Wafer clamping device

Abstract

The utility model discloses a wafer clamping device which comprises a rotating platform capable of rotating automatically. The first clamping parts and the second clamping parts are arranged in the rotating platform in the mode of moving along with the rotating platform. The first transmission assembly and the second transmission assembly are connected with the first clamping part and the second clamping part respectively, and the ejection assembly is connected with the second clamping part. When the rotating platform is in a static state, the first transmission assembly and the second transmission assembly maintain the first clamping component and the second clamping component to be in a loosening state and a clamping state respectively. When the centrifugal force generated by the rotating platform in the rotating acceleration state is larger than the maintaining force applied by the first transmission assembly to the first clamping component to loosen the wafer and the maintaining force applied by the second transmission assembly to the second clamping component to clamp the wafer, the first clamping component is converted from the loosening state to the clamping state. And the second clamping part is converted from the clamping state to the loosening state, so that the clamping edge part of the wafer can be cleaned when the wafer is cleaned.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and particularly relates to a clamping device for a wafer. Background Art

[0002] After lithography of the circuit diagram is completed on the wafer, an etching process is required to remove the excess oxide film, leaving the semiconductor circuit diagram. Etching usually uses chemical solutions, gases (or / and) plasmas to remove the selected excess material. After etching the wafer, the wafer needs to be cleaned.

[0003] In the prior art, most of them use clamping PINs to clamp the wafer, and then rotate the wafer through a rotatable turntable for cleaning to remove the traces left after etching. However, it is found in the actual cleaning process that since the clamping PINs clamp the edge portion of the wafer during cleaning, the etching residues on the edge portion of the wafer cannot be effectively cleaned. After cleaning is completed, there are still etching residues on the edge portion of the wafer, resulting in incomplete cleaning of the wafer, affecting the production and use of the wafer, and bringing many inconveniences to the actual use. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a clamping device for a wafer to overcome the deficiencies of the prior art, so that there is no etching residue on the edge portion of the wafer, and the overall cleaning effect of the wafer is good.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is: a clamping device for a wafer, comprising:

[0006] A rotating platform, which can rotate automatically;

[0007] A first clamping component and a second clamping component. A plurality of the first clamping components and the second clamping components are respectively arranged inside the rotating platform following the movement of the rotating platform and penetrate out from the upper end of the rotating platform for clamping or releasing the wafer;

[0008] A first transmission component and a second transmission component, which are respectively connected to the first clamping component and the second clamping component;

[0009] A jacking component, which is arranged on one side of the second clamping component and is used to jack open the second clamping component in the clamping state and switch it to the releasing state;

[0010] Wherein, when the rotating platform is in a static state, the first transmission component and the second transmission component respectively maintain the first clamping component and the second clamping component in the states of releasing and clamping the wafer;

[0011] When the rotating platform is in a state of rotational acceleration, a centrifugal force is generated. When the centrifugal force is greater than the holding force that the first transmission component gives to the first clamping component to release the wafer and the holding force that the second transmission component gives to the second clamping component to hold the wafer, the first clamping component changes from the released state to the clamping state, and the second clamping component changes from the clamping state to the released state.

[0012] Furthermore, the structures of the first clamping component and the second clamping component are the same; the first clamping component includes a supporting part arranged inside the rotating platform; the supporting part penetrates upward from the inside of the rotating platform; a clamping part located above the rotating platform is provided at the top of the supporting part.

[0013] Furthermore, the first transmission component includes:

[0014] A first rotating shaft, arranged at the upper part of the first clamping component, for enabling the first clamping component to rotate around the first rotating shaft;

[0015] A first counterweight block, arranged at the bottom of the first clamping component, for enabling the center of mass of the first clamping component to be below the first rotating shaft;

[0016] A first spring, connected to the first configuration block, with the other end connected to the inside of the rotating platform, for applying a pulling force to the bottom of the first clamping part towards the center side of the rotating platform.

[0017] Furthermore, the second transmission component includes:

[0018] A second rotating shaft, arranged at the bottom of the second clamping component, for enabling the second clamping component to rotate around the second rotating shaft;

[0019] A second counterweight block, arranged at the upper middle part of the second clamping component, for enabling the center of mass of the second clamping component to be above the second rotating shaft;

[0020] A second spring, connected to the second configuration block, with the other end connected to the inside of the rotating platform, for applying a pulling force to the upper middle part of the second clamping part towards the center side of the rotating platform.

