Wafer edge film fragment detection device and chemical mechanical polishing equipment
By setting up friction detection components on chemical mechanical polishing equipment, the wafer edge film debris is automatically judged, which solves the scratching problem caused by inaccurate detection in the prior art, and realizes efficient film debris detection and processing, which improves product yield.
Patent Information
- Application Number
- CN202422288516.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-19
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-09-19
AI Technical Summary
The prior art lacks targeted detection of wafer edge film debris, resulting in the problem of scratching the wafer surface after chemical mechanical polishing.
Friction force detection components are provided on the top of the conveying disk of the chemical mechanical polishing equipment. The wafer is driven to rotate through the grinding head, and the frictional force value at the edge of the wafer is detected. The controller is used to automatically judge the existence of film debris, and automatic detection and processing are realized.
It improves the detection accuracy of wafer edge film debris, avoids scratches during chemical mechanical polishing, improves product yields, and realizes intelligent and automated production processes.
Smart Images
Figure CN223057369U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a film layer fragment detection device at the edge of a wafer and a chemical mechanical polishing equipment. Background Art
[0002] For Chemical Mechanical Polishing (CMP), the film layer fragments (peeling) at the edge of the wafer have a crucial impact on the defects of the wafer surface after chemical mechanical polishing. The film layer fragments at the edge of the wafer will cause scratches on the wafer surface during the grinding process. For the film layer fragments, the main reasons for the defects on the wafer surface are as follows: Due to the need to meet the process requirements, the edge cleaning conditions of different film layers on the wafer may be different, which may lead to weak adhesion of different film layer materials in the areas with different edge cleaning differences at the edge of the wafer, and then the film layer materials will peel off to form film layer fragments in the subsequent process. Therefore, if the film layer fragments can be detected and cleaned in time, the overall yield of the wafer can be improved. However, there is currently a lack of targeted detection of film layer fragments.
[0003] In view of this, it is necessary to provide a film layer fragment detection device at the edge of a wafer and a chemical mechanical polishing equipment to solve the above problems. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a film layer fragment detection device at the edge of a wafer and a chemical mechanical polishing equipment to improve the problem of the lack of targeted detection of film layer fragments in the prior art.
[0005] The utility model provides a film layer fragment detection device at the edge of a wafer, including: a friction force detection component arranged on the top surface of a transfer disk of a chemical mechanical polishing equipment, the transfer disk being a wafer waiting area, adsorbing the wafer by a grinding head of the chemical mechanical polishing equipment and placing the edge of the wafer on the friction force detection component, enabling the grinding head to rotate with the wafer, and detecting the friction force value at the edge of the wafer through the friction force detection component, so as to judge whether there are film layer fragments at the edge of the wafer according to the detected friction force value.
[0006] The beneficial effects of the film layer fragment detection device for the wafer edge provided by the present utility model are as follows: The friction force detection component is arranged on the transfer disk of the chemical mechanical polishing equipment. Before the wafer undergoes chemical mechanical polishing, the grinding head adsorbs the wafer and places the wafer edge on the friction force detection component. The grinding head rotates together with the wafer, and the wafer edge contacts the friction force detection component to generate a friction force. The friction force when there are film layer fragments at the wafer edge is greater than the friction force when there are no film layer fragments at the wafer edge. By detecting the friction force value at the wafer edge through the friction force detection component, it can be determined whether there are film layer fragments at the wafer edge according to the magnitude of the detected friction force value.
[0007] In a possible embodiment, the friction force detection component includes a supporting portion for supporting the wafer edge. When the wafer is placed on the supporting portion, there is a gap between the area of the wafer inside the supporting portion and the top surface of the transfer disk. The beneficial effects are as follows: Only the wafer edge area contacts the supporting portion. On the one hand, only detecting the wafer edge area can improve the accuracy of friction force detection; on the other hand, the area of the wafer inside the supporting portion is suspended, avoiding wear caused by contact friction of the area of the wafer inside the supporting portion.
[0008] In a possible embodiment, the supporting portion is in a ring shape; or, there are several supporting portions, and the several supporting portions are distributed in a circular array. The beneficial effects are as follows: The setting that the supporting portion is in a ring shape or the several supporting portions are distributed in a circular array can better match the circular wafer.
[0009] In a possible embodiment, for the case where there are several supporting portions distributed in a circular array, the supporting portion is in an arc shape or a circular shape.
