Material taking and placing mechanism

Abstract

The utility model provides a material taking and placing mechanism. The material taking and placing mechanism comprises a base; the two adsorption assemblies are arranged on the base in a spaced mode in the first direction, each adsorption assembly comprises a suction cup, each suction cup comprises a plurality of adsorption pieces arranged in the second direction, the second direction intersects with the first direction, each adsorption piece is provided with an adsorption hole, and the at least one air pipe is arranged on the side, away from one of the two adsorption assemblies, of one of the two adsorption assemblies. The air pipe is provided with an air blowing hole facing the suction cup. The input end of the ion generator is used for being communicated with an air source, the output end of the ion generator is communicated with the at least one adsorption hole and the at least one air blowing hole, and the ion generator is used for blowing ion air mass to the suction cup to eliminate static electricity. According to the material taking and placing mechanism, static electricity between the silicon wafers can be eliminated in the separation process of the silicon wafers, static electricity between the silicon wafers and the adsorption sheets can be eliminated in the separation process of the silicon wafers and the adsorption sheets, the silicon wafers can be effectively prevented from being broken, and the yield of products can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production equipment, and more specifically, to a pick-and-place mechanism. Background Art

[0002] In the related art, a method of coating one side of a silicon wafer by laminating two silicon wafers and then coating is adopted. After coating, the laminated silicon wafers need to be separated before blanking. Electrostatic adsorption will occur between the two laminated silicon wafers and between the silicon wafer and the adsorption sheet of the suction cup. Forcible separation will cause the silicon wafer to break. In the prior art, an electrostatic eliminator is arranged on one side of the suction cup to blow ion wind to the silicon wafer to eliminate static electricity. However, the structure of the electrostatic eliminator is complex, occupies a large space, and it is difficult for the ion wind to blow to the other side of the suction cup, resulting in poor elimination effect. The silicon wafers are still prone to breakage when being separated from each other and from the adsorption sheet. Summary of the Utility Model

[0003] The utility model provides a new technical solution for a pick-and-place mechanism, which can at least solve the problem of poor electrostatic elimination effect of the pick-and-place mechanism in the prior art.

[0004] According to a first aspect of the utility model, there is provided a pick-and-place mechanism, including: a base; two adsorption components, the two adsorption components are spaced apart along a first direction on the base, each adsorption component includes a suction cup, each suction cup includes a plurality of adsorption sheets arranged along a second direction, the second direction intersects the first direction, each adsorption sheet is provided with an adsorption hole, at least one air duct, the air duct is arranged on one side of the two adsorption components away from the other, the air duct has a blowing hole facing the suction cup; an ion generator, an input end of the ion generator is used to communicate with a gas source, and an output end of the ion generator is respectively communicated with at least one adsorption hole and at least one blowing hole, and is used to blow an ion gas mass to the suction cup to eliminate static electricity.

[0005] Optionally, the air duct extends along the first direction, and a plurality of the blowing holes are arranged on the air duct along the first direction.

[0006] Optionally, the number of the blowing holes on each air duct is not less than the number of the adsorption sheets on the corresponding suction cup.

[0007] Optionally, the suction cup further includes a mounting plate, a connecting member is arranged on the mounting plate, the connecting member extends towards a side of the suction cup away from the other suction cup, and the air duct is connected to the connecting member.

[0008] Optionally, the height of the air duct is higher than the height of the adsorption sheet.

[0009] Optionally, the axis of the adsorption holes extends obliquely towards the point on the adsorption sheet that is farthest from the air duct.

[0010] Optionally, the air duct includes a transparent PC tube.

[0011] Optionally, the number of the ion generators and the air ducts is two each, and the two ion generators, the two adsorption components and the two air ducts are connected in one-to-one correspondence.

[0012] Optionally, the ion generator is an ion air nozzle.

[0013] Optionally, the two adsorption components are a first adsorption component and a second adsorption component respectively, and the picking and placing mechanism further includes: a rotating component, which is connected to the first adsorption component to drive the first adsorption component to rotate around a preset axis, the preset axis extends along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other; a first translation component, which is connected to the rotating component and is used to drive the rotating component and the first adsorption component to move along the second direction; a second translation component, which is respectively connected to the second adsorption component and the first translation component and is used to drive the second adsorption component and the first adsorption component to approach or move away from each other.

