Wafer bearing table

Abstract

The utility model provides a wafer bearing table, relates to the technical field of semiconductors, and is used for solving the problem that the wafer bearing table is easy to block. The wafer bearing table comprises a bearing base and a moving device connected with the bearing base, and the moving device is used for driving the bearing base to move in a first direction. The moving device comprises a first guide part and a second guide part, the first guide part is provided with a first containing cavity, the first containing cavity penetrates through the opposite surfaces of the first guide part in the first direction, and at least one first limiting part is arranged on the surface of the first containing cavity. The second guide part is arranged in the first containing cavity, at least one second limiting part is arranged on the outer surface of the second guide part, and the first limiting part and the second limiting part are connected in a matched mode and can move relatively in the first direction. The moving device in the application can guide the bearing base and reduce the blockage of the wafer bearing table.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to a wafer carrier. Background Art

[0002] In the process of semiconductor manufacturing, wafers need to be transferred between different reaction chambers to implement different processing technologies on the wafers, such as deposition, etching, ion implantation, grinding and other processes. In processes such as grinding, the wafers are usually placed on a wafer carrier, and the wafer carrier is used to lift or lower the wafers to achieve loading and unloading of the wafers. The first driving device can be a motor or a cylinder.

[0003] However, the wafer carrier is prone to jamming during movement, and the wafer loading and / or unloading fails. Summary of the Utility Model

[0004] In view of the above problems, embodiments of this application provide a wafer carrier to reduce jamming and reduce loading and / or unloading failures.

[0005] To achieve the above object, embodiments of this application provide a wafer carrier, which includes: a carrying base, and a moving device connected to the carrying base, the moving device being configured to drive the carrying base to move in a first direction;

[0006] The moving device includes:

[0007] A first guide member having a first receiving cavity that penetrates opposite surfaces of the first guide member along the first direction, and at least one first limiting portion is provided on the surface of the first receiving cavity;

[0008] A second guide member disposed in the first receiving cavity, at least one second limiting portion is provided on the outer surface of the second guide member, the first limiting portion and the second limiting portion are cooperatively connected and the first limiting portion and the second limiting portion can move relative to each other in the first direction.

[0009] In some possible embodiments, the first guide member and the second guide member are cylindrical bodies.

[0010] In some possible embodiments, the first limiting portion includes a positioning groove provided on the surface of the first receiving cavity and a ball located in the positioning groove, and the second limiting portion has a guiding groove that extends along the first direction away from the outer surface of the second guide member.

[0011] In some possible embodiments, the diameter of the ball is equal to or greater than the opening size of the positioning groove, and the diameter of the ball is greater than the depth of the positioning groove.

[0012] In some possible embodiments, the number of the second limiting portions is 2N, where N is a positive integer greater than or equal to 1;

[0013] The 2N second limiting portions are divided into N second limiting groups, each of the second limiting groups has 2 second limiting portions, and the 2 second limiting portions in the same second limiting group are symmetrically arranged along the axis of the second guiding member.

[0014] In some possible embodiments, the number of the first limiting portions is 2M, where M is a positive integer greater than or equal to 1;

[0015] The 2M first limiting portions are divided into N first limiting groups, each of the first limiting groups has 2 first limiting portions, and the 2 first limiting portions in the same first limiting group are symmetrically located along the axis of the first guiding member.

[0016] In some possible embodiments, the second limiting portion includes two oppositely arranged baffles, the two baffles are arranged on the outer peripheral surface of the second guiding member, and both extend along the first direction, and a guiding groove is formed between the two baffles.

[0017] In some possible embodiments, the second limiting portion includes a substrate, the substrate is arranged on the outer peripheral surface of the second guiding member and extends along the first direction, and a guiding groove is formed on the surface of the substrate facing away from the second guiding member.

[0018] In some possible embodiments, the second limiting portion is a groove arranged on the outer peripheral surface of the second guiding member, the groove extends along the first direction, and the groove also forms the guiding groove.

