Drying jet pipe and wafer drying device for wafer planarization process
By setting up multiple ejection hole groups in the dry ejection tube, multiple ejection operations are achieved, the problem of ejection tube blockage is solved, the wafer surface drying effect is ensured, and the yield rate of the wafer planarization process is improved.
Patent Information
- Application Number
- CN202422242245.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-09-12
AI Technical Summary
Existing dry jet tubes are prone to spray blockage due to impurities entrained in isopropanol or nitrogen, which affects the drying effect of the wafer surface, and shows water marks, reducing the yield rate of the wafer planarization process.
A dry ejection tube for wafer planarization is designed, and at least two ejection hole groups are arranged to be distributed radially along the tube body. Each ejection hole group includes multiple ejection holes to ensure that other ejection groups can still eject nitrogen and isopropanol normally when one ejection hole group is blocked, achieving multiple ejection operations to ensure the wafer drying effect.
It effectively avoids clogging of the spray part, ensures the drying effect of the wafer surface, reduces water marks, and improves the yield rate of the wafer planarization process.
Smart Images
Figure CN223050396U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of wafer manufacturing technology, and more particularly, to a drying spray tube for a wafer planarization process and a wafer drying device. Background Art
[0002] In the related art, the drying spray tube is prone to blockage during spraying due to impurities entrained in isopropyl alcohol or nitrogen, resulting in incomplete drying of the wafer surface, water mark imprints, and affecting the yield of the wafer planarization process. Summary of the Utility Model
[0003] The purpose of the present disclosure is to provide a drying spray tube for a wafer planarization process and a wafer drying device to solve the above problems in the related art.
[0004] To achieve the above object, on the one hand, the present disclosure provides a drying spray tube for a wafer planarization process, including:
[0005] A tube body for the flow of nitrogen and isopropyl alcohol, with a spraying portion provided on the tube body, the spraying portion facing the wafer being lifted, and the spraying portion for spraying nitrogen and isopropyl alcohol onto the wafer;
[0006] Wherein, the spraying portion is configured as a group of spraying holes, the group of spraying holes is at least two and is spaced along the radial direction of the tube body, and each group of spraying holes includes a plurality of spraying holes, and the plurality of spraying holes are spaced along the axial direction of the tube body.
[0007] Optionally, the centers of the spraying holes of at least two groups of spraying holes are located on the same radial plane of the tube body, so that the spraying holes of the two groups of spraying holes are arranged side by side on a radial plane of the tube body; or,
[0008] The centers of the spraying holes of at least two groups of spraying holes are respectively located on two radial planes of the tube body, so that the spraying holes of the two groups of spraying holes are arranged staggeredly on a radial plane of the tube body.
[0009] Optionally, the number of spraying holes in the plurality of groups of spraying holes is the same or different.
[0010] Optionally, the number of groups of spraying holes is two, and the groups of spraying holes include a first group of spraying holes and a second group of spraying holes;
[0011] Wherein, the number of spraying holes in the first group of spraying holes is greater than or less than the number of spraying holes in the second group of spraying holes; or,
[0012] The number of spraying holes in the first group of spraying holes is equal to the number of spraying holes in the second group of spraying holes.
[0013] Optionally, in the moving direction of the wafer, the first ejection hole group is located below the second ejection hole group, and the number of the ejection holes in the first ejection hole group is 168.
[0014] Optionally, the apertures of two adjacent ejection holes in each ejection hole group are the same, and the apertures of the ejection holes in two adjacent ejection hole groups are the same.
[0015] Optionally, the ejection part faces the front side of the wafer, and the pipe body is used for drying the front side of the wafer.
[0016] Optionally, the ejection direction of the ejection part is set at an angle to the moving direction of the wafer.
[0017] The second aspect of the present disclosure further provides a wafer drying device, including a lifting mechanism and the drying ejection pipe in the above-mentioned wafer planarization process;
[0018] The lifting mechanism is used to connect with the wafer, the drying ejection pipe is located below the lifting mechanism, and the ejection part of the drying ejection pipe faces the wafer.
