Electronic package cleaning system

Abstract

An electronic packaging part cleaning system comprises a side wall arranged around a vacuum pipeline opening hole used for capturing an capturing part of an electronic packaging part, so that when the electronic packaging part is placed on a bearing part, residual cleaning liquid is prevented from flowing out of the opening hole to the surface of the bearing part, and no water mark is left on the surface of the bearing part; the problem that residual water of a vacuum pipeline of an existing picking piece easily flows out to the surface of a bearing piece is solved.

Description

Technical Field

[0001] The present application relates to a cleaning system, and particularly to a cleaning system for electronic packages. Background Art

[0002] Figure 1 FIG. 1 is a schematic cross-sectional view of an existing semiconductor packaging process. Among them, a carrier plate 16 is used to place a plurality of semiconductor packages 1. Each semiconductor package 1 includes a plurality of conductive bumps 11, a packaging substrate 12, and a packaging colloid 13. The conductive bumps 11 and the packaging colloid 13 are respectively formed on the upper side and the lower side of the packaging substrate 12. At least one semiconductor chip (not shown) is provided in the packaging colloid 13.

[0003] Figure 1 The plurality of semiconductor packages 1 shown are obtained by cutting a large-format package. After cutting and cleaning the semiconductor packages 1, an extraction member 15 extracts the semiconductor packages 1, and then places the semiconductor packages 1 on the carrier plate 16 for subsequent processes. The extraction member 15 is provided with a plurality of openings 151, and the semiconductor packages 1 are extracted by the upward vacuum suction force passing through the openings 151.

[0004] Before the extraction member 15 extracts the semiconductor packages 1, the extraction member 15 needs to be cleaned to prevent dirt on the extraction member 15 from adhering to the cleaned semiconductor packages 1. However, when cleaning the existing extraction member 15, water stains will remain in the openings 151 or the connected vacuum pipelines. In addition, when the extraction member 15 stops the vacuum suction force to release the semiconductor packages 1 on the carrier plate 16, airflows will gush out from the vacuum pipelines and the openings 151, causing the remaining water to flow out from the openings 151 onto the surface of the carrier plate 16, resulting in water mark residues, and thus an additional process of drying the carrier plate 16 is required.

[0005] Therefore, how to overcome the problems of the above-mentioned prior art has actually become an urgent issue to be solved currently. Summary of the Utility Model

[0006] To solve the above problems, the present application provides a cleaning system for electronic packages, including a carrier member and an extraction member. The carrier member is used to carry the electronic package, wherein the electronic package has opposite first and second sides. The extraction member is used to extract the first side of the electronic package to clean and dry the second side of the electronic package, and then place the electronic package on the carrier member with the second side, wherein the extraction member is provided with an opening and includes side walls provided around the opening, and the side walls are configured to form a channel extending from the opening to the first side of the electronic package when the extraction member extracts the electronic package.

[0007] The present application further provides a method for cleaning an electronic package, including: enabling a picking member to pick up the electronic package on a first side of the electronic package, wherein the picking member is provided with an opening and includes sidewalls disposed around the opening, and the sidewalls are configured to form a channel extending from the opening to the first side of the electronic package when the picking member picks up the electronic package; when the picking member picks up the electronic package, cleaning and drying a second side of the electronic package, wherein the first side and the second side of the electronic package are opposite different sides; and placing the electronic package on a carrier with the second side thereof.

[0008] The above-mentioned sidewalls of the picking member in the present application can block the residual cleaning liquid from flowing out of the opening to the surface of the carrier when the electronic package is placed on the carrier, so that there is no water mark residue on the surface of the carrier. Therefore, the present application can solve the drawback that the residual water in the pipeline of the existing picking member is likely to flow out to the surface of the carrier, and thus the process of drying the carrier needs to be added. Description of the Drawings

[0009] Figure 1 It is a cross-sectional schematic view of an existing semiconductor packaging process.

[0010] Figures 2 to 9 It is a cross-sectional schematic view of each step of the method for cleaning an electronic package executed by the electronic package cleaning system of the present application.

