Wafer cleaning roller and wafer cleaning device with same
By using hollow rods and foam filler design in the wafer cleaning roller, the problem of uneven cleaning of the sponge roller brush is solved, and efficient cleaning of the wafer surface is achieved, dirt residue is avoided and cleaning quality is improved.
Patent Information
- Application Number
- CN202422047831.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-08-22
AI Technical Summary
In the prior art, the sponge roller brush is unevenly wet when cleaning the wafer, resulting in dirt that cannot be effectively removed, resulting in residual defects on the wafer surface.
Design a wafer cleaning roller, which uses a hollow cavity and cleaning hole in the hollow rod to fill the foam filler and the cleaning sponge, and uses centrifugal force to evenly distribute the cleaning liquid to ensure that the cleaning sponge is evenly wet and avoid dirt residue caused by local drying.
By evenly distributing the cleaning liquid, the cleaning degree of wafer cleaning is improved, dirt is prevented from remaining on the wafer surface, and the cleaning effect is improved.
Smart Images
Figure CN223056215U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a wafer cleaning roller and a wafer cleaning device with the same. Background Art
[0002] After polishing, the wafer needs to be cleaned of surface impurities to avoid contamination of semiconductor devices by dirt particles, etc. The cleaning of the wafer generally uses a brush cleaning method. At this time, the brush used includes a hollow shaft and a sponge outside the hollow shaft. The brush is installed on a rotatable brush fixing structure. During the rotation of the brush, the cleaning liquid enters the sponge through the hollow shaft and seeps out from the surface of the sponge, thereby completing the cleaning of the wafer.
[0003] In the prior art, when using a sponge brush to clean a wafer, due to the uneven wetness of the sponge, the local sponge is often relatively dry, which causes dirt to be unable to be effectively removed and adheres to the surface of the sponge, resulting in defects on the surface of the wafer during wafer cleaning. Summary of the Utility Model
[0004] Therefore, the technical problem to be solved by the utility model is to overcome the defect that dirt remains on the wafer surface when using a sponge brush to clean the wafer in the prior art, so as to provide a wafer cleaning roller and a wafer cleaning device with the same.
[0005] To solve the above technical problem, the utility model provides a wafer cleaning roller, including:
[0006] A hollow rod, provided with a hollow cavity thereon, the hollow cavity extends along the axial direction of the hollow rod, and the hollow cavity is adapted to be filled with a cleaning liquid, and cleaning holes are penetrated through the side wall of the hollow cavity;
[0007] A foaming filling member, filled and installed in the hollow cavity;
[0008] A cleaning sponge, sleeved and installed outside the hollow rod.
[0009] Optionally, a plurality of cleaning holes are provided, and the plurality of cleaning holes are uniformly arranged on the inner wall of the hollow cavity.
[0010] Optionally, the cleaning holes are arranged in four columns at intervals along the circumferential direction of the hollow rod.
[0011] Optionally, the foaming filling member extends into the cleaning holes.
[0012] Optionally, the foaming filling member extends to contact and connect with the cleaning sponge.
[0013] Optionally, the foaming filling member is a foaming sponge, and the water absorption rate of the foaming sponge is 800% - 1200%.
[0014] Optionally, the outer surface of the cleaning sponge is provided with cleaning protrusions, and a plurality of cleaning protrusions are arranged at intervals on the outer surface of the cleaning sponge.
[0015] Optionally, the plurality of cleaning protrusions are uniformly arranged on the outer surface of the cleaning sponge.
[0016] Optionally, one end of the hollow cavity is closed, and the other end is adapted to communicate with a cleaning liquid supply device.
[0017] The present utility model also provides a wafer cleaning device, which has the wafer cleaning roller described in the present utility model.
[0018] The technical solution of the present utility model has the following advantages:
[0019] 1. The wafer cleaning roller provided by the present utility model includes: a hollow rod, on which a hollow cavity is provided, the hollow cavity extends along the axial direction of the hollow rod, a cleaning liquid is adapted to be filled in the hollow cavity, and cleaning holes are penetrated through the side wall of the hollow cavity; a foaming filling member, which is filled and installed in the hollow cavity; a cleaning sponge, which is sleeved and installed outside the hollow rod.
