Material box

By using a combined design of flexible film and side baffle in the material box, the damage caused by collision in the silicon wafer during material collection or discharge is solved, and the protection of the silicon wafer is achieved, ensuring the stability and quality of the material supply.

CN223060210UActive Publication Date: 2025-07-04WUXI LEAD INTELLIGENT EQUIP CO LTD
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Patent Information

Application Number
CN202421857863.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-01
Publication Date
2025-07-04
Estimated Expiration
2034-08-01

AI Technical Summary

Technical Problem

The limit stops in the prior art usually use hard materials, which leads to the photovoltaic silicon wafers being easily damaged, cracked, fragmented, etc. during material collection or discharge.

Method used

The design is adopted for a combination of flexible film and side baffle. The flexible film is tightened to the inside of the side baffle and air space is left to form a soft contact buffer to prevent the silicon wafer from directly impacting the baffle.

Benefits of technology

It effectively avoids defects such as edge collapse, hidden cracks, and fragmentation caused by collision during material collection or discharge of silicon wafers, and ensures the quality of the material supply.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a material box. The material box is applied to laminated materials and comprises a bottom plate and a plurality of baffle assemblies arranged on the peripheral side of the bottom plate, and the multiple baffle assemblies are used for limiting the laminated materials to the inner side of the bottom plate; the baffle assembly comprises a side baffle and a flexible film, the flexible film is tensioned on the inner side of the side baffle, and an air gap is reserved between the flexible film and the side baffle. The material box provided by the utility model can prevent the laminated material from being damaged in the material taking or placing process, and ensures the material supply quality.
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Description

Technical Field

[0001] The utility model relates to the technical field of feeding equipment, and more specifically, the utility model relates to a cassette. Background Art

[0002] For a photovoltaic silicon wafer stacking cassette, limit blocks are installed around on the bottom plate of the cassette. The blocks are perpendicular to the bottom plate, and a certain number of stacked silicon wafers are restricted in the central area of the cassette for positioning, so that an automatic loading and unloading mechanism can accurately take out / put in silicon wafers from the cassette in sequence.

[0003] In the prior art, the limit blocks are usually made of hard materials. During the process of taking or placing materials, the silicon wafers are likely to hit the limit baffle, resulting in defects such as chipping, hidden cracks, and fragmentation of the silicon wafers. Summary of the Utility Model

[0004] An object of the utility model is to provide a cassette to solve at least one of the problems in the background art.

[0005] According to one aspect of the utility model, there is provided a cassette for laminated materials, comprising:

[0006] A bottom plate and a plurality of baffle assemblies arranged on the periphery of the bottom plate, the plurality of baffle assemblies being used to limit the laminated materials inside the bottom plate;

[0007] The baffle assembly includes a side baffle and a flexible film. The flexible film is tensioned inside the side baffle, and an air gap is left between the flexible film and the side baffle.

[0008] Optionally, the flexible film is made of polyvinyl chloride, polytetrafluoroethylene, polytetrafluoroethylene or PET.

[0009] Optionally, the size of the air gap is 1 mm to 6 mm.

[0010] Optionally, the baffle assembly further includes a pressing block, and the pressing block is arranged outside the side baffle for tensioning and fixing the flexible film.

[0011] Optionally, the baffle assembly further includes a soft pad, and the soft pad is arranged at the upper part inside the side baffle, and the material hardness of the soft pad is less than that of the side baffle.

[0012] Optionally, the soft pad is made of rubber, polyurethane or foam, and the side baffle is made of POM, PEEK, resin glass fiber board or metal.

[0013] Optionally, it further includes a backing plate, and the backing plate is stacked on the bottom plate for placing the laminated materials.

[0014] Optionally, a plurality of diversion grooves are provided on one side of the backing plate facing away from the bottom plate at intervals.

[0015] Optionally, it further includes a sensor for detecting whether there are stacked sheet materials on the backing plate; through holes are provided at the centers of the backing plate and the bottom plate for avoiding the sensor.

[0016] Optionally, a plurality of groups of limiting structures are provided on the bottom plate, and each group of limiting structures corresponds to one of the baffle assemblies;

[0017] Each group of limiting structures includes a plurality of limiting bars, and the plurality of limiting bars are arranged at intervals along the inner and outer directions of the bottom plate to respectively limit the position of the baffle assembly on the bottom plate.

[0018] Optionally, each group of limiting structures further includes a limiting groove, which is located on one side of the plurality of limiting bars and extends along the inner and outer directions, and the limiting groove is used for assembling the baffle assembly.

[0019] Optionally, it further includes an RFID chip, which can be used to encode the cartridge and can send the encoded information externally;

[0020] A receiving groove and a cover plate covering the receiving groove are provided on one side of the bottom plate facing away from the baffle assembly, and the RFID chip is fixed on the cover plate and is located in the receiving groove.

