X-ray detector and detection equipment
By setting an X-ray shielding layer on the circuit board and adjusting the structure of the circuit board and the fixed bracket, the problem of easy damage to the electronic components of the X-ray detector circuit board is solved, and the service life of the detector and the thickness are extended, which improves production efficiency and reduces manufacturing costs.
Patent Information
- Application Number
- CN202422119278.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-30
AI Technical Summary
The electronic components on the circuit board of the X-ray detector are easily damaged by X-rays, resulting in a short service life.
An X-ray shielding layer is provided on the circuit board, covering one side of the circuit board facing the fixing bracket, and the electronic components are arranged on the side of the shielding layer to prevent X-ray irradiation, in combination with reducing the gap between the fixing bracket and the circuit board to reduce the thickness.
Effectively protect circuit boards and electronic components, extend the service life of X-ray detectors, and reduce detector thickness, improve production efficiency and reduce manufacturing costs.
Smart Images

Figure CN223053371U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of detectors, in particular to an X-ray detector and detection equipment. Background Art
[0002] An X-ray detector is a device that converts X-ray energy into an electrical signal that can be recorded. X-ray detectors are widely used in security inspection, parts inspection and other inspection equipment. In related technologies, X-rays emitted by an X-ray source are received by an X-ray detector after passing through the object to be inspected. Due to the different parameters such as mass and density of the object to be inspected, the energy of the X-rays after passing through the object to be inspected is different, so the X-ray energy received by the X-ray detector is different, and then the electrical signal is different, thus achieving the detection requirements.
[0003] Since X-rays are a type of electromagnetic wave with strong penetrating power, when the X-ray detector is working, some X-rays will pass through the X-ray sensor of the X-ray detector and irradiate the circuit board of the X-ray detector. The electronic components on the circuit board are easily damaged after being irradiated by X-rays, which can easily affect the service life of the X-ray detector. Utility Model Content
[0004] The utility model discloses an X-ray detector and detection equipment, which are used to solve the problem of short service life of the X-ray detector.
[0005] In order to solve the above problems, the utility model adopts the following technical solutions:
[0006] An X-ray detector comprises an X-ray sensor, a fixing bracket, a circuit board and electronic components;
[0007] The X-ray sensor, the fixing bracket and the circuit board are stacked in sequence, and the X-ray sensor is electrically connected to the circuit board;
[0008] The circuit board includes a board body and a first base layer, the first base layer is an X-ray shielding layer, the first base layer is located between the fixed bracket and the board body, the first base layer covers the surface of the board body facing the fixed bracket, and the electronic components are all arranged on the side of the board body away from the first base layer.
[0009] A detection device comprises the above-mentioned X-ray detector.
[0010] The technical solution adopted by the utility model can achieve the following beneficial effects:
[0011] In the X-ray detector disclosed in the utility model, the circuit board includes a board body and a first base layer, the first base layer is an X-ray shielding layer, the first base layer is located between the board body and the fixed bracket of the circuit board, and the electronic components are all arranged on the side of the board body away from the first base layer. In this scheme, the electronic components are all arranged on the side of the circuit board away from the fixed bracket. At this time, since the electronic components do not need to be arranged on the side of the circuit board facing the fixed bracket, an X-ray shielding layer is arranged on the side of the circuit board facing the fixed bracket. The X-ray shielding layer can play a role in radiation protection, thereby avoiding the risk of damage to the electronic components on the circuit board, and thus can effectively improve the service life of the X-ray detector. In addition, the side of the circuit board facing the fixed bracket does not need to be arranged with electronic components, and thus there is no need to design a gap between the circuit board and the fixed bracket for the short circuit problem, and the thickness of the X-ray detector can be designed to be thinner. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:
[0013] Figure 1 It is a structural schematic diagram of an X-ray detector in the related art;
[0014] Figure 2 A schematic diagram of the structure of an X-ray detector disclosed in an embodiment of the utility model;
[0015] Figure 3 This is a schematic diagram of the structure of another X-ray detector disclosed in an embodiment of the utility model;
[0016] Figure 4 The present invention is a schematic diagram of the structure of a circuit board of an X-ray detector disclosed in an embodiment of the present invention.