[0014] According to the picking and placing mechanism of the present invention, by setting that the adsorption holes on the adsorption sheet and the blowing holes on the air duct are both connected to the ion generator, not only can the static electricity between the silicon wafers be eliminated during the silicon wafer separation process, but also the static electricity between the silicon wafer and the adsorption sheet can be eliminated during the separation process of the silicon wafer and the adsorption sheet, which can more effectively prevent the silicon wafers from being broken and is beneficial to improving the product yield.

[0015] Other features and advantages of the present invention will become clear through the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings. Description of the Drawings

[0016] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present invention and, together with the description, are used to explain the principles of the present invention.

[0017] Figure 1 is a perspective view of a picking and placing mechanism according to an embodiment provided by the present invention;

[0018] Figure 2 is a front view of a picking and placing mechanism according to an embodiment provided by the present invention;

[0019] Figure 3 is Figure 2 an enlarged view of a partial structure in

[0020] Figure 4 It is a side view of the pick-and-place mechanism according to an embodiment provided by the present utility model;

[0021] Figure 5 It is a schematic diagram of the pipeline connection between the ion air nozzle, the air source, the suction cup and the branch pipe in the pick-and-place mechanism according to an embodiment provided by the present utility model.

[0022] Reference numerals

[0023] 100, pick-and-place mechanism;

[0024] 10, machine base;

[0025] 20, adsorption assembly; 20a, first adsorption assembly; 20b, second adsorption assembly; 21, suction cup; 211, adsorption sheet; 212, adsorption hole; 213, mounting plate; 214, connecting piece; 2141, first plate body; 2142, second plate body; 22, air duct; 221, blowing direction;

[0026] 30, ion generator;

[0027] 40, rotation assembly;

[0028] 50, first translation assembly;

[0029] 60, second translation assembly. Detailed implementation manners

[0030] Now, various exemplary embodiments of the present utility model will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements, numerical expressions and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present utility model.

[0031] The following description of at least one exemplary embodiment is actually merely illustrative and in no way restricts the present utility model and its application or use.

[0032] Technologies, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods and devices should be regarded as part of the specification.

[0033] In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0034] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0035] The pick-and-place mechanism 100 according to an embodiment of the present invention will be specifically described below with reference to the accompanying drawings.

[0036] As Figures 1 to 5 shown, the pick-and-place mechanism 100 according to an embodiment of the present invention includes: a base, two adsorption components 20, at least one air duct 22, and an ion generator 30.

[0037] Specifically, the two adsorption components 20 are spaced apart along a first direction on the base. Each adsorption component 20 includes a suction cup 21. Each suction cup 21 includes a plurality of adsorption sheets 211 arranged along a second direction. The second direction intersects the first direction. Each adsorption sheet 211 is provided with an adsorption hole 212. The air duct 22 is provided on one side of one of the two adsorption components 20 away from the other. The air duct 22 has a blowing hole facing the suction cup 21. The input end of the ion generator 30 is used to communicate with a gas source. The output end of the ion generator 30 is respectively communicated with at least one adsorption hole 212 and at least one blowing hole, and is used to blow an ion gas mass to the suction cup 21 to eliminate static electricity.

[0038] In other words, the pick-and-place mechanism 100 according to an embodiment of the present invention is mainly composed of a base, two adsorption components 20, at least one air duct 22, and an ion generator 30.

[0039] Among them, the base can be used to install the two adsorption components 20. When taking materials from the flower basket, the two adsorption components 20 can be spaced apart in the first direction.

[0040] Each adsorption component 20 can include a suction cup 21. Each suction cup 21 has a plurality of adsorption sheets 211. The plurality of adsorption sheets 211 can be spaced apart along the second direction. The thickness direction of each adsorption sheet 211 can extend along the second direction. The surface of each adsorption sheet 211 can be provided with an adsorption hole 212. The number of adsorption holes 212 can be one or more. A negative pressure can be generated at the adsorption hole 212 to adsorb the silicon wafer. It should be noted that air can also be blown at the adsorption hole 212.