[0019] Optionally, the wafer drying device further includes a backside ejection pipe, and the backside ejection pipe is disposed opposite to the drying ejection pipe and located on both sides of the wafer;
[0020] Wherein, the ejection part of the drying ejection pipe faces the front side of the wafer, the backside ejection pipe is provided with ejection holes, the number of the ejection holes is multiple and they are arranged at intervals along the axial direction of the backside ejection pipe, and the ejection holes face the backside of the wafer.
[0021] Through the above technical solutions, at least two ejection hole groups are provided and arranged at intervals in the radial direction of the pipe body, so that at least two ejection operations can be realized. That is to say, when nitrogen and isopropyl alcohol flow in the pipe body, they can be ejected from multiple ejection hole groups at the same time to realize multiple ejection operations. Therefore, when the ejection holes in one of the ejection hole groups are blocked, the ejection holes in other ejection hole groups can still eject nitrogen and isopropyl alcohol normally, which can ensure the drying effect on the wafer and avoid water mark imprints on the surface of the wafer. Moreover, each ejection hole group includes multiple ejection holes, and the probability that the ejection holes at the adjacent positions of two adjacent ejection hole groups are blocked simultaneously is relatively small. Therefore, the probability that the ejection part is blocked and affects the ejection of nitrogen and isopropyl alcohol is greatly reduced, ensuring the drying effect on the wafer. The multiple ejection holes in each ejection hole group are arranged along the axial direction of the pipe body, which can eject nitrogen and isopropyl alcohol to different positions on the surface of the wafer and can dry the entire surface of the wafer.
[0022] Other features and advantages of the present disclosure will be described in detail in the following detailed description section. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The drawings are used to provide a further understanding of the present disclosure, and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure, but do not constitute a limitation to the present disclosure. In the drawings:
[0024] Figure 1 is a schematic structural diagram of a drying spray pipe according to an embodiment of the present disclosure;
[0025] Figure 2 is a schematic structural diagram of a drying spray pipe according to another embodiment of the present disclosure;
[0026] Figure 3 is a schematic structural diagram of the usage state of a drying spray pipe according to an embodiment of the present disclosure.
[0027] DESCRIPTION OF THE REFERENCE NUMERALS
[0028] 1. Drying spray pipe, 11. Pipe body, 12. Ejection part, 13. Ejection hole group, 131. First ejection hole group, 132. Second ejection hole group, 14. Ejection hole;
[0029] 2. Back spray pipe;
[0030] 3. Wafer. DETAILED DESCRIPTION
[0031] The following details the specific embodiments of the present disclosure with reference to the drawings. It should be understood that the specific embodiments described herein are only for the purpose of illustrating and explaining the present disclosure, and are not used to limit the present disclosure.
[0032] In the present disclosure, unless otherwise stated, the orientation terms such as "upper, lower, left, right" are usually defined according to the direction of the drawing surface of the drawings, and "inner, outer" refer to the inside and outside of the relevant components. In addition, the terms "first", "second", etc. are only used for distinguishing descriptions, and cannot be understood as indicating or implying relative importance.
[0033] In the description of the present disclosure, it should also be noted that, unless otherwise clearly defined and limited, the terms "arranged", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be directly connected, or indirectly connected through an intermediate medium. It can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific situations.
[0034] In the wafer flattening process, the processed wafer surface needs to be cleaned and dried. The current mainstream drying method is to pull the wafer upward along a vertical setting, and the cleaning solution falls downward during the pulling process. At the same time, a mixture of isopropyl alcohol and nitrogen is sprayed onto the wafer surface to further promote the cleaning solution to fall downward and achieve a drying effect.
[0035] In the related art, a drying spray tube is used to spray isopropyl alcohol and nitrogen onto the surface of the wafer. However, impurities are easily present in isopropyl alcohol or nitrogen. The impurities will enter the drying spray tube with the movement of isopropyl alcohol and nitrogen, causing the drying spray tube to be easily blocked by the impurities carried in the isopropyl alcohol or nitrogen, thereby affecting the uniformity of the spraying of isopropyl alcohol and nitrogen, resulting in the surface of the wafer not being completely dry, and water marks appearing, affecting the yield of the wafer planarization process.
