SMT (Surface Mount Technology) cleaning machine

Abstract

The utility model provides an SMT paster cleaning machine which comprises a cleaning table and a cleaning assembly installed above the cleaning table in a sliding mode, a first telescopic device used for driving the cleaning assembly to move is installed on the cleaning table, and a step groove is formed in the cleaning table. A dust collection assembly communicating with the stepped groove is installed at the bottom end of the stepped groove. The cleaning assembly comprises a supporting frame and a cleaning plate installed on the supporting frame, a liquid cavity is formed in the cleaning plate, and a plurality of dripping holes communicating with the liquid cavity are formed in the cleaning plate; a liquid supply assembly is installed on the cleaning table and used for inputting plate cleaning liquid into the liquid cavity. The circuit board cleaning device can solve the problems that in the prior art, when board cleaning water is directly sprayed to the back face of a circuit board to remove welding residues, the board cleaning water permeates into a sensitive element arranged on the front face of the circuit board through a board hole in the circuit board and makes contact with a silk screen, corrosion is caused, and the quality of finished products is affected.

Description

Technical Field

[0001] The utility model relates to the technical field of SMT patch processing, and particularly relates to an SMT patch cleaning machine. Background Art

[0002] At present, in the production process of PCB circuit boards, welding residues will be formed on the PCB circuit boards assembled and welded through processes such as patching and plugging; in order to improve the quality of SMT patching, a cleaning device for SMT patch production and processing is usually used to clean the surface of the PCB board, remove the welding residues harmful to the human body on the PCB board, so as to facilitate the subsequent assembly or processing of SMT patching and improve the production efficiency of SMT patching.

[0003] In order to achieve a comprehensive cleaning of SMT patches, the utility model with the publication number of CN221361486U discloses a cleaning device for SMT patch production and processing (hereinafter referred to as the prior art 1), including: a base, a spray head is arranged on the top of the base, and a collection component is arranged at the bottom of the base; an adjustment component, the adjustment component includes a support plate arranged on the top of the base and an opening groove opened on the top of the support plate, a screw rod is rotatably installed inside the opening groove, a moving seat is sleeved on the periphery of the screw rod, the top of the spray head is connected with the bottom of the moving seat, and a first power component is arranged on one side of the support plate.

[0004] Although the prior art 1 realizes a comprehensive cleaning of SMT patches by setting an adjustable spray head, when the prior art 1 directly sprays the board washing water with certain corrosiveness onto the back of the circuit board to remove the welding residues, the board washing water may penetrate through the board holes on the circuit board and contact with the sensitive components and silk printing arranged on the front of the circuit board, causing corrosion and affecting the finished product quality. Content of the Utility Model

[0005] The purpose of the utility model is to provide an SMT patch cleaning machine, which can solve the problem that when the board washing water is directly sprayed onto the back of the circuit board to remove the welding residues in the prior art, the board washing water penetrates through the board holes on the circuit board and contacts with the sensitive components and silk printing arranged on the front of the circuit board, causing corrosion and affecting the finished product quality during the actual use process.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0007] An SMT patch cleaning machine includes a cleaning table and a cleaning component slidably installed above the cleaning table, a first telescopic device for driving the cleaning component to move is installed on the cleaning table, a stepped groove is arranged on the cleaning table, and a dust suction component communicated with the stepped groove is installed at the bottom end of the stepped groove;

[0008] The cleaning component includes a support frame and a cleaning plate mounted on the support frame. A liquid chamber is provided inside the cleaning plate, and a number of drip holes communicating with the liquid chamber are provided on the cleaning plate. A liquid supply component is mounted on the cleaning table, and the liquid supply component is used to input the plate washing liquid into the liquid chamber.

[0009] A number of filter holes are provided on the stepped groove, and the filter holes are communicated with the dust suction component.

[0010] Preferably, a second telescopic device is mounted on the support frame, and the cleaning plate is connected to the support frame through the second telescopic device.

[0011] Preferably, the cleaning plate is detachably connected to the telescopic end of the second telescopic device.

[0012] Preferably, the dust suction component includes a dust collection cover, an exhaust pipe and an exhaust fan. The exhaust fan is mounted on the cleaning table. The dust collection cover is connected to the bottom end of the stepped groove and is communicated with the stepped groove and the filter holes. The dust collection cover is connected to the exhaust fan through the exhaust pipe.

[0013] Preferably, a liquid collection box is mounted on the intake end of the exhaust pipe. A number of through holes are provided on the liquid collection box, and a water absorbent cotton is mounted inside the liquid collection box.