[0017] Description of reference numerals:
[0018] 10-X-ray sensor, 30-circuit board, 40-electronic components, 50-fixed bracket;
[0019] 100-X-ray sensor, 200-fixing bracket, 300-circuit board, 310-board body, 311-second base layer, 311a-via, 312-first circuit substrate, 313-second circuit substrate, 314-support frame, 3101-first surface, 3102-second surface, 320-first base layer, 400-electronic components, 500-fasteners, 600-electrical connectors. DETAILED DESCRIPTION
[0020] To make the objectives, technical solutions, and advantages of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below in conjunction with specific embodiments of the present utility model and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0021] The following will, in conjunction with the drawings, detail the technical solutions disclosed in each embodiment of the present utility model.
[0022] As Figures 2 to 4 shown, an embodiment of the present utility model discloses an X-ray detector. The disclosed X-ray detector includes an X-ray sensor 100, a fixing bracket 200, a circuit board 300, and electronic components 400.
[0023] The X-ray sensor 100, the fixing bracket 200, and the circuit board 300 are stacked in sequence, and the X-ray sensor 100 is electrically connected to the circuit board 300. The X-ray sensor 100 is the main component of the X-ray detector, and the X-ray sensor 100 is used to receive X-rays. The specific structure and working principle of the X-ray sensor 100 are well-known technologies and will not be elaborated herein. The fixing bracket 200 provides an installation basis for other components of the X-ray detector. The circuit board 300 is used to implement functions such as image acquisition and data conversion of the X-ray sensor 100, and is also used for interaction with the upper computer. In addition, the circuit board 300 is also used to supply electrical energy to the X-ray sensor 100. Optionally, the X-ray sensor 100 can be connected to the circuit board 300 through an electrical connection member 600. Here, the electrical connection member 600 can be an electrical connection structure such as a wire or a flexible circuit board.
[0024] The circuit board 300 includes a board body 310 and a first base layer 320. The first base layer 320 is an X-ray shielding layer, that is to say, the first base layer 320 can shield X-rays. Here, it means that the first base layer 320 can absorb and block X-rays, so as to prevent X-rays from penetrating the first base layer 320. The board body 310 here is electrically connected to the X-ray sensor 100 through the electrical connection member 600. The first base layer 320 is located between the fixing bracket 200 and the board body 310, and the first base layer 320 covers the surface of the board body 310 facing the fixing bracket 200. At this time, the surface of the board body 310 facing the fixing bracket 200 is completely covered by the first base layer 320. Here, the complete coverage means that the first base layer 320 completely covers one side surface of the board body 310. It can also be understood that, in the thickness direction of the circuit board 300, the orthographic projection of the board body 310 coincides with the orthographic projection of the first base layer 320. It can also be understood here that the first base layer 320 is a solid layer and is not a hollow structure.
[0025] The electronic components 400 are all disposed on the side of the board body 310 away from the first base layer 320. The electronic components 400 include, but are not limited to, programmable devices, inductors, capacitors, resistors, memory cells and other devices. At this time, the electronic components 400 on the circuit board 300 are disposed on the side opposite to the first base layer 320. Here, the board body 310 is the main structure of the circuit board 300, and the first base layer 320 is a metal layer on one side of the board body 310. It can also be understood that the circuit board 300 is composed of multiple stacked base layers, and the first base layer 320 is the first layer of the multiple base layers, and the structure formed by all the remaining base layers is the board body 310.
[0026] Optionally, the first base layer 320 can be made of a material that attenuates X-rays. In an alternative embodiment, the first base layer 320 can be a copper layer. Since the circuit structure of the circuit board 300 is usually a copper layer, the first base layer 320 also adopts a copper layer, so that the manufacturing process of the circuit board 300 is simpler, thereby reducing the manufacturing process of the circuit board 300. In another alternative embodiment, the first base layer 320 can be a tungsten layer. In this solution, the tungsten layer has a better attenuation effect on X-rays, so it can further improve the safety and reliability of the circuit board 300.