[0019] In some possible embodiments, at least a part of the side wall of the guiding groove close to the first guiding member is an arc surface.

[0020] The wafer carrier in the embodiment of the present application includes a carrier base and a motion device. The motion device is connected to the carrier base to drive the carrier base to move in a first direction. The motion device includes a first guide member and a second guide member. The first guide member has a first accommodation cavity that penetrates the opposite surfaces of the first guide member along the first direction. At least one first limiting portion is provided on the surface of the first accommodation cavity. The second guide member is disposed in the first accommodation cavity, and at least one second limiting portion is provided on the outer surface of the second guide member. The second limiting portion is cooperatively connected with the first limiting portion and can move relative to each other in the first direction, so as to guide the carrier base and enable the carrier base to move along the first direction. At the same time, the first guide member is sleeved outside the second guide member, so that the first guide member and the second guide member form a sleeve structure, and the first guide member and the second guide member are not easily bent, which can reduce the jamming of the wafer carrier, thereby reducing the failure of wafer loading and / or unloading.

[0021] In addition to the technical problems solved by the embodiments of the present application, the technical features constituting the technical solutions, and the beneficial effects brought by these technical features of the technical solutions described above, the other technical problems that can be solved by the wafer carrier provided by the embodiments of the present application, the other technical features included in the technical solutions, and the beneficial effects brought by these technical features will be further described in detail in the specific implementation manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 Schematic diagrams of a guide rod, a carrier base, a support device, and a machine table in the related art;

[0024] Figure 2 Stereogram of a guide rod and a carrier base in the related art;

[0025] Figure 3 Side view of a guide rod and a carrier base in the related art;

[0026] Figure 4 Schematic diagram of a deformed guide rod in the related art;

[0027] Figure 5 Schematic diagram of a carrier base and a motion device in the embodiment of the present application;

[0028] Figure 6 Schematic diagram of a carrier base in the embodiment of the present application;

[0029] Figure 7 Schematic diagram of the first guiding member and the second guiding member in the embodiment of the present application;

[0030] Figure 8 Schematic diagram of the first guiding member and the ball in the embodiment of the present application;

[0031] Figure 9 Schematic diagram of the second guiding member and the baffle in the embodiment of the present application;

[0032] Figure 10 Schematic diagram of the second guiding member and the substrate in the embodiment of the present application;

[0033] Figure 11 Schematic diagram of the second guiding member and the groove in the embodiment of the present application.

[0034] Explanation of reference numerals:

[0035] 10: wafer; 21: machine;

[0036] 22: first driving device; 23: supporting device;

[0037] 24, 90: carrier base 90; 25: second driving device;

[0038] 26: spring; 27: guide rod;

[0039] 30: first guiding member; 31: first accommodating cavity;

[0040] 32: first segment; 33: second segment;

[0041] 34: mounting ring; 35: positioning groove;

[0042] 40: second guiding member; 41: second accommodating cavity;

[0043] 50: ball; 60: baffle;

[0044] 70: substrate; 80: guiding groove;

[0045] 91: connecting rod; 92: bottom support;

[0046] 93: carrier tray; 100: moving device. Detailed implementation manners

[0047] Refer to Figures 1 to 4, Wafer loading and unloading are usually carried out inside the loading device. The loading device includes a machine platform 21, a support device 23 (Load Cup) provided on the machine platform 21, and a wafer carrier provided inside the machine platform 21. The wafer carrier bears a base 24. A spring 26 is abutted between the support device 23 and the machine platform 21, and the support device 23 is in transmission connection with a second driving device 25. The second driving device 25 drives the support device 23 to lift and lower. The second driving device 25 can be a motor or a cylinder. The bearing base 24 is in transmission connection with a first driving device 22 at the bottom of the support device 23, and the first driving device 22 is used to drive the bearing base 24 to lift and lower so as to lift or lower the wafer on the bearing base 24.

