Heat dissipation structure and circuit board assembly

Abstract

The utility model discloses a heat dissipation structure and a circuit board assembly, and relates to the technical field of display equipment, the heat dissipation structure comprises a heat conduction plate and a heat dissipation fin, the heat conduction plate is provided with a first side and a second side opposite to the first side, the first side is used for being at least attached to the front surface of a circuit board main body, and the second side is used for being attached to the back surface of the circuit board main body. The heat conducting plate is provided with a high-heat area corresponding to a heating element on the circuit board body, and the cooling fin is arranged on the second side and located in the high-heat area. According to the technical scheme of the utility model, the heat of the position, where the heating element is arranged, of the circuit board main body is higher, and the heat dissipation capability of the part, where the heat is higher, of the circuit board main body is improved in a targeted manner by arranging the heat dissipation fins in the high-heat area, namely the area, corresponding to the heating element, of the heat conduction plate, so that the heat dissipation performance of the part, where the heat is higher, of the circuit board main body is improved. The overall heat dissipation performance is guaranteed, meanwhile, excessive size cannot be occupied, passive heat dissipation is adopted in the whole, and noise cannot be generated.

Description

Technical Field

[0001] The utility model relates to the technical field of display devices, and particularly relates to a heat dissipation structure and a circuit board assembly. Background Art

[0002] With the continuous development of television display technology, the resolution and brightness of the television screen are getting higher and higher, which leads to an increase in the heat generation of the internal circuit board (especially the T-CON board). The T-CON board (Timing Controller, logic board) is one of the core components of the display screen, and its main function is to process the input signal and convert it into a signal that the display screen can understand. Due to the large workload and high working temperature of the T-CON board, if heat dissipation cannot be carried out in time, its performance and lifespan will be affected, and even the television may malfunction.

[0003] At present, the T-CON board in a television usually uses a heat dissipation method of overall covering with a heat sink or a fan, but these methods have some deficiencies. The overall covering with a heat sink and a fan occupies a large space, and the fan will generate noise during operation, affecting the user experience. Summary of the Utility Model

[0004] The main purpose of the utility model is to propose a heat dissipation structure and a circuit board assembly, aiming to at least solve the technical problems that the heat dissipation structure of the circuit board in the related art occupies a large space and generates noise during operation.

[0005] To achieve the above purpose, a heat dissipation structure proposed by the utility model includes:

[0006] A heat conducting plate having a first side and a second side opposite to the first side, the first side being used to at least attach to the front of the main body of the circuit board, and the heat conducting plate having a high heat region corresponding to the heat generating element on the circuit board main body; and,

[0007] A heat sink disposed on the second side and located in the high heat region.

[0008] In an embodiment, the heat sink includes a plurality of heat dissipation parts arranged horizontally;

[0009] On the second side of the heat conducting plate, a plurality of grooves are arranged horizontally in the high heat region, and the side walls of the grooves form the heat dissipation parts.

[0010] In an embodiment, the plurality of grooves are formed by stamping on the second side of the heat conducting plate.

[0011] In an embodiment, adjacent two of the heat dissipation parts are horizontally disconnected.

[0012] In one embodiment, the plurality of heat dissipation parts include two edge heat dissipation parts that are laterally close to the heat conduction plate;

[0013] The edge heat dissipation part and the heat conduction plate are laterally disconnected.

[0014] In one embodiment, the heat conduction plate is provided with a flanging part extending towards the first side at a position close to the edge heat dissipation part, and the flanging part and the corresponding edge heat dissipation part are laterally spaced apart.

[0015] In one embodiment, the material of the heat conduction plate includes a heat conduction shielding material.

[0016] In one embodiment, a heat conduction coating is provided on the first side and / or the second side and / or the outside of the heat sink.

[0017] In one embodiment, the heat conduction coating includes a graphite coating.

[0018] The present utility model also proposes a circuit board assembly, including a circuit board main body and a heat dissipation structure. A heating element is provided on the circuit board main body, and the heat dissipation structure includes:

[0019] A heat conduction plate having a first side and a second side opposite to the first side. The first side is used to at least attach to the front of the circuit board main body, and the heat conduction plate has a high heat region corresponding to the heating element on the circuit board main body; and,

[0020] A heat sink provided on the second side and located in the high heat region.

