Phase shifter cavity of antenna

By using conductive solderable layers of copper coating and tin solder coating on the antenna phase shifter cavity, the problems of material waste and pollution are solved, and an efficient and environmentally friendly production process is achieved.

CN223052355UActive Publication Date: 2025-07-01SHENZHEN JINSHANGJIN NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202422025523.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-20
Publication Date
2025-07-01
Estimated Expiration
2034-08-20

AI Technical Summary

Technical Problem

The existing antenna phase shifter cavity has problems such as large waste of materials, heavy pollution and low efficiency.

Method used

The conductive solderable layer using copper coating and tin solder coating is sprayed at local locations of the phase shifter cavity body through cold spraying technology. The bonding strength is high, the material utilization rate is high, and the environmental protection and pollution-free.

Benefits of technology

It reduces material consumption by more than 80%, improves processing efficiency, realizes green manufacturing, and is suitable for large-scale production.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of communication, and discloses a phase shifter cavity of an antenna. The phase shifter cavity comprises a phase shifter cavity base body and a conductive weldable layer, the phase shifter cavity base body comprises a phase shifter cavity body and a raised line arranged on the phase shifter cavity body, the phase shifter cavity body is provided with at least one weldable position, and the weldable positions are located on one side or two sides of the raised line; the conductive weldable layer comprises a copper coating and a tin solder coating, the copper coating is arranged on the weldable position, the tin solder coating is arranged on the copper coating, and the conductive weldable layer is used for welding the antenna and an external communication assembly and performing communication. The material utilization rate of the phase shifter cavity is improved, pollution is small, and efficiency is high.
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Description

Technical Field

[0001] The utility model relates to the field of communication technologies, and in particular to a phase shifter cavity of an antenna. Background Art

[0002] The phase shifter of an antenna is a key device commonly used in systems such as radars and communications. For example, it controls the direction of signals in phased array radars and wireless networks. The conductivity and welding performance of its cavity directly affect the performance of the whole machine. The traditional manufacturing process mainly uses integral electroplating of nickel layer, copper layer and tin layer on the surface of the aluminum alloy cavity, and the tin layer is used to ensure the bonding force, which has problems such as large material waste, heavy pollution and low efficiency. Summary of the Utility Model

[0003] The main purpose of the utility model is to provide a phase shifter cavity of an antenna, aiming to solve the technical problems of large material waste, heavy pollution and low efficiency existing in the existing phase shifter cavities.

[0004] To achieve the above purpose, the utility model provides a phase shifter cavity of an antenna, and the phase shifter cavity of the antenna includes:

[0005] A phase shifter cavity base body, the phase shifter cavity base body includes a phase shifter cavity body and a rib provided on the phase shifter cavity, and at least one weldable position is provided on the phase shifter cavity body, and the weldable position is located on one side or both sides of the rib;

[0006] At least one conductive weldable layer, the conductive weldable layer includes a copper coating and a tin solder coating, the copper coating is provided on the weldable position, the tin solder coating is provided on the copper coating, and the conductive weldable layer is used for welding the antenna and an external communication component and conducting communication. Among them, the copper powder particle size of the copper coating is 1μm - 45μm, and the tin solder powder particle size of the tin solder coating is 2μm - 53μm.

[0007] Further, in an embodiment, the rib is arranged along the length direction of the phase shifter cavity body.

[0008] Further, in an embodiment, the bonding strength between the conductive weldable layer and the phase shifter cavity body is 15MPa - 70 MPa.

[0009] Further, in an embodiment, the copper coating is provided on the weldable position by a cold spraying process, and the tin solder coating is provided on the copper coating by a cold spraying process.

[0010] Further, in an embodiment, the material of the copper coating is pure copper or copper alloy, and the thickness of the copper coating is 5μm - 100μm.

[0011] Further, in an embodiment, the solder coating is a tin alloy coating, and the thickness of the solder coating is 5μm - 100μm.

[0012] Further, in an embodiment, a plurality of solderable positions are provided, and a plurality of conductive solder layers are correspondingly provided, and each conductive solder layer is correspondingly provided on each solderable position.

[0013] Further, in an embodiment, the solderable position is pre-treated to form an attachment surface for enhancing the bonding with the copper coating.

[0014] Further, in an embodiment, the material of the phase shifter cavity body is aluminum alloy, and the phase shifter cavity body is formed by die casting process, numerical control machining process and milling process in sequence.

[0015] Further, in an embodiment, the copper powder particle size of the copper coating is 1μm - 45μm, and the solder powder particle size of the solder coating is 2μm - 53μm.

