tray is located directly below the fan.

[0006] The technical effect of adopting the above further scheme is: turn on the lighting lamp to irradiate the upper surface of the silicon wafer. After irradiation, the staff can tear off the film above the silicon wafer through the groove. After tearing off, the dust in the air will enter the upper surface, and the fan is started through an external power source to blow away the dust on the surface of the silicon wafer.

[0007] As a preferred embodiment, a fixed semi-circular block is fixedly connected to the top of the outer surface of the workbench. A groove is formed on the outer surface of the fixed semi-circular block, and a square block is fixedly connected to the top of the outer surface of the workbench.

[0008] The technical effect of adopting the above further solution is that the fixed semi-circular block is used for limiting the silicon wafer.

[0009] As a preferred embodiment, a first threaded rod is movably embedded in the square block. One end of the first threaded rod is rotatably connected to a movable semi-circular block through a bearing. A limiting telescopic rod is fixedly connected to the outer surface of the movable semi-circular block, and one end of the limiting telescopic rod is fixedly connected to the outer surface of the square block. A hollow plate is rotatably connected to the outer surface of the connecting plate.

[0010] The technical effect of adopting the above further solution is that by rotating the first threaded rod, the movable semi-circular block moves towards the fixed semi-circular block under the limitation of the limiting telescopic rod, and the silicon wafer can be fixedly clamped. At this time, the silicon wafer is fixed at the middle position between the fixed semi-circular block and the movable semi-circular block.

[0011] As a preferred embodiment, the hollow plate can rotate in a horizontal semi-circular manner around the outer surface of the connecting plate. A telescopic plate is movably embedded in the hollow plate, and a limiting strip is fixedly connected to the outer surface of the telescopic plate away from the hollow plate.

[0012] The technical effect of adopting the above further solution is that by rotating the magnifying glass, the hollow plate can rotate in a horizontal semi-circular manner around the outer surface of the connecting plate as the center. After rotation, the magnifying glass is located directly above the silicon wafer.

[0013] As a preferred embodiment, a chute is formed on the outer surface of the limiting strip, and a plurality of round holes are formed on the outer surface of the limiting strip. A U-shaped strip is slidably connected to the inside of the chute.

[0014] The technical effect of adopting the above further solution is that the clamping rod is stuck inside the round hole to limit the U-shaped strip. At this time, the magnifying glass can realize the adjustment of the up and down height.

[0015] As a preferred embodiment, an L-shaped block is fixedly connected to the outer surface of the U-shaped strip. A pull rod is movably embedded in the L-shaped block, and a limiting disk is fixedly connected to one end of the pull rod.

[0016] The technical effect of adopting the above further solution is that by pulling the pull rod to drive the limiting disk and the clamping rod to move to one side, after moving, the clamping rod disengages from the inside of the round hole on the limiting strip. At this time, the U-shaped strip slides up and down inside the chute, and under the limiting action of the spring, the clamping rod is stuck inside the round hole.

[0017] As a preferred embodiment, a spring is fixedly connected to the outer surface of the limit disk, a clamping rod is fixedly connected to the outer surface of the limit disk, the clamping rod is movably embedded in one of the circular holes, and a magnifying glass is fixedly connected to the outer surface of the U-shaped strip.

[0018] The technical effect of adopting the above further scheme is that the height of the magnifying glass can be adjusted, which is convenient for the magnifying glass to observe the dust on the surface of the silicon wafer. Pull the telescopic plate to move inside the hollow plate, and at this time, the observation range of the magnifying glass will become wider.

[0019] Compared with the prior art, the advantages and positive effects of the present utility model are as follows.

