High-power semiconductor laser module

Abstract

The utility model discloses a high-power semiconductor laser module, which relates to the technical field of semiconductor laser modules, and comprises a shell, one side of the shell is movably connected with a flexible optical sheet, the shell and the flexible optical sheet are connected through a rubber ring, one end of the shell close to the flexible optical sheet is provided with two groups of sliding chutes, and the two groups of sliding chutes are arranged in the shell. A sliding rod matched with the sliding groove is connected into the sliding groove in a sliding mode. When the flexible optical sheet makes contact with the outer surface of the skin, the flexible optical sheet can be extruded through the outer surface of the skin, the flexible optical sheet can slide in the sliding groove through the sliding rod, and due to the fact that the outer surface of the skin is not a plane, different extrusion forces can be generated on different positions of the flexible optical sheet; therefore, the flexible optical sheet can deform through the elastic force of the flexible optical sheet, the flexible optical sheet can be attached to the outer surface of the skin, the outer surface of the skin can be depilated better, and the depilation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor laser modules, and particularly relates to a high-power semiconductor laser module. Background Technique

[0002] Semiconductor lasers are lasers based on semiconductor materials. They utilize the recombination between electrons and holes in semiconductor materials to release photons and generate laser beams. Semiconductor lasers have the advantages of small size, high power, high efficiency, long lifespan, etc. Moreover, high-power semiconductor laser modules have high efficiency, so they are widely used in many fields, including laser hair removal, laser medicine, laser communication, laser printing, etc.

[0003] In laser hair removal, semiconductor lasers are usually used as the light source of hair removal devices. The laser emitted by them can be absorbed by melanin in the skin and converted into heat energy, thereby destroying hair follicles and achieving the hair removal effect. Semiconductor laser hair removal devices have the advantages of simple operation, long-lasting effect, short treatment time, etc., so they are widely used in the beauty industry. It should be noted that the adaptability of semiconductor laser hair removal to different skin colors varies, and the effect on dark skin is relatively poor because the laser will absorb melanin and easily cause skin damage.

[0004] Currently, when using a semiconductor laser hair removal treatment instrument, it is usually necessary to apply gel to the area to be hair removed, then select the area to be hair removed on the semiconductor laser hair removal treatment instrument and adjust the parameters. Finally, place the hair removal instrument on the skin to be hair removed and move the position of the hair removal instrument to complete hair removal.

[0005] Since the hair removal head part of the existing semiconductor laser hair removal instrument is flat, it cannot fully fit the outer surface of the skin, and it is necessary to constantly adjust the angle of the hair removal head, which will affect the hair removal effect and reduce the hair removal efficiency. Content of the Utility Model

[0006] Based on this, the purpose of the present utility model is to provide a high-power semiconductor laser module to solve the technical problem that since the hair removal head part of the existing semiconductor laser hair removal instrument is flat, it cannot fully fit the outer surface of the skin, and it is necessary to constantly adjust the angle of the hair removal head, which will affect the hair removal effect and reduce the hair removal efficiency.

[0007] To achieve the above object, the present utility model provides the following technical solution: A high-power semiconductor laser module, comprising a housing, one side of the housing is movably connected with a flexible optical sheet, the housing and the flexible optical sheet are connected by a rubber ring, two groups of chutes are provided at one end of the housing close to the flexible optical sheet, a sliding rod that fits with the chute is slidably connected in the chute, one end of the sliding rod is connected to one side of the flexible optical sheet, and each chute and the corresponding sliding rod are connected by a first spring.

[0008] By adopting the above technical solution, when using the semiconductor laser hair removal device, the flexible optical sheet can be brought into contact with the skin surface, and different squeezes can be generated on the flexible optical sheet through the outer surface of the skin, so that the sliding rods at different positions can be driven to move in the chutes according to different squeezing forces. At this time, since the flexible optical sheet is elastic, it can deform, so that the flexible optical sheet can fit on the outer surface of the skin, facilitating better hair removal on the outer surface of the skin and thus improving the hair removal efficiency.