[0021] In the technical solution of the present utility model, the heat conduction plate has a first side and a second side opposite to the first side. The first side is used to at least attach to the front of the circuit board main body, and the heat conduction plate has a high heat region corresponding to the heating element on the circuit board main body. The heat sink is provided on the second side and located in the high heat region. With such a setting, the heat conduction plate is attached to the circuit board main body to dissipate heat from the circuit board main body. The position on the circuit board main body where the heating element is provided has a higher temperature. By providing the heat sink in the high heat region, that is, the region on the heat conduction plate corresponding to the heating element, the heat dissipation capacity of the part with higher heat on the circuit board main body is specifically improved. While ensuring the overall heat dissipation performance, it does not occupy too much volume, and the overall uses passive heat dissipation without generating noise. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0023] Figure 1 Schematic perspective view of an embodiment of the heat dissipation structure provided by the present invention;

[0024] Figure 2 Schematic exploded perspective view of an embodiment of the circuit board assembly provided by the present invention;

[0025] Figure 3 is Figure 2 Cross-sectional structure view of the circuit board assembly in

[0026] Figure 4 is Figure 2 Structure view of another embodiment of the heat dissipation structure in

[0027] Explanation of the reference numerals in the drawings:

[0028] 1000, circuit board assembly; 100, heat dissipation structure; 1, heat conducting plate; 101, groove; 102, turning edge part; 11, first side; 12, second side; 13, high heat area; 2, heat sink; 21, heat dissipation part; 211, edge heat dissipation part; 3, heat conducting coating; 200, circuit board main body; 201, heating element.

[0029] The realization, functional features and advantages of the object of the present invention will be further described in conjunction with the embodiments with reference to the drawings. Detailed implementation manners

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0031] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0032] In addition, if the descriptions such as "first" and "second" are involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel scenarios. Taking "A and / or B" as an example, it includes Scenario A, or Scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0033] With the continuous development of television display technology, the resolution and brightness of the television screen are getting higher and higher, which leads to an increase in the heat generation of its internal circuit board (especially the T-CON board). The T-CON board (Timing Controller, logic board) is one of the core components of the display screen, and its main function is to process the input signal and convert it into a signal that the display screen can understand. Due to the large workload and high working temperature of the T-CON board, if heat dissipation cannot be carried out in time, its performance and lifespan will be affected, and even the television may malfunction.

[0034] Currently, the T-CON board in a television usually uses the heat dissipation method of overall covering with a heat sink or a fan for heat dissipation, but these methods have some deficiencies. The overall covering heat sink and fan occupy a relatively large space, and the fan will generate noise during operation, affecting the user experience.

[0035] The main purpose of the present utility model is to propose a heat dissipation structure and a circuit board assembly, aiming to at least solve the technical problems that the heat dissipation structure of the circuit board in the related art occupies a relatively large space and generates noise during operation.

[0036] Please refer to Figure 1 、 Figure 2 and Figure 3 , in an embodiment of the present utility model, the heat dissipation structure 100 includes a heat conduction plate 1 and a heat sink 2. The heat conduction plate 1 has a first side 11 and a second side 12 opposite to the first side 11. The first side 11 is used to at least attach to the front surface of the circuit board main body 200. The heat conduction plate 1 has a high heat region 13 corresponding to the heat generating element 201 on the circuit board main body 200. The heat sink 2 is disposed on the second side 12 and is located in the high heat region 13.

[0037] In the technical solution of the present utility model, the heat conducting plate 1 has a first side 11 and a second side 12 opposite to the first side 11. The first side 11 is used to at least adhere to the front surface of the circuit board main body 200. The heat conducting plate 1 has a high heat region 13 corresponding to the heating element 201 on the circuit board main body 200. The heat sink 2 is arranged on the second side 12 and located in the high heat region 13. With such an arrangement, the heat conducting plate 1 is adhered to the circuit board main body 200 to dissipate heat from the circuit board main body 200. The position on the circuit board main body 200 where the heating element 201 is arranged has a higher temperature. By arranging the heat sink 2 in the high heat region 13, that is, the region on the heat conducting plate 1 corresponding to the heating element 201, the heat dissipation capacity of the part with higher heat on the circuit board main body 200 is specifically improved. While ensuring the overall heat dissipation performance, it will not occupy too much volume, and the overall uses passive heat dissipation without generating noise.