[0020] When using the wafer cleaning roller to clean the wafer, the cleaning liquid is introduced into the hollow cavity of the hollow rod through a cleaning liquid supply device. The foaming filling member expands under the action of the cleaning liquid to completely fill the hollow cavity and stores the cleaning liquid inside the foaming filling member. Due to the water absorption of the foaming filling member, the cleaning liquid can be evenly distributed in the hollow cavity. During the rotation of the wafer cleaning roller, due to the action of centrifugal force, the cleaning liquid in the foaming filling member is thrown out from the cleaning holes to wet the cleaning sponge, so that the cleaning sponge can be evenly wetted by the cleaning liquid, thereby avoiding the situation that local dirt on the wafer cannot be cleaned due to local drying of the cleaning sponge, preventing dirt from remaining on the wafer surface and affecting the quality of the wafer, and improving the cleaning degree of wafer cleaning.
[0021] 2. For the wafer cleaning roller provided by the present utility model, the foaming filling member extends into the cleaning holes, which increases the smooth length of the cleaning liquid thrown out from the foaming filling member under the action of centrifugal force, and further improves the evenness of the cleaning sponge being soaked. Description of the Drawings
[0022] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0023] Figure 1 It is a schematic structural diagram of the wafer cleaning roller provided in the embodiment of the present utility model.
[0024] Figure 2 This is a schematic structural view of the hollow rod provided in the embodiment of the present utility model.
[0025] Figure 3 This is a side view of the hollow rod provided in the embodiment of the present utility model.
[0026] Explanation of reference numerals: 1, hollow rod; 2, hollow cavity; 3, cleaning hole; 4, foaming filler; 5, cleaning sponge; 6, cleaning protrusion. Specific embodiments
[0027] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0028] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0029] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0030] In addition, the technical features involved in different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.
[0031] Embodiment 1
[0032] Figures 1 to 3 Shown is a wafer cleaning roller provided in this embodiment, including a hollow rod 1, a foaming sponge as the foaming filler 4, and a cleaning sponge 5 sleeved and installed on the hollow rod 1.
[0033] A hollow cavity 2 is provided on the hollow rod 1. The hollow cavity 2 extends along the axial direction of the hollow rod 1. The hollow cavity 2 is adapted to be filled with a cleaning liquid. A cleaning hole 3 is provided through the side wall of the hollow cavity 2. One end of the hollow cavity 2 is closed, and the other end is adapted to communicate with a cleaning liquid supply device, so that the cleaning liquid entering the hollow cavity 2 is all ejected from the cleaning hole 3 and absorbed by the cleaning sponge 5. A foaming filler 4 is filled and installed in the hollow cavity 2. The cleaning sponge 5 is coaxially sleeved and installed outside the hollow rod 1.
[0034] In order to improve the uniformity and smoothness of the outflow of the cleaning liquid from the hollow cavity 2, a plurality of cleaning holes 3 are provided, and the plurality of cleaning holes 3 are uniformly arranged on the inner wall of the hollow cavity 2. In this embodiment, the cleaning holes 3 are arranged in four columns at intervals along the circumferential direction of the hollow rod 1. The foaming filler 4 completely fills the cleaning holes 3 so that the foaming filler 4 is in direct contact connection with the cleaning sponge 5. In order to improve the cleaning degree of the cleaning sponge 5 for wafer cleaning, cleaning protrusions 6 are provided on the outer surface of the cleaning sponge 5, and a plurality of cleaning protrusions 6 are arranged at intervals on the outer surface of the cleaning sponge 5. The plurality of cleaning protrusions 6 are uniformly arranged on the outer surface of the cleaning sponge 5. In some other embodiments, the foaming filler 4 may not extend into the cleaning holes 3; or, the foaming filler 4 extends into the cleaning holes 3, but does not completely fill the cleaning holes 3, and the foaming filler 4 is not in direct contact with the cleaning sponge 5.