[0048] As Figure 2 and Figure 3 shown, the bearing base 24 is also fixedly connected to a guide rod 27. The guide rod 27 is arranged in a guide hole of the first driving device 22 and moves in the guide hole. However, referring to Figure 4 , when the guide rod 27 is bent, the guide rod 27 will get stuck in the guide hole, causing the bearing base 24 to get stuck and the wafer loading and / or unloading to fail. In addition, the guide rod 27 is also prone to friction with the guide hole to generate debris. On the one hand, the guide rod 27 needs to be frequently replaced, and the machine platform 21 needs to be frequently cleaned to ensure no alarm and the cleanliness of the machine platform 21, which is extremely cumbersome. On the other hand, the debris is also likely to scratch the wafer 10 or even cause it to be scrapped.

[0049] An embodiment of the present application provides a wafer carrier, which includes a bearing base and a moving device. The moving device drives the bearing base to move in a first direction. The moving device includes a first guide member and a second guide member. The second guide member can pass through the first guide member, and at least one first limiting portion and at least one second limiting portion are respectively arranged on the first guide member and the second guide member. The second limiting portion is cooperatively connected with the first limiting portion and can move relatively in the first direction to realize guiding the bearing base so that the bearing base moves along the first direction. At the same time, the first guide member is sleeved outside the second guide member, so that the first guide member and the second guide member form a sleeve form. The first guide member and the second guide member are not easily bent, which can reduce the jamming of the wafer carrier, thereby reducing the failure of wafer loading and / or unloading.

[0050] In order to make the above objects, features and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0051] Referring toFigure 5 and Figure 6 The wafer carrier includes a carrier base 90 and a motion device 100. The motion device 100 is connected to the carrier base 90 and is used to drive the carrier base 90 to move in a first direction. Figure 5 The vertical direction (Y direction) is shown.

[0052] Furthermore, the supporting base 90 includes a bottom bracket 92, a carrier plate 93 and a connecting rod 91. The carrier plate 93 is used to support the wafer 10. The carrier plate 93 is arranged on the bottom bracket 92. The connecting rod 91 is passed through the bottom bracket 92 and is threadedly connected to the bottom bracket 92. The connecting rod 91 is also abutted against or fixedly connected to the carrier plate 93. In this arrangement, by adjusting the height of the connecting rod 91 protruding from the bottom bracket 92, the distance between the bottom bracket 92 and the carrier plate 93 can be adjusted, thereby adjusting the height of the carrier plate 93.

[0053] Specifically, the connecting rod 91 is provided with an external thread, and the bottom bracket 92 is provided with a matching threaded through hole. The connecting rod 91 is inserted into the threaded through hole and connected to the threaded through hole. The connecting rod 91 is also connected to the motion device 100 in a transmission manner. The motion device 100 drives the carrier 93 to move in the first direction through the connecting rod 91. In some embodiments, the motion device can be directly connected to the carrier 93 to drive the carrier 93 to move in the first direction without the connecting rod 91. The bottom bracket 92 is opposite to the middle of the carrier 93, the bottom bracket 92 is smaller in size, the carrier 93 is larger in size, and the outer peripheral surface of the carrier 93 protrudes from the outer peripheral surface of the bottom bracket 92. The carrier 93 carries the wafer 10, and its size is close to that of the wafer 10 to adapt to the wafer 10. The supporting device 23 can be a cylindrical structure, the bottom bracket 92 and the carrier 93 are located at the bottom of the cylindrical structure, and the side wall of the cylindrical structure can guide and limit the carrier 93 and reduce the wafer 10 from sliding.

[0054] Reference Figure 7 The motion device 100 in the embodiment of the present application includes a first guide member 30 and a second guide member 40. The first guide member 30 has a first accommodating cavity 31, and the first accommodating cavity 31 penetrates the surfaces of the first guide member 30 opposite to each other along the first direction. The first direction is the extension direction of the first guide member 30, such as Figure 7 As shown, the first direction is the vertical direction (Y direction), and the surfaces of the first guide member 30 that are opposite to each other along the first direction are the upper surface and the lower surface of the first guide member 30 .