[0038] Among them, there are various types of the heating element 201. For example, it can be a chip, a capacitor, an inductor coil, a resistor, and so on.

[0039] The present design does not limit the specific number of the heat sinks 2. During actual design, it can be selected according to the heat dissipation requirements of each heating element 201 on the circuit board main body 200.

[0040] There are various ways to fix the heat conducting plate 1 to the circuit board main body 200. For example, it can be fixed by screws, or by bonding or clamping. The embodiments of the present utility model do not limit this here.

[0041] The back surface of the circuit board main body 200 is generally fixed to the bottom plate. Therefore, the heat conducting plate 1 is adhered to the front surface of the circuit board main body 200. However, it is not limited to adhering to the front surface only. A flanging portion can also be provided on the heat conducting plate 1. By adhering the flanging portion to the side of the circuit board main body 200, the contact area with the circuit board main body 200 can be increased, improving the heat dissipation capacity. At the same time, when the heat conducting plate 1 is installed on the circuit board main body 200, the flanging portion can play a positioning role. Of course, if only adhering to the front surface of the circuit board main body 200 is required, the structure of the heat conducting plate 1 is simpler and the production is more convenient.

[0042] There are various forming methods for the heat sink 2 and the heat conducting plate 1. It can be that the heat sink 2 and the heat conducting plate 1 are produced separately first, and then the heat sink 2 is installed in the high heat region 13 of the heat conducting plate 1. It can also be integrally formed. In the embodiments of the present utility model, the heat sink 2 and the heat conducting plate 1 are integrally formed, which makes the production more convenient.

[0043] The heat sink 2 may be formed by opening a groove on the heat conducting plate 1 or by setting a convex rib. In an embodiment of the utility model, the heat sink 2 includes a plurality of heat dissipation portions 21 arranged in a transverse direction; a plurality of grooves 101 are arranged in a transverse direction on the second side 12 of the heat conducting plate 1 in the high heat region 13, and the side walls of the grooves 101 constitute the heat dissipation portions 21; that is, the heat sink 2 is formed by setting the grooves 101 on the heat conducting plate 1. In comparison, the convex rib form is often formed by split molding and then fixed, or is formed by injection molding. The split molding and then fixed method will lead to more troublesome production, while the injection molding method has a higher cost.

[0044] The grooves 101 can be formed by cutting grooves on the heat conducting plate 1 using a groove cutting device, or can be formed by stamping. It is understandable that when cutting grooves using a groove cutting device, they need to be processed one by one. The more the grooves 101 are, the more troublesome the processing is. However, with the stamping forming method, a plurality of the grooves 101 can be punched out at one time using only a stamping head of a specific shape, which is more efficient. Therefore, in an embodiment of the utility model, the plurality of grooves 101 are stamped out on the second side 12 of the heat conducting plate 1.

[0045] After the plurality of heat dissipation parts are punched out by a punching device, two adjacent heat dissipation parts 21 may be connected together or disconnected. Please refer to Figure 3 , Figure 3 In the heat dissipation structure 100 shown in FIG. 1 , two adjacent heat dissipation portions 21 are disconnected, that is, they are not connected in the horizontal direction. Figure 4 , Figure 4 In the heat dissipation structure 100 shown, two adjacent heat dissipation parts 21 are connected. Obviously, when the two adjacent heat dissipation parts 21 are disconnected, the contact area between the heat sink 2 and the outside air is larger. After the heat of the heating element 201 is transferred to the heat sink 2, the heat can be dissipated into the air more quickly, and the heat dissipation effect is better. Therefore, in an embodiment of the utility model, the two adjacent heat dissipation parts 21 are disconnected in the horizontal direction.

[0046] In order to disconnect two adjacent heat dissipation parts 21 , the grooves 101 may be punched out and then cut by a cutting device, or they may be directly punched out until disconnected by punching.

[0047] Please refer to Figure 3 and Figure 4, as described above, similarly, when the heat dissipation part 21 located at the edge is laterally connected to the heat conduction plate 1, a considerable part of the surface area of the heat dissipation part 21 located at the edge will not be in contact with the outside air, but in contact with the air between the heat conduction plate 1 and the circuit board body 200. Therefore, in this embodiment, the plurality of heat dissipation parts 21 include two edge heat dissipation parts 211 that are laterally close to the heat conduction plate 1, and the edge heat dissipation part 211 is laterally disconnected from the heat conduction plate 1; by setting it like this, the contact area between the edge heat dissipation part 211 and the outside air can be increased, and the heat dissipation efficiency can be improved.