[0009] The present utility model is further configured such that an optical component is movably connected to one side of the flexible optical sheet close to the housing, and the optical component slides in the housing.

[0010] By adopting the above technical solution, the optical component can slide in the housing, so that when the flexible optical sheet deforms, the position of the optical component can be changed, so that the flexible optical sheet can fit with the skin, facilitating better use of the device and thus improving the hair removal efficiency.

[0011] The present utility model is further configured such that grooves are provided on both sides inside the housing, bumps that fit with the grooves are slidably connected in the grooves, each bump is fixedly connected to one side of the optical component, and the bump is provided in a "T" shape.

[0012] By adopting the above technical solution, when the flexible optical sheet deforms, the optical component can slide in the housing according to the degree of deformation of the flexible optical sheet, and the sliding stability can be increased through the grooves and the bumps.

[0013] The present utility model is further configured such that each groove and the corresponding bump are connected by a second spring.

[0014] By adopting the above technical solution, a thrust can be generated on the optical component by the second spring, so that the optical component can not only deform following the flexible optical sheet to change its position, but also closely adhere to one side of the flexible optical sheet, facilitating better use of the device.

[0015] The present utility model is further configured such that a plurality of heat dissipation holes are provided on both sides of the housing, and a filter screen is interactively connected to one side of the heat dissipation holes.

[0016] By adopting the above technical solution, the heat dissipation holes can increase the air fluidity inside and outside the housing, so that the heat generated when the semiconductor hair removal device works can be dissipated through the heat dissipation holes, avoiding the influence on the use of components due to excessive internal temperature. At the same time, the setting of the filter screen can prevent external dust and impurities from entering the housing interior, ensuring the cleanliness and hygiene inside the housing, and facilitating the extension of the service life of the components inside the housing.

[0017] The present utility model is further configured such that the heat dissipation holes and the filter screen are connected by a colloid.

[0018] By adopting the above technical solution, the colloid can be flexibly applied according to the shapes of the heat dissipation holes and the filter screen, adapting to various complex connection requirements. At the same time, it can quickly complete the installation of the filter screen, facilitating better use of the device.

[0019] In summary, the present utility model mainly has the following beneficial effects:

[0020] When the flexible optical sheet of the present utility model contacts the outer surface of the skin, the outer surface of the skin can exert extrusion on the flexible optical sheet, causing it to slide through the slide rod in the chute. Since the outer surface of the skin is not a flat surface, different extrusion forces will be generated on different positions of the flexible optical sheet. Therefore, the flexible optical sheet can deform due to its own elastic force, enabling the flexible optical sheet to fit the outer surface of the skin, which helps to better remove hair from the outer surface of the skin and thus improve the hair removal efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a three-dimensional structure schematic diagram of the present utility model;

[0022] Figure 2 is a detailed internal view of the three-dimensional structure of the present utility model;

[0023] Figure 3 is a sectional view of the three-dimensional structure of the present utility model;

[0024] Figure 4 is a detailed view of the connection structure of the present utility model.

[0025] In the figure: 1, housing; 2, flexible optical sheet; 3, rubber ring; 4, chute; 5, slide rod; 6, first spring; 7, optical component; 8, groove; 9, convex block; 10, second spring; 11, heat dissipation hole; 12, filter screen. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model, and should not be construed as a limitation to the present utility model.

[0027] The following will describe the embodiments according to the overall structure of the present utility model.

[0028] A high-power semiconductor laser module, as Figures 1-4 shown, includes a housing 1. A plurality of heat dissipation holes 11 are provided on both sides of the housing 1. Heat inside the housing 1 can be dissipated through the heat dissipation holes 11, avoiding affecting the use of components due to excessive temperature inside the housing 1. A filter screen 12 is interactively connected to one side of the heat dissipation holes 11, and the heat dissipation holes 11 and the filter screen 12 are connected by a colloid. The filter screen 12 can prevent external dust and impurities from entering the inside of the housing 1, thus keeping the inside of the housing 1 clean and facilitating the extension of the service life of the components inside the housing 1.