[0010] In a possible embodiment, for the case where the supporting portion is in a ring shape, the radius range of the inner ring of the supporting portion is 140 mm - 145 mm; and / or, the radius range of the outer ring of the supporting portion is 155 mm - 160 mm. The beneficial effects are as follows: By reasonably setting the sizes of the inner ring radius and the outer ring radius of the supporting portion in a ring shape to match the size of the wafer, the wafer edge area can be detected specifically.
[0011] In a possible embodiment, in the case where a plurality of the supporting portions are distributed in an annular array, the plurality of the supporting portions define an annular region, and the radius range of the inner ring of the annular region is 140 mm - 145 mm; and / or, the radius range of the outer ring of the annular region is 155 mm - 160 mm. The beneficial effect is that by reasonably setting the sizes of the inner ring radius and the outer ring radius of the annular region to match the size of the wafer, the edge region of the wafer is specifically detected.
[0012] In a possible embodiment, the film layer fragment detection device further includes a controller communicatively connected to the friction force detection component. The controller is configured to compare the detected friction force value with a set friction force value. If the detected friction force value is less than the set friction force value, it is determined that there are no film layer fragments at the edge of the wafer; if the detected friction force value is greater than or equal to the set friction force value, it is determined that there are film layer fragments at the edge of the wafer. The beneficial effect is that the controller automatically receives the friction force data of the friction force detection component, compares and judges the friction force value, realizing an automated judgment.
[0013] In a possible embodiment, the controller is communicatively connected to the polishing head; when the controller determines that there are no film layer fragments at the edge of the wafer, the controller controls the polishing head to place the wafer on the polishing pad of the chemical mechanical polishing equipment, apply pressure to the whole wafer through the polishing head, and perform overall polishing on the wafer; when the controller determines that there are film layer fragments at the edge of the wafer, the controller controls the polishing head to place the wafer on the polishing pad of the chemical mechanical polishing equipment, apply pressure to the edge of the wafer through the polishing head, and perform separate polishing on the edge of the wafer. The beneficial effect is that the controller is communicatively connected to the polishing head, and the operation mode of the polishing head (i.e., overall polishing or separate edge polishing) is controlled according to the detection result of the film layer fragments at the edge of the wafer by the controller, realizing an intelligent production process.
[0014] In a possible embodiment, the film layer fragment detection device further includes an alarm communicatively connected to the controller. When the controller determines that there are film layer fragments at the edge of the wafer, the controller controls the alarm to give an alarm. The beneficial effect is that when the controller determines that there are film layer fragments at the edge of the wafer, an alarm is given by controlling the alarm to timely remind the operator.
[0015] In a possible embodiment, the film layer fragment detection device further includes a display communicatively connected to the controller, and the display is configured to display the detected friction force data in a graphical manner. The beneficial effect is that the detected friction force data is displayed through the display for the operator to observe.
[0016] The present utility model also provides a chemical mechanical polishing apparatus, including: a film layer fragment detection device at the edge of a wafer as in any of the above embodiments. Description of the Drawings
[0017] Figure 1 It is a schematic diagram of the film layer fragment detection device at the edge of a wafer of the present utility model installed in a chemical mechanical polishing apparatus.
[0018] Figure 2 It is a schematic diagram of the film layer fragment detection device at the edge of a wafer of the present utility model when detecting the edge of a wafer.
[0019] Figure 3 It is a schematic diagram of the film layer fragment detection device at the edge of a wafer of the present utility model when the supporting portion is arc-shaped.
[0020] Figure 4 It is a schematic diagram of the film layer fragment detection device at the edge of a wafer of the present utility model when the supporting portion is circular.
[0021] Figure 5 It is a logic block diagram of the film layer fragment detection device at the edge of a wafer of the present utility model and a polishing head.
[0022] Figure 6 It is a friction force curve diagram of the film layer fragment detection device at the edge of a wafer of the present utility model.
[0023] Description of the reference numerals: 110, friction force detection component; 111, supporting portion; 120, controller; 130, alarm; 140, display; 210, transfer disk; 220, polishing head; 230, polishing disk; 300, wafer. Detailed Embodiments
[0024] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0025] With the continuous development of the semiconductor industry, chemical mechanical polishing is considered to be the only process technology that can provide global and local planarization of wafers. The chemical mechanical polishing process has been widely used for the removal and planarization of interlayer dielectrics, metal layers (e.g., tungsten plugs, copper interconnects), and shallow trench isolation, becoming one of the fastest-growing fields in semiconductor manufacturing processes. With the continuous development of the semiconductor industry, the market demand for chips is increasing continuously, and it is particularly important to improve the production capacity and yield of chip manufacturing.