[0048] In order to achieve the disconnection between the edge heat dissipation part 211 and the heat conduction plate 1, holes can be directly opened at the connection part of the edge heat dissipation part 211 and the heat conduction plate 1. However, if holes are directly opened, the overall structure is like Figure 3 the heat dissipation structure 100 shown has no flanging part 102, which is likely to cause external dust and impurities to enter between the heat conduction plate 1 and the circuit board body 200. Long-term accumulation will affect the heat dissipation of the components on the circuit board body 200, and may also increase the risk of component damage. Therefore, in this embodiment, the heat conduction plate 1 is provided with a flanging part 102 extending towards the first side 11 at a position close to the edge heat dissipation part 211, and the flanging part 102 is laterally spaced from the corresponding edge heat dissipation part 211; by setting it like this, the flanging part 102 can reduce the possibility of impurities entering between the heat conduction plate 1 and the circuit board body 200, and at the same time can also increase the surface area of the overall structure and improve the heat dissipation efficiency.

[0049] There are various choices for the material of the heat conduction plate 1. It can be made of metal materials such as aluminum, copper, stainless steel, etc., or some non-metal materials with high thermal conductivity such as aluminum nitride ceramics.

[0050] It can be understood that the circuit board body 200 needs to be protected from the influence of external electromagnetic interference and noise during operation, which will affect the normal operation of the circuit. Further, in order to enable the heat dissipation structure 100 to shield external electromagnetic interference, in the embodiment of the present invention, the material of the heat conduction plate 1 includes a heat-conducting shielding material, that is, the heat conduction plate 1 uses a heat-conducting material that can play an electromagnetic shielding role, so that the heat conduction plate 1 can dissipate heat from the circuit board body 200 and can effectively prevent the influence of external high-frequency electromagnetic interference signals on the circuit, ensuring the normal operation of the circuit.

[0051] There are various heat-conducting shielding materials, such as iron, copper, aluminum, etc. In the embodiments of the utility model, the heat-conducting plate 1 includes an aluminum plate, that is, the material of the heat-conducting plate 1 is aluminum. The aluminum plate has good heat-conducting ability, enabling the heat energy of the circuit board main body 200 to be dissipated as soon as possible. At the same time, it can play an electromagnetic shielding role to protect the circuit board main body 200, and aluminum itself has good mechanical strength.

[0052] In order to further improve the heat dissipation ability of the heat dissipation structure 100, in the embodiments of the present utility model, a heat-conducting coating 3 is provided on the first side 11 and / or the second side 12 and / or the outer side of the heat sink 2. In this way, when the heat-conducting coating 3 is coated on the first side 11, the heat-conducting ability between the circuit board main body 200 and the heating element 201 and the heat-conducting plate 1 can be increased. When the heat-conducting coating 3 is coated on the second side 12, the heat exchange ability between the heat-conducting plate 1 and the air can be increased. When the heat-conducting coating 3 is provided on the outer side of the heat sink 2, the heat-conducting ability between the heat sink 2 and the air is increased, thereby improving the overall heat dissipation ability of the heat dissipation structure 100. Preferably, the heat-conducting coating 3 is provided on the outer sides of the first side 11, the second side 12, and the heat sink 2. The heat on the circuit board main body 200 is transferred to the heat-conducting plate 1 through the heat-conducting coating 3, and then transferred to the air through the heat-conducting coating 3. The heat of the heating element 201 is transferred to the heat-conducting plate 1 through the heat-conducting coating 3, then transferred to the heat sink 2, and then transferred to the air through the heat-conducting coating 3. By means of the heat-conducting coating 3, the heat dissipation ability is increased without occupying space.

[0053] It should be noted that the heat-conducting coating 3 on the first side 11, the second side 12, and the heat sink 2 can be the same heat-conducting coating 3 or different heat-conducting coatings 3. In the embodiments of the present utility model, for the convenience of production and processing, the three use the same heat-conducting coating 3, and there is no need to replace different heat-conducting coatings 3 during spraying to reduce efficiency.