[0027] The above-mentioned first base layer 320 can be a metal layer. For example, the above-mentioned copper layer or tungsten layer. Alternatively, the first base layer 320 can include a carrier layer and a metal layer. The metal layer can be embedded in the carrier layer, or the metal layer can be attached to the upper surface or the lower surface of the carrier layer. Here, the metal layer can completely cover the surface of the carrier layer, or can only cover a part of the surface of the carrier layer, but it should be noted that the area of the metal layer needs to be larger than the surface area of the board body 310, so that the metal layer can completely cover the board body 310. Here, the carrier layer can be made of materials such as plastics.
[0028] In the embodiments disclosed in the present application, the electronic components 400 are all disposed on the side of the circuit board 300 away from the fixed bracket 200. At this time, since there is no need to dispose the electronic components 400 on the side of the circuit board 300 facing the fixed bracket 200, the first base layer 320 on the side of the circuit board 300 facing the fixed bracket 200 can be set as a full-coverage structure, so that the first base layer 320 can completely cover the board body 310. Therefore, the first base layer 320 can block X-rays, thereby preventing X-rays from irradiating the board body 310. Therefore, the first base layer 320 can play a role in radiation protection. At this time, the first base layer 320 of the circuit board 300 can protect the circuit board 300 and the electronic components 400 on the circuit board 300, so that the circuit board 300 and the electronic components 400 on the circuit board 300 are not easily damaged, thereby extending the service life of the X-ray detector.
[0029] In addition, as Figure 1 shown in the structure of the X-ray detector in the related art, an X-ray sensor 10, a fixing bracket 50, and a circuit board 30 are stacked in sequence. In the related art, a large gap needs to be reserved between the fixing bracket 50 and the circuit board 30 to avoid interference between the fixing bracket 50 and the electronic components 40 on the circuit board 30. Therefore, the thickness of the X-ray detector in the related art is relatively large.
[0030] In the X-ray detector disclosed in the present application, all the electronic components 400 are arranged on the side of the circuit board 300 away from the fixing bracket 200, and no electronic components 400 are arranged on the first base layer 320 of the circuit board 300. Therefore, a large gap does not need to be reserved between the first base layer 320 and the fixing bracket 200, so that the stacking height of the circuit board 300 and the fixing bracket 200 can be further reduced, and thus the thickness of the X-ray detector can be further reduced.
[0031] In addition, since the electronic components 400 are arranged on the side of the board body 310 away from the first base layer 320, the board body 310 itself can also block a part of the X-rays, thereby further weakening the intensity of the X-rays, and further avoiding the risk of damage to the electronic components 400.
[0032] The X-ray detector according to the embodiment disclosed in the present application reduces the design of an independent protective member, thereby reducing the assembly process of the X-ray detector, and further improving the production efficiency of the X-ray detector.
[0033] In an alternative embodiment, the board body 310 may include a first surface 3101 and a second surface 3102 disposed opposite to each other. The first base layer 320 may cover the first surface 3101, and all the electronic components 400 may be disposed on the second surface 3102. At this time, the first base layer 320 and the electronic components 400 may be respectively located on two opposite surfaces of the board body 310. This solution has a simple structure and is convenient for manufacturing, thereby reducing the manufacturing cost of the X-ray detector.
[0034] In another alternative solution, as Figure 3As shown, the board body 310 may include a first circuit board 312, a second circuit board 313, and a support frame 314. The first circuit board 312 and the second circuit board 313 are stacked, and the support frame 314 is disposed between the first circuit board 312 and the second circuit board 313. The first circuit board 312 and the second circuit board 313 are electrically connected through the support frame 314. The first circuit board 312, the second circuit board 313, and the support frame 314 enclose a cavity. At this time, the circuit board 300 has a double-layer circuit structure, and a first base layer 320 covers a surface of the first circuit board 312 facing away from the second circuit board 313. The electronic components 400 may be disposed on a surface of the first circuit board 312 facing the second circuit board 313, on a surface of the second circuit board 313 facing the first circuit board 312, and on a surface of the second circuit board 313 facing away from the first circuit board 312.
[0035] This solution can increase the setting area of the electronic components 400, thereby being more conducive to the function expansion of the X-ray detection device.
