Automatic welding and coating equipment for circuit board

Abstract

The utility model relates to the technical field of circuit board processing, in particular to automatic welding and coating equipment for a circuit board, which comprises a positioning jig for placing the circuit board, a conveying belt for conveying the positioning jig, and a welding station, a coating station and a drying station which are sequentially arranged on the conveying belt, the welding station comprises a first ejection mechanism used for ejecting the circuit board on the conveying belt, a first clamping and overturning mechanism used for clamping and overturning the ejected circuit board, and a welding mechanism used for welding the back face of the circuit board. The coating station comprises a second ejection mechanism used for ejecting the circuit board on the conveying belt, a second clamping and overturning mechanism used for clamping and overturning the ejected circuit board and a coating mechanism used for coating the back face of the welded circuit board. The drying station comprises a drying mechanism for drying the coated circuit board; the device is simple in structure and convenient to operate and control, welding of electronic components on the circuit board and selective coating of the circuit board can be automatically completed, and the quality stability of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, and particularly relates to an automatic soldering and coating device for circuit boards. Background Art

[0002] With the development of society and industrialization, in the process of industrial production, there is an increasing need to coat and dry industrial products. For example, after the circuit board is soldered and tested, it is necessary to spray a three-proof paint for protection.

[0003] At present, most applications are manual soldering and spraying, with low efficiency and natural drying required; moreover, there are unstable quality factors in manual soldering and gluing, resulting in a low product yield. Summary of the Invention

[0004] In order to overcome the disadvantages and deficiencies existing in the prior art, the purpose of the utility model is to provide an automatic soldering and coating device for circuit boards.

[0005] The purpose of the utility model is achieved by the following technical solutions: An automatic soldering and coating device for circuit boards includes a positioning fixture for placing the circuit board, a conveyor belt for conveying the positioning fixture, and a soldering station, a coating station, and a drying station sequentially arranged on the conveyor belt; the soldering station includes a first ejecting mechanism for ejecting the circuit board on the conveyor belt, a first clamping and flipping mechanism for clamping and flipping the ejected circuit board, and a soldering mechanism for soldering the back of the circuit board; the coating station includes a second ejecting mechanism for ejecting the circuit board on the conveyor belt, a second clamping and flipping mechanism for clamping and flipping the ejected circuit board, and a coating mechanism for coating the back of the soldered circuit board; the drying station includes a drying mechanism for drying the coated circuit board.

[0006] Further, the first ejecting mechanism includes a first top plate arranged below the conveyor belt and a first cylinder for driving the first top plate to move up and down.

[0007] Further, the first clamping and flipping mechanism includes a first flipping seat arranged above the conveyor belt, two first motors arranged on both sides of the first flipping seat and used for driving the first flipping seat to rotate, two first clamping members respectively arranged at the bottoms of the two first motors, and two second cylinders respectively used for driving the two first clamping members to move relatively.

[0008] Further, the soldering mechanism includes at least one soldering component for soldering the back of the circuit board and a first multi-axis robot for driving each soldering component to perform three-dimensional movement.

[0009] Further, the welding station further includes a first pressing plate for pressing the back surface of the circuit board and a third air cylinder for driving the first pressing plate to move up and down. The first pressing plate is provided with a plurality of first through holes corresponding to the welding positions on the back surface of the circuit board.

[0010] Further, the second ejecting mechanism includes a second top plate disposed below the conveyor belt and a fourth air cylinder for driving the second top plate to move up and down.

[0011] Further, the second clamping and flipping mechanism includes a second flipping seat disposed above the conveyor belt, two second motors disposed on both sides of the second flipping seat and used for driving the second flipping seat to rotate, two second clamping members respectively disposed at the bottoms of the two second motors, and two fifth air cylinders respectively used for driving the two second clamping members to move relatively.

[0012] Further, the coating mechanism includes at least one coating head for coating the back surface of the circuit board and a second multi-axis robot for driving each coating head to perform three-dimensional movement.