[0054] There are various heat-conducting coatings 3, such as silicone grease coatings, graphite coatings, aluminum alloy coatings, etc. Preferably, in the embodiments of the present utility model, the heat-conducting coating 3 is a heat-conducting coating 3 with electromagnetic shielding function. In this way, through the setting of the heat-conducting coating 3, not only the heat dissipation ability of the heat dissipation structure 100 can be improved, but also the electromagnetic shielding ability of the circuit board main body 200 can be improved.

[0055] There is more than one heat-conducting coating 3 with electromagnetic shielding function, which can be a graphite coating or an aluminum alloy coating.

[0056] The present utility model further provides a circuit board assembly 1000, which includes a circuit board main body 200 and a heat dissipation structure 100. The specific structure of the heat dissipation structure 100 refers to the above embodiments. Since the circuit board assembly 1000 adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated herein one by one. Among them, a heating element 201 is provided on the circuit board main body 200.

[0057] In the technical solution of the present utility model, the heat conducting plate 1 has a first side 11 and a second side 12 opposite to the first side 11. The first side 11 is used to at least adhere to the front surface of the circuit board main body 200. The heat conducting plate 1 has a high heat area 13 corresponding to the heating element 201 on the circuit board main body 200. The heat sink 2 is arranged on the second side 12 and located in the high heat area 13. With such an arrangement, the heat conducting plate 1 is adhered to the circuit board main body 200 to dissipate heat from the circuit board main body 200. The position where the heating element 201 is provided on the circuit board main body 200 has a higher temperature. By arranging the heat sink 2 in the high heat area 13, that is, the area on the heat conducting plate 1 corresponding to the heating element 201, the heat dissipation capacity of the part with higher heat on the circuit board main body 200 is specifically improved. While ensuring the overall heat dissipation performance, it does not occupy too much volume, and the overall uses passive heat dissipation without generating noise.

[0058] There are various types of the heating element 201, such as chips, capacitors, inductance coils, resistors, etc. For the circuit board main body 200, the chips usually generate the most heat. Therefore, when arranging the heat sink 2, it is preferably arranged in the area corresponding to the chips.

[0059] The above is only an exemplary embodiment of the present utility model, and does not limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present utility model.

Claims

1. A heat dissipation structure, characterized in that: include: a heat conducting plate having a first side and a second side opposite to the first side, wherein the first side is used to be attached to at least the front surface of the circuit board body, and the heat conducting plate has a high heat area corresponding to the heating element on the circuit board body; and A heat sink is arranged on the second side and located in the high heat area.

2. The heat dissipation structure according to claim 1, characterized in that: The heat sink comprises a plurality of heat dissipation parts arranged in a transverse direction; The second side of the heat conducting plate is provided with a plurality of grooves in a lateral direction in the high heat area, and the side walls of the grooves constitute the heat dissipation portion.

3. The heat dissipation structure according to claim 2, characterized in that: The plurality of grooves are formed by punching the second side of the heat conducting plate.

4. The heat dissipation structure according to claim 2 or 3, characterized in that: Two adjacent heat dissipation parts are separated in the transverse direction.

5. The heat dissipation structure according to claim 2 or 3, characterized in that: The plurality of heat dissipation portions include two edge heat dissipation portions that are laterally close to the heat conducting plate; The edge heat dissipation portion and the heat conducting plate are separated in a transverse direction.

6. The heat dissipation structure according to claim 5, characterized in that: The heat conducting plate is provided with a flange portion extending toward the first side at a position close to the edge heat dissipation portion, and the flange portion is arranged at an interval with respect to the corresponding edge heat dissipation portion in the lateral direction.

7. The heat dissipation structure according to claim 1, characterized in that: The material of the heat conducting plate includes heat conducting shielding material.

8. The heat dissipation structure according to claim 1, characterized in that: The first side and / or the second side and / or the outer side of the heat sink are provided with a thermal conductive coating.

9. The heat dissipation structure according to claim 8, characterized in that: The thermally conductive coating includes a graphite coating.

10. A circuit board assembly, characterized in that: include: A circuit board body, wherein a heating element is arranged on the circuit board body; as well as, A heat dissipation structure according to any one of claims 1 to 9.

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