[0026] If there are film fragments at the edge of the wafer, during the grinding process, the film fragments will cause scratches on the wafer surface. In the prior art, for film fragments, the edge etch method is usually used to clean the film fragments, but due to the accumulation of multiple films in the front during chemical mechanical polishing, the edge etch method cannot clean all the film fragments (e.g., the edge etch has no consumption on the Ta barrier layer, bevel etch). In order to avoid residual film fragments at the edge of the wafer, it is also necessary to detect whether there are film fragments at the edge of the wafer before chemical mechanical polishing of the wafer to ensure that the film fragments are completely removed before chemical mechanical polishing of the wafer.
[0027] In view of the problems existing in the prior art, an embodiment of the present utility model provides a film fragment detection device for the edge of a wafer. Figure 1 It is a schematic diagram of the installation of the film fragment detection device for the edge of the wafer of the present utility model in a chemical mechanical polishing equipment. Figure 2 It is a schematic diagram of the film fragment detection device for the edge of the wafer of the present utility model when detecting the edge of the wafer. Figure 3 It is a schematic diagram of the film fragment detection device for the edge of the wafer of the present utility model when the supporting part is arc-shaped. Refer to Figure 1 、 Figure 2 and Figure 3 . The film fragment detection device includes: a friction force detection component 110 provided on the top surface of a transfer disk 210 of the chemical mechanical polishing equipment. The transfer disk 210 serves as a wafer waiting area. The grinding head 220 of the chemical mechanical polishing equipment adsorbs the wafer 300 and places the edge of the wafer 300 on the friction force detection component 110, so that the grinding head 220 drives the wafer 300 to rotate together, and the friction force value at the edge of the wafer 300 is detected by the friction force detection component 110, so that it can be judged whether there are film fragments at the edge of the wafer 300 according to the detected friction force value.
[0028] In this embodiment, the transfer disk 210 serves as a wafer waiting area for placing the wafer 300, and the friction force detection component 110 is disposed on the transfer disk 210. Before the wafer 300 undergoes chemical mechanical polishing, the polishing head 220 adsorbs the wafer 300 and places the edge of the wafer 300 on the friction force detection component 110. The polishing head 220 rotates together with the wafer 300, so that the edge of the wafer 300 is in full contact with the friction force detection component 110 and generates a friction force. When there are film fragments at the edge of the wafer 300, due to the relatively small contact area between the film fragments and the friction force detection component 110, a relatively large friction force will be generated. On the contrary, when there are no film fragments at the edge of the wafer 300, a relatively small friction force will be generated. According to the difference in the friction force between the two, it can be determined whether there are film fragments at the edge of the wafer 300. By detecting the friction force at the edge of the wafer 300 before chemical mechanical polishing, the present utility model can timely detect and handle the problem of film fragments at the edge of the wafer 300, and avoid scratching the surface of the wafer 300 caused by chemical mechanical polishing of the wafer 300 with film fragments, thereby improving the product yield.
[0029] In one embodiment, the friction force detection component 110 includes a supporting portion 111 for supporting the edge of the wafer 300. The surface of the supporting portion 111 for supporting the wafer 300 is a horizontal plane. When the wafer 300 is placed on the supporting portion 111, there is a gap between the area of the wafer 300 inside the supporting portion 111 and the top surface of the transfer disk 210. The shape of the supporting portion 111 is not specifically limited herein, as long as it can meet the requirement of adapting to the edge area range of the wafer 300. In this embodiment, since the film fragments are generated due to differences in the edge cleaning of the wafer 300, the film fragments usually appear at the edge of the wafer 300. The supporting portion 111 is designed to only contact the edge of the wafer 300 and only detect the friction force at the edge of the wafer 300, so as to avoid affecting the accuracy of the friction force detection due to too large a contact area. The area of the wafer 300 inside the supporting portion 111 is suspended and does not directly contact the transfer disk 210, avoiding possible friction between the area of the wafer 300 inside the supporting portion 111 and the transfer disk 210 during the rotation of the wafer 300, thereby improving the safety of the detection.
[0030] In the first embodiment, referring to Figure 1 , the supporting portion 111 is in a ring shape. In this embodiment, the supporting portion 111 being in a ring shape can better match the circular wafer 300. The ring-shaped supporting portion 111 can be in full contact with the edge of the wafer 300. During the rotation of the wafer 300, each position of the edge of the wafer 300 is supported and the force is balanced.