[0013] Further, the coating station further includes a second pressing plate for pressing the back surface of the circuit board and a sixth air cylinder for driving the second pressing plate to move up and down. The second pressing plate is provided with a plurality of second through holes corresponding to the welding positions on the back surface of the circuit board.

[0014] Further, the drying mechanism is a tunnel furnace.

[0015] The beneficial effects of the present utility model are as follows: The automatic soldering and coating equipment for circuit boards of the present utility model uses a positioning fixture to place and fix the circuit board on the positioning fixture, and conveys it to the welding station through a conveyor belt. At the welding station, the first ejecting mechanism ejects the positioning fixture, the first clamping and flipping mechanism clamps and flips the positioning fixture by 180 degrees, and the welding mechanism welds the back surface of the circuit board. After welding is completed, the first clamping and flipping mechanism flips the positioning fixture by 180 degrees, and the first ejecting mechanism rises to pick up the positioning fixture and descends to the conveyor belt; the positioning fixture is conveyed to the coating station along with the conveyor belt. At the coating station, the second ejecting mechanism ejects the positioning fixture, the second clamping and flipping mechanism clamps and flips the positioning fixture by 180 degrees, and the coating mechanism coats the back surface of the welded circuit board. After coating is completed, the second clamping and flipping mechanism flips the positioning fixture by 180 degrees, and the second ejecting mechanism rises to pick up the positioning fixture and descends to the conveyor belt; the positioning fixture is conveyed to the drying station along with the conveyor belt. At the drying station, the drying mechanism dries the coated circuit board; the structure is simple, the operation and control are convenient, and the soldering of electronic components on the circuit board and the selective coating of the circuit board can be automatically completed, improving the quality stability of the circuit board.

[0016] The overall production capacity of the automatic soldering and coating equipment for the circuit board of the present utility model reaches 550 pcs / H with one operator, and the yield of automatic soldering and coating can reach 98%. While for manual soldering and coating with three operators, the production capacity is only 380 pcs / H and the yield can only reach 90%. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a perspective view of the present utility model.

[0018] Figure 2 is a perspective view of the soldering station of the present utility model.

[0019] Figure 3 is a perspective view of the coating station of the present utility model.

[0020] Figure 4 is a perspective view of the soldering station when loading materials.

[0021] Figure 5 is a perspective view of the soldering station during soldering of the present utility model.

[0022] Figure 6 is a perspective view of the coating station when loading materials.

[0023] Figure 7 is a perspective view of the coating station during coating of the present utility model.

[0024] Reference numerals are: circuit board 10, positioning fixture 1, conveyor belt 2, soldering station 3, first ejecting mechanism 31, first top plate 311, first cylinder 312, first clamping and flipping mechanism 32, first flipping seat 321, first motor 322, first clamping member 323, second cylinder 324, soldering mechanism 33, soldering assembly 331, first multi-axis robot 332, first pressing plate 333, third cylinder 334, first through hole 335, coating station 4, second ejecting mechanism 41, second top plate 411, fourth cylinder 412, second clamping and flipping mechanism 42, second flipping seat 421, second motor 422, second clamping member 423, fifth cylinder 424, coating mechanism 43, coating head 431, second multi-axis robot 432, second pressing plate 433, sixth cylinder 434, second through hole 435, drying station 5, drying mechanism 51. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] For the convenience of understanding by those skilled in the art, the present utility model will be further described below in conjunction with embodiments and attached Figures 1-7 drawings. The content mentioned in the embodiments does not limit the present utility model.