[0020] 1. When the present utility model is in use, first turn on the lighting lamp to irradiate the upper surface of the silicon wafer. After irradiation, the staff can tear off the film above the silicon wafer through the groove. After tearing off, the dust in the air will enter the upper surface. Start the fan through an external power supply to blow off the dust on the surface of the silicon wafer. By rotating the magnifying glass, at this time, the hollow plate can rotate horizontally in a semi-circular manner around the outer surface of the connecting plate as the center. After rotation, the magnifying glass is located directly above the silicon wafer, and it can be more clearly observed whether the dust on the surface of the silicon wafer has been cleaned. Pull the pull rod to drive the limit disk and the clamping rod to move to one side. After moving, the clamping rod disengages from the circular hole inside the limit strip. At this time, the U-shaped strip slides up and down inside the chute. Under the limiting action of the spring, the clamping rod is stuck inside the circular hole to limit the U-shaped strip. At this time, the height of the magnifying glass can be adjusted, which is convenient for the magnifying glass to observe the dust on the surface of the silicon wafer. Pull the telescopic plate to move inside the hollow plate, and at this time, the observation range of the magnifying glass will become wider.

[0021] 2. When the present utility model is in use, place the silicon wafer in the middle of the fixed semi-circular block and the moving semi-circular block. At this time, the silicon wafer is directly above the placement disk. Rotate the second threaded rod to move upward inside the workbench, so that the placement disk drives the silicon wafer above to move upward, so that the silicon wafer can always be located inside the card slot in the middle of the fixed semi-circular block and the moving semi-circular block. At this time, rotate the first threaded rod, and under the limiting action of the limiting telescopic rod, the moving semi-circular block moves towards the fixed semi-circular block to fix and clamp the silicon wafer. At this time, the silicon wafer is fixed in the middle of the fixed semi-circular block and the moving semi-circular block, preventing the silicon wafer from deviating. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a three-dimensional structural schematic diagram of a film tearing operation table for thinning silicon wafer processing proposed by the present utility model;

[0023] Figure 2 is an enlarged structural schematic diagram of the limit strip of a film tearing operation table for thinning silicon wafer processing proposed by the present utility model;

[0024] Figure 3The present utility model provides an enlarged structural schematic diagram of part A of a film tearing operation table for thinning silicon wafer processing;

[0025] Figure 4 The present utility model provides a front view plane structural schematic diagram of a film tearing operation table for thinning silicon wafer processing.

[0026] Legend: 101, bottom plate; 102, electric push rod; 103, fixed semi-circular block; 1031, workbench; 104, groove; 105, placement tray; 106, movable semi-circular block; 107, first threaded rod; 108, limit telescopic rod; 109, square block; 110, second threaded rod; 111, fan; 112, lighting lamp; 113, connecting plate; 114, hollow plate; 115, telescopic plate; 116, limit strip; 117, sliding groove; 118, magnifying glass; 119, U-shaped strip; 120, pull rod; 121, limit disc; 122, spring; 123, L-shaped block; 124, clamping rod. Detailed implementation manners

[0027] In order to more clearly understand the above-mentioned objects, features and advantages of the present utility model, the following further describes the present utility model with reference to the drawings and embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0028] In the following description, many specific details are set forth to fully understand the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Therefore, the present utility model is not limited by the specific embodiments disclosed in the following specification.

[0029] Please refer to Figures 1 - 4 , the present utility model provides a film tearing operation table for thinning silicon wafer processing, including: a bottom plate 101, a plurality of electric push rods 102 are fixedly connected to the top of the outer surface of the bottom plate 101, the tops of the plurality of electric push rods 102 are fixedly connected to a workbench 1031, a connecting plate 113 is fixedly connected to the outer surface of the workbench 1031, a fan 111 is fixedly connected to the outer surface of the connecting plate 113, a lighting lamp 112 is fixedly connected to the outer surface of the connecting plate 113, the fan 111 and the lighting lamp 112 are located directly above the workbench 1031, a second threaded rod 110 is movably embedded in the center of the workbench 1031, the top of the second threaded rod 110 is fixedly connected to a placement tray 105, the placement tray 105 is located directly below the fan 111, the lighting lamp 112 is turned on to irradiate the upper surface of the silicon wafer. After irradiation, the staff can tear off the film above the silicon wafer through the groove 104. After tearing off, dust in the air will enter the upper surface. The fan 111 is started by an external power source to blow away the dust on the surface of the silicon wafer.

[0030] AsFigures 1 - 4 As shown, a fixed semi-circular block 103 is fixedly connected to the top of the outer surface of the workbench 1031. A groove 104 is formed on the outer surface of the fixed semi-circular block 103. A square block 109 is fixedly connected to the top of the outer surface of the workbench 1031. The fixed semi-circular block 103 is used for limiting the silicon wafer.

