Plug-in welding structure of circuit main board and circuit auxiliary board

Abstract

The utility model discloses a plug-in welding structure of a circuit main board and a circuit auxiliary board, which comprises the circuit main board and the circuit auxiliary board, the circuit auxiliary board is plugged in a slot of the circuit main board, and a welding object of the circuit main board is fixedly connected with a welding object of the circuit auxiliary board through soldering tin. According to the technical scheme, the first arc-shaped recess is arranged at the position, where the first copper deposition area is arranged, of the slot wall of the circuit main board, and the second arc-shaped recess is also arranged at the position, where the second copper deposition area is arranged, of the board wall of the circuit auxiliary board. According to the technical scheme, the half-hole copper deposition design is adopted on the circuit main board and the circuit auxiliary board, so that the mechanical strength of the insertion part of the circuit main board and the circuit auxiliary board after welding is improved, and the possibility of cracking is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically, to a plugging and welding structure between a main circuit board and a secondary circuit board. Background Art

[0002] Due to their increasingly rich functions, products such as gas appliances, air conditioners, photovoltaic inverters, and kitchen appliances on the market have complex circuit structures. When wiring for a complex and large circuit structure, conventional operations are likely to result in a relatively large circuit board area, which is not conducive to the installation of the circuit board inside the product. To solve the above problems, currently, technicians will arrange all the components required for the entire circuit on two or more circuit boards, define one of the circuit boards as the main board, and the rest as secondary boards. The installation method between the main board and the secondary boards generally uses a vertical plugging method for connection, with a right angle at the connection, and solder is used at the connection to connect relevant circuits. In the prior art, the connection between the main circuit board and the secondary circuit board is prone to solder joint cracking. The reason for this phenomenon is that a certain length is exposed at the position on the main board surface where the secondary board is butted, which is equivalent to forming a lever, and the solder joint becomes the fulcrum, which is the point where the force is the greatest, and the stress is most concentrated here, resulting in the solder joint cracking and open circuit, forming poor contact. Summary of the Utility Model

[0003] To solve the above technical problems, the purpose of the utility model is to provide a plugging and welding structure between a main circuit board and a secondary circuit board.

[0004] The technical solution adopted by the utility model to solve the problem is:

[0005] A plugging and welding structure between a main circuit board and a secondary circuit board includes a main circuit board and a secondary circuit board, and both the main circuit board and the secondary circuit board are double-sided boards;

[0006] One or more slots are provided on the main circuit board. At least one first solder pad is provided at the edge of the slot on the front surface of the main circuit board, and at least one second solder pad is provided at the edge of the slot on the back surface of the main circuit board. At least one first copper deposition area is provided on the slot wall of the slot. The first solder pad, the second solder pad, and the first copper deposition area correspond to each other one by one. The corresponding first solder pad, second solder pad, and first copper deposition area form a welding object. In a welding object, the first solder pad is electrically connected to the second solder pad through the first copper deposition area. At the position where the first copper deposition area is provided on the slot wall of the slot, a first arc-shaped depression is provided.

[0007] The thickness of the circuit daughter board matches the width of the slot of the circuit main board. At least one third pad is provided at the front edge of the circuit daughter board, and at least one fourth pad is provided at the back edge of the circuit daughter board. At least one second copper deposition area is provided on the board wall of the circuit daughter board. The third pad, the fourth pad, and the second copper deposition area correspond to each other one by one. The corresponding third pad, fourth pad, and second copper deposition area form a welding object. In a welding object, the third pad is electrically connected to the fourth pad through the second copper deposition area. At the position where the second copper deposition area is provided on the board wall of the circuit daughter board, a second arc-shaped depression is provided;

[0008] The circuit daughter board is inserted into the slot of the circuit main board, and the welding objects of the circuit main board and the circuit daughter board are fixedly connected by solder.

[0009] As a further improvement of the above technical solution, both the circuit main board and the circuit daughter board are made of FR-4 material.

[0010] As a further improvement of the above technical solution, on the circuit main board, the first pad and the second pad have the same shape and size, and the width of the first arc-shaped depression of the slot is the same as the width of the first pad and the second pad;

[0011] On the circuit daughter board, the third pad and the fourth pad have the same shape and size, and the width of the second arc-shaped depression on the board wall of the circuit daughter board is the same as the width of the third pad and the fourth pad.