[0036] For this reason, Figures 1 - 3 As shown, one aspect of the present disclosure provides a drying spray tube 1 for a wafer 3 flattening process, comprising a tube body 11 .
[0037] The tube body 11 is used for supplying nitrogen and isopropyl alcohol to flow. A spraying portion 12 is provided on the tube body 11 . The spraying portion 12 faces the wafer 3 being pulled. The spraying portion 12 is used for spraying nitrogen and isopropyl alcohol onto the wafer 3 .
[0038] That is to say, nitrogen and isopropyl alcohol can flow in the tube body 11 and move along the length direction of the tube body 11. With the delivery pressure of nitrogen and isopropyl alcohol, they can be sprayed out from the tube body 11 through the spray part 12 on the tube body 11 and sprayed onto the wafer 3, thereby pulling the wafer 3 upward to dry the wafer 3.
[0039] The ejection portion 12 is configured as an ejection hole group 13, at least two ejection hole groups 13 are arranged at intervals along the radial direction of the tube body 11, each ejection hole group 13 includes a plurality of ejection holes 14, and the plurality of ejection holes 14 are arranged at intervals along the axial direction of the tube body 11. In some examples, the axial direction of the tube body 11 is the same as the lateral direction of the wafer 3, so that the surface of the entire wafer 3 can be dried.
[0040] In the above technical solution, at least two ejection hole groups 13 are provided and arranged at intervals in the radial direction of the pipe body 11, whereby at least two ejection operations can be realized. That is to say, when nitrogen and isopropyl alcohol flow in the pipe body 11, they can be ejected from multiple ejection hole groups 13 at the same time to realize multiple ejection operations. Thus, when the ejection holes 14 in one of the ejection hole groups 13 are blocked, the ejection holes 14 in the other ejection hole groups 13 can still eject nitrogen and isopropyl alcohol normally, which can ensure the drying effect on the wafer 3 and avoid water mark imprints on the surface of the wafer 3. Moreover, each ejection hole group 13 includes multiple ejection holes 14, and the probability that the ejection holes 14 at the adjacent positions of two adjacent ejection hole groups 13 are blocked simultaneously is relatively small. Thus, the probability that the ejection part 12 is blocked and affects the ejection of nitrogen and isopropyl alcohol is greatly reduced, and the drying effect on the wafer 3 is ensured. The multiple ejection holes 14 of each ejection hole group 13 are arranged along the axial direction of the pipe body 11, which can eject nitrogen and isopropyl alcohol to different positions on the surface of the wafer 3 and can dry the entire surface of the wafer 3.
[0041] As Figure 1 shown, optionally, in an embodiment of the present disclosure, the centers of the ejection holes 14 of at least two ejection hole groups 13 are located in the same radial plane of the pipe body 11, so that the ejection holes 14 of the two ejection hole groups 13 are arranged side by side in a radial plane of the pipe body 11. By setting like this, the orientations of the nitrogen and isopropyl alcohol ejected from the ejection holes 14 of multiple ejection hole groups 13 are roughly the same, realizing at least two reproducible ejections of nitrogen and isopropyl alcohol, and at the same time, it is also beneficial to the processing and manufacturing of the ejection hole groups 13.
[0042] Among them, the ejection holes 14 in multiple ejection hole groups 13 are arranged side by side. That is to say, the ejection holes 14 of multiple ejection hole groups 13 are arranged in a uniform array in the horizontal and vertical directions.
