Wafer switching mechanism and wafer processing equipment

Abstract

The utility model provides a wafer switching mechanism and wafer processing equipment, the wafer switching mechanism comprises a carrier plate, the carrier plate comprises a main body part and a plurality of carrier parts, the plurality of carrier parts are uniformly distributed along the circumference of the main body part, and the carrier parts are used for bearing wafers; the driving part is provided with an output rotating shaft, the main body part is in transmission connection with the output rotating shaft, and the driving part is used for driving the main body part to rotate. According to the utility model, a plurality of wafers can be loaded at the same time, and switching is convenient to realize continuous processing.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer switching mechanism and wafer processing equipment. Background Art

[0002] Existing wafer processing equipment can usually only process one wafer, requiring frequent loading and unloading of materials, which greatly affects the processing efficiency of the wafer. Utility Model Content

[0003] In view of the deficiencies in the prior art, the first object of the present invention is to provide a wafer switching mechanism that can load multiple wafers at the same time and facilitate switching to achieve continuous processing.

[0004] Another object of the present invention is to provide a wafer processing device, which can reduce the downtime frequency, thereby effectively improving the wafer processing efficiency.

[0005] The embodiments of the present invention are implemented by the following technical solutions:

[0006] A wafer switching mechanism includes a carrier plate, the carrier plate includes a main body and multiple carrier parts, the multiple carrier parts are evenly distributed along the circumference of the main body, and the carrier part is used to carry wafers; it also includes a driving member, which has an output shaft, the main body is transmission-connected to the output shaft, and the driving member is used to drive the main body to rotate.

[0007] According to a preferred embodiment, the carrier portion is provided with a positioning column and a limiting member, the wafer is located in an area defined by the positioning column and the limiting member, and the limiting member acts on the wafer so that the wafer can abut against the positioning column.

[0008] According to a preferred embodiment, the limiting member includes a pressure arm rod and a limiting block, the pressure arm rod is pivotally connected to the carrier part, the first end of the pressure arm rod is configured with a clamping surface, the first end of the pressure arm rod is located between the wafer and the limiting block, and a first spring is pressed between the pressure arm rod and the limiting block.

[0009] According to a preferred embodiment, the pressing surface is a cylindrical surface.

[0010] According to a preferred embodiment, the rotation axis between the pressure arm lever and the carrier portion is defined as the first axis; and the distance from the first end of the pressure arm lever to the first axis is smaller than the distance from the second end of the pressure arm lever to the first axis.

[0011] According to a preferred embodiment, the positioning post includes an outer cylinder and an adjusting rod. The outer cylinder is installed on the carrier part, and the adjusting rod is embedded in the outer cylinder. A plurality of weakening slots are provided through the side wall of the outer cylinder, and the plurality of weakening slots are evenly distributed along the circumferential direction of the outer cylinder. The inner wall of the outer cylinder is configured with a first conical surface, and the weakening slots are within the area of the first conical surface. The adjusting rod includes an adjusting section and an assembling section connected to each other. The adjusting section is configured with a second conical surface adapted to the first conical surface, and the assembling section is threadedly connected to the outer cylinder.

[0012] According to a preferred embodiment, the inner wall of the outer cylinder further includes an inner guiding section, and the adjusting rod further includes an outer guiding section. The outer guiding section is connected to the adjusting section, and the adjusting section is located between the outer guiding section and the assembling section. The outer guiding section is slidably connected to the inner guiding section.

[0013] According to a preferred embodiment, the first end of the adjusting rod is configured with an operating part. A second spring is sleeved outside the adjusting rod, and the second spring is located between the operating part and the end of the outer cylinder.

[0014] According to a preferred embodiment, the weakening slots extend along the axial direction of the outer cylinder.

[0015] A wafer processing device includes a frame and the aforementioned wafer switching mechanism, and the wafer switching mechanism is installed on the frame.

