Local and remote temperature chip conversion time and conversion current test module

Abstract

The utility model relates to a module for testing conversion time and conversion current of local and remote temperature chips. The module comprises a current acquisition circuit and a minimum system circuit, wherein the current acquisition circuit comprises a current detection chip, a local temperature sensor interface and a remote temperature sensor interface; the minimum system circuit comprises an MCU and a TTL-to-USB chip. Pins 9 and 10 of the MCU are connected with pins 2 and 3 of a local temperature sensor interface and a remote temperature sensor interface. Pins 12 and 11 of the MCU are respectively connected with pins 4 and 5 of the current detection chip, and pins 2 and 3 of the MCU are connected with a crystal oscillator circuit. According to the local and remote temperature chip conversion time and conversion current test module, the conversion time and conversion current of the local and remote temperature chips can be tested on the premise that the test time is not additionally increased, the chips exceeding a set threshold value are screened out, marked as defective products and sent to the upper computer, and the product quality and performance are further improved.

Description

Technical Field

[0001] The utility model relates to a local and remote temperature chip conversion time and conversion current test module. Background Art

[0002] To ensure the product quality and performance of local and remote temperature chips, dynamic current testing and screening are usually carried out during the production process, and chips exceeding the set threshold are marked as defective products. However, the power consumption of such chips during normal operation is not only related to the magnitude of the current during temperature conversion but also to the temperature conversion time. The previous test process ignored the step of testing the conversion time, resulting in a situation where a small number of local and remote temperature chips have normal dynamic current but a relatively long conversion time. Ultimately, the problem chips have a higher power consumption than normal chips, affecting the product performance and reputation. Summary of the Invention

[0003] To solve the above problems, this solution designs a local and remote temperature chip conversion time and conversion current test module, which can measure the conversion time and conversion current of local and remote temperature chips without additional test time.

[0004] The purpose of the utility model is achieved as follows:

[0005] A local and remote temperature chip conversion time and conversion current test module includes a current acquisition circuit and a minimum system circuit;

[0006] The current acquisition circuit includes a current detection chip, and the 9th and 10th pins of the current detection chip are respectively connected to both ends of a sampling resistor; the 1st and 2nd pins of the current detection chip are grounded, the 4th and 5th pins are communication pins, a first pull-up resistor and a second pull-up resistor are respectively connected to the 4th and 5th pins of the current detection chip, and a decoupling capacitor is connected to the 6th and 7th pins of the current detection chip;

[0007] The current acquisition circuit further includes local and remote temperature sensor interfaces. The 1st pin of the local and remote temperature sensor interfaces is a sensor power supply interface, which is connected to the 9th pin of the current detection chip; the 2nd and 3rd pins of the local and remote temperature sensor interfaces are respectively the SDA and SCL pins of the local and remote temperature sensors, and the 4th pin of the local and remote temperature sensor interfaces is a sensor GND pin. After power-on, the current flows through the sampling resistor into the power supply of the local and remote temperature sensors and finally flows from the 4th pin of the local and remote temperature sensor interfaces to GND, thus forming a loop;

[0008] The minimum system circuit includes an MCU and a TTL-to-USB chip. The 9th and 10th pins of the MCU are connected to the 2nd and 3rd pins of the local and remote temperature sensor interfaces. The 12th and 11th pins of the MCU are respectively connected to the 4th and 5th pins of the current detection chip. The 17th and 18th pins of the MCU are serial communication pins and can communicate with a computer through the TTL-to-USB chip.

[0009] The 2nd and 3rd pins of the TTL-to-USB chip are respectively connected to the 18th and 17th pins of the MCU. The 5th and 6th pins of the TTL-to-USB chip are the converted USB signals and are connected to the USB interface, which powers the entire circuit.