[0021] Furthermore, the jacking component includes:

[0022] A jacking cylinder, arranged inside the rotating platform;

[0023] A link mechanism, the middle part of the link mechanism is connected to the jacking cylinder, and the link mechanism is respectively movably connected to a plurality of the second clamping components;

[0024] A compression spring is arranged inside the rotating platform, and the other end is connected to the lifting rod of the lifting cylinder;

[0025] A hard limit component is arranged inside the rotating platform and is located below the linkage mechanism.

[0026] Furthermore, a plurality of the first clamping components and a plurality of the second clamping components are arranged on the rotating platform at intervals.

[0027] Furthermore, a protective cover is also arranged on the rotating platform.

[0028] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0029] In the wafer clamping device of the utility model, a first transmission component and a second switching component are respectively added to the first clamping component and the second clamping component. When the rotating platform is in a static state, the first transmission component and the second transmission component respectively maintain the first clamping component and the second clamping component in a state of loosening and clamping the wafer. When the centrifugal force generated when the rotating platform is in a state of rotational acceleration is greater than the maintaining force given by the first transmission component to the first clamping component and the maintaining force given by the second transmission component to the second clamping component, the first clamping component changes from the loosening state to the clamping state, and the second clamping component changes from the clamping state to the loosening state. In this way, when cleaning the wafer, the wafer can be separately clamped and switched between the first clamping component and the second clamping component, so that the edge part of the wafer can be effectively cleaned synchronously, and the overall cleaning effect of the wafer is good. Description of the Drawings

[0030] The technical solution of the utility model will be further described below with reference to the drawings:

[0031] Figure 1 It is a top view of an embodiment of the utility model;

[0032] Figure 2 It is a schematic structural diagram of the first clamping component loosening the wafer in an embodiment of the utility model;

[0033] Figure 3 It is a schematic structural diagram of the first clamping component clamping the wafer in an embodiment of the utility model;

[0034] Figure 4 It is a schematic structural diagram of the second clamping component clamping the wafer in an embodiment of the utility model;

[0035] Figure 5 It is a schematic structural diagram of the second clamping component loosening the wafer in an embodiment of the utility model;

[0036] Figure 6This is a comparison diagram of the states of the first clamping component and the second clamping component when the rotating platform in the present utility model is in an accelerating state;

[0037] Among them: rotating platform 1, first clamping component 2, second clamping component 3, first transmission component 4, second transmission component 5, wafer 6, ejecting component 7, supporting part 20, clamping part 21, first rotating shaft 40, first counterweight 41, first spring 42, second rotating shaft 50, second counterweight 51, second spring 52, lifting cylinder 70, connecting rod mechanism 71, compression spring 72, hard limit component 73. Specific implementation manner

[0038] In order to enable those skilled in the art to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0039] The present utility model provides a clamping device for a wafer, which solves the problem in the prior art that the edge of the wafer is clamped by clamping the PIN, resulting in the inability to effectively clean the etching marks on the edge of the wafer, and thus the cleaning effect of the wafer cannot meet the use requirements.

[0040] For the sake of easy understanding, the specific process in the embodiments of this application will be described below. Please refer to Figures 1 to 5 A clamping device for a wafer in an embodiment of this application includes a rotating platform 1, a first clamping component 2, a second clamping component 3, a first transmission component 4, a second transmission component 5 and an ejecting component 7; the rotating platform 1 can rotate automatically; a plurality of the first clamping components 2 and the second clamping components 3 are respectively arranged inside the rotating platform 1 following the rotation of the rotating platform 1 and penetrate out from the upper end of the rotating platform 1 for clamping or loosening the wafer located on the rotating platform 1. The first transmission component 4 and the second transmission component 5 are respectively connected to the first clamping component 2 and the second clamping component 3; the ejecting component 7 is arranged on one side of the second clamping component 3 for ejecting the second clamping component 3 in the clamping state to switch to the loosening state.

[0041] The wafer clamping device of the present utility model, when the rotating platform 1 is in a stationary state, the first transmission component 4 and the second transmission component 5 respectively maintain the first clamping component 2 and the second clamping component 3 in a state of releasing the wafer and clamping the wafer. At this time, the second clamping component 3 is first changed from the clamping state to the releasing state by the ejecting component 7, and then the wafer is placed, and then the ejecting component 7 returns to its original position; when the rotating platform 1 is in a state of accelerating rotation, a centrifugal force is generated. When the centrifugal force is greater than the maintaining force for the first clamping component 4 to release the wafer by the first transmission component 4 and the maintaining force for the second clamping component 3 to clamp the wafer by the second transmission component 5, the first clamping component 2 is changed from the releasing state to the clamping state, and the second clamping component 3 is changed from the clamping state to the releasing state.