[0011] Description of the Main Component Symbols

[0012] 1 Semiconductor package

[0013] 11 Conductive bump

[0014] 12 Package substrate

[0015] 13 Encapsulation colloid

[0016] 15 Picking member

[0017] 151 Opening

[0018] 16 Carrier plate

[0019] 200 Electronic package cleaning system

[0020] 2 Large-panel package

[0021] 21 Conductive element

[0022] 22 Carrier structure

[0023] 23 Encapsulation layer

[0024] 24 Fixing member

[0025] 241 Opening

[0026] 25 Extraction part

[0027] 251 Opening

[0028] 252 Side wall

[0029] 26 Carrier

[0030] 22a, 23a, 25a, 3a First side

[0031] 22b, 23b, 25b, 3b Second side

[0032] 3 Electronic package

[0033] 60 Upward vacuum suction

[0034] 65 Cleaning liquid

[0035] 70 Downward force. Detailed implementation manners

[0036] The following illustrates the implementation manners of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0037] It should be noted that the structures, ratios, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in the art to understand and read, and are not used to limit the limited conditions under which the present application can be implemented. Therefore, they do not have any technical substance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present application. At the same time, the terms such as "up", "down", "one", "first", and "second" used in this specification are only for the convenience of clear narration and are not used to limit the scope under which the present application can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope within which the present application can be implemented.

[0038] Figures 2 to 9 It is a cross-sectional view showing the steps of the electronic package cleaning method executed by the electronic package cleaning system 200 of the present application. The electronic package cleaning system 200 includes Figures 2 to 9 the fixing part 24, the extraction part 25, and the carrier 26 in Figures 2 to 9 The steps shown are executed in the order of the attached drawings.

[0039] First, as Figure 2 shown, place the large-format package 2 on the fixing part 24. The fixing part 24 is provided with a plurality of openings 241 to fix the large-format package 2 by using the downward vacuum suction passing through the openings 241.

[0040] The large-format package 2 includes a plurality of conductive elements 21, a carrier structure 22, and a packaging layer 23. The carrier structure 22 has opposite first and second sides 22a and 22b, and the conductive elements 21 and the packaging layer 23 are respectively disposed on the first side 22a and the second side 22b of the carrier structure 22. The packaging layer 23 has opposite first and second sides 23a and 23b, and the carrier structure 22 is disposed on the first side 23a of the packaging layer 23.

[0041] The conductive element 21 can be a metal column such as a copper pillar, a metal bump coated with an insulating block, a solder ball, or a solder ball having a core copper ball, etc.

[0042] The carrier structure 22 can be a packaging substrate having a core layer and a circuit structure or a coreless circuit structure.

[0043] The packaging layer 23 can be an insulating material, such as polyimide (PI for short), dry film, or a packaging colloid or molding compound such as epoxy resin. The packaging layer 23 can be formed on the second side 22b of the carrier structure 22 by means of lamination or molding.

[0044] A plurality of electronic components (not shown) are provided in the packaging layer 23. Each of the electronic components is an active component, a passive component, or a combination of the two, and the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and / or an inductor. Each of the electronic components is electrically connected to the conductive element 21 through the circuit in the carrier structure 22 to transmit and / or receive electrical signals.

[0045] As Figure 3 shown, the large-format package 2 is cut into a plurality of electronic packages 3 by a milling cutter. During the cutting process, the fixing member 24 fixes the large-format package 2 and the electronic package 3 by means of downward vacuum suction through the opening 241.

[0046] Similar to the large-format package 2, the electronic package 3 also includes a conductive element 21, a carrier structure 22, and a packaging layer 23. In addition, the electronic package 3 has opposite first and second sides 3a and 3b, wherein the first side 3a of the electronic package 3 is Figure 3 the upper side provided with the conductive element 21 in Figure 3 and the second side 3b of the electronic package 3 is

[0047] Figure 3 There will be debris remaining after the cutting operation shown, and the electronic package 3 must be cleaned. Therefore, as Figure 4As shown, first clean the first side 3a of the electronic package 3, and then dry (such as by baking and / or blowing dry) the first side 3a of the electronic package 3.

[0048] As Figure 5 shown, clean the pick-up member 25 for picking up the electronic package 3 to prevent dirt on the pick-up member 25 from adhering to the already cleaned electronic package 3. The pick-up member 25 has opposite first side 25a and second side 25b, and in this step, clean the second side 25b of the pick-up member 25 for picking up the electronic package 3.