[0010] The 2nd and 3rd pins of the MCU are connected to a crystal oscillator circuit, which consists of a first crystal oscillator, a resistor, a first resonant capacitor, and a second resonant capacitor. The 7th and 8th pins of the TTL-to-USB chip are also connected to a crystal oscillator circuit, which consists of a second crystal oscillator, a third resonant capacitor, and a fourth resonant capacitor.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] The present utility model relates to a local and remote temperature chip conversion time and conversion current test module, which can measure the conversion time and conversion current of local and remote temperature chips without additional test time, and respectively screen out the chips exceeding the set threshold and mark them as defective products and send them to the host computer, further improving the product quality and performance. Description of the Drawings

[0013] Figure 1 It is the current acquisition circuit diagram of a local and remote temperature chip conversion time and conversion current test module of the present utility model.

[0014] Figure 2 It is the minimum system circuit diagram of a local and remote temperature chip conversion time and conversion current test module of the present utility model.

[0015] Figure 3 It is a schematic diagram of continuous sampling starting from the power-on moment of this module.

[0016] Figure 4 It is the current change diagram after the power-on of the test module of the present utility model.

[0017] Among them: current detection chip U3, sampling resistor RS, first pull-up resistor R3, second pull-up resistor R4, decoupling capacitor C6, local and remote temperature sensor interface P1, MCU U1, TTL-to-USB chip U2, USB interface P2, first crystal oscillator Y1, resistor R2, first resonant capacitor C1, second resonant capacitor C2, second crystal oscillator Y2, third resonant capacitor C4, fourth resonant capacitor C5. Detailed implementation mode

[0018] The utility model relates to a local and remote temperature chip conversion time and conversion current test module. As Figure 1 shown is the current acquisition circuit diagram of this module. The circuit includes a current detection chip U3. The 9th and 10th pins of the current detection chip U3 are respectively connected to both ends of a sampling resistor RS. The 1st and 2nd pins of the current detection chip U3 are grounded. The 4th and 5th pins are communication pins for the MCU to access data. A first pull-up resistor R3 and a second pull-up resistor R4 are respectively connected to the 4th and 5th pins of the current detection chip U3. A decoupling capacitor C6 is connected to the 6th and 7th pins of the current detection chip U3.

[0019] The current acquisition circuit diagram further includes a local and remote temperature sensor interface P1. The 1st pin of the local and remote temperature sensor interface P1 is a sensor power supply interface, which is connected to the 9th pin of the current detection chip U3. The 2nd and 3rd pins of the local and remote temperature sensor interface P1 are respectively the SDA and SCL pins of the local and remote temperature sensors for communication between the MCU and the sensors. The 4th pin of the local and remote temperature sensor interface P1 is the sensor GND pin. After power-on, the current flows through the sampling resistor RS into the power supply of the local and remote temperature sensors and finally flows from the 4th pin of the local and remote temperature sensor interface P1 to GND, thus forming a loop.

[0020] As Figure 2 shown is the minimum system circuit diagram of this module. The circuit includes an MCU U1 and a TTL to USB chip U2. The 9th and 10th pins of the MCU U1 are connected to Figure 1 the 2nd and 3rd pins of the local and remote temperature sensor interface P1 in Figure 1 . The 12th and 11th pins of the MCU U1 are respectively connected to the 4th and 5th pins of the current detection chip U3 in Figure 1 to read the current. The 17th and 18th pins of the MCU U1 are serial communication pins and can communicate with a computer through the TTL to USB chip.

[0021] The 2nd and 3rd pins of the TTL to USB chip U2 are respectively connected to the 18th and 17th pins of the MCU U1 to transmit TTL signals. The 5th and 6th pins of the TTL to USB chip U2 are the converted USB signals, which are connected to a USB interface P2, so that this module can directly communicate with a computer; the USB interface P2 supplies power to the entire circuit.

[0022] A crystal oscillator circuit is connected to the 2nd and 3rd pins of the MCU U1. This crystal oscillator circuit is composed of a first crystal oscillator Y1, a resistor R2, a first resonant capacitor C1, and a second resonant capacitor C2. A crystal oscillator circuit is also connected to the 7th and 8th pins of the TTL to USB chip U2. This crystal oscillator circuit is composed of a second crystal oscillator Y2, a third resonant capacitor C4, and a fourth resonant capacitor C5.

[0023] The processing method of the present utility model is as follows:

[0024] Refer to Figure 3 , Figure 3 which is a schematic diagram of continuous sampling starting from the power-on moment of this module.