[0041] The number of air ducts 22 can be one or more, which is not limited herein. The air duct 22 can be provided on one side of one adsorption component 20 away from the other adsorption component 20.

[0042] Each air duct 22 can be provided with one or more blowing holes. The blowing holes can be arranged facing the adsorption sheet 211 to blow air towards the adsorption sheet 211.

[0043] The adsorption holes 212 and the air blowing holes in each adsorption component 20 can be communicated with the air source through the ion generator 30, and the number of ion generators 30 can be one or more. For example, when the number of ion generators 30 is one, each adsorption hole 212 and each air blowing hole are communicated with the air source through the ion generator 30.

[0044] The ion generator 30 can generate positive and negative ions and blow them out through the adsorption holes 212 and the air blowing holes to eliminate the static electricity between two silicon wafers that are attached together and between the silicon wafer and the adsorption sheet 211.

[0045] In the coating process, one-sided coating of the silicon wafer is required. Therefore, two adsorption components 20 are needed to suck the silicon wafers. Then, one of the adsorption components 20 is rotated 180°, and this adsorption component 20 is moved a certain distance in the positive direction of the first direction so that the two rows of adsorbed silicon wafers are misaligned. Then, the two adsorption components 20 are driven to approach each other so that the two rows of silicon wafers cross. Then, one of the two adsorption components 20 is driven to approach the other in the reverse direction of the first direction so that the silicon wafers are attached to each other in pairs. Then, the silicon wafers attached to each other in pairs are sent into the coating equipment.

[0046] After the coating is completed, the loading and unloading mechanism 100 takes out the silicon wafers attached to each other in pairs, and then the air outlet blows out the ion-rich air to eliminate the static electricity between the two silicon wafers attached together. One of the two adsorption components 20 is driven to move in the reverse direction of the first direction to separate the two silicon wafers that were originally attached together. After the silicon wafers are separated, the two adsorption components 20 move away from each other in the second direction to separate the two crossed rows of silicon wafers. One of the two adsorption components 20 moves a certain distance in the reverse direction of the first direction so that the ends of the two rows of silicon wafers are aligned one by one, and then the two rows of silicon wafers are sent into the flower basket. During the process of the adsorption sheet 211 adsorbing the silicon wafer, a negative pressure is generated at the adsorption holes 212. During the process of the adsorption sheet 211 separating from the silicon wafer, the adsorption holes 212 can blow out the ion-rich air to eliminate the static electricity between the silicon wafer and the adsorption sheet 211.

[0047] Thus, according to the loading and unloading mechanism 100 of the embodiment of the present invention, by setting that both the adsorption holes 212 on the adsorption sheet 211 and the air blowing holes on the air duct 22 are connected to the ion generator 30, not only can the static electricity between the silicon wafers be eliminated during the separation process of the silicon wafers, but also the static electricity between the silicon wafer and the adsorption sheet 211 can be eliminated during the separation process of the silicon wafer and the adsorption sheet 211, which can more effectively prevent the silicon wafers from being broken and is beneficial to improving the yield of the product.

[0048] In addition, compared with the traditional technology in which the ion generator 30 is respectively arranged on one side of each suction cup 21, only the air duct 22 needs to be arranged on one side of the suction cup 21 in this embodiment, which occupies less space and has a simple structure. The ion generator 30 can be integrated on the base, which is convenient for the connection of the adsorption holes 212.

[0049] According to an embodiment of the present invention, the air duct 22 extends in the first direction, and a plurality of blowing holes are arranged on the air duct 22 along the first direction. That is to say, the air duct 22 can extend along the arrangement direction of the adsorption sheets 211 on each suction cup 21, and the plurality of blowing holes on each air duct 22 can also be arranged along the arrangement direction of the adsorption sheets 211, so that the blowing holes can cover the adsorption sheets 211 on the suction cup 21, thereby blowing ion wind on each pair of bonded silicon wafers to eliminate static electricity.