[0042] In summary, when the wafer 6 is cleaned in the above manner, it can ensure that the edge part of the wafer 6 is effectively cleaned synchronously, the overall cleaning effect of the wafer is good, and there is no etching residue on the cleaned wafer.

[0043] In this embodiment, the structures of the first clamping component 2 and the second clamping component 3 are the same; the first clamping component 2 includes a supporting part 20 arranged inside the rotating platform 1; the supporting part 20 penetrates upward from the inside of the rotating platform 1; a clamping part 21 located above the rotating platform 1 is provided at the top of the supporting part 20, and a clamping groove for clamping the wafer 6 is formed on the clamping part 21; in this embodiment, the plurality of clamping components 2 and the plurality of second clamping components 3 can all perform the operations of clamping or releasing the wafer 6 through the clamping grooves on the clamping part 21.

[0044] Based on Figure 2 and Figure 3 , in this embodiment, the first transmission component 4 includes a first rotating shaft 40, a first counterweight 41 and a first spring 42; the first rotating shaft 40 is arranged in the upper middle part of the first clamping component 2, and the first clamping component 2 can rotate in the rotating platform 1 with the first rotating shaft 40 as a fulcrum. During the rotation, the clamping part 21 at the upper end of the first clamping component 2 can clamp or release the wafer 6.

[0045] A first counterweight 41 is provided at the bottom of the first clamping component 2, and the center of mass of the entire first clamping component 2 is located below the first rotating shaft 40; the other end of the first counterweight 41 is connected to the first spring 42, and the other end of the first spring 42 is connected to the inside of the rotating platform 1; the first spring 42 is used to apply a pulling force Fr to the bottom of the first clamping part 2 toward the center side of the rotating platform.

[0046] The initial state of the first clamping component 2 is as Figure 2As shown, the centroid of the entire first clamping member 2 is located below the first rotating shaft 40. A first counterweight 41 is added to the bottom of the first clamping member 2. At this time, the first clamping member 2 should deflect to the right with the first rotating shaft 40 as the fulcrum. However, since the first spring 42 also applies a pulling force Fr to the bottom of the first clamping member 2 towards the center side of the rotating platform 1, the upper middle part of the first clamping member 2 above the first rotating shaft 40 deflects to the left at this time, that is, the corresponding clamping part 21 tilts to the left, and the first clamping member 2 is in a state of releasing the wafer.

[0047] When the rotating platform 1 starts to rotate, the rotating platform 1 will cause a centrifugal force Fw that throws the first clamping member 2 outwards below the first rotating shaft 40. As the rotational speed of the rotating platform 1 increases, the centrifugal force Fw also increases. When the centrifugal force Fw is greater than the pulling force Fr given by the first spring 42, since the acting point of the centrifugal force Fw is below the first rotating shaft 40, the first clamping member 2 is caused to drive the clamping part 21 above the first clamping member 2 to rotate to the right with the first rotating shaft 40 as the center, overcoming the pulling force Fr of the first spring 42 and the weight of the first counterweight 41, thereby causing the clamping part 21 to convert to a state of clamping the wafer. The rotating platform 1 completes the switching of the first clamping member 2 from the state of releasing the wafer to the state of clamping the wafer during the rotation process.

[0048] Based on Figure 4 and Figure 5 , in this embodiment, the second transmission component 5 includes a second rotating shaft 50, a second counterweight 51, and a second spring 52; the second rotating shaft 50 is provided at the bottom of the second clamping member 3. The second clamping member 3 can also rotate within the rotating platform 1 with the second rotating shaft 50 as the fulcrum. During the rotation process, the clamping part 21 at the upper end of the second clamping member 3 can clamp or release the wafer.

[0049] A second counterweight 51 is provided in the upper middle part of the second clamping member 3, and the centroid of the entire second clamping member 3 is located above the second rotating shaft 50; the other end of the second counterweight 51 is connected to the second spring 52, and the other end of the second spring 52 is connected to the inside of the rotating platform 1; the second spring 52 is used to apply a pulling force Fr' to the upper middle part of the second clamping member 3 towards the center side of the rotating platform.