[0036] In the above embodiment, the first base layer 320 may be a signal transmission layer. At this time, the first base layer 320 can be used for signal transmission of the circuit board 300. At this time, in order to avoid short-circuiting of the first base layer 320 by the fixing bracket 200, a certain gap needs to be provided between the fixing bracket 200 and the first base layer 320, so as to avoid contact between the fixing bracket 200 and the first base layer 320, and the risk of short-circuiting of the first base layer 320. However, this solution will increase the stacking height between the fixing bracket 200 and the circuit board 300, resulting in a larger thickness of the X-ray detector.
[0037] Based on this, in another alternative embodiment, the fixing bracket 200 is attached to the first base layer 320, and the first base layer 320 is grounded to the board body 310. In this solution, since the first base layer 320 is grounded to the board body 310, the first base layer 320 is a ground layer. At this time, the fixing bracket 200 can be directly mounted on the first base layer 320, so that the stacking thickness between the fixing bracket 200 and the circuit board 300 can be further reduced, and thus the thickness of the X-ray detector can be further reduced.
[0038] In an alternative embodiment, the board body 310 may include a plurality of second base layers 311 stacked in sequence. The number of the second base layers 311 is m layers, and m is greater than or equal to 2. A surface of the first layer of the second base layer 311 facing the fixing bracket 200 may be a first surface 3101. A surface of the mth layer of the second base layer 311 facing away from the fixing bracket 200 may be a second surface 3102. At least two of the second base layers 311 may be electrically connected, and the first base layer 320 is grounded to at least one of the second base layers 311.
[0039] Specifically, the circuit board 300 may include a base layer with m + 1 layers. The base layer of the first layer is the first base layer 320, and the base layers of the second layer to the m + 1 layer are m second base layers 311. That is to say, the first base layer 320 is the first layer of multiple base layers, and the electronic components 400 are all arranged on the base layer of the bottommost layer.
[0040] In this solution, by setting the base layer of the first layer of the circuit board 300 as an X-ray shielding layer, the first base layer plays a protective role for the circuit board 300. Therefore, under the condition of ensuring the same protection design, the overall thickness of the detector is further reduced.
[0041] The first circuit board 312 and the second circuit board 313 in the above embodiments may also be multi-base layer structures, and this is not limited in this article.
[0042] In another alternative embodiment, the second base layer 311 is provided with a via 311a. Here, the via 311a means that a through hole is provided on the second base layer 311, and the side wall of the through hole is electroplated with a conductive material or the through hole is filled with a conductive material, so that adjacent base layers can be electrically connected through the via 311a. The first base layer 320 and at least one second base layer 311 can be grounded through the via 311a. In this solution, by connecting the first base layer 320 to the ground through the via 311a on the second base layer 311, there is no need to set an electrical connection structure between the first base layer 320 and the second base layer 311, thereby further simplifying the design structure of the circuit board 300 and also reducing the thickness of the circuit board 300.
[0043] In another alternative embodiment, the X-ray detector may further include a plurality of fasteners 500. The fasteners 500 can sequentially penetrate the board body 310 and the first base layer 320 and be connected to the fixing bracket 200. The fixing bracket 200 and the circuit board 300 can be connected through a plurality of fasteners 500, and the plurality of fasteners 500 can be arranged at intervals. This solution can improve the connection strength between the fixing bracket 200 and the circuit board 300.
[0044] Furthermore, the fastener 500 can be a threaded part. Here, the threaded part can be a bolt or a combined structure of a bolt, a nut, and a gasket. At this time, a threaded groove can be provided on the fixing bracket 200, and a through hole penetrating the board body 310 and the first base layer 320 is provided on the circuit board 300. The threaded part passes through the through hole and is connected to the threaded groove. Or, a threaded sleeve can be built in the fixing bracket 200, and the bolt passes through the through hole on the circuit board 300 and is threadedly connected to the threaded sleeve.
[0045] In this solution, the threaded part can achieve a detachable connection between the fixing bracket 200 and the circuit board 300, thus facilitating the disassembly and installation of the fixing bracket 200 and the circuit board 300.
[0046] Of course, the above-mentioned fastener 500 is not limited to the threaded part, and can also be a fastening structure such as a hoop, or can also be a riveting structure such as a rivet. This article only discloses the specific structures of several fasteners 500 and is not used to limit the specific structure of the fastener 500.