[0043] As Figure 2 shown, optionally, in another embodiment of the present disclosure, the centers of the ejection holes 14 of at least two ejection hole groups 13 are located in two radial planes of the pipe body 11 respectively, so that the ejection holes 14 of the two ejection hole groups 13 are arranged staggeredly in a radial plane of the pipe body 11. By setting like this, the nitrogen and isopropyl alcohol ejected from the ejection holes 14 of multiple ejection hole groups 13 are arranged in a small range of stagger, so that the uniformity of the contact between the ejected nitrogen and isopropyl alcohol and the wafer 3 is higher, and at the same time, the probability that two adjacent ejection holes 14 in the radial direction of the pipe body 11 are blocked simultaneously can be further reduced, and the occurrence of blockage can be further reduced.
[0044] It can be understood that multiple ejection holes 14 in an ejection hole group 13 are arranged in a row and extend along the axial direction of the pipe body 11. Multiple ejection holes 14 in another ejection hole group 13 adjacent to the ejection hole group 13 are also arranged in a row and extend along the axial direction of the pipe body 11. One ejection hole 14 in one ejection hole group 13 is located between two adjacent ejection holes 14 in the other ejection hole group 13.
[0045] Optionally, in an embodiment of the present disclosure, the number of ejection holes 14 in multiple ejection hole groups 13 may be the same or different. Among them, the number of ejection holes 14 in each ejection hole group 13 can be set according to specific needs, as long as it is ensured that in the axial direction of the pipe body 11, the number of ejection holes 14 satisfies the requirement of ejecting nitrogen and isopropyl alcohol in the lateral width direction of the wafer 3. Thus, it is convenient for processing and manufacturing without excessive requirements.
[0046] Optionally, in an embodiment of the present disclosure, the number of ejection hole groups 13 is two, and the ejection hole group 13 includes a first ejection hole group 131 and a second ejection hole group 132. That is to say, there are two rows of ejection holes 14 extending along the axial direction on the pipe body 11.
[0047] Among them, the number of ejection holes 14 in the first ejection hole group 131 is greater than or less than the number of ejection holes 14 in the second ejection hole group 132. By setting like this, the number of the first ejection hole group 131 can be fixed, so that it can meet the drying effect on the wafer 3. The number of ejection holes 14 in the second ejection hole group 132 can be adjusted according to needs, so as to reduce the situation where nitrogen and isopropyl alcohol cannot be ejected after blockage.
[0048] In some examples, the number of ejection holes 14 in the first ejection hole group 131 is greater than the number of ejection holes 14 in the second ejection hole group 132. That is to say, the amount of nitrogen and isopropyl alcohol ejected by the first ejection hole group 131 is greater than the amount of nitrogen and isopropyl alcohol ejected by the second ejection hole group 132. It can meet the requirement that if the ejection holes 14 in the first ejection hole group 131 are blocked, a small amount of ejection holes 14 in the second ejection hole group 132 can still eject nitrogen and isopropyl alcohol, which can ensure the drying of the wafer 3. On the contrary, if the ejection holes 14 in the second ejection hole group 132 are blocked, the ejection holes 14 in the first ejection hole group 131 can still eject nitrogen and isopropyl alcohol.
[0049] In some other examples, the number of ejection holes 14 in the first ejection hole group 131 is less than the number of ejection holes 14 in the second ejection hole group 132. That is to say, the amount of nitrogen and isopropyl alcohol ejected from the first ejection hole group 131 is less than the amount of nitrogen and isopropyl alcohol ejected from the second ejection hole group 132. This enables the ejection holes 14 of the second ejection hole group 132 to eject more nitrogen and isopropyl alcohol, which can improve the drying effect of the wafer 3. Assuming that the ejection holes 14 of the first ejection hole group 131 are blocked, the remaining ejection holes 14 of the second ejection hole group 132 can still ensure the ejection of nitrogen and isopropyl alcohol, ensuring the drying of the wafer 3. On the contrary, if the ejection holes 14 of the second ejection hole group 132 are blocked, the ejection holes 14 of the first ejection hole group 131 can still eject nitrogen and isopropyl alcohol.
[0050] Optionally, in another embodiment of the present disclosure, the number of ejection hole groups 13 is two, and the ejection hole group 13 includes a first ejection hole group 131 and a second ejection hole group 132. That is to say, there are two rows of ejection holes 14 extending along the axial direction on the pipe body 11.