[0055] A second guiding member 40 is disposed in the first accommodating cavity 31. Both opposite ends of the first accommodating cavity 31 in the first direction communicate with the outside, so that both opposite ends of the second guiding member 40 in the first direction can extend out of the first accommodating cavity 31, thereby increasing the moving range of the second guiding member 40 relative to the first guiding member 30, and thus improving the guiding range of the wafer carrier. At least one first limiting portion is disposed on the surface of the first accommodating cavity 31 to define the moving direction of the second guiding member 40.

[0056] In some possible examples, the first guiding member 30 is a cylinder. Along the first direction, the first accommodating cavity 31 is a through cavity, that is, the sizes of the cross-sections of the first accommodating cavity 31 are equal, which is convenient for the manufacture of the first accommodating cavity 31. The first guiding member 30 is configured to be fixedly connected to the machine table 21, that is, the first guiding member 30 is fixed relative to the machine table 21.

[0057] In some possible implementation manners, the first guiding member 30 includes a first segment 32 and a second segment 33 disposed along the first direction. One end of the first segment 32 is connected to one end of the second segment 33. The outer peripheral surface of the first segment 32 is recessed from the outer peripheral surface of the second segment 33, that is, a stepped surface is formed between the first segment 32 and the second segment 33.

[0058] Wherein, the first segment 32 is adjacent to the carrying base 90, and the size of the outer peripheral surface of the first segment 32 is smaller to facilitate adaptation to the carrying base 90. The size of the outer peripheral surface of the second segment 33 is larger to facilitate connection to the machine table 21. Exemplarily, the first accommodating cavity 31 penetrates through the first segment 32 and the second segment 33, and the wall thickness of the first segment 32 is smaller than the wall thickness of the second segment 33.

[0059] An installation ring 34 is disposed on the outer peripheral surface of the second segment 33. The installation ring 34 is provided with a first installation hole, and the machine table 21 is correspondingly provided with a second installation hole. A screw passes through one of the first installation hole and the second installation hole and is threadedly connected to the other, or, a bolt passes through the first installation hole and the second installation hole and is threadedly connected to a nut. The second segment 33, the first segment 32 and the installation ring 34 may be an integral structure.

[0060] In some possible examples, refer to Figure 8 , the first limiting portion includes a positioning groove 35 and a ball 50. The positioning groove 35 is disposed on the surface of the first accommodating cavity 31, and the ball 50 is disposed in the positioning groove 35. The positioning groove 35 accommodates the ball 50, and the ball 50 is in rolling cooperation with the second guiding member 40. By using the fact that the rolling friction is less than the sliding friction, on the one hand, it can ensure the smooth movement of the second guiding member 40 relative to the first guiding member 30, improve jamming, and on the other hand, it can reduce or even avoid metal debris generated by friction, reduce the scratching rate of the wafer 10, ensure the cleanliness of the wafer 10, and reduce the labor cost of cleaning the machine table 21 and the material cost of frequently replacing the wafer carrier.

[0061] Wherein, the diameter of the ball 50 is equal to or greater than the opening size of the positioning groove 35, and the diameter of the ball 50 is greater than the depth of the positioning groove 35, so that the ball 50 can roll in the corresponding positioning groove 35 and can prevent the ball 50 from falling out of the positioning groove 35.

[0062] In some possible examples, there are multiple first limiting parts, and the number of the first limiting parts can be 2M, where M is a positive integer greater than or equal to 1. The 2M first limiting parts are divided into N first limiting groups, each first limiting group has 2 first limiting parts, and the 2 first limiting parts in the same first limiting group are symmetrically located along the axis of the first guiding part.

