Device for taking sliced germanium single crystal rod
By designing a germanium single crystal rod slice post-slicing device and using an automatic slice picking mechanism to operate synchronously with the inner circle slicer, the safety risks and slice drop problems of manual slice picking are solved, and a safe and convenient post-slicing process is achieved.
Patent Information
- Application Number
- CN202422572466.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-10-24
AI Technical Summary
During the slicing of germanium single crystal rods, there is a safety risk in manual slice collection, the weight of the slice affects irregular disconnection, the drop position deviates instantly, and the slice falls freely and easily falls.
A germanium single crystal rod slice post-slicing device is designed, and an automatic slice picking mechanism is adopted, including a Z-axis servo module, an X-axis servo module, a drag chain, a linear guide and a feeding tray. It is operated synchronously with an inner circular slicer through a controller. The feeding tray is built into a sponge body to accurately control the slice position to avoid falling.
Automatic slice pickup is realized to avoid the safety risks of manual operation, ensure that the slice is accurately caught at the moment of cutting, reduce the risk of slice fall injury, and improve operation safety and convenience.
Smart Images
Figure CN223058078U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of germanium wafer processing, and particularly to a device for picking up slices after slicing a germanium single crystal rod. Background Art
[0002] The zone-melted germanium ingot is heated by a single crystal furnace and pulled into a germanium single crystal rod after crystal pulling. The diameter specification of the single crystal rod is about φ60 to φ200, and the length is about 200 mm. According to production requirements, the single crystal rod needs to be sliced by an internal circle slicing machine, and the crystal rod is cut into slices of 2 - 8 mm. In this process, the internal circle slicing machine is a professional production equipment. To ensure the cutting accuracy and stability, the slicing machine operates without stopping.
[0003] In the actual production process, workers first use a bamboo piece to push the slice to a convenient position for picking up, and then pass through the high-speed rotating internal circle cutting tool to take out the slice. There are the following problems in the process of picking up the slice: the distance between the hand and the high-speed rotating blade is relatively close, there is a great safety risk; when the germanium single crystal rod is about to be cut off, due to the influence of the slice weight, irregular notches are likely to occur at the disconnection position; at the moment when the germanium single crystal slice is cut off, affected by inertia, the falling position will deviate from the picking-up space, and it needs to be pushed to an appropriate position during picking up, increasing the operation risk; after the germanium single crystal slice is cut off, it falls freely and is easy to damage the slice.
[0004] It is necessary to add a device for picking up slices after slicing a germanium single crystal rod to replace workers in picking up slices, so as to improve the safety and convenience of the operation of this process. Summary of the Utility Model
[0005] To solve or partially solve the problems existing in the related technologies, this application provides a device for picking up slices after slicing a germanium single crystal rod. By automatically picking up slices instead of manual picking up, the device is synchronized with the cutting feed, and the slice is caught by the device at the moment of cutting.
[0006] The first aspect of this application provides a device for picking up slices after slicing a germanium single crystal rod, including: a controller and a picking-up mechanism connected to the controller. The picking-up mechanism includes a mounting support, a displacement structure, and a receiving tray. The displacement structure includes a Z-axis servo module, an X-axis servo module, a drag chain, a Z-axis linear guide rail, and an X-axis linear guide rail. The Z-axis servo module, the drag chain, and the Z-axis linear guide rail are installed on the mounting support. The X-axis servo module is installed on the Z-axis servo module, and the X-axis linear guide rail and the receiving tray are installed on the X-axis servo module.
[0007] In some embodiments of this embodiment, the receiving tray is installed at the end of the X-axis linear guide rail through a connecting mechanism, and the connecting mechanism positions the receiving tray directly below the germanium crystal rod.
[0008] In some embodiments of this embodiment, a sponge body is provided inside the receiving tray.
[0009] In some embodiments of the present embodiment, the slicing device is installed on the left vertical surface of the internal circle slicing machine through a fixing base.
[0010] In some embodiments of the present embodiment, the slicing mechanism further includes a fixing base, and the installation support is arranged on the fixing base. The slicing device is installed on the left vertical surface of the internal circle slicing machine through the fixing base.
[0011] In some embodiments of the present embodiment, the slicing device is connected to the controller, and the controller communicates with the control system of the internal circle slicing machine.
[0012] The technical solution provided by this application may include the following beneficial effects:
[0013] This application provides a slicing device for a germanium single crystal rod after slicing, which is applicable to various different specifications of slices. By automatically taking slices instead of manual taking, the safety risks in the process of manual taking are avoided. The receiving tray is synchronized with the slice feeding on the slicing machine, and the falling position of the slice is restricted at the moment of cutting. The height of the receiving tray is precisely controlled by the servo module and a sponge body is built in, which minimizes the risk of the slice being damaged by free falling after cutting and provides safety guarantee for the slice taking process.
[0014] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit this application. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] By describing the exemplary embodiments of the present application in more detail in conjunction with the drawings, the above and other objects, features and advantages of the present application will become more obvious. Among them, in the exemplary embodiments of the present application, the same reference numerals generally represent the same components.
[0016] Figure 1 is a schematic structural diagram of the slicing device for a germanium single crystal rod after slicing shown in the embodiment of the present application;
[0017] Figure 2 is an installation schematic diagram of the slicing device for a germanium single crystal rod after slicing shown in the embodiment of the present application;
[0018] REFERENCE SIGNS:
[0019] In the figure, 1 - internal circle slicing machine, 2 - slicing mechanism, 3 - controller, 4 - fixing base, 5 - installation support, 6 - Z-axis servo module, 7 - X-axis servo module, 8 - drag chain, 9 - Z-axis linear guide rail, 10 - X-axis linear guide rail, 11 - receiving tray, 12 - sponge body. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0021] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically defined.