[0026] See Figures 1-7, An automatic soldering and coating device for circuit boards, comprising a positioning fixture 1 for placing the circuit board 10, a conveyor belt 2 for conveying the positioning fixture 1, and a soldering station 3, a coating station 4, and a drying station 5 sequentially arranged on the conveyor belt 2; the soldering station 3 includes a first ejecting mechanism 31 for ejecting the circuit board 10 on the conveyor belt 2, a first clamping and flipping mechanism 32 for clamping and flipping the ejected circuit board 10, and a soldering mechanism 33 for soldering the back of the circuit board 10; the coating station 4 includes a second ejecting mechanism 41 for ejecting the circuit board 10 on the conveyor belt 2, a second clamping and flipping mechanism 42 for clamping and flipping the ejected circuit board 10, and a coating mechanism 43 for coating the back of the soldered circuit board 10; the drying station 5 includes a drying mechanism 51 for drying the coated circuit board 10.

[0027] The automatic soldering and coating device for the circuit board 10 of the present utility model utilizes the positioning fixture 1 to place and fix the circuit board 10 on the positioning fixture 1, and conveys it to the soldering station 3 through the conveyor belt 2. At the soldering station 3, the first ejecting mechanism 31 ejects the positioning fixture 1, the first clamping and flipping mechanism 32 clamps and flips the positioning fixture 1 by 180 degrees, and the soldering mechanism 33 solders the back of the circuit board 10. After soldering is completed, the first clamping and flipping mechanism 32 flips the positioning fixture 1 by 180 degrees, and the first ejecting mechanism 31 rises to pick up the positioning fixture 1 and descends to the conveyor belt 2; the positioning fixture 1 is conveyed to the coating station 4 along with the conveyor belt 2. At the coating station 4, the second ejecting mechanism 41 ejects the positioning fixture 1, the second clamping and flipping mechanism 42 clamps and flips the positioning fixture 1 by 180 degrees, and the coating mechanism 43 coats the back of the soldered circuit board 10. After coating is completed, the second clamping and flipping mechanism 42 flips the positioning fixture 1 by 180 degrees, and the second ejecting mechanism 41 rises to pick up the positioning fixture 1 and descends to the conveyor belt 2; the positioning fixture 1 is conveyed to the drying station 5 along with the conveyor belt 2. At the drying station 5, the drying mechanism 51 dries the coated circuit board 10; the structure is simple, the operation and control are convenient, and it can automatically complete the soldering of electronic components on the circuit board 10 and the selective coating of the circuit board 10, improving the quality stability of the circuit board 10.

[0028] In this embodiment, the first ejecting mechanism 31 includes a first top plate 311 disposed below the conveyor belt 2 and a first cylinder 312 for driving the first top plate 311 to move up and down. The first top plate 311 is located between the two conveyor belts 2, and the top of the first top plate 311 faces the welding mechanism 33. By driving the first top plate 311 to move upward through the first cylinder 312, the positioning fixture 1 is lifted. After the first clamping and flipping mechanism 32 clamps the positioning fixture 1, the first cylinder 312 drives the first top plate 311 to move downward. After welding is completed, the first cylinder 312 drives the first top plate 311 to move upward to a specified position, the first clamping and flipping mechanism 32 releases the clamped positioning fixture 1, the positioning fixture 1 falls onto the first top plate 311, and then the first cylinder 312 drives the first top plate 311 to move downward back onto the conveyor belt 2.

[0029] In this embodiment, the first clamping and flipping mechanism 32 includes a first flipping base 321 disposed above the conveyor belt 2, two first motors 322 disposed on both sides of the first flipping base 321 and used to drive the first flipping base 321 to rotate, two first clamping members 323 respectively disposed at the bottoms of the two first motors 322, and two second cylinders 324 respectively used to drive the two first clamping members 323 to move relatively. As Figure 4 shown, when the positioning fixture 1 is ejected by the first top plate 311, the top surface of the positioning fixture 1 fits against the bottom surface of the first flipping base 321. The two second cylinders 324 drive the first clamping members 323 to move relatively inward to clamp both sides of the positioning fixture 1, and the two first motors 322 drive the first flipping base 321 to rotate 180 degrees for welding, as Figure 5 shown; after welding is completed, the two first motors 322 drive the first flipping base 321 to rotate 180 degrees, the first cylinder 312 drives the first top plate 311 to move upward to a specified position, the two second cylinders 324 drive the first clamping members 323 to move relatively outward to release both sides of the clamped positioning fixture 1, and the positioning fixture 1 falls onto the first top plate 311.