[0063] It can be understood that the number of the first limiting parts is an even number, and another first limiting part is arranged at the symmetrical position of each first limiting part with respect to the axis of the first guiding part 30. In this way, the symmetry of the multiple first limiting parts with respect to the axis of the first guiding part 30 can be ensured to improve the smoothness of the movement of the first guiding part 30. The multiple first limiting parts can be arranged at equal intervals in the circumferential direction of the first accommodating cavity 31 to improve the uniformity of the distribution of the multiple first limiting parts.

[0064] It can be understood that each first limiting part includes a positioning groove 35 and a ball 50, that is, there are multiple positioning grooves 35 and balls 50, and they are in one-to-one correspondence. The multiple positioning grooves 35 surround a circle and surround the second guiding part 40. A ball 50 is correspondingly arranged in each positioning groove 35, and the balls 50 are in contact with the second guiding part 40 in a surrounding manner.

[0065] Continue to refer to Figure 5 , the second guiding part 40 is arranged in the first accommodating cavity 31 and can move relative to the first guiding part 30 along the first direction. The extending direction of the second guiding part 40 can also be the first direction. The second guiding part 40 has a second accommodating cavity 41, and the second accommodating cavity 41 penetrates through the surfaces of the second guiding part 40 opposite to each other along the first direction, that is, both ends of the second accommodating cavity 41 opposite to each other along the first direction communicate with the outside.

[0066] The second guiding part 40 is fixedly connected to the bearing base 90 to move synchronously with the bearing base 90, so as to guide the bearing base 90 through the cooperation between the second guiding part 40 and the first guiding part 30 and reduce the shaking of the bearing base 90. In some possible implementation manners, one end of the second guiding part 40 is threadedly connected to the bearing base 90, which is convenient for the installation and disassembly between the second guiding part 40 and the bearing base 90.

[0067] The second receiving cavity 41 is provided for the connecting rod 91 connected to the carrying base 90 to pass through, so as to connect the first driving device 22, thereby driving the carrying base 90 to move. Wherein, at least one second limiting part is arranged on the outer surface of the second guiding part 40, and the second limiting part is connected with the first limiting part in a matching manner and can move relatively in the first direction.

[0068] In this way, the first limiting part of the first guiding part 30 and the second limiting part of the second guiding part 40 cooperate with each other, which can effectively guide the carrying base 90, so that the carrying base 90 moves along the first direction. At the same time, by sleeving the first guiding part 30 outside the second guiding part 40, the first guiding part 30 and the second guiding part 40 form a sleeve form, and the first guiding part 30 and the second guiding part 40 are not easy to bend, which can reduce the jamming of the wafer carrying platform.

[0069] In some possible examples, the second guiding part 40 is a cylinder, and the second guiding part 40 is adapted to the first guiding part 30, so that the second guiding part 40 can slide smoothly in the first guiding part 30. Along the first direction, the second receiving cavity 41 is a through cavity, that is, the sizes of the cross sections of the second receiving cavity 41 are equal, so as to facilitate the manufacture of the second receiving cavity 41. A connecting rod 91 is arranged in the second receiving cavity 41, and the distance between the connecting rod 91 and the side wall of the second receiving cavity 41 is at least greater than half of the cross-sectional width of the connecting rod 91, so that there is a large gap between the side wall of the second receiving cavity 41 and the connecting rod 91, reducing the contact between the connecting rod 91 and the second receiving cavity 41, thereby reducing or even avoiding the friction between the connecting rod 91 and the second guiding part 40.

[0070] Wherein, the cross-sectional width of the connecting rod 91 refers to the width of the cross section of the connecting rod 91 obtained with a plane perpendicular to the first direction as the cross section. When the cross-sectional shape of the connecting rod 91 is circular, the cross-sectional width of the connecting rod 91 refers to the diameter length of the connecting rod 91. When the cross-sectional shape of the connecting rod 91 is elliptical, the cross-sectional width of the connecting rod 91 refers to the major axis length of the connecting rod 91. When the cross-sectional shape of the connecting rod 91 is rectangular, the cross-sectional width of the connecting rod 91 refers to the length of the long side of the connecting rod 91.