[0016] In the technical solution provided by the present utility model, the phase shifter cavity body includes a phase shifter cavity body and a rib provided on the phase shifter cavity body. The phase shifter cavity body is provided with at least one solderable position, and the solderable position is located on one side or both sides of the rib; at least one conductive solder layer, and the conductive solder layer includes a copper coating and a solder coating, reducing the attachment process of a nickel metal layer, reducing the material consumption by more than 80%, and only need to set the conductive solder layer at the position where conductive soldering is required, without covering the conductive solder layer comprehensively, improving the material utilization rate; and the conductive solder layer is combined with the metal strip substrate through the cold spraying process, with strong bonding force between the two, close interface bonding, uniform thickness, and good solderability; the cold spraying process is a pure physical processing process, without chemical reaction, without generating waste gas and waste water, friendly to the environment, and the raw material powder can be recycled, truly realizing green manufacturing; the cold spraying process accelerates the powder to impact the metal strip substrate through high air pressure to generate plastic deformation and then combine, with simple process, time saving, high efficiency, and suitable for mass production. Description of the Drawings

[0017] One or more embodiments are exemplarily illustrated by corresponding drawings. These exemplary illustrations do not limit the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, and the drawings in the drawings do not constitute a proportional limitation.

[0018] Figure 1 It is a schematic structural diagram of a phase shifter cavity of an embodiment of the present utility model;

[0019] Figure 2 is Figure 1 the sectional view at A - A in.

[0020] Among them, 100 is the phase shifter cavity; 10 is the phase shifter cavity base; 101 is the phase shifter cavity body; 102 is the rib; 103 is the weldable position; 20 is the conductive weldable layer; 201 is the copper coating; 202 is the tin solder coating. Specific embodiments

[0021] For the convenience of understanding the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are only for the purpose of illustration. In the description of the present invention, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating relative importance or implicitly indicating the quantity of the indicated technical features. Thus, unless otherwise stated, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features; the meaning of "plurality" is two or more. The term "comprising" and any deformation thereof mean non-exclusive inclusion, and there may be or be added one or more other features, integers, steps, operations, units, components and / or their combinations.

[0022] In addition, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or the internal communication of two elements. All the technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention are only for the purpose of describing specific embodiments and are not used to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0023] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0024] Please refer to Figures 1-2 , an embodiment of the present invention discloses a phase shifter cavity 100 of an antenna.

[0025] In one embodiment, as Figures 1-2As shown in the figure, the phase shifter cavity 100 of the antenna includes a phase shifter cavity base body 10 and at least one conductive solderable layer 20. The phase shifter cavity base body 10 includes a phase shifter cavity body 101 and a rib 102 provided on the phase shifter cavity body 101. Specifically, the rib 102 is arranged along the length direction of the phase shifter cavity body 101, and the rib 102 facilitates welding or connecting other communication components; at least one solderable position 103 is provided on the phase shifter cavity body 101, and the solderable position 103 is located on one side or both sides of the rib 102. The solderable position 103 is a partial area on the surface of the phase shifter cavity body 101, rather than the entire surface of the phase shifter cavity body 101; the conductive solderable layer 20 is provided on the solderable position 103, and the conductive solderable layer 20 is used for welding the antenna to an external communication component and for mutual communication. Therefore, the conductive solderable layer 20 has both conductive properties and solderable properties. The conductive solderable layer 20 includes a copper coating 201 and a tin solder coating 202. The copper coating 201 is formed by spraying copper powder with a particle size of 1 μm - 45 μm on the solderable position 103 through a cold spraying process, and the tin solder coating 202 is formed by spraying tin solder powder with a particle size of 2 μm - 53 μm on the copper coating 201 through a cold spraying process. By spraying the conductive solderable layer 20 at a local position on the phase shifter cavity body 101 through a cold spraying process, there is no need to electroplate the conductive solderable layer 20 on the entire surface of the phase shifter cavity body 101, which avoids material waste, improves material utilization rate, and the cold spraying processing method makes the bonding force between the conductive solderable layer 20 and the phase shifter cavity body 101 stronger. The conductive solderable layer 20 is a pure physical process during spraying, without chemical reactions, and does not generate waste gas or waste water. The powder can be recycled, which is very environmentally friendly. At the same time, the local processing method saves time and improves efficiency.

[0026] In an embodiment, the solderable position 103 can be pretreated according to actual needs to form an attachment surface for enhancing the bonding with the copper coating 201.