[0016] The technical solution of the embodiment of the present invention has at least the following advantages and beneficial effects:

[0017] The structure of the present invention is simple, convenient for switching multiple wafers to achieve continuous processing, and can effectively improve the production and processing efficiency of wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 It is a three-dimensional structure schematic diagram of the wafer switching mechanism provided by the embodiment of the present invention;

[0020] Figure 2 For Figure 1 a partial enlarged schematic diagram of the structure at A in

[0021] Figure 3Front view structural schematic diagram of the wafer switching mechanism provided by the embodiment of the present utility model;

[0022] Figure 4 Stereoscopic structural schematic diagram of the positioning post provided by the embodiment of the present utility model;

[0023] Figure 5 Front view structural schematic diagram of the positioning post provided by the embodiment of the present utility model;

[0024] Figure 6 is Figure 5 Cross-sectional view structural schematic diagram of the B-B section in

[0025] Figure 7 is Figure 6 Partial enlarged schematic diagram of the structure at C in

[0026] Icon: 1, carrier plate; 11, main body part; 12, carrier part; 2, driving member; 21, motor; 22, speed reducer; 3, mounting seat; 4, wafer; 5, positioning post; 51, outer cylinder; 511, weakened slot hole; 512, first conical surface; 513, inner guiding section; 52, second spring; 53, adjusting rod; 531, adjusting section; 5311, second conical surface; 532, assembling section; 533, outer guiding section; 54, operating part; 6, limiting member; 61, pressing arm rod; 611, pressing surface; 62, limiting block; 63, first spring. Detailed implementation manners

[0027] For better understanding and implementation, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

[0028] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present utility model belongs. The terms used in the description of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model.

[0030] Please refer to Figures 1 to 7, a wafer switching mechanism, comprising a carrier plate 1, the carrier plate 1 including a main body portion 11 and a plurality of carrier portions 12, the plurality of carrier portions 12 being circumferentially and evenly distributed along the circumference of the main body portion 11, the carrier portions 12 being used for carrying wafers 4; further comprising a driving member 2 having an output rotating shaft, the main body portion 11 being drivingly connected to the output rotating shaft, the driving member 2 being used for driving the main body portion 11 to rotate. Optionally, there are three carrier portions 12, that is, this wafer switching mechanism can simultaneously assemble three wafers 4. Applied to wafer 4 processing equipment, it can realize the switching of three wafers 4 so as to realize continuous operation, and it is convenient to switch wafers 4 to realize continuous processing. It should be noted that the number of carrier portions 12 can be set as required and is not limited to three.

[0031] As Figure 3 shown, in this embodiment, the driving member 2 includes a speed reducer 22 and a motor 21, the motor 21 being used for driving the speed reducer 22, and the main body portion 11 being installed on the output shaft of the speed reducer 22. Further, the speed reducer 22 is installed on the mounting seat 3.

[0032] Further, the carrier portion 12 is provided with a positioning post 5 and a limiting member 6. The wafer 4 is located within the area defined by the positioning post 5 and the limiting member 6, and the limiting member 6 acts on the wafer 4 so that the wafer 4 can abut against the positioning post 5. The assembly method of the limiting member 6 cooperating with the positioning post 5 here facilitates the disassembly and assembly of the wafer 4.

[0033] Even further, as Figure 1 and Figure 2 shown, the limiting member 6 includes a pressing arm rod 61 and a limiting block 62. The pressing arm rod 61 is pivotally connected to the carrier portion 12. A pressing surface 611 is arranged at the first end of the pressing arm rod 61. The first end of the pressing arm rod 61 is located between the wafer 4 and the limiting block 62, and a first spring 63 is pressed between the pressing arm rod 61 and the limiting block 62. With such a setting, the rapid disassembly and assembly of the wafer 4 can be realized, the operation is simple, and at the same time, the limiting member 6 is easy to produce and process, which is beneficial to reducing the cost of the wafer switching mechanism. Specifically, in use, the first spring 63 acts on the pressing arm rod 61, making it have a tendency to move towards the wafer 4, so as to cooperate with the positioning post 5 to apply a force to the wafer 4 in the radial direction of the wafer 4 to fix the wafer 4; when the wafer 4 needs to be disassembled, press the pressing arm rod 61 towards the wafer 4 at the second end of the pressing arm rod 61, so that the first end of the pressing arm rod 61, that is, the pressing surface 611, can be separated from the wafer 4.

