Wafer rolling pasting film moving device

Abstract

The utility model relates to the technical field of semiconductor production equipment, and discloses a wafer rolling pasting and film moving device which comprises a mounting bottom plate, a T-shaped mounting plate is fixedly connected to the outer surface, close to the left end, of the top of the mounting bottom plate, and a film pasting roller is rotationally connected between the opposite outer surfaces of the T-shaped mounting plate and a T-shaped supporting plate. A plurality of vacuum suction holes are formed in the outer surface of the film pasting roller, a rotary valve is mounted on the outer surface of the L-shaped mounting plate, the inlet end of the rotary valve is fixedly communicated with the interior of the film pasting roller, and a plurality of positioning and pressing mechanisms are symmetrically arranged on the outer surfaces of the left side and the right side of the film pasting roller in a circumferential array mode. According to the wafer rolling pasting and film moving device, the blue film can be pasted on the film pasting roller in advance according to the size of the wafer, then the blue film is pasted on the wafer in a rolling mode, compared with a wafer film pasting device in the prior art, the mode is novel, bubbles cannot be generated on the surface of a wafer finished product subjected to film pasting through the wafer rolling pasting and film moving device, and the quality of the finished product is high.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production equipment, and particularly relates to a wafer rolling and pasting film transfer device. Background Technique

[0002] Wafer film pasting is a thin film material used to protect the surface of semiconductor wafers. It can effectively prevent the wafer surface from being contaminated, scratched, oxidized, etc., thereby ensuring the quality and stability of the wafers. Therefore, it plays a very important role in the semiconductor manufacturing process.

[0003] At present, most of the common film pasting methods for wafers are manual film pasting, and then cut into circles. However, manual film pasting has a low degree of automation and high labor intensity. There are also automatic film pasting devices for wafers on the market, but most of the devices use the method of rolling and pasting after laying the film. When using this method, there will be bubbles on the surface of the pasted product, which affects the product quality. Therefore, a wafer rolling and pasting film transfer device is proposed. Content of the Utility Model

[0004] In view of the deficiencies of the prior art, the utility model provides a wafer rolling and pasting film transfer device to solve the problems mentioned in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A wafer rolling and pasting film transfer device includes a mounting base plate. The outer surface of the top of the mounting base plate is fixedly connected with a T-shaped support plate at the right end. The outer surface of the top of the mounting base plate is fixedly connected with a T-shaped mounting plate at the left end. A film pasting roller is rotatably connected between the opposite outer surfaces of the T-shaped mounting plate and the T-shaped support plate. A plurality of vacuum suction holes are formed on the outer surface of the film pasting roller. The outer surface of the end of the T-shaped support plate away from the film pasting roller is fixedly connected with an L-shaped mounting plate. A rotary valve is installed on the outer surface of the L-shaped mounting plate. The inlet end of the rotary valve is fixedly communicated with the inside of the film pasting roller. A plurality of positioning and pressing mechanisms are symmetrically arranged and arranged in a circumferential array on the left and right outer surfaces of the film pasting roller.

[0006] Further, the positioning and pressing mechanism includes a fixing plate. The fixing plate is fixedly connected with the outer surface of the film pasting roller. A pressing cylinder is fixedly installed on the outer surface of the top of the fixing plate. The output end of the pressing cylinder is fixedly connected with a pressing block.

[0007] Further, a precision reduction gear and a driving motor are fixedly installed on the outer surface of the side of the T-shaped mounting plate away from the film pasting roller. The output end of the driving motor is fixedly connected with the input end of the precision reduction gear. The output end of the precision reduction gear is fixedly connected with the film pasting roller.

[0008] Furthermore, on both sides of the top outer surface of the fixed plate located on both sides of the pressing cylinder, precision guide sleeves are fixedly connected. Precision guide rods are movably inserted into the interiors of the two precision guide sleeves. The tops of the two precision guide rods are fixedly connected to the bottom outer surface of the pressing block, and a connecting block is fixedly connected to the bottom outer surface of the two precision guide rods.

[0009] Furthermore, one side of the pressing block near the middle end of the film pasting roller is bent, and one side of the pressing block near the middle end of the film pasting roller extends to the edge of the film pasting roller.