[0027] Exemplarily, the pretreatment includes a series of processes such as degreasing, grinding, and pickling on a selected area of the phase shifter cavity body 101 to remove impurities and oil stains on the surface of the phase shifter cavity body 101 and form a rough microstructure, thereby increasing the bonding area between the phase shifter cavity body 101 and the copper coating 201 while ensuring cleanliness, and improving the bonding effect between the phase shifter cavity body 101 and the copper coating 201. And after bonding, the bonding strength between the phase shifter cavity body 101 and the copper coating 201 can be measured by a tensile testing machine.

[0028] In an embodiment, the material of the phase shifter cavity base body 10 is aluminum alloy, and the phase shifter cavity base body 10 is formed by die-casting process, numerical control machining process, and milling process in sequence. And the die-casting process, numerical control machining process, and milling process are pure physical processes without chemical reactions and pollution.

[0029] In one embodiment, the material of the copper coating 201 is pure copper or a copper alloy. To ensure the performance of the copper coating 201, the copper content in the copper coating 201 is in the range of 80% - 99.9%, preferably 99.9%. The copper powder particle size of the copper coating 201 is 1μm - 45μm. The copper coating 201 with a thickness of 5μm - 100μm is sprayed on the weldable position 103 through a cold spraying process. In the cold spraying process during processing, the raw material powder particles of the copper coating 201 are not heated, or are heated only enough to make the particles plastically soften. High-pressure gas is used to accelerate the powder particles to a high speed, and then they collide with the phase shifter cavity body 101. The energy related to the collision event causes a high degree of plastic deformation, which makes the particles combine with the phase shifter cavity body 101, thus establishing a layered structure, and then obtaining the copper coating 201. The bonding strength between the copper coating 201 and the phase shifter cavity body 101 is 15MPa - 70 MPa. Since the bonding strength is large, there is no need to additionally add a nickel layer between the phase shifter cavity body 101 and the copper coating 201 to ensure the bonding force, reducing the material consumption of one nickel layer and simplifying the process. The cold spraying process generates plastic deformation by high-speed collision of particles with the phase shifter cavity body 101 to establish a layered structure. The whole processing process is a pure physical process, without chemical reactions, no waste gas and waste water are generated, and the powder can be recycled, which is very environmentally friendly and has little pollution.

[0030] In one embodiment, the tin solder coating 202 is a tin alloy coating. The tin alloy is a non-ferrous alloy composed of tin as the base and other alloying elements added. The other alloying elements can be copper, silver, bronze, etc. To ensure the performance of the tin solder coating 202, the tin content in the tin solder coating 202 is in the range of 80% - 99.99%. The tin solder powder particle size of the tin solder coating 202 is 2μm - 53μm. The tin solder coating 202 with a thickness of 5μm - 100μm is sprayed on the weldable position 103 through a cold spraying process. In the cold spraying process during processing, the raw material powder particles of the tin solder coating 202 are not heated, or are heated only enough to make the particles plastically soften. High-pressure gas is used to accelerate the powder particles to a high speed, and then they collide with the copper coating 201. The energy related to the collision event causes a high degree of plastic deformation, which makes the particles combine with the copper coating 201, thus establishing a layered structure, and then obtaining the tin solder coating 202. The bonding strength between the tin solder coating 202 and the copper coating 201 is 15MPa - 70MPa, and the bonding strength is large. The cold spraying process generates plastic deformation by high-speed collision of particles with the copper coating 201 to establish a layered structure. The whole processing process is a pure physical process, without chemical reactions, no waste gas and waste water are generated, and the powder can be recycled, which is very environmentally friendly and has little pollution.

[0031] In one embodiment, a plurality of solderable positions 103 are provided, and a plurality of conductive solderable layers 20 are correspondingly provided. Each conductive solderable layer 20 is correspondingly disposed on each solderable position 103, so that a plurality of solderable positions 103 can be pre-treated on the phase shifter cavity body 101 according to the actual requirements of the antenna, and then the conductive solderable layer 20 is sprayed on the solderable positions 103, enabling the antenna to be welded to an external communication component and communicate with each other. According to the actual spraying of the conductive solderable layer 20, it is not necessary to electroplate the conductive solderable layer 20 on the entire surface of the phase shifter cavity substrate 10. Electroplating the conductive solderable layer 20 on the entire surface not only has a long processing time and low efficiency, but also wastes a large amount of materials.