[0014] Preferably, the liquid collection box is detachably connected to the exhaust pipe.

[0015] Preferably, the liquid supply component includes a liquid supply tank and a pump body. The liquid supply tank is mounted on the cleaning table, the pump body is mounted on the liquid supply tank, the end of the liquid delivery pipe far from the cleaning plate is connected to the liquid outlet end of the pump body, and the pump body is used to pump the liquid in the liquid supply tank into the liquid delivery pipe.

[0016] Preferably, the liquid delivery pipe is a telescopic pipe.

[0017] Preferably, bristles are connected to the bottom surface of the cleaning plate.

[0018] Preferably, a sliding groove is provided on the cleaning table, and the support frame is slidably mounted on the cleaning table through the sliding groove.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] In the present utility model, after the SMT patch is placed face up in the stepped groove, the stepped groove can limit the SMT patch after contacting it; after the liquid supply component inputs the circuit board cleaning liquid into the liquid cavity, the circuit board cleaning liquid flows out through a plurality of drip holes provided at the bottom end of the cleaning board and can moisten the cleaning board; the support frame is connected to the telescopic end of the first telescopic device, and under the drive of the first telescopic device, the support frame can drive the cleaning board to move horizontally. After the bottom surface of the cleaning board contacts the back surface of the SMT patch, the welding residues on the back surface of the SMT patch can be cleaned as the cleaning board moves horizontally.

[0021] The dust suction component is installed at the bottom end of the stepped groove and is communicated with the stepped groove. When the dust suction component is started, it can clean the dust adhered to each component on the surface of the SMT patch; during the process of the cleaning board cleaning the back surface of the SMT patch, the excess circuit board cleaning liquid enters the dust collection component through the filter holes under the action of the dust collection component for collection, so as to prevent the excess circuit board cleaning liquid from remaining on the SMT patch and eroding the components installed on the surface of the SMT patch. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 is a perspective view of the present utility model.

[0024] Figure 2 is a structural schematic diagram of the present utility model.

[0025] Figure 3 For the present utility model Figure 2 is a partial enlarged view of part A.

[0026] In the drawings, the list of components represented by each reference numeral is as follows:

[0027] 101-cleaning table, 102-cleaning assembly, 103-first telescopic device, 104-step groove, 105-dust suction assembly, 106-support frame, 107-cleaning plate, 108-liquid chamber, 109-liquid supply assembly, 110-filter hole, 111-second telescopic device, 112-dust hood, 113-exhaust pipe, 114-exhaust fan, 115-liquid collection box, 116-through hole, 117-absorbent cotton, 118-liquid supply box, 119-pump body, 120-infusion tube, 121-brush, 122-chute. DETAILED DESCRIPTION

[0028] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0029] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0031] In the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0032] In the embodiments of the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over", and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath", and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0033] The following disclosure provides many different embodiments or examples for implementing different structures of the embodiments of the present utility model. To simplify the disclosure of the embodiments of the present utility model, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the embodiments of the present utility model. In addition, the embodiments of the present utility model may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0034] The embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

[0035] Refer to Figures 1 - 3 , this embodiment discloses a cleaning machine for cleaning a circuit board, specifically an SMT patch cleaning machine, including a cleaning table 101 and a cleaning component 102 slidably installed above the cleaning table 101. A first telescopic device 103 for driving the movement of the cleaning component 102 is installed on the cleaning table 101. A stepped groove 104 is provided on the cleaning table 101, and a dust suction component 105 communicating with the stepped groove 104 is installed on the cleaning table 101;

[0036] The cleaning component 102 includes a support frame 106 and a cleaning plate 107 installed on the support frame 106. A liquid cavity 108 is provided inside the cleaning plate 107, and a number of drip holes communicating with the liquid cavity 108 are provided on the cleaning plate 107. A liquid supply component 109 is installed on the cleaning table 101, and the liquid supply component 109 is used to input a circuit board cleaning liquid into the liquid cavity 108;

[0037] A number of filter holes 110 are provided on the stepped groove 104, and the filter holes 110 communicate with the dust suction component 105.