[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0011] 1. For this wafer rolling and pasting film transfer device, by setting a rotary valve, an adsorption force is generated at the vacuum suction holes to adsorb the film on the film pasting roller, and the film is pressed on the film pasting roller through a positioning and pressing mechanism. Then, in cooperation with the driving motor and the precision reduction gear, the film pasting roller is driven to make the film rotate precisely, and after adjusting the wafer, the wafer pasting function is precisely completed. This wafer rolling and pasting film transfer device can pre-paste the blue film on the film pasting roller according to the size of the wafer, and then roll and paste it on the wafer. Compared with the prior art wafer pasting devices, this method is relatively novel, and no bubbles will be generated on the surface of the wafer finished product after pasting with this device, and the finished product quality is relatively high. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a front view structural schematic diagram of the present utility model;

[0013] Figure 2 is a structural schematic diagram of the positioning and pressing mechanism of the present utility model.

[0014] In the figure: 1. Installation base plate; 2. T-shaped support plate; 3. T-shaped installation plate; 4. L-shaped installation plate; 5. Rotary valve; 6. Positioning and pressing mechanism; 7. Film pasting roller; 8. Precision reduction gear; 9. Driving motor; 601. Fixed plate; 602. Pressing cylinder; 603. Precision guide sleeve; 604. Precision guide rod; 605. Pressing block; 606. Connecting block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0015] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0016] Embodiment 1:

[0017] Please refer to Figure 1 - Figure 2, the present utility model provides a technical solution: a wafer rolling and pasting film transfer device, including a mounting base plate 1. A T-shaped support plate 2 is fixedly connected to the outer surface of the top of the mounting base plate 1 near the right end. A T-shaped mounting plate 3 is fixedly connected to the outer surface of the top of the mounting base plate 1 near the left end. A film pasting roller 7 is rotatably connected between the opposite outer surfaces of the T-shaped mounting plate 3 and the T-shaped support plate 2. A plurality of vacuum suction holes are formed on the outer surface of the film pasting roller 7. An L-shaped mounting plate 4 is fixedly connected to the outer surface of the end of the T-shaped support plate 2 away from the film pasting roller 7. A rotary valve 5 is installed on the outer surface of the L-shaped mounting plate 4. The inlet end of the rotary valve 5 is fixedly communicated with the inside of the film pasting roller 7. A plurality of positioning and pressing mechanisms 6 are symmetrically arranged on the left and right outer surfaces of the film pasting roller 7 and are arranged in a circumferential array. Specifically, the device is installed on the film pasting machine table through the mounting base plate 1. The peeled film sheet falls on the film pasting roller 7. By the operation of the rotary valve 5, negative pressure is generated inside the film pasting roller 7, and the film sheet is adsorbed through the vacuum suction holes, and the film sheet is pressed and positioned on the surface of the film pasting roller 7 through the positioning and pressing mechanism 6.

[0018] In this embodiment, the positioning and pressing mechanism 6 includes a fixing plate 601. The fixing plate 601 is fixedly connected to the outer surface of the film pasting roller 7. A pressing cylinder 602 is fixedly installed on the outer surface of the top of the fixing plate 601. The output end of the pressing cylinder 602 is fixedly connected to a pressing block 605. Specifically, when the pressing cylinder 602 operates, it drives the pressing block 605 to press and fix the film sheet on the film pasting roller 7.

[0019] In this embodiment, a precision speed reducer 8 and a driving motor 9 are fixedly installed on the outer surface of the side of the T-shaped mounting plate 3 away from the film pasting roller 7. The output end of the driving motor 9 is fixedly connected to the input end of the precision speed reducer 8. The output end of the precision speed reducer 8 is fixedly connected to the film pasting roller 7. Specifically, when fixing the film sheet, after the driving motor 9 operates and is decelerated by the precision speed reducer 8, it drives the film pasting roller 7 to rotate, so that the film pasting roller 7 drives the film sheet to rotate to a suitable angle for precision film pasting work. This wafer rolling and pasting film transfer device can pre-paste the blue film on the film pasting roller 7 according to the size of the wafer, and then roll and paste it on the wafer. Compared with the existing wafer film pasting devices, this method is relatively novel, and no bubbles will be generated on the surface of the wafer finished product after being pasted by this device, and the finished product quality is relatively high.

[0020] In this embodiment, precision guide sleeves 603 are fixedly connected to both sides of the top outer surface of the fixed plate 601 and located on both sides of the pressing cylinder 602. Precision guide rods 604 are movably inserted into the interiors of the two precision guide sleeves 603. The tops of the two precision guide rods 604 are fixedly connected to the bottom outer surface of the pressing block 605, and the bottom outer surfaces of the two precision guide rods 604 are fixedly connected to a connecting block 606. Specifically, when the pressing cylinder 602 works to drive the pressing block 605 to move, the precision guide rods 604 slide within the precision guide sleeves 603, and the precision guide rods 604 play a guiding role, enabling the pressing cylinder 602 to drive the pressing block 605 to move stably.