[0034] As Figure 2 shown, the pressing surface 611 is a cylindrical surface.

[0035] Define the rotating shaft between the pressing arm rod 61 and the carrier portion 12 as the first shaft; the distance from the first end of the pressing arm rod 61 to the first shaft is less than the distance from the second end of the pressing arm rod 61 to the first shaft. With such a setting, it is beneficial to operate the pressing arm rod 61 when disassembling the wafer 4, achieving the purpose of labor saving.

[0036] As shown Figures 4 to 7 in the figure, the positioning post 5 includes an outer cylinder 51 and an adjusting rod 53. The outer cylinder 51 is installed on the carrier part 12, and the adjusting rod 53 is embedded in the outer cylinder 51. A plurality of weakening slot holes 511 are provided through the side wall of the outer cylinder 51, and the plurality of weakening slot holes 511 are evenly distributed along the circumferential direction of the outer cylinder 51. The inner wall of the outer cylinder 51 is provided with a first conical surface 512, and the weakening slot holes 511 are located in the area of the first conical surface 512. The adjusting rod 53 includes an adjusting section 531 and an assembling section 532 connected to each other. The adjusting section 531 is provided with a second conical surface 5311 adapted to the first conical surface 512, and the assembling section 532 is threadedly connected to the outer cylinder 51. Here, the outer cylinder 51 is made of metal, including but not limited to steel or aluminum alloy. The weakening slot holes 511 can endow the structure of the area between two adjacent weakening slot holes 511 on the outer cylinder 51 with elastic deformation ability. During use, when the adjusting rod 53 is rotated, under the action of the threaded connection between the assembling section 532 and the outer cylinder 51, the adjusting rod 53 moves axially, so that the first conical surface 512 and the second conical surface 5311 cooperate to expand the outer cylinder 51, that is, the outer diameter of the outer cylinder 51 can be finely adjusted under the action of the adjusting section 531, thereby enabling fine adjustment of the area defined by the positioning post 5 and the limiting member 6, which is beneficial to more accurate positioning adjustment of the assembled wafer 4.

[0037] As shown Figure 1 in the figure, there are two positioning posts 5.

[0038] In this embodiment, the weakening slot holes 511 extend along the axial direction of the outer cylinder 51.

[0039] As shown Figure 6 and Figure 7 in the figure, the inner wall of the outer cylinder 51 further includes an inner guiding section 513, and the adjusting rod 53 further includes an outer guiding section 533. The outer guiding section 533 is connected to the adjusting section 531, and the adjusting section 531 is located between the outer guiding section 533 and the assembling section 532. The outer guiding section 533 is slidably connected to the inner guiding section 513. Here, the cooperation between the outer guiding section 533 and the inner guiding section 513 can improve the structural stability of the adjustment of the adjusting rod 53 in the outer cylinder 51.

[0040] Further, a first end of the adjusting rod 53 is provided with an operating part 54; a second spring 52 is sleeved outside the adjusting rod 53, and the second spring 52 is located between the operating part 54 and the end of the outer cylinder 51. Here, the operating part 54 is disc-shaped, and its outer diameter is larger than the outer diameter of the outer guiding section 533. Here, the second spring 52 is in a compressed state, and the second spring 52 continuously applies pressure to the operating part 54 so that the adjusting rod 53 has a tendency to move upward along its axial direction, thereby playing a role in preventing loosening of the threaded connection between the assembling section 532 and the outer cylinder 51.

[0041] In this embodiment, an assembly hole (not shown in the figure) is provided on the carrier part 12, and the positioning post 5 is embedded in the assembly hole. It should be noted that there is enough space in the assembly hole to allow the adjusting rod 53 to move axially therein. When necessary, the assembly hole can be a through hole.