[0022] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.
[0023] Unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0024] The technical solutions of the embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0025] A wafer taking device after slicing a germanium single crystal rod includes a wafer taking mechanism and a controller as shown in Figure 1 and is applicable to an internal circular slicing machine. As shown in Figure 2 , the wafer taking mechanism 2 is installed on the left side surface of the internal circular slicing machine 1, and the controller 3 is installed on the lower frame of the internal circular slicing machine 1. The controller 3 is connected to the wafer taking mechanism 2 and the internal circular slicing machine 1. All actions of the wafer taking mechanism 2 are controlled by the controller 3. Through this set of devices, the wafer is automatically taken out after the germanium single crystal rod is sliced in cooperation with the internal circular slicing machine 1.
[0026] The wafer picking mechanism 2 is composed of a fixed seat 4, a mounting support 5, a Z-axis servo module 6, an X-axis servo module 7, a drag chain 8, a Z-axis linear guide 9, an X-axis linear guide 10, a receiving tray 11, and a sponge body 12. The fixed seat 4 is installed on the left vertical surface of the internal circle slicing machine 1, the mounting support 5 is installed on the fixed seat 4, and the Z-axis servo module 6, the drag chain 8, and the Z-axis linear guide 9 are installed on the mounting support 5; the X-axis servo module 7 is installed on the Z-axis servo module 6; the X-axis linear guide 10 and the receiving tray 11 are installed on the X-axis servo module 7, and the sponge body 12 is installed in the receiving tray 11.
[0027] When picking up the wafer: The Z-axis servo module 6 drives the X-axis servo module 7, the X-axis linear guide 10, the receiving tray 11, and the sponge body 12 installed in the receiving tray 11 to perform lifting movements together, and the X-axis servo module 7 drives the X-axis linear guide 10, the receiving tray 11, and the sponge body 12 to perform horizontal displacement movements. Under the control of the controller 3, a complete wafer picking device after slicing the germanium single crystal rod is formed.
[0028] Operating mode:
[0029] The internal circle slicing machine 1 is a standard single machine device, and its operating parameters and actions are independently controlled by the original device. The wafer picking mechanism 2 added in this solution is controlled by the controller 3, and the controller 3 has communication and signal interaction with the control system of the internal circle slicing machine. Before slicing starts, the germanium single crystal rod to be sliced is manually installed in the fixture of the internal circle slicing machine according to requirements (the initial position of the fixture part needs to be far from the hollow position of the internal circle blade), and the receiving tray 11 in the wafer picking mechanism 2 for germanium single crystal rod after slicing waits at the waiting position for picking up the material. After the operator presses the slicing start button, the controller 3 controls the Z-axis servo module 6 and the X-axis servo module 7 to shift the receiving tray 11 to the central position in the internal circle slicing machine 1. After arriving, the internal circle slicing machine 1 starts to shift the fixture to the middle position of the blade and controls the cutting thickness. The controller 3 compensates the receiving position of the receiving tray 11. After completion, slicing starts, and the receiving tray 11 follows the feed of the slicing machine passively, keeping the receiving tray 11 always directly below the germanium crystal rod. After slicing is completed, the controller 3 controls the X-axis servo module 7 to first shift the receiving tray 11 to the center position of the cutting tool, and then the Z-axis servo module 6 shifts the receiving tray 11 to the waiting position for picking up the wafer, and the buzzer emits a warning sound to prompt the operator to pick up the part. Then a wafer picking cycle is completed.
[0030] Finally, it should also be noted that in this text, relationships such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "including", "comprising" or any other variants are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.
[0031] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0032] The embodiments of the present application have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art in the technical field without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, the practical application or the improvement of the technology in the market, or to enable other ordinary skill in the art in the technical field to understand the embodiments disclosed herein.
Claims
1. A device for taking slices after slicing a germanium single crystal rod, characterized in that, Including: A controller and a wafer picking mechanism connected to the controller. The wafer picking mechanism includes a mounting support (5), a displacement structure, and a receiving tray (11). The displacement structure includes a Z-axis servo module (6), an X-axis servo module (7), a drag chain (8), a Z-axis linear guide (9), and an X-axis linear guide (10). The Z-axis servo module (6), the drag chain (8), and the Z-axis linear guide (9) are mounted on the mounting support (5). The X-axis servo module (7) is mounted on the Z-axis servo module (6). The X-axis linear guide (10) and the receiving tray (11) are mounted on the X-axis servo module (7).
2. The wafer taking device after slicing the germanium single crystal rod according to claim 1, characterized in that, The receiving tray (11) is mounted at the end of the X-axis linear guide (10) through a connecting mechanism, and the connecting mechanism positions the receiving tray (11) directly below the germanium ingot.
3. The wafer taking device after slicing the germanium single crystal rod according to claim 1, characterized in that, A sponge body (12) is provided inside the receiving tray (11).
4. The wafer taking device after slicing the germanium single crystal rod according to claim 1, characterized in that, The wafer picking mechanism further includes a fixed seat (4). The mounting support (5) is arranged on the fixed seat (4), and the wafer picking device is mounted on the left vertical surface of the internal circle slicing machine through the fixed seat (4).
5. The wafer taking device after slicing the germanium single crystal rod according to claim 1, characterized in that, The controller communicates with the control system of the internal circle slicing machine.