[0049] The pick-up member 25 is provided with a plurality of openings 251, and includes side walls 252 provided around each opening 251. When the pick-up member 25 picks up the electronic package 3, the side walls 252 can form a channel extending from the opening 251 to the electronic package 3, and the inner diameter of the channel is the same as the inner diameter of the opening 251.

[0050] As Figure 6 shown, let the pick-up member 25 pick up the electronic package 3 on the first side 3a of the electronic package 3, and when the pick-up member 25 picks up the electronic package 3, first clean the second side 3b of the electronic package 3, and then dry (such as by baking and / or blowing dry) the second side 3b of the electronic package 3, wherein the pick-up member 25 picks up the electronic package 3 by an upward vacuum suction force 60 passing through the opening 251, and due to the aforementioned cleaning, there may be residual cleaning liquid 65 (such as water) in the opening 251 and the vacuum pipeline communicated therewith.

[0051] As Figure 7 shown, let the pick-up member 25 place the electronic package 3 on the second side 3b on the carrier 26, and stop the vacuum suction force to release the electronic package 3. The carrier 26 is a carrier plate or other object that can be used to carry the electronic package 3. When the vacuum suction force is stopped, an air flow will gush out from the vacuum pipeline and the opening 251, and form a downward acting force 70, causing the residual cleaning liquid 65 to flow downward.

[0052] Figure 8 This is a schematic cross-sectional view of the opening 251 and the side wall 252 of the pick-up member 25 of the present application from a top or bottom view angle. As Figure 7 and Figure 8 shown, when the pick-up member 25 picks up the electronic package 3, the side walls 252 can enclose the periphery of the opening 251 to form a channel extending from the opening 251 to the first side 3a of the electronic package 3, and one end of the channel in contact with the first side 3a of the electronic package 3 is sealed by the side wall 252 and the first side 3a of the electronic package 3. Therefore, when the pick-up member 25 stops the vacuum suction force to release the electronic package 3, the channel can block the cleaning liquid 65 flowing out from the opening 251 to prevent the cleaning liquid 65 from overflowing onto the carrier 26.

[0053] Figure 8 The side wall 252 shown is quadrilateral, but the side wall 252 can also be other shapes such as circular or oval.

[0054] Such as Figure 9 As shown, dry (such as baking and / or air-drying) the first side 3a of the electronic package 3.

[0055] In summary, when the electronic package 3 is placed on the carrier 26, the side wall 252 of the extraction part 25 of the present application can prevent the residual cleaning liquid 65 from flowing out of the opening 251 to the surface of the carrier 26, so that there is no water mark residue on the surface of the carrier 26. Therefore, the present application can solve the defect that the residual water in the pipeline of the existing extraction part is easy to flow out to the surface of the carrier, and the process of drying the carrier needs to be increased.

[0056] The above embodiments are only used to exemplarily illustrate the principles and effects of the present application, rather than to limit the present application. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the scope of the patent protection of the present application shall be as listed in the claims.

Claims

1. An electronic packaging cleaning system, characterized in that: include: A carrier for carrying an electronic package, wherein the electronic package has a first side and a second side opposite to each other; and The capturing member is used to capture the first side of the electronic package to clean and dry the second side of the electronic package, and then place the electronic package on the carrier with the second side, wherein the capturing member is provided with an opening and includes a side wall arranged around the opening, and the side wall is configured to form a channel extending from the opening to the first side of the electronic package when the capturing member captures the electronic package.

2. The electronic package cleaning system according to claim 1, characterized in that: The picking component uses vacuum suction through the opening to pick up the electronic package.

3. The electronic package cleaning system according to claim 2, characterized in that: The picking component stops the vacuum suction to release the electronic package, so as to place the electronic package on the carrier with the second side.

4. The electronic package cleaning system according to claim 3, characterized in that: The side wall is configured to block the cleaning liquid flowing out of the opening when the capture member stops the vacuum suction to release the electronic package.

5. The electronic package cleaning system according to claim 1, wherein: The inner diameter of the channel is the same as the inner diameter of the opening.

6. The electronic package cleaning system according to claim 1, wherein: The system also includes: The fixing part is used for fixing the large-format package so as to cut the large-format package into a plurality of electronic packages.

7. The electronic package cleaning system according to claim 6, wherein: The fixing member fixes the large-format packaging member and the plurality of electronic packaging members by using vacuum suction.

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