[0021] One technical effect of the present invention is that:

[0022] By providing a flexible film with an air gap on the inner side of the side baffle in the present invention, during the process of taking or placing materials, when the stacked sheet materials collide with the baffle assembly, the flexible film and the air gap can play a certain buffering role, so that the contact between the stacked sheet materials and the baffle assembly is soft contact, avoiding defects such as edge chipping, hidden cracks, and fragmentation of the stacked sheet materials caused by collision with the baffle assembly, and ensuring the feeding quality of the stacked sheet materials.

[0023] Other features and advantages of the present invention will become clear through the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings forming a part of the specification depict embodiments of the present invention and, together with the description, are used to explain the principles of the present invention.

[0025] Figure 1 is one of the schematic structural diagrams of a cartridge provided by the present invention.

[0026] Figure 2It is the second structural schematic diagram of a material box provided by the present utility model.

[0027] Figure 3 It is Figure 1 the front view schematic diagram of the provided material box.

[0028] Figure 4 It is Figure 3 the cross-sectional view at A-A in

[0029] Figure 5 It is Figure 3 the top view of

[0030] Figure 6 It is the structural schematic diagram of a bottom plate provided by the present utility model.

[0031] 1. Bottom plate; 11. Limit strip; 12. Limit groove; 13. Dimension wire groove; 14. Cover plate; 15. Accommodating groove; 2. Baffle assembly; 21. Side baffle; 22. Flexible film; 23. Air gap; 24. Pressing block; 25. Soft pad; 3. Base plate; 31. Flow guiding groove; 32. Through hole; 33. Notch; 4. Handle. Detailed implementation manners

[0032] Now, various exemplary embodiments of the present utility model will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present utility model.

[0033] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended as a limitation on the present utility model and its application or use.

[0034] Technologies and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies and devices should be regarded as part of the specification.

[0035] In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0036] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0037] As Figures 1 to 5As shown, according to one aspect of the present utility model, a material box is provided, which is applied to stacked materials and includes: a bottom plate 1 and a plurality of baffle assemblies 2 arranged on the periphery of the bottom plate 1. The plurality of baffle assemblies 2 are used to confine the stacked materials inside the bottom plate 1. The baffle assembly 2 includes a side baffle 21 and a flexible film 22. The flexible film 22 is tensioned inside the side baffle 21, and an air gap 23 is left between the flexible film 22 and the side baffle 21.

[0038] Specifically, in this embodiment, a plurality of baffle assemblies 2 are arranged on the periphery of the bottom plate 1 so that the stacked materials can be confined inside the bottom plate 1, that is, within the range enclosed by the baffle assemblies 2. In practical applications, during the process of taking or placing materials in the material box, when the stacked materials collide with the baffle assembly 2, the flexible film 22 and the air gap 23 can form a soft contact between the stacked materials and the baffle assembly 2, avoiding damage such as edge chipping, hidden cracks, and fragmentation to the stacked materials caused by the baffle assembly 2, and ensuring the feeding quality of the material box.

[0039] Among them, the flexible film 22 is a wear-resistant plastic film, mainly composed of polymers, metals, oxides, etc., and has high flexibility and plasticity. Its main characteristics are that it can be bent, stretched, flipped, and folded, can adapt to various different-shaped surfaces, and does not break or deform during the deformation process. When applied to the baffle assembly 2, it can not only achieve soft contact between the baffle assembly 2 and the stacked materials but also improve its service life.

[0040] In the above embodiment, the number and installation positions of the baffle assemblies can be designed according to actual needs or the specific shape of the stacked materials. For example, if the stacked material is a silicon wafer and its shape is rectangular or square, the bottom plate 1 can be designed as rectangular or square, and two baffle assemblies 2 can be arranged on each of its sides, so that the eight baffle assemblies 2 can enclose a shape and area matching the silicon wafer in the middle area (i.e., the inner side) of the bottom plate 1.

[0041] In actual use, the silicon wafer can be directly placed on the bottom plate 1, or a backing plate 3 can be placed inside the bottom plate 1, etc., to facilitate operations such as stacking and taking of the silicon wafer. Among them, the silicon wafer is placed in the area enclosed by the eight baffles. During the process of placing or taking out the silicon wafer, when the silicon wafer touches the baffle assembly 2, the flexible film 22 and the air gap 23 can form a buffering and protective effect on it. In addition, the flexible film 22 can be made of a smooth material with good flexibility, tensile resistance, wear resistance, and not easy to deform to improve the protective effect and service life for the silicon wafer.

[0042] Further, the side baffle 21 is made of a rigid material, providing support and limiting functions for the entire baffle assembly 2. The flexible film 22 covers at least the inner side of the side baffle 21, and its outer edge can be tensioned on the outer side or the side of the side baffle 21 through other auxiliary structures to avoid affecting the silicon wafers. Usually, the distance of each baffle assembly from the center of the bottom plate 1 is designed to be equidistant for easy assembly and manufacturing.