[0031] In the second embodiment,Figure 3 This is a schematic diagram of the film layer fragment detection device at the edge of the wafer of the present utility model when the supporting part is arc-shaped. Figure 4 This is a schematic diagram of the film layer fragment detection device at the edge of the wafer of the present utility model when the supporting part is circular. Refer to Figure 3 and Figure 4 , there are several of the supporting parts 111, and the several supporting parts 111 are distributed in a circular array. In this embodiment, the arrangement of the several supporting parts 111 distributed in a circular array can better match the circular wafer 300.
[0032] Furthermore, for the case where the several supporting parts 111 are distributed in a circular array, the supporting part 111 is in an arc shape or other shapes such as a circle, as Figure 3 and Figure 4 shown.
[0033] In a possible embodiment, refer to Figure 1 , for the case where the supporting part 111 is in a ring shape, the radius range of the inner ring of the supporting part 111 is 140 mm - 145 mm; and / or, the radius range of the outer ring of the supporting part 111 is 155 mm - 160 mm. In this embodiment, according to the size of the wafer 300, the sizes of the inner ring radius and the outer ring radius of the supporting part 111 in a ring shape are reasonably set to more accurately detect the frictional force at the edge of the wafer 300. On the one hand, it is avoided that the size of the supporting part 111 is too small to fully cover the edge area of the wafer 300, that is, it is possible that the film layer fragments do not contact the supporting part 111, thereby affecting the accuracy of the frictional force detection; on the other hand, it is avoided that the size of the supporting part 111 is too large to affect the accuracy of the frictional force detection, and it is also avoided that unnecessary contact friction is caused to the wafer 300 due to excessive contact.
[0034] Furthermore, refer to Figure 1 , for the case where the supporting part 111 is in a ring shape, the frictional force detection component 110 includes a frictional force sensor, and the supporting part 111 is the part where the frictional force sensor contacts the wafer 300.
[0035] In a possible embodiment, refer to Figure 3 and Figure 4, for the case where several of the supporting parts 111 are distributed in a circular array, the several supporting parts 111 define a circular area, and the radius range of the inner ring of the circular area is 140 mm - 145 mm; and / or, the radius range of the outer ring of the circular area is 155 mm - 160 mm. In this embodiment, according to the size of the wafer 300, the sizes of the inner ring radius and the outer ring radius of the circular area are reasonably set to more accurately detect the frictional force at the edge of the wafer 300. On the one hand, it is avoided that the size of the supporting part 111 is too small to fully cover the edge area of the wafer 300, that is, there may be film layer fragments that do not contact the supporting part 111, thereby affecting the accuracy of the frictional force detection; on the other hand, it is avoided that the size of the supporting part 111 is too large to affect the accuracy of the frictional force detection, and it is also avoided that unnecessary contact friction is caused to the wafer 300 due to excessive contact.
[0036] Further, referring to Figure 3 and Figure 4 , for the case where several of the supporting parts 111 are distributed in a circular array, the frictional force detection assembly 110 includes several frictional force sensors, and the supporting part 111 is the part where the frictional force sensor contacts the wafer 300.
[0037] In a preferred embodiment, Figure 5 is the logic block diagram of the film layer fragment detection device at the edge of the wafer of the present invention and the grinding head. Referring to Figure 5 , the film layer fragment detection device further includes a controller 120 communicatively connected to the frictional force detection assembly 110. The controller 120 is used to compare the detected frictional force value with a set frictional force value. If the detected frictional force value is less than the set frictional force value, it is determined that there are no film layer fragments at the edge of the wafer 300; if the detected frictional force value is greater than or equal to the set frictional force value, it is determined that there are film layer fragments at the edge of the wafer 300. In this embodiment, the controller 120 can automatically receive the frictional force data of the frictional force detection assembly 110. The controller 120 uses the pre-set frictional force value as a judgment criterion to judge and evaluate the detected frictional force value, so as to more accurately detect whether there are film layer fragments at the edge of the wafer 300. This automatic judgment method based on numerical comparison is faster, more accurate and more reliable than manually observing the data for judgment.
[0038] In one embodiment, an airbag assembly is provided inside the grinding head 220. The airbag assembly is divided into several air chambers in the radial direction of the grinding head 220. By pumping air out of the air chambers, the adsorption of the wafer 300 can be realized. By inflating specific air chambers, targeted pressurization of different areas of the wafer 300 can be realized.