[0031] As Figures 1 - 4 shown, a first threaded rod 107 is movably embedded in the square block 109. One end of the first threaded rod 107 is rotatably connected to a movable semi-circular block 106 through a bearing. A limiting telescopic rod 108 is fixedly connected to the outer surface of the movable semi-circular block 106. One end of the limiting telescopic rod 108 is fixedly connected to the outer surface of the square block 109. A hollow plate 114 is rotatably connected to the outer surface of the connecting plate 113. By rotating the first threaded rod 107, under the limitation of the limiting telescopic rod 108, the movable semi-circular block 106 moves towards the fixed semi-circular block 103, and the silicon wafer can be fixedly clamped. At this time, the silicon wafer is fixed at the middle position between the fixed semi-circular block 103 and the movable semi-circular block 106.

[0032] As Figures 1 - 4 shown, the hollow plate 114 can rotate in a horizontal semi-circular manner around the outer surface of the connecting plate 113. A telescopic plate 115 is movably embedded in the hollow plate 114. A limiting strip 116 is fixedly connected to the outer surface of the telescopic plate 115 away from the hollow plate 114. By rotating the magnifying glass 118, at this time, the hollow plate 114 can rotate in a horizontal semi-circular manner around the outer surface of the connecting plate 113 as the center. After rotation, the magnifying glass 118 is located directly above the silicon wafer.

[0033] As Figures 1 - 4 shown, a sliding groove 117 is formed on the outer surface of the limiting strip 116. A plurality of circular holes are formed on the outer surface of the limiting strip 116. A U-shaped strip 119 is slidably connected in the sliding groove 117. A clamping rod 124 is stuck in the circular hole of the limiting strip 116 to limit the U-shaped strip 119. At this time, the magnifying glass 118 can realize the adjustment of the up and down height.

[0034] As Figures 1 - 4 shown, an L-shaped block 123 is fixedly connected to the outer surface of the U-shaped strip 119. A pull rod 120 is movably embedded in the L-shaped block 123. A limiting disk 121 is fixedly connected to one end of the pull rod 120. By pulling the pull rod 120, the limiting disk 121 and the clamping rod 124 are driven to move to one side. After moving, the clamping rod 124 disengages from the circular hole inside the limiting strip 116. At this time, the U-shaped strip 119 slides up and down in the sliding groove 117, and under the limiting action of the spring 122, the clamping rod 124 is stuck in the circular hole.

[0035] As Figures 1 - 4As shown in the figure, a spring 122 is fixedly connected to the outer surface of the limit disc 121, and a clamping rod 124 is fixedly connected to the outer surface of the limit disc 121. The clamping rod 124 is movably embedded in one of the circular holes. A magnifying glass 118 is fixedly connected to the outer surface of the U-shaped strip 119, and the height of the magnifying glass 118 can be adjusted to facilitate the magnifying glass 118 to observe the dust on the surface of the silicon wafer. Pull the telescopic plate 115 to move inside the hollow plate 114, and at this time, the observation range of the magnifying glass 118 will become wider.