[0050] The initial state of the second clamping member 3 is as Figure 4As shown, the centroid of the entire second clamping member 3 is located above the second rotating shaft 50. A second counterweight 51 adds counterweight to the upper middle part of the second clamping member 3. At this time, the second clamping member 3 should deflect to the left with the second rotating shaft 50 as the fulcrum. However, since the second spring 52 provides a pulling force Fr' to the upper middle part of the second clamping member 3 towards the center side of the rotating platform 1, the upper middle part of the second clamping member 3 located at the second rotating shaft 50 changes from deflecting to the left to being vertically arranged within the rotating platform 1. In this way, the clamping part 21 at the upper end of the second clamping member 3 is exactly in the state of clamping the wafer.

[0051] Refer to Figure 5 , when the rotating platform 1 starts to rotate, the rotating platform 1 generates a centrifugal force Fw' that causes the second clamping member 3 to be thrown outwards above the second rotating shaft 50. As the rotational speed of the rotating platform 1 increases, the centrifugal force Fw' also increases. When the centrifugal force Fw' is greater than the pulling force Fr' given by the second spring 52, the second clamping member 3 overcomes the pulling force Fr' of the second spring 52 and the weight of the second counterweight 51, and with the second rotating shaft 50 as the center, deflects the clamping part 21 of the second clamping member 3 to the opposite side of the clamping to change to the state of releasing the wafer. During the rotation of the rotating platform 1, the process of the second clamping member 3 changing from the clamping state to the releasing state for the wafer is realized.

[0052] Furthermore, the top-opening assembly 7 is provided to be able to place the wafer 6 into the clamping positions of the first clamping member 2 and the second clamping member 3, facilitating the subsequent clamping and cleaning of the wafer. Specifically, in this embodiment, the top-opening assembly 7 includes a lifting cylinder 70, a link mechanism 71, a compression spring 72, and a hard limit member 73; the lifting cylinder 70 is arranged inside the rotating platform 1, and the lifting rod of the lifting cylinder 70 is connected to the link mechanism 71 for driving the link mechanism 71 to move upwards; both ends of the link mechanism 71 are movably connected to a plurality of the second clamping members 3, and at the same time, the middle part of the link mechanism is connected to the compression spring 72, and the compression spring 72 is arranged inside the rotating platform 1.

[0053] When the lifting rod of the lifting cylinder 70 drives the link mechanism 71 to lift upwards, a plurality of the second clamping members 3 movably connected to the link mechanism 71 deflect outwards, so that the second clamping member 3 switches to the state of releasing the wafer. At this time, the wafer 6 can be placed at the clamping center of the first clamping member 2 and the second clamping member 3, and then the lifting rod of the lifting cylinder retracts, and the second clamping member 3 returns to its original position to continue clamping the wafer.

[0054] In addition, a hard limit member 73 is also arranged inside the rotating platform 1 below the link mechanism 71, which can prevent the lifting cylinder 70 from lifting the link mechanism 71 beyond the position.

[0055] Further, a plurality of the first clamping members 2 and the second clamping members 3 are arranged at intervals on the rotating platform 1. In this embodiment, three first clamping members 2 and three second clamping members 3 are included and arranged at intervals on the rotating platform 1, so as to ensure the stability of the wafer in the clamped state.

[0056] Further, a protective cover is further included on the rotating platform 1 for protecting the wafer to a certain extent during wafer cleaning.

[0057] In addition, in actual use, the relationship between the rotation speed of the rotating platform 1 and the first clamping member 2 and the second clamping member 3 is as Figure 6 shown. It can be seen from the figure that when the rotation speed of the rotating platform 1 is between 0 and 750 rpm, the first clamping member 2 is in the state of releasing the wafer. When the rotation speed of the rotating platform 1 is between 750 and 1500 rpm, the first clamping member 2 is in the state of clamping the wafer. When the rotation speed of the rotating platform 1 is between 0 and 1000 rpm, the second clamping member 3 is in the state of clamping the wafer. When the rotation speed of the rotating platform 1 is between 1000 and 1500 rpm, the second clamping member 3 is in the state of releasing the wafer.

[0058] Based on Figures 1 to 6 , a specific embodiment is listed below for illustration.

[0059] When the rotating platform 1 is in a stationary state, first, the ejecting assembly 7 starts to work. The ejecting assembly 7 is used to change the second clamping member 3 from the clamped state to the released state, and then the wafer 6 is placed at the center clamped by the first clamping member 2 and the second clamping member 3. The lifting cylinder 70 in the ejecting assembly 7 returns to its original position. At this time, the second clamping member 3 is used to clamp the wafer 6, and the first clamping member 2 is in the state of releasing the wafer.