[0071] In some possible examples, the second limiting part includes a guiding groove 80 arranged on the outer surface of the second guiding part 40, and a partial area of the ball 50 is located in the corresponding guiding groove 80. By arranging the ball 50 in the positioning groove 35 and the guiding groove 80, the second guiding part 40 moves relative to the first guiding part 30 along the first direction, avoiding the rotation of the second guiding part 40.

[0072] Among them, there are multiple second limiting parts. For example, the number of second limiting parts can be 2N, where N is a positive integer greater than or equal to 1. The 2N second limiting parts are divided into N second limiting groups, and each second limiting group has 2 second limiting parts. The 2 second limiting parts in the same second limiting group are symmetrically located along the axis of the second guide member 40.

[0073] It can be understood that the number of second limiting parts is an even number, and another second limiting part is arranged at the symmetric position of each second limiting part with respect to the axis of the second guide member 40. In this way, the symmetry of the multiple second limiting parts with respect to the axis of the second guide member 40 can be ensured to improve the smoothness of the movement of the second guide member 40. The multiple second limiting parts can be arranged at equal intervals in the circumferential direction of the first accommodating cavity 31 to improve the uniformity of the distribution of the multiple second limiting parts.

[0074] In some possible implementation manners, refer to Figure 9 , the second limiting part includes two oppositely arranged baffles 60. The two baffles 60 both extend in the first direction, and a guide groove 80 is formed between the two baffles 60. Among them, the two baffles 60 are arranged at intervals on the outer peripheral surface of the second guide member 40. The two baffles 60 both extend in the first direction, and a guide groove 80 extending in the first direction is formed between the two baffles 60. The ball 50 is located in the guide groove 80. The two baffles 60 can move in the first direction and are difficult to rotate, so as to prevent the second guide member 40 from rotating relative to the first guide member 30.

[0075] In some other possible implementation manners, refer to Figure 10 , the second limiting part includes a substrate 70. The substrate 70 extends in the first direction, and a guide groove 80 is formed on the surface of the substrate 70 facing away from the second guide member 40. Among them, the substrate 70 is arranged on the outer peripheral surface of the second guide member 40. The guide groove 80 on the substrate 70 extends in the first direction, and the ball 50 is located in the guide groove 80. The substrate 70 can move in the first direction and is difficult to rotate, so as to prevent the second guide member 40 from rotating relative to the first guide member 30.

[0076] In still some other possible implementation manners, refer to Figure 11 , the second limiting part is a groove provided on the outer peripheral surface of the second guide member 40. The groove extends in the first direction, and both ends of the groove extend to both ends of the second guide member 40 respectively to facilitate the assembly of the first guide member 30. The groove also forms a guide groove 80, and the ball 50 is located in the guide groove 80. The second guide member 40 moves in the first direction and is difficult to rotate, so as to prevent the second guide member 40 from rotating relative to the first guide member 30.

[0077] Among them, the number of the second limiting parts can be less than or equal to the number of the balls 50. For example, the number of the second limiting parts is equal to the number of the balls 50, and each ball 50 is correspondingly arranged in a second limiting part to use all the balls 50 to stop the rotation of the second guiding part 40, and the rotation stopping effect is better. Another example is that the number of the second limiting parts is less than the number of the balls 50, and each ball 50 is correspondingly arranged in a second limiting part. The number of the second limiting parts is small, which is convenient for manufacturing while stopping the rotation.

[0078] At least a part of the side wall of the guiding groove 80 close to the first guiding part 30 is an arc surface to increase the contact area between the ball 50 and the first guiding part 30, reduce the local stress of the rolling parts, and improve the service life of the rolling parts.