[0036] Working principle: When in use, place the silicon wafer in the middle of the fixed semi-circular block 103 and the moving semi-circular block 106. At this time, the silicon wafer is directly above the placement disc 105. Rotate the second threaded rod 110 to move upward inside the workbench 1031, so that the placement disc 105 drives the silicon wafer above to move upward, so that the silicon wafer can always be in the card slot inside the middle of the fixed semi-circular block 103 and the moving semi-circular block 106. At this time, rotate the first threaded rod 107, and under the limit of the limit telescopic rod 108, the moving semi-circular block 106 moves towards the fixed semi-circular block 103 to fixedly clamp the silicon wafer. At this time, the silicon wafer is fixed in the middle of the fixed semi-circular block 103 and the moving semi-circular block 106 to prevent the silicon wafer from deviating. Then turn on the lighting lamp 112 to irradiate the upper surface of the silicon wafer. After irradiation, the staff can tear off the film above the silicon wafer through the groove 104. After tearing off, the dust in the air will enter the upper surface. Start the fan 111 through an external power supply to blow off the dust on the surface of the silicon wafer. By rotating the magnifying glass 118, at this time, the hollow plate 114 can rotate horizontally in a semi-circular manner around the outer surface of the connecting plate 113. After rotation, the magnifying glass 118 is directly above the silicon wafer, and it can be more clearly observed whether the dust on the surface of the silicon wafer has been cleaned. Pull the pull rod 120 to drive the limit disc 121 and the clamping rod 124 to move to one side. After moving, the clamping rod 124 disengages from the circular hole inside the limit strip 116. At this time, the U-shaped strip 119 slides up and down inside the sliding groove 117. Under the limiting action of the spring 122, the clamping rod 124 is stuck in the circular hole to limit the U-shaped strip 119. At this time, the height of the magnifying glass 118 can be adjusted to facilitate the magnifying glass 118 to observe the dust on the surface of the silicon wafer. Pull the telescopic plate 115 to move inside the hollow plate 114, and at this time, the observation range of the magnifying glass 118 will become wider.

[0037] The above is only the preferred embodiment of the present invention, and it is not a limitation of the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical content of the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims

1. A film-tearing operation table for thinning silicon wafers, characterized in that: include: A bottom plate (101), a plurality of electric push rods (102) are fixedly connected to the top of the outer surface of the bottom plate (101), a workbench (1031) is fixedly connected to the top of the plurality of electric push rods (102), a connecting plate (113) is fixedly connected to the outer surface of the workbench (1031), a fan (111) is fixedly connected to the outer surface of the connecting plate (113), a lighting lamp (112) is fixedly connected to the outer surface of the connecting plate (113), the fan (111) and the lighting lamp (112) are located directly above the workbench (1031), a threaded rod 2 (110) is movably embedded inside the center of the workbench (1031), a placement plate (105) is fixedly connected to the top of the threaded rod 2 (110), and the placement plate (105) is located directly below the fan (111).

2. The film-tearing operation table for thinning silicon wafers according to claim 1, characterized in that: A fixed semicircular block (103) is fixedly connected to the top of the outer surface of the workbench (1031), a groove (104) is provided on the outer surface of the fixed semicircular block (103), and a square block (109) is fixedly connected to the top of the outer surface of the workbench (1031).

3. The film-tearing operation table for thinning silicon wafers according to claim 2, characterized in that: A threaded rod (107) is movably embedded inside the block (109); one end of the threaded rod (107) is rotatably connected to a movable semicircular block (106) via a bearing; the outer surface of the movable semicircular block (106) is fixedly connected to a limited telescopic rod (108); one end of the limited telescopic rod (108) is fixedly connected to the outer surface of the block (109); and the outer surface of the connecting plate (113) is rotatably connected to a hollow plate (114).

4. The film-tearing operation table for thinning silicon wafers according to claim 3, characterized in that: The hollow plate (114) can rotate in a transverse semicircular manner around the outer surface of the connecting plate (113); a telescopic plate (115) is movably embedded inside the hollow plate (114); and the telescopic plate (115) is fixedly connected to a limiting strip (116) away from the outer surface of the hollow plate (114).

5. The film-tearing operation table for thinning silicon wafers according to claim 4, characterized in that: The outer surface of the limiting strip (116) is provided with a sliding groove (117), the outer surface of the limiting strip (116) is provided with a plurality of circular holes, and the interior of the sliding groove (117) is slidably connected with a U-shaped strip (119).

6. The film-tearing operation table for thinning silicon wafers according to claim 5, characterized in that: An L block (123) is fixedly connected to the outer surface of the U-shaped bar (119), a pull rod (120) is movably embedded inside the L block (123), and one end of the pull rod (120) is fixedly connected to a limiting plate (121).

7. The film-tearing operation table for thinning silicon wafers according to claim 6, characterized in that: The outer surface of the limiting plate (121) is fixedly connected to a spring (122), the outer surface of the limiting plate (121) is fixedly connected to a clamping rod (124), the clamping rod (124) is movably embedded in one of the circular holes, and the outer surface of the U-shaped bar (119) is fixedly connected to a magnifying glass (118).

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