[0042] This embodiment also provides a wafer processing device, which includes a frame (not shown in the figure) and the aforementioned wafer switching mechanism, and the wafer switching mechanism is installed on the frame. Based on the wafer switching mechanism, this wafer 4 processing device can reduce the downtime frequency, thereby effectively improving the wafer 4 processing efficiency.

[0043] The technical means disclosed in the solution of the present invention are not limited to the technical means disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present invention.

Claims

1. A wafer switching mechanism, characterized in that: The carrier plate (1) comprises a main body (11) and a plurality of carrier parts (12), the plurality of carrier parts (12) are evenly distributed along the circumference of the main body (11), and the carrier parts (12) are used to carry wafers (4); It also comprises a driving member (2) having an output rotating shaft, the main body (11) being transmission-connected to the output rotating shaft, and the driving member (2) being used for driving the main body (11) to rotate.

2. The wafer switching mechanism according to claim 1, characterized in that: The carrier part (12) is provided with a positioning column (5) and a limiting member (6); the wafer (4) is located within an area defined by the positioning column (5) and the limiting member (6); the limiting member (6) acts on the wafer (4) so ​​that the wafer (4) can abut against the positioning column (5).

3. The wafer switching mechanism according to claim 2, characterized in that: The limiting member (6) comprises a pressure arm rod (61) and a limiting block (62); the pressure arm rod (61) is pivotally connected to the carrier part (12); the first end of the pressure arm rod (61) is provided with a clamping surface (611); the first end of the pressure arm rod (61) is located between the wafer (4) and the limiting block (62); and a first spring (63) is provided between the pressure arm rod (61) and the limiting block (62).

4. The wafer switching mechanism according to claim 3, characterized in that: The pressing surface (611) is a cylindrical surface.

5. The wafer switching mechanism according to claim 3, characterized in that: The rotation axis between the pressure arm rod (61) and the carrier part (12) is defined as a first axis; The distance from the first end of the pressure arm rod (61) to the first axis is smaller than the distance from the second end of the pressure arm rod (61) to the first axis.

6. The wafer switching mechanism according to claim 2, characterized in that: The positioning column (5) comprises an outer cylinder (51) and an adjusting rod (53), wherein the outer cylinder (51) is mounted on the carrier portion (12), and the adjusting rod (53) is embedded in the outer cylinder (51); A plurality of weakening slots (511) are provided through the side arm of the outer cylinder (51), and the plurality of weakening slots (511) are evenly distributed along the circumference of the outer cylinder (51); a first conical surface (512) is provided on the inner wall of the outer cylinder (51), and the weakening slots (511) are located in the region of the first conical surface (512); The adjusting rod (53) comprises an adjusting section (531) and an assembling section (532) which are connected to each other. The adjusting section (531) is provided with a second conical surface (5311) adapted to the first conical surface (512). The assembling section (532) is threadedly connected to the outer cylinder (51).

7. The wafer switching mechanism according to claim 6, characterized in that: The inner wall of the outer cylinder (51) further comprises an inner guide section (513), the adjusting rod (53) further comprises an outer guide section (533), the outer guide section (533) is connected to the adjusting section (531), and the adjusting section (531) is located between the outer guide section (533) and the assembly section (532); The outer guide section (533) is slidably connected to the inner guide section (513).

8. The wafer switching mechanism according to claim 6, characterized in that: The first end of the adjusting rod (53) is provided with an operating portion (54); The adjusting rod (53) is provided with a second spring (52) on its outer sleeve, and the second spring (52) is located between the operating portion (54) and the end of the outer cylinder (51).

9. The wafer switching mechanism according to claim 6, characterized in that: The weakening slot (511) is arranged to extend along the axial direction of the outer cylinder (51).

10. A wafer processing equipment, characterized in that: It comprises a frame and a wafer switching mechanism as described in any one of claims 1 to 9, wherein the wafer switching mechanism is installed on the frame.

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