[0043] In the above embodiment, the setting of the air gap 23 enables the flexible film 22 to provide a certain buffer space when it is deformed by the impact of the silicon wafer, avoiding direct impact on the side baffle 21 and improving the reliability of the silicon wafer buffer. The size of the air gap 23 can be adaptively designed according to the tensile strength or deformation degree of the flexible film 22. For example, the size of the air gap 23 can be designed to be between 1 mm and 6 mm to assist the soft contact degree between the flexible film 22 and the stacked materials and control the size of the baffle assembly 2.

[0044] Optionally, the flexible film 22 is made of polyvinyl chloride, polytetrafluoroethylene, polytetrafluoroethylene or PET.

[0045] Specifically, in this embodiment, the flexible film 22 can be made of one or several of polyvinyl chloride, polytetrafluoroethylene, polytetrafluoroethylene or PET, so that the flexible film 22 has excellent toughness, wear resistance and fatigue resistance, and its surface has high hardness, is resistant to friction and scratches, providing high flexibility and plasticity for the flexible film. Among them, PET is polyethylene terephthalate.

[0046] Optionally, as Figures 1 to 4 shown, the baffle assembly 2 further includes a pressing block 24, and the pressing block 24 is arranged on the outer side of the side baffle 21 for tensioning and fixing the flexible film 22.

[0047] Specifically, in this embodiment, the flexible film 22 is tensioned on the inner side of the side baffle 21 by the pressing block 24, and the pressing block 24 is located on the outer side of the side baffle 21, so that on the one hand, the tensioning and fixing functions of the flexible film 22 can be realized, and on the other hand, the picking and placing of the stacked materials are not affected. In addition, in practical applications, when the flexible film 22 is damaged, it is convenient to replace it. Among them, the pressing block 24 can be fixed on the outer side of the side baffle 21 through fasteners such as screws.

[0048] In one embodiment, as Figure 4 shown, two pressing blocks 24 can be respectively arranged at the upper and lower ends of the outer side of the side baffle 21, jointly used for tensioning the same flexible film 22.

[0049] Optionally, the baffle assembly 2 further includes a soft pad 25, which is arranged at the upper part inside the side baffle 21, and the material hardness of the soft pad 25 is less than that of the side baffle 21.

[0050] Specifically, in practical applications, the material box can be loaded with a full material box by a dedicated AGV robot or manually, and the empty material box can be unloaded into the automation equipment. After being transported to the corresponding loading position by the conveyor belt and clamped and positioned, there are usually multiple pairs of air knives on the upper side of the material box to blow the top few silicon wafers apart, so as to realize the function of the picking and placing mechanism to pick and place single silicon wafers in sequence. Among them, the size of the soft pad 25 in the height direction of the side baffle 21 can be designed to be between 5 mm and 20 mm, and its width does not exceed the width of the side baffle 21, so as to optimize the protection performance of the baffle assembly 2 for the stacked wafers.

[0051] When the air knives blow the top few silicon wafers apart, there is an air layer interval between the silicon wafers, and they float evenly and stably at the opening of the material box, waiting to be continuously taken away by the suction cup / vacuum belt. A soft pad 25 is arranged at the upper part inside the side baffle 21, and the flexible film 22 can be wrapped on the soft pad 25, so that the limiting edge of the silicon wafer located here is also in soft contact, playing a further protective role for the silicon wafer. Among them, the surface of the soft pad 25 in contact with the side baffle 21 can be bonded to the side baffle 21 with glue to prevent it from falling off.

[0052] In the above embodiment, the soft pad 25 is made of rubber, polyurethane or foam, and the side baffle 21 is made of POM, PEEK, resin glass fiber board or metal.

[0053] Among them, POM is the abbreviation of Polyoxymethylene, which has the characteristics of high hardness, high rigidity, good wear resistance and fatigue resistance, etc., and can improve the overall structural stiffness and limiting function of the baffle assembly 2. And PEEK is the abbreviation of Polyetheretherketone, which is a high-performance polymer material and also has high mechanical strength, anti-aging, high temperature resistance, corrosion resistance and other characteristics, and can improve the service life of the baffle assembly.

[0054] In addition, rubber, polyurethane or foam all have good elasticity and flexibility, and have the characteristics of anti-aging and low cost. Applying them to the soft pad 25 can provide a good buffering effect for the stacked wafers and realize soft contact between the port of the material box and the stacked wafers.

[0055] Optionally, as Figure 1 and Figure 5 shown, it further includes a backing plate 3, which is stacked on the bottom plate 1 and is used for placing the stacked wafers.