[0050] Optionally, the length of the air duct 22 can be greater than the distance between the two farthest adsorption sheets 211 on the suction cup 21.

[0051] According to some other embodiments of the present invention, the number of blowing holes on each air duct 22 is not less than the number of adsorption sheets 211 on the corresponding suction cup 21. Thus, it can be set so that each adsorption sheet 211 corresponds to at least one blowing hole, so that each pair of adsorbed silicon wafers can eliminate static electricity through the ion wind blown out by at least one blowing hole.

[0052] Preferably, the number of blowing holes on each air duct 22 is equal to the number of adsorption sheets 211 on the corresponding suction cup 21. Therefore, the blowing holes on the air duct 22 and the adsorption sheets 211 on the suction cup 21 can be arranged in one-to-one correspondence, so that each pair of adsorbed silicon wafers can eliminate static electricity through the ion wind blown out by the corresponding blowing hole.

[0053] In some specific embodiments of the present invention, the suction cup 21 further includes a mounting plate 213, and a connecting member 214 is provided on the mounting plate 213. The connecting member 214 extends toward the side of the suction cup 21 away from the other suction cup 21, and the air duct 22 is connected to the connecting member 214.

[0054] Specifically, the mounting plate 213 can extend in the first direction, and a plurality of adsorbing members can be connected to the bottom of the mounting plate 213. An adsorption channel can be provided in the adsorbing member and the mounting plate 213 for communicating the adsorption hole 212 and the ion generator 30.

[0055] A connecting member 214 can also be connected to the mounting plate 213. The connecting member 214 can extend toward the direction away from the other adsorbing member of the adsorbing member corresponding to the mounting plate 213. The connecting member 214 can be used to fix the air duct 22.

[0056] Optionally, the cross-section of the connecting member 214 is V-shaped. The connecting member 214 includes a first plate body 2141 and a second plate body 2142. The first plate body 2141 is connected to the second plate body 2142, and the included angle between them can be an acute angle. The first plate body 2141 can extend in the vertical direction and be connected to the side of the mounting plate 213. The second plate body 2142 can extend obliquely upward away from the mounting plate 213. One end of the second plate body 2142 away from the first plate body 2141 can be connected to the air duct 22. Thus, the blowing holes on the air duct 22 can be located below the second plate body 2142. The inclined setting of the second plate body 2142 can block and guide the air blown out from the blowing holes, so that the air from the blowing holes can be blown obliquely downward towards the adsorption sheet 211.

[0057] According to some alternative embodiments of the present invention, the height of the air duct 22 is higher than the height of the adsorption sheet 211, which can make the height of the blowing holes of the air duct 22 reach the height of the adsorption sheet 211 and the silicon wafer, so as to blow obliquely downward from above the silicon wafer, which is beneficial to increasing the effective distance of blowing and improving the effect of static electricity elimination. At the same time, the air duct 22 being higher than the adsorption sheet 211 can also prevent the air duct 22 from interfering with the silicon wafer.

[0058] According to some other embodiments of the present invention, the axis of the adsorption hole 212 extends obliquely towards the point on the adsorption sheet 211 that is farthest from the air duct 22. Thus, the blowing holes can blow obliquely towards the point on the adsorption sheet 211 that is farthest from the air duct 22, so as to increase the contact area between the ion-rich air and the silicon wafer.

[0059] As Figure 3 shown, the air duct 22 is arranged at the upper left corner of the adsorption sheet 211, and the point on the adsorption sheet 211 that is farthest from the air duct 22 is located at the lower right corner of the adsorption sheet 211. The blowing holes on the air duct 22 can blow towards the lower right of the adsorption sheet 211.

[0060] Optionally, the extension line of the axis of the adsorption hole 212 can intersect with the point on the adsorption sheet 211 that is farthest from the air duct 22.

[0061] In some specific embodiments of the present invention, the air duct 22 includes a transparent PC tube. The transparent PC tube has high transparency and good physical properties. At the same time, the transparent PC tube has great plasticity, which is beneficial to the processing of the air duct 22 and has low cost.