[0047] In another alternative embodiment, the thickness of the first base layer 320 can be less than the thickness of the second base layer 311. The second base layer 311 is used to form the board body 310, and the second base layer 311 needs to carry a large current, so the thickness of the second base layer 311 is relatively large. And the first base layer 320 does not need to carry current or carries a small current, so the thickness of the first base layer 320 can be set to be relatively small. In this solution, the thickness of the first base layer 320 is small, so the overall thickness of the circuit board 300 can be reduced, and thus the thickness of the X-ray detector can be further reduced.
[0048] The X-ray detector disclosed in this application can be a planar array detector or a TDI detector, and can also be of other types, which are not limited in this article.
[0049] Based on the X-ray detector of any of the above embodiments of this application, the embodiments of this application also disclose a detection device, and the disclosed detection device includes the X-ray detector of any of the above embodiments.
[0050] The detection device disclosed in this application further includes an X-ray source. The X-ray emitted by the X-ray source is received by the X-ray detector after passing through the object to be detected, so as to achieve the detection function.
[0051] In the above embodiments of the present utility model, the differences between the various embodiments are mainly described. As long as the different optimized features between the various embodiments are not contradictory, they can be combined to form a more optimal embodiment. Considering the simplicity of the text, they will not be elaborated here.
[0052] The above are only the embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the scope of the claims of the present utility model.
Claims
1. An X-ray detector, characterized in that: It comprises an X-ray sensor (100), a fixing bracket (200), a circuit board (300) and electronic components (400); The X-ray sensor (100), the fixing bracket (200) and the circuit board (300) are stacked in sequence, and the X-ray sensor (100) is electrically connected to the circuit board (300); The circuit board (300) comprises a board body (310) and a first base layer (320), wherein the first base layer (320) is an X-ray shielding layer, and the first base layer (320) is located between the fixing bracket (200) and the board body (310), and the first base layer (320) covers the surface of the board body (310) on a side facing the fixing bracket (200), and the electronic components (400) are all arranged on a side of the board body (310) facing away from the first base layer (320).
2. The X-ray detector according to claim 1, characterized in that: The board body (310) comprises a first surface (3101) and a second surface (3102) which are arranged opposite to each other, the first base layer (320) covers the first surface (3101), and the electronic components (400) are all arranged on the second surface (3102).
3. The X-ray detector according to claim 1, characterized in that: The fixing bracket (200) is attached to the first base layer (320), and the first base layer (320) is grounded to the plate body (310).
4. The X-ray detector according to claim 2, characterized in that: The plate body (310) comprises a plurality of second base layers (311) stacked in sequence, the number of the second base layers (311) being m layers, and m being greater than or equal to 2, the surface of the second base layer (311) of the first layer facing the fixed bracket (200) being the first surface (3101); the surface of the second base layer (311) of the mth layer facing away from the fixed bracket (200) being the second surface (3102), at least two of the second base layers (311) being electrically connected, and the first base layer (320) being grounded to at least one of the second base layers (311).
5. The X-ray detector according to claim 4, characterized in that: The second base layer (311) is provided with a via hole (311a), and the first base layer (320) and at least one layer of the second base layer (311) are grounded via the via hole (311a).
6. The X-ray detector according to claim 1, characterized in that: The X-ray detector further comprises a plurality of fasteners (500), wherein the fasteners (500) sequentially penetrate the board body (310) and the first base layer (320), and are connected to the fixing bracket (200), and the fixing bracket (200) is connected to the circuit board (300) via the plurality of fasteners (500), and the plurality of fasteners (500) are arranged at intervals.
7. The X-ray detector according to claim 6, characterized in that: The fastener (500) is a threaded member.
8. The X-ray detector according to claim 1, characterized in that: The first base layer (320) is a copper layer; or, The first base layer (320) is a tungsten layer.
9. The X-ray detector according to claim 4, characterized in that: The thickness of the first base layer (320) is smaller than the thickness of the second base layer (311).
10. A detection device, characterized in that: An X-ray detector comprising the one of claims 1 to 9.