[0025] Starting from the power-on moment of the local and remote temperature chips, continuously sample for a time t3 (t3 is greater than T1 + T2 and has a certain margin), and the sampling period is Ts, so as to obtain t3 / Ts sampling points. The current measured at the t1 / Ts-th sampling point is the local temperature conversion current I1, where t1 = T1 / 2; the current measured at the t2 / Ts-th sampling point is the remote temperature conversion current I2, where t2 = T1 + T2 / 2.

[0026] Then process the Figure 3 sampling points shown. The number of sampling points greater than the value A among the t3 / Ts sampling points is recorded as n1, where A = (I1 + I2) / 2, then the actual measured value TR of the remote temperature conversion time is TR = n1*Ts; the number of sampling points greater than the value B and less than the value A among the t3 / Ts sampling points is recorded as n2, where B = I1 / 2, then the actual measured value TL of the local temperature conversion time is TL = n2*Ts.

[0027] During the mass production process of the local and remote temperature chips, through the above module, each chip only needs t3 time to measure the local conversion current and time, and the remote conversion current and time of the local and remote temperature chips, without increasing additional test costs, and respectively compare and screen them with the set thresholds, which can further improve the performance and reliability of the product.

[0028] Figure 4 is the current change diagram after the power-on of the test module of the present utility model. T1 and T2 are the theoretical values of the local temperature conversion time and the remote temperature conversion time respectively, and I1 and I2 are the local temperature conversion current and the remote temperature conversion current respectively.

Claims

1. A local and remote temperature chip conversion time and conversion current test module, characterized in that: Including current acquisition circuit and minimum system circuit; The current acquisition circuit includes a current detection chip (U3), and pins 9 and 10 of the current detection chip (U3) are respectively connected to the two ends of the sampling resistor (RS); pins 1 and 2 of the current detection chip (U3) are grounded, pins 4 and 5 are communication pins, a first pull-up resistor (R3) and a second pull-up resistor (R4) are respectively connected to pins 4 and 5 of the current detection chip (U3), and a decoupling capacitor (C6) is connected to pins 6 and 7 of the current detection chip (U3); The current acquisition circuit also includes a local and remote temperature sensor interface (P1). Pin 1 of the local and remote temperature sensor interface (P1) is a sensor power interface, which is connected to pin 9 of the current detection chip (U3). Pins 2 and 3 of the local and remote temperature sensor interface (P1) are respectively the SDA and SCL pins of the local and remote temperature sensors. Pin 4 of the local and remote temperature sensor interface (P1) is a sensor GND pin. After power-on, the current flows into the power supply of the local and remote temperature sensor interface (P1) through the sampling resistor (RS), and finally flows from pin 4 of the local and remote temperature sensor interface (P1) to GND, thereby forming a loop. The minimum system circuit includes an MCU (U1) and a TTL to USB chip (U2). Pins 9 and 10 of the MCU (U1) are connected to pins 2 and 3 of the local and remote temperature sensor interfaces (P1); pins 12 and 11 of the MCU (U1) are connected to pins 4 and 5 of the current detection chip (U3) respectively. Pins 17 and 18 of the MCU (U1) are serial communication pins, which can communicate with the computer through the TTL to USB chip (U2). Pins 2 and 3 of the TTL to USB chip (U2) are connected to pins 18 and 17 of the MCU (U1) respectively. Pins 5 and 6 of the TTL to USB chip (U2) are converted USB signals and connected to the USB interface (P2). The USB interface (P2) provides power for the entire circuit.

2. A local and remote temperature chip conversion time and conversion current test module according to claim 1, characterized in that: Pins 2 and 3 of the MCU (U1) are connected to a crystal oscillator circuit, which consists of a first crystal oscillator (Y1), a resistor (R2), a first resonant capacitor (C1), and a second resonant capacitor (C2). Pins 7 and 8 of the TTL to USB chip (U2) are also connected to a crystal oscillator circuit, which consists of a second crystal oscillator (Y2), a third resonant capacitor (C4), and a fourth resonant capacitor (C5).

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