[0030] In this embodiment, the welding mechanism 33 includes at least one welding component 331 for welding the back surface of the circuit board 10 and a first multi-axis robot 332 for driving each welding component 331 to perform three-dimensional movement. The welding component 331 includes a solder adding head and a heating rod. In this embodiment, the welding components 331 are two groups in the front and back, and can weld two positions simultaneously. The first multi-axis robot 332 can be a four-axis or five-axis robot, and can realize automatic welding of electronic components in all directions on the circuit board 10.

[0031] In this embodiment, the welding station 3 further includes a first pressing plate 333 for pressing the back surface of the circuit board 10 and a third air cylinder 334 for driving the first pressing plate 333 to move up and down. The first pressing plate 333 is provided with a plurality of first through holes 335 corresponding to the welding positions on the back surface of the circuit board 10. The first pressing plate 333 can press the back surface of the circuit board 10 and prevent solder balls from splashing onto other areas that do not need to be welded.

[0032] In this embodiment, the second ejecting mechanism 41 includes a second top plate 411 disposed below the conveyor belt 2 and a fourth air cylinder 412 for driving the second top plate 411 to move up and down. The second top plate 411 is located between the two conveyor belts 2, and the top of the second top plate 411 faces the coating structure. By driving the second top plate 411 to move upward through the fourth air cylinder 412, the positioning fixture 1 is lifted. After the second clamping and flipping mechanism 42 clamps the positioning fixture 1, the fourth air cylinder 412 drives the second top plate 411 to move downward; after coating, the fourth air cylinder 412 drives the second top plate 411 to move upward to a specified position, the second clamping and flipping mechanism 42 releases the clamped positioning fixture 1, the positioning fixture 1 falls onto the second top plate 411, and then the fourth air cylinder 412 drives the second top plate 411 to move downward back onto the conveyor belt 2.

[0033] In this embodiment, the second clamping and flipping mechanism 42 includes a second flipping base 421 disposed above the conveyor belt 2, two second motors 422 disposed on both sides of the second flipping base 421 and used for driving the second flipping base 421 to rotate, two second clamping members 423 respectively disposed at the bottoms of the two second motors 422, and two fifth air cylinders 424 respectively used for driving the two second clamping members 423 to move relatively. As Figure 6 shown, when the positioning fixture 1 is ejected by the second top plate 411, the top surface of the positioning fixture 1 fits against the bottom surface of the second flipping base 421. The two fifth air cylinders 424 drive the second clamping members 423 to move relatively inward to clamp both sides of the positioning fixture 1, and the two second motors 422 drive the second flipping base 421 to rotate 180 degrees for coating, as Figure 7 shown; after coating, the two second motors 422 drive the second flipping base 421 to rotate 180 degrees, the fifth air cylinder 424 drives the second top plate 411 to move upward to a specified position, the two fifth air cylinders 424 drive the second clamping members 423 to move relatively outward to release both sides of the clamped positioning fixture 1, and the positioning fixture 1 falls onto the second top plate 411.

[0034] In this embodiment, the coating mechanism 43 includes at least one coating head 431 for coating the back surface of the circuit board 10 and a second multi-axis robot 432 for driving each coating head 431 to perform three-dimensional movement. Specifically, the number of coating heads 431 is three, and three areas can be coated simultaneously. The second multi-axis robot 432 can be a four-axis or five-axis robot, which can achieve selective coating of all orientations of the circuit board 10.

[0035] In this embodiment, the coating station 4 further includes a second pressing plate for pressing the back surface of the circuit board 10 and a sixth cylinder 434 for driving the second pressing plate 433 to move up and down. The second pressing plate 433 is provided with a plurality of second through holes 435 corresponding to the welding positions on the back surface of the circuit board 10. The setting of the second pressing plate 433 can press the back surface of the circuit board 10 and prevent the coating from splashing onto other areas that do not need to be coated.