[0012] As a further improvement of the above technical solution, on the circuit main board, the depth of the first arc-shaped depression of the slot is half of its width, and the depth of the second arc-shaped depression on the board wall of the circuit daughter board is half of its width.

[0013] The beneficial effect of the present utility model is that in the present technical solution, at the position where the first copper deposition area is provided on the slot wall of the circuit main board, a first arc-shaped depression is provided. At the same time, at the position where the second copper deposition area is provided on the board wall of the circuit daughter board, a second arc-shaped depression is provided. The present technical solution adopts a half-hole copper deposition design on the circuit main board and the circuit daughter board to improve the mechanical strength of the connection between the circuit main board and the circuit daughter board after welding and reduce the possibility of cracking. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present utility model will be further explained below in conjunction with the drawings and specific embodiments.

[0015] Figure 1 Figure a is the front view of the circuit main board in the present utility model;

[0016] Figure 1 Figure b is a cross-sectional view of the circuit main board in the present utility model;

[0017] Figure 2 Figure a is a front view of the circuit secondary board in the present utility model;

[0018] Figure 2 Figure b is a side view of the circuit secondary board in the present utility model. Specific embodiments

[0019] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the drawings. The function of the drawings is to supplement the description in the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present utility model. However, it should not be construed as a limitation on the protection scope of the present utility model.

[0020] In the description of the present utility model, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the present utility model.

[0021] In the description of the present utility model, the meaning of several is one or more, the meaning of multiple is more than two, greater than, less than, exceeding, etc. are understood as not including the present number, above, below, within, etc. are understood as including the present number. If the first and second are described only for the purpose of distinguishing technical features, they should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence relationship of the indicated technical features.

[0022] In the description of the present utility model, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.

[0023] Referring to Figure 1 and Figure 2 , the present application discloses a plugging and welding structure between a circuit main board and a circuit secondary board. In its first embodiment, it includes a circuit main board 100 and a circuit secondary board 200. Both the circuit main board 100 and the circuit secondary board 200 are double-sided boards;

[0024] One or more slots 110 are provided on the circuit main board 100. At least one first pad 120 is provided at the edge of the slot 110 on the front surface of the circuit main board 100. At least one second pad is provided at the edge of the slot 110 on the back surface of the circuit main board 100. At least one first copper deposition area 140 is provided on the slot wall of the slot 110. The first pad 120, the second pad, and the first copper deposition area 140 correspond to each other one by one. The corresponding first pad 120, second pad, and first copper deposition area 140 form a welding object. In a welding object, the first pad 120 is electrically connected to the second pad through the first copper deposition area 140. At the position where the first copper deposition area 140 is provided on the slot wall of the slot 110, a first arc-shaped depression 130 is provided.

[0025] The thickness of the circuit sub-board 200 matches the width of the slot 110 of the circuit main board 100. At least one third pad 210 is provided at the front edge of the circuit sub-board 200. At least one fourth pad is provided at the back edge of the circuit sub-board 200. At least one second copper deposition area 230 is provided on the board wall of the circuit sub-board 200. The third pad 210, the fourth pad, and the second copper deposition area 230 correspond to each other one by one. The corresponding third pad 210, fourth pad, and second copper deposition area 230 form a welding object. In a welding object, the third pad 210 is electrically connected to the fourth pad through the second copper deposition area 230. At the position where the second copper deposition area 230 is provided on the board wall of the circuit sub-board 200, a second arc-shaped depression 220 is provided.

[0026] The circuit sub-board 200 is inserted into the slot 110 of the circuit main board 100. The welding objects of the circuit main board 100 and the circuit sub-board 200 are fixedly connected by solder.

[0027] Specifically, in this embodiment, at the position where the first copper deposition area 140 is provided on the slot wall of the slot 110 of the circuit main board 100, a first arc-shaped depression 130 is provided. At the same time, at the position where the second copper deposition area 230 is provided on the board wall of the circuit sub-board 200, a second arc-shaped depression 220 is provided. In this embodiment, a half-hole copper deposition design is adopted on the circuit main board 100 and the circuit sub-board 200 to improve the mechanical strength of the insertion part between the circuit main board 100 and the circuit sub-board 200 after welding and reduce the possibility of cracking.