[0079] In summary, the wafer carrier in the embodiment of the present application includes a carrier base 90 and a moving device 100. The moving device 100 is connected to the carrier base 90 to drive the carrier base 90 to move in the first direction. The moving device 100 includes a first guiding part 30 and a second guiding part 40. The first guiding part 30 has a first accommodating cavity 31. The first accommodating cavity 31 penetrates the opposite surfaces of the first guiding part 30 along the first direction, and at least one first limiting part is arranged on the surface of the first accommodating cavity 31. The second guiding part 40 is arranged in the first accommodating cavity 31, and at least one second limiting part is arranged on the outer surface of the second guiding part 40. The second limiting part is connected with the first limiting part in a matching manner and can move relatively in the first direction, so as to guide the carrier base 90 and enable the carrier base 90 to move along the first direction. At the same time, the first guiding part 30 is sleeved outside the second guiding part 40, so that the first guiding part 30 and the second guiding part 40 form a sleeve form. The first guiding part 30 and the second guiding part 40 are not easy to bend, which can reduce the jamming of the wafer carrier and reduce the failure of loading / unloading the wafer 10.

[0080] In the description of this specification, the embodiments or implementation manners are described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0081] In the description of this specification, the description with reference to the terms "one implementation manner", "some implementation manners", "illustrative implementation manner", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials or characteristics described in connection with the implementation manner or example are included in at least one implementation manner or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation manner or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more implementation manners or examples.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer carrier, characterized in that: include: A bearing base, and a motion device connected to the bearing base, the motion device being used to drive the bearing base to move in a first direction; The sports device comprises: A first guide member, wherein the first guide member has a first accommodating cavity, the first accommodating cavity penetrates the surface of the first guide member opposite to the first direction, and at least one first limiting portion is arranged on the surface of the first accommodating cavity; A second guide member is arranged in the first accommodating cavity, and at least one second limiting portion is arranged on the outer surface of the second guide member. The first limiting portion and the second limiting portion are cooperatively connected and can move relative to each other in the first direction.

2. The wafer carrier according to claim 1, characterized in that: The first guide member and the second guide member are columns.

3. The wafer carrier according to claim 1, characterized in that: The first limiting portion includes a positioning groove arranged on the surface of the first accommodating cavity and a ball located in the positioning groove, and the second limiting portion has a guiding groove away from the outer surface of the second guide member and extending along the first direction.

4. The wafer carrier according to claim 3, characterized in that: The diameter of the ball is equal to or greater than the opening size of the positioning groove, and the diameter of the ball is greater than the depth of the positioning groove.

5. The wafer carrier according to claim 1, characterized in that: The number of the second limiting parts is 2N, where N is a positive integer greater than or equal to 1; 2N second limiting parts constitute N second limiting groups, each of the second limiting groups has two second limiting parts, and the two second limiting parts in the same second limiting group are symmetrically arranged along the axis of the second guide member.

6. The wafer carrier according to claim 5, characterized in that: The number of the first limiting parts is 2M, where M is a positive integer greater than or equal to 1; The 2M first limiting parts are N first limiting groups, each of the first limiting groups has two first limiting parts, and the two first limiting parts in the same first limiting group are symmetrically positioned along the axis of the first guide member.

7. The wafer carrier according to any one of claims 3 to 6, characterized in that: The second limiting portion includes two baffles arranged opposite to each other. The two baffles are arranged on the outer peripheral surface of the second guide member and extend along the first direction. A guide groove is formed between the two baffles.

8. The wafer carrier according to any one of claims 3 to 6, characterized in that: The second limiting portion includes a substrate, which is disposed on the outer peripheral surface of the second guide member and extends along the first direction. A guide groove is formed on a surface of the substrate away from the second guide member.

9. The wafer carrier according to claim 3 or 4, characterized in that: The second limiting portion is a groove arranged on the outer peripheral surface of the second guide member, the groove extends along the first direction, and the groove also forms the guide groove.

10. The wafer carrier according to claim 3 or 4, characterized in that: At least a portion of the side wall of the guide groove close to the first guide member is an arc surface.

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