[0032] In a specific embodiment, the process of preparing the phase shifter cavity 100 includes:

[0033] 1) Providing an aluminum alloy blank;

[0034] 2) Sequentially processing the phase shifter cavity substrate 10 into the required shape through the processes of die casting, numerical control machining, and milling;

[0035] 3) Shielding other areas on the surface of the phase shifter cavity body 101 except for the solderable positions 103 with a jig. The material of the jig can be stainless steel or aluminum alloy;

[0036] 4) Using a pulsed fiber laser with a wavelength of 1064 nm, adjusting the focused spot diameter to 1 mm, the pulse width to 10 ms, and the frequency to 20 Hz, performing point-by-point scanning heating on the surface of the solderable position 103 at a scanning speed of 10 mm / s, and heating each point for 1 s to make the surface temperature of the solderable position 103 reach 150 - 250 °C;

[0037] 5) Using a cold spraying process to spray atomized copper powder with an average particle size of 15 μm and a purity of 99.95% on the solderable position 103 to prepare a copper coating 201 with a thickness of 30 μm;

[0038] 6) Using a cold spraying process to spray a solder composed of tin and bronze with an average particle size of 5 μm on the copper coating 201 to prepare a solder coating 202 with a thickness of 15 μm;

[0039] 7) Removing the shielding jig to obtain the phase shifter cavity 100 composed of an aluminum substrate, a copper intermediate layer, and a solder layer.

[0040] The phase shifter cavity of the present application is composed of a copper coating and a tin solder coating to form a conductive and solderable layer, reducing the attachment process of a nickel metal layer, reducing material consumption by more than 80%. At the same time, the conductive and solderable layer only needs to be set at the positions where conductive welding is required, without the need to fully cover the conductive and solderable layer, improving the material utilization rate. Moreover, the conductive and solderable layer is combined with the phase shifter cavity body through the cold spraying process. The combination force between the two is strong, the interface combination is tight, the thickness is uniform, and the solderability is good. The cold spraying process is a pure physical processing process without chemical reactions, without generating waste gas and waste water, friendly to the environment, and the raw material powder can be recycled, truly realizing green manufacturing. The cold spraying process accelerates the powder through high air pressure to impact the phase shifter cavity body to generate plastic deformation and combine. The manufacturing process is simple, time-saving, efficient, and suitable for mass production.

[0041] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them. Under the idea of the present invention, the technical features in the above embodiments or different embodiments can also be combined, and the steps can be implemented in any order. There are many other variations in different aspects of the present invention as described above. For the sake of brevity, they are not provided in detail. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features. And these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A phase shifter cavity of an antenna, characterized in that: The phase shifter cavity comprises: A phase shifter cavity substrate, the phase shifter cavity substrate comprising a phase shifter cavity body and a convex strip arranged on the phase shifter cavity body, the phase shifter cavity body is provided with at least one weldable position, and the weldable position is located on one side or both sides of the convex strip; At least one conductive solderable layer, the conductive solderable layer includes a copper coating and a tin solder coating, the copper coating is arranged on the solderable position, the tin solder coating is arranged on the copper coating, and the conductive solderable layer is used for welding the antenna to communicate with external communication components.

2. The phase shifter cavity of the antenna according to claim 1, characterized in that: The convex strips are arranged along the length direction of the phase shifter cavity body.

3. The phase shifter cavity of the antenna according to claim 1, characterized in that: The bonding strength between the conductive solderable layer and the phase shifter cavity body is 15 MPa-70 MPa.

4. The phase shifter cavity of the antenna according to claim 1, characterized in that: The copper coating is disposed on the solderable position by a cold spraying process, and the tin solder coating is disposed on the copper coating by a cold spraying process.

5. The phase shifter cavity of the antenna according to claim 1, characterized in that: The copper coating is made of pure copper or copper alloy, and the thickness of the copper coating is 5 μm-100 μm.

6. The phase shifter cavity of the antenna according to claim 1, characterized in that: The tin solder coating is a tin alloy coating, and the thickness of the tin solder coating is 5 μm-100 μm.

7. The phase shifter cavity of the antenna according to claim 1, characterized in that: The solderable positions are multiple, the conductive solderable layers are correspondingly multiple, and each conductive solderable layer is correspondingly arranged on each solderable position.

8. The phase shifter cavity of the antenna according to claim 1, characterized in that: The solderable spot is formed with a to-be-attached surface for enhancing the bonding with the copper coating through pretreatment.

9. The phase shifter cavity of the antenna according to claim 1, characterized in that: The phase shifter cavity matrix is ​​made of aluminum alloy, and is formed by die-casting, CNC machining and milling processes in sequence.

10. The phase shifter cavity of the antenna according to claim 1, characterized in that: The copper powder particle size of the copper coating is 1 μm-45 μm, and the tin solder powder particle size of the tin solder coating is 2 μm-53 μm.