[0036] In this embodiment, the drying mechanism 51 is a tunnel furnace. Using a tunnel furnace for drying has high efficiency and is convenient for conveying.

[0037] It should be noted that the automatic soldering and coating equipment for the circuit board 10 of the present invention further includes a control device (such as a PLC controller). The control device is electrically connected to the above-mentioned conveyor belt 2, motor, cylinder, and multi-axis robot respectively to achieve automatic control of the equipment. Of course, infrared sensors for detecting and positioning whether the jig 1 is in place can also be installed at each station. The above settings are prior art and will not be elaborated here.

[0038] The above embodiments are the preferred implementation solutions of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present invention is within the protection scope of the present invention.

Claims

1. A circuit board automatic soldering and coating equipment, characterized in that: It includes a positioning jig for placing a circuit board, a conveyor belt for conveying the positioning jig, and a welding station, a coating station and a drying station sequentially arranged on the conveyor belt; the welding station includes a first ejection mechanism for ejecting the circuit board on the conveyor belt, a first clamping and turning mechanism for clamping and turning the ejected circuit board, and a welding mechanism for welding the back side of the circuit board; the coating station includes a second ejection mechanism for ejecting the circuit board on the conveyor belt, a second clamping and turning mechanism for clamping and turning the ejected circuit board, and a coating mechanism for coating the back side of the welded circuit board; the drying station includes a drying mechanism for drying the coated circuit board.

2. The circuit board automatic soldering and coating equipment according to claim 1 is characterized in that: The first ejection mechanism includes a first ejection plate disposed below the conveyor belt and a first cylinder driving the first ejection plate to move up and down.

3. The circuit board automatic soldering and coating equipment according to claim 1 is characterized in that: The first clamping and flipping mechanism includes a first flip seat arranged above the conveyor belt, two first motors arranged on both sides of the first flip seat and used to drive the first flip seat to rotate, two first clamping members respectively arranged at the bottom of the two first motors, and two second cylinders respectively used to drive the two first clamping members to move relative to each other.

4. The circuit board automatic soldering and coating equipment according to claim 1 is characterized in that: The welding mechanism includes at least one welding assembly for welding the back side of the circuit board and a first multi-axis robot for driving each welding assembly to move in three dimensions.

5. The circuit board automatic soldering and coating equipment according to claim 1 is characterized in that: The welding station also includes a first pressing plate for pressing the back of the circuit board and a third cylinder for driving the first pressing plate to move up and down. The first pressing plate is provided with a plurality of first through holes corresponding to the welding positions on the back of the circuit board.

6. The circuit board automatic soldering and coating equipment according to claim 1, characterized in that: The second ejection mechanism includes a second ejection plate disposed below the conveyor belt and a fourth cylinder driving the second ejection plate to move up and down.

7. The circuit board automatic soldering and coating equipment according to claim 1 is characterized in that: The second clamping and flipping mechanism includes a second flip seat arranged above the conveyor belt, two second motors arranged on both sides of the second flip seat and used to drive the second flip seat to rotate, two second clamping members respectively arranged at the bottom of the two second motors, and two fifth cylinders respectively used to drive the two second clamping members to move relative to each other.

8. The circuit board automatic soldering and coating equipment according to claim 1, characterized in that: The coating mechanism includes at least one coating head for coating the back side of the circuit board and a second multi-axis robot for driving each coating head to move in three dimensions.

9. The circuit board automatic soldering and coating equipment according to claim 1, characterized in that: The coating station also includes a second pressing plate for pressing the back of the circuit board and a sixth cylinder for driving the second pressing plate to move up and down. The second pressing plate is provided with a plurality of second through holes corresponding to the welding positions on the back of the circuit board.

10. The circuit board automatic soldering and coating equipment according to claim 1, characterized in that: The drying mechanism is a tunnel furnace.

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