[0039] In one embodiment, referring toFigure 5 The controller 120 is communicatively connected to the polishing head 220. When the controller 120 determines that there are no film fragments at the edge of the wafer 300, the controller 120 controls the polishing head 220 to place the wafer 300 on the polishing pad 230 of the chemical mechanical polishing equipment, apply pressure to the entire wafer 300 through the polishing head 220, and perform overall polishing on the wafer 300. When the controller 120 determines that there are film fragments at the edge of the wafer 300, the controller 120 controls the polishing head 220 to place the wafer 300 on the polishing pad 230 of the chemical mechanical polishing equipment, apply pressure to the edge of the wafer 300 through the polishing head 220, and perform separate polishing on the edge of the wafer 300. After separately polishing the edge of the wafer 300, the controller 120 controls the polishing head 220 to place the wafer 300 on the friction force detection component 110 for detection again.
[0040] In this embodiment, the controller 120 can accurately adjust the polishing strategy by determining whether there are film fragments at the edge of the wafer 300. When it is detected that there are film fragments at the edge of the wafer 300, the controller 120 controls the polishing head 220 to only inflate a set amount of gas into the air chambers located in the edge area of the airbag assembly. In this way, separate and small-pressure friction on the edge of the wafer 300 can be achieved, effectively removing the film fragments. Since the pressure in the air chamber can be precisely controlled, it can be ensured that while removing the fragments, excessive polishing or scratching of the edge of the wafer 300 will not occur. Since only the edge area of the wafer 300 is polished, scratching of the surface of the wafer 300 caused by overall polishing of the wafer 300 can be avoided. When it is detected that there are no film fragments at the edge of the wafer 300, all the air chambers of the airbag assembly are inflated, pressure is applied to the entire wafer 300, and overall polishing of the wafer 300 is performed. By controlling the polishing method of the wafer 300 by the controller 120, an automated and intelligent production process is realized, improving the production efficiency.
[0041] In a specific embodiment, the film fragment detection device further includes an alarm 130 communicatively connected to the controller 120. When the controller 120 determines that there are film fragments at the edge of the wafer 300, the controller 120 controls the alarm 130 to give an alarm. The alarm 130 includes an alarm light and / or an alarm speaker. In this embodiment, the alarm 130 can give an alarm in the first time when the controller 120 detects the film fragments, timely reminding the operator.
[0042] In a possible embodiment, see Figure 5, the film layer fragment detection device further includes a display 140 communicatively connected to the controller 120. The display 140 is used to display the detected friction force data in a graphical manner, and the graphical manner includes a curve graph, a table, etc. By showing the changing trend of the friction force over time through the curve graph, the fluctuation of the friction force can be intuitively seen, which helps the operator quickly identify abnormal friction force conditions. Figure 6 is the friction force curve graph of the film layer fragment detection device at the edge of the wafer of the present invention, as Figure 6 shown in. Curve 1 represents the friction force curve graph of a normal wafer (i.e., there are no film layer fragments at the edge of the wafer 300), and curve 2 represents the friction force curve graph of an abnormal wafer (i.e., there are film layer fragments at the edge of the wafer 300). The horizontal line in the middle represents the set friction force value. According to the friction force value data in the table, the change of the friction force value can be intuitively observed. For example, whether there is a friction force value exceeding the set friction force value.
[0043] The present invention also provides a chemical mechanical polishing equipment, including: the film layer fragment detection device at the edge of the wafer 300 in any of the above embodiments.
[0044] Next, the technical effects of the film layer fragment detection device at the edge of the wafer 300 of the present invention will be explained.
[0045] 1. Before the wafer 300 undergoes chemical mechanical polishing, the friction force value at the edge of the wafer 300 is detected by the friction force detection component 110, and then it can be judged whether there are film layer fragments at the edge of the circle, so as to timely discover and handle the problem of film layer fragments at the edge of the wafer 300, and avoid scratching the surface of the wafer 300 caused by chemical mechanical polishing of the wafer 300 with film layer fragments, thereby improving the product yield.
[0046] 2. The supporting part 111 only supports the edge of the wafer 300, and the area inside the edge of the wafer 300 is suspended, avoiding the area inside the edge of the wafer 300 from directly contacting the transfer disk 210, thereby reducing the wear caused by friction and avoiding affecting the product quality of the wafer 300.