[0060] Then the rotating platform 1 starts to rotate and accelerate. When the speed of the rotating platform 1 accelerates from 0 to 500 rpm, the second clamping member continues to clamp the wafer at this time. Then when the speed of the rotating platform 1 accelerates from 500 to 750 rpm, the first step of etching and cleaning starts. At this time, the wafer can be effectively cleaned except for the edge portion clamped by the second clamping member 3.

[0061] Then the rotating platform is accelerated to 750 - 1000 rpm. At this time, both the first clamping member 2 and the second clamping member 3 clamp the wafer, so that the wafer can be effectively cleaned.

[0062] When the rotating platform is accelerated to 1000 - 1250 rpm, the first clamping member 2 clamps the wafer at this time, and the second clamping member 3 is loosened, so that the wafer can be effectively cleaned except for the edge portion clamped by the first clamping member 2, and thus the entire edge portion of the wafer can be effectively cleaned.

[0063] When the rotating platform 1 is accelerated to 1250 - 1500 rpm, the first clamping part still clamps the wafer at this time, and then spin-drying is performed.

[0064] Finally, the rotating platform 1 returns to the stopped state, and then the second clamping member 3 is loosened by using the ejecting assembly 7, and the cleaned wafer can be taken out.

[0065] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims

1. A wafer clamping device, characterized in that: include: A rotating platform, which can rotate automatically; A first clamping component and a second clamping component, wherein a plurality of the first clamping components and the second clamping components are respectively arranged inside the rotating platform and pass through the upper end of the rotating platform, and are used to clamp or release the wafer; A first transmission assembly and a second transmission assembly are connected to the first clamping component and the second clamping component respectively; A push-opening assembly is arranged on one side of the second clamping member, and is used to push open the second clamping member in the clamping state and switch it to a loose state; Wherein, when the rotating platform is in a stationary state, the first transmission assembly and the second transmission assembly respectively maintain the first clamping component and the second clamping component in a state of loosening and clamping the wafer; The rotating platform generates centrifugal force when it is in a rotational acceleration state. When the centrifugal force is greater than the maintenance force given by the first transmission component to the first clamping component to release the wafer and the maintenance force given by the second transmission component to the second clamping component to clamp the wafer, the first clamping component changes from a released state to a clamped state, and the second clamping component changes from a clamped state to a released state.

2. The wafer clamping device according to claim 1, characterized in that: The first clamping component and the second clamping component have the same structure; the first clamping component includes a supporting portion arranged inside the rotating platform; the supporting portion extends upward from the inside of the rotating platform; and a clamping portion located above the rotating platform is provided on the top of the supporting portion.

3. The wafer clamping device according to claim 1, characterized in that: The first transmission assembly comprises: A first rotating shaft, disposed on an upper portion of the first clamping member, for allowing the first clamping member to rotate around the first rotating shaft; a first counterweight block, disposed at the bottom of the first clamping member, so that the center of mass of the first clamping member is below the first rotating shaft; The first spring is connected to the first counterweight block, and the other end of the first spring is connected to the inside of the rotating platform, so as to give a pulling force to the bottom of the first clamping part toward the center of the rotating platform.

4. The wafer clamping device according to claim 1, characterized in that: The second transmission assembly comprises: A second rotating shaft, disposed at the bottom of the second clamping member, for enabling the second clamping member to rotate around the second rotating shaft; a second counterweight block, disposed at the middle and upper part of the second clamping member, so as to make the center of mass of the second clamping member be above the second rotating shaft; The second spring is connected to the second counterweight block, and the other end of the second spring is connected to the inside of the rotating platform, so as to give a pulling force to the upper middle part of the second clamping part toward the center of the rotating platform.

5. The wafer clamping device according to claim 1, characterized in that: The top opening assembly comprises: A lifting cylinder is arranged inside the rotating platform; A connecting rod mechanism, the middle part of which is connected to the lifting cylinder, and the connecting rod mechanism is movably connected to a plurality of the second clamping components respectively; A compression spring, which is arranged in the rotating platform and the other end of which is connected to the lifting rod of the lifting cylinder; The hard limit component is arranged in the rotating platform and is located below the connecting rod mechanism.

6. The wafer clamping device according to claim 1, characterized in that: A plurality of the first clamping members and a plurality of the second clamping members are arranged on the rotating platform at intervals.

7. The wafer clamping device according to claim 1, characterized in that: The rotating platform is also provided with a protective cover.

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