[0051] Among them, the number of ejection holes 14 in the first ejection hole group 131 is equal to the number of ejection holes 14 in the second ejection hole group 132. That is to say, the amount of nitrogen and isopropyl alcohol ejected from the first ejection hole group 131 is equal to the amount of nitrogen and isopropyl alcohol ejected from the second ejection hole group 132. At this time, the two-time ejection drying process is fully realized, which can greatly improve the drying effect of the wafer 3. At the same time, it can meet the requirement that if the ejection holes 14 of one of the first ejection hole group 131 or the second ejection hole group 132 are blocked, the ejection holes 14 of the other group can still eject nitrogen and isopropyl alcohol to realize the drying of the wafer 3.
[0052] Optionally, in one embodiment of the present disclosure, in the moving direction of the wafer 3, the first ejection hole group 131 is located below the second ejection hole group 132, and the number of ejection holes 14 in the first ejection hole group 131 is 168. By setting it in this way, the drying effect of the wafer 3 can be ensured.
[0053] Among them, the first ejection hole group 131 is located below the second ejection hole group 132, which can realize the two-time blowing of nitrogen and isopropyl alcohol in the up and down directions, realizing the two-time drying effect, adapting to the upward lifting of the wafer 3, and being able to better dry the wafer 3.
[0054] Optionally, in an embodiment of the present disclosure, the apertures of two adjacent ejection holes 14 in each ejection hole group 13 are the same, and the apertures of the ejection holes 14 in two adjacent ejection hole groups 13 are the same. By setting like this, the pressures of nitrogen and isopropanol at each ejection hole 14 are made consistent, so that the amounts of nitrogen and isopropanol ejected from each ejection hole 14 are kept consistent, and thus the nitrogen and isopropanol ejected from multiple ejection hole groups 13 are kept uniform, which is beneficial to drying the surface of the wafer 3.
[0055] Optionally, in an embodiment of the present disclosure, the ejection part 12 faces the front side of the wafer 3, and the tube body 11 is used for drying the front side of the wafer 3. By setting like this, the drying injection tube 1 mainly dries the front side of the wafer 3, because if there are water mark imprints on the front side of the wafer 3, it will seriously affect the use of the wafer 3. Therefore, the drying condition of the front side of the wafer 3 is particularly important.
[0056] Optionally, in an embodiment of the present disclosure, the ejection direction of the ejection part 12 is set at an angle with the moving direction of the wafer 3. By setting like this, the nitrogen and isopropanol ejected from the ejection part 12 can be directed towards the position where the surface of the wafer 3 contacts the liquid surface near the cleaning solution, improving the drying effect on the wafer 3.
[0057] The second aspect of the present disclosure also provides a wafer 3 drying device, including a lifting mechanism and the drying injection tube 1 for the wafer 3 planarization process as described above.
[0058] The lifting mechanism is used to connect with the wafer 3. The drying injection tube 1 is located below the lifting mechanism, and the ejection part 12 of the drying injection tube 1 faces the wafer 3. The lifting mechanism provided can lift the wafer 3. As the wafer 3 rises under the lifting action of the lifting mechanism, the cleaning solution can fall. At the same time, combined with the nitrogen and isopropanol ejected from the drying injection tube 1, complete drying of the wafer 3 can be achieved.
[0059] Optionally, in an embodiment of the present disclosure, the wafer 3 drying device further includes a back injection tube 2. The back injection tube 2 is disposed opposite to the drying injection tube 1 and is located on both sides of the wafer 3.
[0060] Among them, the ejection part 12 of the drying injection tube 1 faces the front side of the wafer 3. The back injection tube 2 has ejection holes. The number of ejection holes is multiple and they are arranged at intervals along the axis direction of the back injection tube 2, and the ejection holes face the back side of the wafer 3.
[0061] Among them, the back injection tube 2 dries the back side of the wafer 3. The back injection tube 2 and the drying injection tube 1 are located on the left and right sides of the wafer 3. The back injection tube 2 and the drying injection tube 1 dry the front side and the back side of the wafer 3 respectively.