[0021] In this embodiment, one side of the pressing block 605 near the middle end of the film applying roller 7 is bent, and one side of the pressing block 605 near the middle end of the film applying roller 7 extends to the edge of the film applying roller 7. Specifically, one end of the pressing block 605 extends to the edge of the film applying roller 7, enabling the pressing cylinder 602 to drive the pressing block 605 to press the film on the film applying roller 7 when it works.

[0022] Working principle: When the present utility model is in use, the device is installed on the film applying machine table through the mounting base plate 1. The peeled film drops onto the film applying roller 7. By the operation of the rotary valve 5, negative pressure is generated inside the film applying roller 7, and the film is adsorbed through the adsorption force generated by the vacuum suction holes. Then, by the operation of the pressing cylinder 602, the pressing cylinder 602 drives the pressing block 605 to work, pressing the film onto the film applying roller 7. After the film is adsorbed and pressed and fixed, by the operation of the drive motor 9, after being decelerated by the precision speed reducer 8, the film applying roller 7 rotates. When the film applying roller 7 rotates, it drives the film on it to rotate precisely. When the film rotates to a suitable position, the rotary valve 5 stops generating negative pressure, and the pressing cylinder 602 retracts, causing the film to detach from the film applying roller 7, thereby precisely completing the function of wafer film application while adjusting the wafer. This wafer rolling and transferring film device can pre-paste the blue film on the film applying roller 7 according to the size of the wafer and then roll and paste it onto the wafer. Compared with the existing wafer film applying devices, this method is relatively novel, and no bubbles will be generated on the surface of the wafer finished product after being film applied by this device, and the finished product quality is relatively high.

[0023] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer rolling film transfer device, comprising a mounting base plate (1), characterized in that: A T-shaped support plate (2) is fixedly connected to the outer surface of the top of the mounting base plate (1) on the right end, and a T-shaped mounting plate (3) is fixedly connected to the outer surface of the top of the mounting base plate (1) on the left end. A film-laminating roller (7) is rotatably connected between the outer surfaces opposite to the T-shaped mounting plate (3) and the T-shaped support plate (2). The outer surface of the film-laminating roller (7) is provided with a plurality of vacuum suction holes. An L-shaped mounting plate (4) is fixedly connected to the outer surface of the end of the T-shaped support plate (2) away from the film-laminating roller (7). A rotary valve (5) is installed on the outer surface of the L-shaped mounting plate (4). The inlet end of the rotary valve (5) is fixedly connected to the inside of the film-laminating roller (7). The left and right outer surfaces of the film-laminating roller (7) are symmetrically arranged and provided with a plurality of positioning and clamping mechanisms (6) in a circular array.

2. The wafer rolling film transfer device according to claim 1, characterized in that: The positioning and pressing mechanism (6) comprises a fixing plate (601), the fixing plate (601) being fixedly connected to the outer surface of the film laminating roller (7), a pressing cylinder (602) being fixedly mounted on the top outer surface of the fixing plate (601), and a pressing block (605) being fixedly connected to the output end of the pressing cylinder (602).

3. The wafer rolling film transfer device according to claim 1, characterized in that: A precision reducer (8) and a drive motor (9) are fixedly mounted on the outer surface of one side of the T-shaped mounting plate (3) away from the film laminating roller (7); the output end of the drive motor (9) is fixedly connected to the input end of the precision reducer (8), and the output end of the precision reducer (8) is fixedly connected to the film laminating roller (7).

4. The wafer rolling film transfer device according to claim 2, characterized in that: The top outer surface of the fixed plate (601) is located on both sides of the clamping cylinder (602) and is fixedly connected to precision guide sleeves (603), and precision guide rods (604) are movably inserted inside the two precision guide sleeves (603). The tops of the two precision guide rods (604) are fixedly connected to the bottom outer surface of the pressing block (605), and the bottom outer surfaces of the two precision guide rods (604) are fixedly connected to a connecting block (606).

5. The wafer rolling film transfer device according to claim 2, characterized in that: The side of the pressing block (605) close to the middle end of the film laminating roller (7) is bent, and the side of the pressing block (605) close to the middle end of the film laminating roller (7) extends to the edge of the film laminating roller (7).

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