[0038] In this embodiment, a non-woven fabric is fixedly connected to one side of the cleaning plate 107 for contacting the back surface of the SMT patch. After the SMT patch is placed face-up in the stepped groove 104, the stepped groove 104 can limit the SMT patch after contacting it. After the liquid supply assembly 109 inputs the cleaning solution into the liquid chamber 108, the cleaning solution can wet the non-woven fabric mounted on the cleaning plate 107 after flowing out through a plurality of drip holes provided at the bottom end of the cleaning plate 107. The support frame 106 is connected to the telescopic end of the first telescopic device 103. Driven by the first telescopic device 103, the support frame 106 can drive the cleaning plate 107 to move horizontally. After the bottom surface of the cleaning plate 107 contacts the back surface of the SMT patch, the welding residues on the back surface of the SMT patch can be cleaned as the cleaning plate 107 moves horizontally. The dust suction assembly 105 is installed at the bottom end of the stepped groove 104 and communicates with the stepped groove 104. When the dust suction assembly 105 is started, it can clean the dust adhered to each component on the surface of the SMT patch. During the process of cleaning the back surface of the SMT patch by the cleaning plate, the excess cleaning solution enters the dust collection assembly through the filter holes 110 under the action of the dust collection assembly for collection, so as to prevent the excess cleaning solution from remaining on the SMT patch and eroding the components mounted on the surface of the SMT patch.

[0039] In some embodiments, a second telescopic device 111 is installed on the support frame 106, and the cleaning plate 107 is connected to the support frame 106 through the second telescopic device 111. The fixed end of the second telescopic device 111 is connected to the support frame 106, and the telescopic end of the second telescopic device 111 is fixedly connected to the cleaning plate 107. By setting the second telescopic device 111, the cleaning plate 107 can be driven to move vertically up and down, so that the cleaning plate 107 can move up and down according to the different thicknesses of the SMT patch and closely adhere to the back surface of the SMT patch, thereby achieving a better cleaning effect.

[0040] In some embodiments, the cleaning plate 107 is detachably connected to the telescopic end of the second telescopic device 111. A threaded groove is provided on the telescopic end of the second telescopic device 111, and the cleaning plate 107 is threadedly connected to the telescopic end of the second telescopic device 111 through the broken stone threaded groove. By making the cleaning plate 107 detachably connected to the second telescopic device 111, it is convenient to clean and replace the cleaning plate 107.

[0041] In some embodiments, the dust suction assembly 105 includes a dust collection hood 112, an air extraction pipe 113, and an air extraction fan 114. The air extraction fan 114 is installed on the cleaning table 101. The dust collection hood 112 is connected to the bottom end of the stepped groove 104 and communicates with the stepped groove 104 and the filter holes 110. The dust collection hood 112 is connected to the air extraction fan 114 through the air extraction pipe 113. After the air extraction fan 114 is started, a negative pressure is formed in the dust collection hood 112. Under the action of the air extraction fan 114, the dust accumulated on the components mounted on the front side of the SMT patch can be cleaned, and the excess washing solution generated during the cleaning process can enter the dust collection hood 112 through the filter holes 110 for collection.

[0042] In some embodiments, the end of the air extraction pipe 113 away from the air extraction fan 114 is connected to the side surface of the dust collection hood 112. By connecting the air extraction pipe 113 to the side surface of the dust collection hood 112, while the dust collection hood 112 forms a negative pressure under the action of the air extraction fan, it can further prevent the liquid droplets of the washing solution entering the dust collection hood 112 from entering the air extraction pipe 113.

[0043] In some embodiments, a liquid collection box 115 is installed at the air inlet end of the air extraction pipe 113. A plurality of through holes 116 are provided on the liquid collection box 115, and a water absorbent cotton 117 is installed in the liquid collection box 115. After a negative pressure is formed in the dust collection hood 112, the excess washing solution generated during the cleaning process enters the liquid collection box 115 provided in the dust collection hood 112 through the filter holes 110. The water absorbent cotton installed in the liquid collection box 115 can collect the washing solution and dust entering the liquid collection box 115. The filtered gas enters the air extraction pipe 113 through the through holes 116 and is discharged outside the cleaning table 101 under the action of the air extraction fan 114.

[0044] In some embodiments, the liquid collection box 115 is detachably connected to the air extraction pipe 113. A limiting platform is fixedly connected to the top end of the liquid collection box 115. After the limiting platform contacts the dust collection hood 112, it can limit the liquid collection box 115, which is convenient for cleaning and replacing the liquid collection box 115.

[0045] In some embodiments, the liquid supply assembly 109 includes a liquid supply tank 118 and a pump body 119. The liquid supply tank 118 is installed on the cleaning table 101, the pump body 119 is installed on the liquid supply tank 118, the liquid outlet end of the pump body 119 is connected with an infusion pipe 120, the cleaning plate 107 is connected to the pump body 119 through the infusion pipe 120, and the pump body 119 is used to pump the liquid in the liquid supply tank 118 into the infusion pipe 120. In this embodiment, the pump body 119 is a conventional conveying device in the prior art, and its structure and function will not be elaborated one by one here.