[0029] Subsequently, a flexible optical sheet 2 is movably connected to one side of the housing 1. The flexible optical sheet 2 has excellent flexibility and bendability, so it can deform under an external force and can return to its original shape after the external force disappears. The housing 1 and the flexible optical sheet 2 are connected by a rubber ring 3, which can increase the sealing performance between the housing 1 and the flexible optical sheet 2. And the rubber ring 3 has a certain elasticity, so when the flexible optical sheet 2 deforms, it can squeeze the rubber ring 3, thus avoiding affecting the use of the device. Two groups of chutes 4 are provided at one end of the housing 1 close to the flexible optical sheet 2. A slide bar 5 that fits with the chute 4 is slidably connected in the chute 4. One end of the slide bar 5 is connected to one side of the flexible optical sheet 2, so that the slide bar 5 can slide in the chute 4, thereby driving the flexible optical sheet 2 to move. Each chute 4 and the corresponding slide bar 5 are connected by a first spring 6. Therefore, after the external force received by the slide bar 5 disappears, the first spring 6 can drive it to reset.

[0030] Further, an optical component 7 is movably connected to the side of the flexible optical sheet 2 close to the housing 1. The optical component 7 slides within the housing 1. Therefore, after the flexible optical sheet 2 deforms, the optical component 7 can be moved according to the degree of deformation of the flexible optical sheet 2, avoiding affecting the use of the device. At the same time, grooves 8 are provided on both sides inside the housing 1. A convex block 9 that fits the groove 8 is slidably connected to the groove 8. Each convex block 9 is fixedly connected to one side of the optical component 7. The convex block 9 is provided in a "T" shape, so that the convex block 9 can move within the groove 8, thereby driving the optical component 7 to slide within the housing 1. And a second spring 10 is connected between each groove 8 and the corresponding convex block 9. The force generated by the second spring 10 can make the optical component 7 contact the flexible optical sheet 2, and the second spring 10 will not affect the movement of the optical component 7 under an external force.

[0031] In this embodiment, when the circuit wires inside the housing 1 are connected to the optical component 7, it will not affect the sliding of the optical component 7 inside the housing 1.

[0032] Although the embodiments of the present invention have been shown and described, this specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. The specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can make modifications, substitutions, and variations that do not contribute creatively to the embodiments as needed, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A high-power semiconductor laser module, comprising a housing (1), characterized in that: One side of the housing (1) is movably connected to a flexible optical sheet (2). The housing (1) and the flexible optical sheet (2) are connected by a rubber ring (3). Two groups of chutes (4) are provided at one end of the housing (1) close to the flexible optical sheet (2). A slide bar (5) that fits with the chute (4) is slidably connected in the chute (4). One end of the slide bar (5) is connected to one side of the flexible optical sheet (2). Each chute (4) and the corresponding slide bar (5) are connected by a first spring (6).

2. The high-power semiconductor laser module according to claim 1, wherein: An optical component (7) is movably connected to one side of the flexible optical sheet (2) close to the housing (1). The optical component (7) slides within the housing (1).

3. The high-power semiconductor laser module according to claim 2, characterized in that: Grooves (8) are provided on both sides inside the housing (1). A convex block (9) that fits with the groove (8) is slidably connected in the groove (8). Each convex block (9) is fixedly connected to one side of the optical component (7). The convex block (9) is arranged in a "T" shape.

4. The high-power semiconductor laser module according to claim 3, wherein: Each groove (8) and the corresponding convex block (9) are connected by a second spring (10).

5. The high-power semiconductor laser module according to claim 4, wherein: A number of heat dissipation holes (11) are provided on both sides of the housing (1). A filter screen (12) is movably connected to one side of the heat dissipation hole (11).

6. The high-power semiconductor laser module according to claim 5, characterized in that: The heat dissipation hole (11) and the filter screen (12) are connected by a colloid.

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