[0062] According to some alternative embodiments of the present invention, the number of the ion generators 30 and the air ducts 22 is two each, and the two ion generators 30, the two adsorption assemblies 20 and the two air ducts 22 are connected in one-to-one correspondence.

[0063] Specifically, two adsorption components 20 can be located between two air ducts 22, and the two air ducts 22 can be spaced apart in the first direction. Each ion generator 30 can be arranged above the corresponding adsorption component 20 and fixed on the base. As Figure 5 shown, each ion generator 30 can communicate with all the air outlets in the corresponding one of the two air ducts 22 and the adsorption holes 212 of all the adsorption sheets 211 in the corresponding one of the two adsorption components 20. Thus, the static elimination of each adsorption component 20 can be controlled separately.

[0064] In addition, by providing two air ducts 22, during the process of separating the silicon wafers, the two air ducts 22 can blow air obliquely towards the silicon wafers respectively, which can increase the coverage area of the ion wind and prevent static electricity from remaining in some areas of the silicon wafers due to lack of air blowing, resulting in cracking of the silicon wafers during the separation process.

[0065] According to some other embodiments of the present invention, the ion generator 30 is an ion air nozzle. The ion air nozzle can generate a large number of air masses with positive and negative charges and blow out these air masses by using compressed air, so that the charges carried on the surface of the object are neutralized, thereby achieving the purpose of eliminating static electricity. In addition, the high-speed compressed air can also blow away the stubborn dust on the surface of the object.

[0066] The ion air nozzle has the advantages of simple installation, stable operation, strong wind speed, and rapid static elimination, especially in occasions with high requirements for static control.

[0067] In some specific embodiments of the present invention, the two adsorption components 20 are respectively a first adsorption component 20a and a second adsorption component 20b, and the loading and unloading mechanism 100 further includes a rotating component 40, a first translation component 50, and a second translation component 60. The rotating component 40 is connected to the first adsorption component 20a to drive the first adsorption component 20a to rotate around a preset axis, and the preset axis extends in the third direction, and the first direction, the second direction, and the third direction are perpendicular to each other. The first translation component 50 is connected to the rotating component 40 and is used to drive the rotating component 40 and the first adsorption component 20a to move in the second direction. The second translation component 60 is respectively connected to the second adsorption component 20b and the first translation component 50 and is used to drive the second adsorption component 20b and the first adsorption component 20a to approach or move away from each other.

[0068] Specifically, in the initial state, the first adsorption component 20a and the second adsorption component 20b can be spaced apart in the first direction, and the two adsorption components 20 take materials from the flower basket and adsorb two rows of silicon wafers. Each adsorption sheet 211 has an extension part in the second direction. At this time, the extension parts of the adsorption sheets 211 of the two suction cups 21 face the same side.

[0069] The rotating assembly 40 drives the first adsorption assembly 20a to rotate 180° around a preset axis, and the preset axis extends along the third direction. At this time, as Figure 1 and Figure 2 , the extending parts of the adsorption sheets 211 of the two suction cups 21 face each other.

[0070] The first translation assembly 50 drives the first adsorption assembly 20a to move a certain distance in the positive direction of the second direction, so that the two rows of silicon wafers are staggered.

[0071] The second translation assembly 60 drives the first adsorption assembly 20a and the second adsorption assembly 20b to approach each other, so that the two rows of silicon wafers cross.

[0072] The first translation assembly 50 drives the first adsorption assembly 20a to move a certain distance in the reverse direction of the second direction, so that the silicon wafers are attached to each other in pairs, and then the silicon wafers attached to each other in pairs are sent into the coating equipment.

[0073] When the silicon wafers are coated, the two adsorption assemblies 20 take out the silicon wafers attached to each other in pairs, and the air blowing ports of the air ducts 22 blow ionized air towards the silicon wafers to eliminate the static electricity between the silicon wafers, and then the first translation assembly 50 drives the first adsorption assembly 20a to move a certain distance in the positive direction of the second direction, so that the silicon wafers are safely separated.