[0062] Optionally, in an implementation manner of the present disclosure, the wafer 3 drying device further includes a supply mechanism for nitrogen and isopropyl alcohol. The supply mechanism is connected to the back spray pipe 2 and the drying spray pipe 1 to achieve the supply of nitrogen and isopropyl alcohol.
[0063] The preferred implementation manners of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details in the above implementation manners. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.
[0064] In addition, it should be noted that, among the various specific technical features described in the above specific implementation manners, they can be combined in any appropriate manner without conflict. To avoid unnecessary repetition, the present disclosure will not separately describe various possible combination manners.
[0065] Furthermore, any combination can be made among various different implementation manners of the present disclosure, as long as it does not violate the idea of the present disclosure, and it should also be regarded as the content disclosed by the present disclosure.
Claims
1. A drying spray tube for a wafer flattening process, characterized in that: include: A tube body, the tube body is used for supplying nitrogen and isopropanol to flow, the tube body is provided with a spraying portion, the spraying portion is directed toward the wafer being pulled, and the spraying portion is used to spray nitrogen and isopropanol onto the wafer; Wherein, the ejection portion is constructed as an ejection hole group, there are at least two ejection hole groups, and they are spaced apart along the radial direction of the tube body, each ejection hole group includes a plurality of ejection holes, and the plurality of ejection holes are spaced apart along the axial direction of the tube body.
2. The drying spray tube for wafer flattening process according to claim 1, characterized in that: The centers of the ejection holes of at least two ejection hole groups are located on the same radial plane of the tube body, so that the ejection holes of the two ejection hole groups are arranged side by side on a radial plane of the tube body; or, The centers of the ejection holes of at least two of the ejection hole groups are respectively located on two radial planes of the tube body, so that the ejection holes of the two ejection hole groups are staggered on a radial plane of the tube body.
3. The drying spray tube for wafer flattening process according to claim 1, characterized in that: The number of the ejection holes in the plurality of ejection hole groups may be the same or different.
4. The drying spray pipe for wafer flattening process according to claim 3, characterized in that: The number of the ejection hole groups is two, and the ejection hole groups include a first ejection hole group and a second ejection hole group; Wherein, the number of the ejection holes in the first ejection hole group is greater than or less than the number of the ejection holes in the second ejection hole group; or, The number of the ejection holes of the first ejection hole group is equal to the number of the ejection holes of the second ejection hole group.
5. The drying spray pipe for wafer flattening process according to claim 4, characterized in that: In the moving direction of the wafer, the first ejection hole group is located below the second ejection hole group, and the number of the ejection holes in the first ejection hole group is 168.
6. The drying spray tube for wafer flattening process according to claim 1, characterized in that: The hole diameters of two adjacent ejection holes in each ejection hole group are the same, and the hole diameters of the ejection holes in two adjacent ejection hole groups are the same.
7. The drying spray pipe for wafer flattening process according to any one of claims 1 to 6, characterized in that: The ejection portion faces the front surface of the wafer, and the tube body is used for drying the front surface of the wafer.
8. The drying spray pipe for wafer flattening process according to claim 7, characterized in that: The spraying direction of the spraying part is set at an angle to the moving direction of the wafer.
9. A wafer drying device, characterized in that: A drying spray pipe for a wafer flattening process comprising a lifting mechanism and any one of claims 1 to 8; The lifting mechanism is used to be connected to the wafer, the drying spray pipe is located below the lifting mechanism, and the spraying portion of the drying spray pipe is directed toward the wafer.
10. The wafer drying device according to claim 9, characterized in that: The wafer drying device further comprises a back side spray pipe, which is arranged opposite to the drying spray pipe and located on both sides of the wafer; Among them, the spray part of the drying spray tube faces the front side of the wafer, and the back spray tube has spray holes. The number of the spray holes is multiple and they are spaced apart along the axial direction of the back spray tube. The spray holes face the back side of the wafer.