[0028] Further as a preferred implementation manner, in this embodiment, both the circuit main board 100 and the circuit sub-board 200 are made of FR-4 material.

[0029] As a further preferred embodiment, in this embodiment, on the circuit main board 100, the first pad 120 and the second pad have the same shape and size, and the width of the first arc-shaped recess 130 of the slot 110 is the same as the width of the first pad 120 and the width of the second pad;

[0030] On the circuit sub-board 200, the third pad 210 and the fourth pad have the same shape and size, and the width of the second arc-shaped recess 220 on the wall of the circuit sub-board 200 is the same as the width of the third pad 210 and the width of the fourth pad.

[0031] As a further preferred embodiment, in this embodiment, on the circuit main board 100, the depth of the first arc-shaped recess 130 of the slot 110 is half of its width, and the depth of the second arc-shaped recess 220 on the wall of the circuit sub-board 200 is half of its width.

[0032] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made by using the content of the specification and drawings of the present invention under the concept of the present invention, or directly or indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A plug-in welding structure of a circuit main board and a circuit sub-board, characterized in that: It comprises a main circuit board (100) and a sub-circuit board (200), wherein both the main circuit board (100) and the sub-circuit board (200) are double-sided boards; The circuit main board (100) is provided with one or more slots (110); at least one first solder pad (120) is provided at the edge of the slot (110) on the front side of the circuit main board (100); at least one second solder pad is provided at the edge of the slot (110) on the back side of the circuit main board (100); at least one first copper-plated area (140) is provided on the slot wall of the slot (110); the first solder pad (120), the second solder pad and the first copper-plated area (140) correspond to each other one by one; the corresponding first solder pad (120), the second solder pad and the first copper-plated area (140) form a welding object; in a welding object, the first solder pad (120) is electrically connected to the second solder pad via the first copper-plated area (140); and a first arc-shaped recess (130) is provided at the position where the first copper-plated area (140) is provided on the slot wall of the slot (110); The thickness of the circuit sub-board (200) matches the width of the slot (110) of the circuit main board (100); at least one third soldering pad (210) is provided on the front edge of the circuit sub-board (200); at least one fourth soldering pad is provided on the back edge of the circuit sub-board (200); at least one second copper-plated area (230) is provided on the board wall of the circuit sub-board (200); the third soldering pad (210), the fourth soldering pad and the second copper-plated area (230) correspond to each other one by one; the corresponding third soldering pad (210), the fourth soldering pad and the second copper-plated area (230) form a welding object; the third soldering pad (210) in a welding object is electrically connected to the fourth soldering pad through the second copper-plated area (230); and a second arc-shaped recess (220) is provided at a position where the second copper-plated area (230) is provided on the board wall of the circuit sub-board (200); The circuit sub-board (200) is plugged into the slot (110) of the circuit main board (100), and the welding object of the circuit main board (100) and the welding object of the circuit sub-board (200) are fixedly connected by soldering.

2. The plug-in welding structure of a circuit main board and a circuit sub-board according to claim 1, characterized in that: The main circuit board (100) and the sub-circuit board (200) are both made of FR-4 material.

3. The plug-in welding structure of a circuit main board and a circuit sub-board according to claim 1, characterized in that: On the circuit main board (100), the first solder pad (120) and the second solder pad have the same shape and size, and the width of the first arc-shaped recess (130) of the slot (110) is consistent with the width of the first solder pad (120) and the width of the second solder pad; On the circuit sub-board (200), the third soldering pad (210) and the fourth soldering pad have the same shape and size, and the width of the second arc-shaped recess (220) on the board wall of the circuit sub-board (200) is consistent with the width of the third soldering pad (210) and the width of the fourth soldering pad.

4. The plug-in welding structure of a circuit main board and a circuit sub-board according to claim 3 is characterized in that: On the main circuit board (100), the depth of the first arc-shaped recess (130) of the slot (110) is half of its width, and the depth of the second arc-shaped recess (220) on the wall of the sub-circuit board (200) is half of its width.

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