[0074] The second translation assembly 60 drives the first adsorption assembly 20a and the second adsorption assembly 20b to move away from each other, so that the two rows of silicon wafers are separated in the second direction.

[0075] The first translation assembly 50 drives the first adsorption assembly 20a to move a certain distance in the reverse direction of the second direction, so that the two rows of silicon wafers are directly opposite to each other in the second direction.

[0076] The two adsorption assemblies 20 place the silicon wafers into the flower basket, and the adsorption holes 212 on each adsorption sheet 211 blow ionized air towards the silicon wafers to eliminate the static electricity between the silicon wafers and the adsorption sheets 211, so that the silicon wafers are safely separated from the adsorption sheets 211.

[0077] Optionally, the first direction and the second direction can be mutually perpendicular horizontal directions, and the third direction can be a vertical direction.

[0078] In summary, for the loading and unloading mechanism 100 of the embodiment of the present invention, the adsorption holes 212 on the adsorption sheet 211 and the air blowing holes on the air duct 22 are both connected to the ion generator 30, which can not only eliminate the static electricity between the silicon wafers during the separation process of the silicon wafers, but also eliminate the static electricity between the silicon wafers and the adsorption sheet 211 during the separation process of the silicon wafers and the adsorption sheet 211, more effectively prevent the silicon wafers from being broken, and is beneficial to improving the yield of the product.

[0079] Although some specific embodiments of the present utility model have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present utility model. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present utility model. The scope of the present utility model is defined by the appended claims.

Claims

1. A pick-and-place mechanism, characterized in that, Comprising: A base; Two adsorption components, the two adsorption components are spaced apart in a first direction on the base, each adsorption component includes a suction cup, each suction cup includes a plurality of adsorption sheets arranged in a second direction, the second direction intersects the first direction, and each adsorption sheet is provided with an adsorption hole. At least one air duct, the air duct is arranged on one side of one of the two adsorption components away from the other, and the air duct has a blowing hole facing the suction cup. An ion generator, an input end of the ion generator is used to communicate with a gas source, and an output end of the ion generator is respectively communicated with at least one of the adsorption holes and at least one of the blowing holes, and is used to blow an ion gas mass to the suction cup to eliminate static electricity.

2. The pick-and-place mechanism according to claim 1, wherein, The air duct extends along the first direction, and a plurality of the blowing holes are arranged on the air duct along the first direction.

3. The pick-and-place mechanism according to claim 1, wherein The number of the blowing holes on each air duct is not less than the number of the adsorption sheets on the corresponding suction cup.

4. The pick-and-place mechanism according to claim 1, wherein, The suction cup further includes a mounting plate, a connecting member is provided on the mounting plate, the connecting member extends toward a side of the suction cup away from the other suction cup, and the air duct is connected to the connecting member.

5. The pick-and-place mechanism according to claim 1, characterized in that, The height of the air duct is higher than the height of the adsorption sheet.

6. The pick-and-place mechanism according to claim 1, characterized in that, The axis of the adsorption hole extends obliquely toward a point on the adsorption sheet that is farthest from the air duct.

7. The pick-and-place mechanism according to claim 1, characterized in that, The air duct includes a transparent PC tube.

8. The pick-and-place mechanism according to claim 1, wherein, The number of the ion generators and the air ducts are both two, and the two ion generators, the two adsorption components and the two air ducts are connected in one-to-one correspondence.

9. The pick-and-place mechanism according to claim 1, wherein, The ion generator is an ion air nozzle.

10. The pick-and-place mechanism according to claim 1, wherein, The two adsorption components are respectively a first adsorption component and a second adsorption component, and the picking and placing mechanism further includes: A rotating component, the rotating component is connected to the first adsorption component to drive the first adsorption component to rotate around a preset axis, the preset axis extends along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other. A first translation component, the first translation component is connected to the rotating component and is used to drive the rotating component and the first adsorption component to move along the second direction. A second translation component, the second translation component is respectively connected to the second adsorption component and the first translation component, and is used to drive the second adsorption component and the first adsorption component to approach or move away from each other.

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