[0047] 3. According to the size of the wafer 300, the size of the area supporting the edge of the wafer 300 is reasonably set to more accurately detect the friction force at the edge of the wafer 300 and improve the accuracy of the friction force detection.
[0048] 4. The controller 120 receives the friction force data of the friction force detection component 110 and compares it with the set friction force value. Once the detected friction force value exceeds the set friction force value, the controller 120 judges that there are film layer fragments at the edge of the wafer 300.
[0049] 5. The controller 120 is communicatively connected to the polishing head 220 and intelligently controls the operation mode of the polishing head 220 according to the detection results. If there are film layer fragments at the edge of the wafer 300, the controller 120 controls the polishing head 220 to polish only the edge of the wafer 300. This intelligent control strategy improves the flexibility and efficiency of the production process.
[0050] 6. When the controller 120 detects film layer fragments at the edge of the wafer 300, it controls the alarm 130 to give an alarm. This immediate feedback mechanism can promptly alert the operator.
[0051] Although the embodiments of the present invention have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and can be implemented or realized in various ways. Unless otherwise defined, the technical terms or scientific terms used herein should have the ordinary meaning understood by those of ordinary skill in the art to which the present invention belongs. The words such as "including" used herein mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.
Claims
1. A film fragment detection device for the edge of a wafer, characterized in that, Comprising: A friction force detection component disposed on the top surface of a transfer plate of a chemical mechanical polishing apparatus. The transfer plate serves as a wafer waiting area. The polishing head of the chemical mechanical polishing apparatus adsorbs the wafer and places the edge of the wafer on the friction force detection component, causing the polishing head to rotate together with the wafer, and the friction force value at the edge of the wafer is detected by the friction force detection component, so that whether there are film fragments at the edge of the wafer can be judged according to the detected friction force value.
2. The film layer fragment detection device for the edge of the wafer according to claim 1, wherein, The friction force detection component includes a supporting portion for supporting the edge of the wafer. When the wafer is placed on the supporting portion, there is a gap between the area of the wafer inside the supporting portion and the top surface of the transfer plate.
3. The film layer fragment detection device for the wafer edge according to claim 2, wherein, The supporting portion is annular; or, There are a plurality of the supporting portions, and the plurality of supporting portions are distributed in an annular array.
4. The film layer fragment detection device for the edge of the wafer according to claim 3, characterized in that For the case where the supporting portion is annular, the radius range of the inner ring of the supporting portion is 140 mm - 145 mm; and / or, the radius range of the outer ring of the supporting portion is 155 mm - 160 mm.
5. The film layer fragment detection device for the wafer edge according to claim 3, wherein, For the case where the plurality of supporting portions are distributed in an annular array, the plurality of supporting portions define an annular region, and the radius range of the inner ring of the annular region is 140 mm - 145 mm; and / or, the radius range of the outer ring of the annular region is 155 mm - 160 mm.
6. The film fragment detection device for the wafer edge according to claim 3, wherein, For the case where the plurality of supporting portions are distributed in an annular array, the supporting portion is arc-shaped or circular.
7. The film layer fragment detection device for the wafer edge according to any one of claims 1-6, characterized in that, It further includes a controller communicatively connected to the friction force detection component. The controller is configured to compare the detected friction force value with a set friction force value. If the detected friction force value is less than the set friction force value, it is judged that there are no film fragments at the edge of the wafer; if the detected friction force value is greater than or equal to the set friction force value, it is judged that there are film fragments at the edge of the wafer.
8. The film layer fragment detection device for the edge of a wafer according to claim 7, wherein The controller is communicatively connected to the polishing head; When the controller judges that there are no film fragments at the edge of the wafer, the controller controls the polishing head to place the wafer on the polishing pad of the chemical mechanical polishing apparatus, apply pressure to the whole wafer through the polishing head, and perform overall polishing on the wafer. When the controller judges that there are film fragments at the edge of the wafer, the controller controls the polishing head to place the wafer on the polishing pad of the chemical mechanical polishing apparatus, apply pressure to the edge of the wafer through the polishing head, and perform separate polishing on the edge of the wafer.
9. The film layer fragment detection device for the wafer edge according to claim 7, characterized in that, It further includes a display communicatively connected to the controller. The display is configured to display the detected friction force data in a graphical manner.
10. A chemical mechanical polishing apparatus, characterized in that, Comprising: A film fragment detection device for the edge of a wafer according to any one of claims 1 - 9.