[0035] In this embodiment, the water absorption rate of the foaming sponge used for the foaming filler 4 is 800% - 1200%. The foaming sponge is made of a polyvinyl alcohol foaming material; the density range of the foaming sponge is 0.07g - 0.13g / cm 3 ; water absorption rate formula: X = (G2 - G1) / G1, where X is the water absorption rate, G2 is the mass after the sponge absorbs the maximum amount of water, and G1 is the mass of the non - water - absorbing sponge; the water absorption rate of the sponge in this solution is calculated to be approximately 800% - 1200%;
[0036] The wafer cleaning roller provided in this embodiment has a cleaning sponge 5 sleeved on the outer periphery of a hollow rod 1. A hollow cavity 2 is formed inside the hollow rod 1, which serves as a water flow pipeline for conveying water. A plurality of through cleaning holes 3 are provided on the hollow rod 1. The water in the hollow cavity 2 serving as the water flow pipeline enters the cleaning sponge 5 arranged outside the hollow rod 1 through the cleaning holes 3 on the hollow rod 1, for infiltrating and flushing the external cleaning sponge 5. By filling a foaming filler 4 inside the hollow rod 1, the foaming filler 4 fills all the space pipelines of the hollow rod 1 inside the hollow rod 1 and communicates with the cleaning sponge 5 through a plurality of cleaning holes 3, playing a role in uniformly conveying water to infiltrate the external cleaning sponge. The foaming sponge serving as the foaming filler 4 is in contact and communication with the cleaning sponge 5 and conducts water. The wafer cleaning roller provided in this embodiment uses a foaming sponge material to fill the hollow cavity 2 for circulating the cleaning liquid in the hollow rod 1, and utilizes the water permeability of the foaming sponge to allow water to pass through unobstructed, making the hollow cavity 2 in a saturated water state, and enabling the water to uniformly flow from the cleaning holes 3 to the surface of the cleaning sponge 5 outside the hollow rod 1, making the water flow condition of the entire cleaning sponge 5 tend to be average, enabling each part of the cleaning sponge 5 to remain moist, reducing the adhesion of dirt, and thus reducing the situation of forming defects on the wafer surface.
[0037] Embodiment 2
[0038] This embodiment provides a wafer cleaning device, which has the wafer cleaning roller described in Embodiment 1. When cleaning the wafer by using the wafer cleaning roller, a cleaning liquid is introduced into the hollow cavity 2 of the hollow rod 1 through a cleaning liquid supply device. The foaming filler 4 expands under the action of the cleaning liquid to completely fill the hollow cavity 2 and stores the cleaning liquid inside the foaming filler 4. Due to the water absorption property of the foaming filler 4, the cleaning liquid can be evenly distributed in the hollow cavity 2. During the rotation of the wafer cleaning roller, due to the action of centrifugal force, the cleaning liquid in the foaming filler 4 is thrown out from the cleaning holes 3 to wet the cleaning sponge 5, enabling the cleaning sponge 5 to be evenly wetted by the cleaning liquid, thereby avoiding the situation that local dirt on the wafer cannot be cleaned due to local drying of the cleaning sponge 5, preventing dirt from remaining on the wafer surface and affecting the wafer quality, and improving the cleaning degree of wafer cleaning.
[0039] Obviously, the above embodiments are only examples given for clear illustration and not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or variations derived therefrom are still within the protection scope of the present invention.
Claims
1. A wafer cleaning roller, characterized in that, Comprising: A hollow rod (1) provided with a hollow cavity (2) extending along the axial direction of the hollow rod (1). The hollow cavity (2) is adapted to be filled with a cleaning liquid, and a cleaning hole (3) is penetratingly provided on the side wall of the hollow cavity (2); A foam filling member (4) filled and installed in the hollow cavity (2); A cleaning sponge (5) sleeved and installed outside the hollow rod (1).
2. The wafer cleaning roller according to claim 1, wherein A plurality of the cleaning holes (3) are provided, and the plurality of cleaning holes (3) are uniformly arranged on the inner wall of the hollow cavity (2).
3. The wafer cleaning roller according to claim 2, wherein The cleaning holes (3) are arranged in four columns at intervals along the circumferential direction of the hollow rod (1).
4. The wafer cleaning roller according to any one of claims 1 to 3, characterized in that, The foam filling member (4) extends into the cleaning holes (3).
5. The wafer cleaning roller according to claim 4, wherein, The foam filling member (4) extends to be in contact connection with the cleaning sponge (5).
6. The wafer cleaning roller according to any one of claims 1 to 3, characterized in that, The foam filling member (4) is a foam sponge, and the water absorption rate of the foam sponge is 800% - 1200%.
7. The wafer cleaning roller according to any one of claims 1 to 3, characterized in that, A cleaning protrusion (6) is provided on the outer surface of the cleaning sponge (5), and a plurality of the cleaning protrusions (6) are provided at intervals on the outer surface of the cleaning sponge (5).
8. The wafer cleaning roller according to claim 7, wherein The plurality of cleaning protrusions (6) are uniformly arranged on the outer surface of the cleaning sponge (5).
9. The wafer cleaning roller according to any one of claims 1 to 3, characterized in that, One end of the hollow cavity (2) is closed, and the other end is adapted to be communicated with a cleaning liquid supply device.
10. A wafer cleaning device, characterized in that, A wafer cleaning roller according to any one of claims 1 to 9.