[0046] In some embodiments, the infusion tube 120 is a telescopic tube. When the support frame 106 horizontally moves away from the liquid supply tank 118 under the drive of the first telescopic device 103, the telescopic tube elongates; when the support frame 106 horizontally moves towards the liquid supply tank 118 under the drive of the first telescopic device 103, the telescopic tube shortens.

[0047] In some embodiments, bristles 121 are connected to the bottom surface of the cleaning plate 107. After the pump body 119 inputs the cleaning liquid in the liquid supply tank 118 into the liquid cavity 108 through the infusion tube 120, the cleaning liquid flows out through a plurality of drip holes provided at the bottom end of the cleaning plate 107 and can moisten the bristles 121. By providing the bristles 121, the cleaning effect on the back surface of the STM patch can be further improved.

[0048] In some embodiments, a sliding groove 122 is provided on the cleaning table 101, and the support frame 106 is slidably mounted on the cleaning table 101 through the sliding groove 122. The sliding groove 122 is used to limit and guide the cleaning table 101, so that the cleaning table 101 can move smoothly under the drive of the first telescopic device 103.

[0049] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications once they learn the basic creative concept. Therefore, the appended claims are intended to be interpreted to include the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An SMT patch cleaning machine, comprising a cleaning table (101) and a cleaning component (102) slidably mounted above the cleaning table (101), wherein a first telescopic device (103) for driving the cleaning component (102) to move is mounted on the cleaning table (101), and is characterized in that: A stepped groove (104) is provided on the cleaning table (101), and a dust suction assembly (105) communicating with the stepped groove (104) is installed at the bottom end of the stepped groove (104); The cleaning assembly (102) includes a support frame (106) and a cleaning plate (107) installed on the support frame (106). A liquid cavity (108) is provided inside the cleaning plate (107), and a number of drip holes communicating with the liquid cavity (108) are provided on the cleaning plate (107); A liquid supply assembly (109) is installed on the cleaning table (101), and the liquid supply assembly (109) is used to input cleaning liquid for the plate into the liquid cavity (108); A number of filter holes (110) are provided on the stepped groove (104), and the filter holes (110) communicate with the dust suction assembly (105).

2. The SMT patch cleaning machine according to claim 1, wherein: A second telescopic device (111) is installed on the support frame (106), and the cleaning plate (107) is connected to the support frame (106) through the second telescopic device (111).

3. The SMT patch cleaning machine according to claim 2, wherein: The cleaning plate (107) is detachably connected to the telescopic end of the second telescopic device (111).

4. A SMT patch cleaning machine according to claim 1, characterized in that: The dust suction assembly (105) includes a dust collection hood (112), an exhaust pipe (113) and an exhaust fan (114). The exhaust fan (114) is installed on the cleaning table (101). The dust collection hood (112) is connected to the bottom end of the stepped groove (104) and communicates with the stepped groove (104) and the filter holes (110). The dust collection hood (112) is connected to the exhaust fan (114) through the exhaust pipe (113).

5. The SMT patch cleaning machine according to claim 4, characterized in that: A liquid collection box (115) is installed at the intake end of the exhaust pipe (113). A number of through holes (116) are provided on the liquid collection box (115), and a water absorbent cotton (117) is installed inside the liquid collection box (115).

6. The SMT patch cleaning machine according to claim 5, characterized in that: The liquid collection box (115) is detachably connected to the exhaust pipe (113).

7. A kind of SMT patch cleaning machine according to claim 1, characterized in that: The liquid supply assembly (109) includes a liquid supply tank (118) and a pump body (119). The liquid supply tank (118) is installed on the cleaning table (101), and the pump body (119) is installed on the liquid supply tank (118). The liquid outlet end of the pump body (119) is connected with an infusion tube (120). The cleaning plate (107) is connected to the pump body (119) through the infusion tube (120). The pump body (119) is used to pump the liquid in the liquid supply tank (118) into the infusion tube (120).

8. The SMT patch cleaning machine according to claim 7, wherein: The infusion tube (120) is a telescopic tube.

9. A kind of SMT patch cleaning machine according to claim 1, characterized in that: The bottom surface of the cleaning plate (107) is connected with bristles (121).

10. A SMT patch cleaning machine according to claim 1, characterized in that: A sliding groove (122) is provided on the cleaning table (101), and the support frame (106) is slidably installed on the cleaning table (101) through the sliding groove (122).

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