[0056] Specifically, in practical applications, a lifting mechanism is usually provided at the bottom of the material box, so that the backing plate 3 can be raised or lowered relative to the bottom plate 1, facilitating the picking of the stacked sheet materials in the material box. In this embodiment, the backing plate 3 is stacked on the bottom plate 1, and avoidance holes can be provided on the bottom plate 1, enabling the lifting mechanism and the like to pass through the bottom plate 1 to lift the backing plate 3, thereby realizing the feeding of the materials.

[0057] Furthermore, in this embodiment, a pair of notches 33 can be oppositely arranged on the peripheral side of the backing plate 3, facilitating the free removal or replacement of the backing plate 3 on the bottom plate 1.

[0058] Optionally, as Figure 1 and Figure 5 shown, a plurality of spaced diversion grooves 31 are arranged on the side of the backing plate 3 facing away from the bottom plate 1.

[0059] Specifically, in practical applications, when the backing plate 3 delivers the last few pieces of materials to the port of the material box, it is not easy to blow the materials apart, resulting in difficult picking. In this embodiment, by arranging a plurality of spaced diversion grooves 31 on the backing plate 3, the air flow blowing towards the materials can be diverted, improving the situation that the last few stacked sheet materials are not easily blown apart from the aerodynamic aspect, thereby improving the stability of automatic sheet picking. Among them, the blowing direction of the air knife is the same as the extending direction of the diversion grooves 31.

[0060] Optionally, as Figure 1 、 Figure 2 and Figure 5 shown, it further includes a sensor (not shown in the figure), and the sensor is used to detect whether there are stacked sheet materials on the backing plate 3; through holes 32 are provided at the centers of both the backing plate 3 and the bottom plate 1, and the through holes 32 are used to avoid the sensor.

[0061] Specifically, in this embodiment, through holes 32 are opened at the centers of both the backing plate 3 and the bottom plate 1 to avoid the sensor located at the bottom of the material box, realizing the detection of whether there are materials in the material box. Among them, the sensor can be realized by distance sensors such as photoelectric sensors and proximity sensors.

[0062] Optionally, as Figure 1 、 Figure 2 、 Figure 5 and Figure 6 shown, a plurality of groups of limiting structures are arranged on the bottom plate 1, and each group of limiting structures corresponds to one of the baffle assemblies 2; each group of limiting structures includes a plurality of limiting bars 11, and the plurality of limiting bars 11 are spaced along the inner and outer directions of the bottom plate 1 to respectively limit the position of the baffle assembly 2 on the bottom plate 1.

[0063] Specifically, in practical applications, the laminated materials usually have various sizes. For example, the silicon wafers used for producing battery components usually have side lengths ranging from 180 mm to 230 mm. In this embodiment, a limiting structure is designed around the bottom plate 1 to quickly and accurately limit the baffle assembly 2, facilitating simple adjustment to ensure the consistency of the silicon wafer limiting by different cartridges, and improving the stability of the automated equipment.

[0064] As Figure 6 shown, a plurality of limiting strips 11 are provided at the position of each baffle assembly 2, and each limiting strip 11 corresponds to a model and size of a silicon wafer, enabling the cartridge to accurately and quickly adjust the position of the baffle assembly 2 on the side plate during use. Among them, the positions and numbers of the limiting strips 11 at each baffle assembly 2 are the same.

[0065] Furthermore, size markings can be provided on one or more sides of the bottom plate 1, and the position of the baffle assembly 2 can be adjusted according to the size markings to meet more compatibility requirements. As Figure 6 shown, the size markings can be designed in the form of size wire grooves 13 to avoid the situation of unclear size markings caused by long-term use. In addition, handles 4 can be provided at the side edges of the bottom plate 1 to facilitate the handling of the cartridge.

[0066] Optionally, as Figure 2 、 Figure 5 and Figure 6 shown, each set of the limiting structures further includes a limiting groove 12, which is located on one side of the plurality of limiting strips 11 and extends along the inside-outside direction, and the limiting groove 12 is used for assembling the baffle assembly 2.

[0067] Specifically, in this embodiment, the baffle assembly 2 can be detachably assembled on the bottom plate 1 by screws or other structures. A limiting groove 12 is provided at the side of the limiting strip 11 to facilitate the disassembly and assembly of each baffle assembly 2. On the other hand, when adjusting the position of the baffle assembly 2, the position consistency of the baffle assembly at different positions in the inside-outside direction of the bottom plate 1 can be ensured through the setting of the limiting groove 12.

[0068] Optionally, as Figure 2 shown, it further includes an RFID chip, which can be used to encode the cartridge and send the encoded information externally; a receiving groove 15 is provided on the side of the bottom plate 1 facing away from the baffle assembly 2, and a cover plate 14 is provided to cover the receiving groove 15. The RFID chip is fixed on the cover plate 14 and is located in the receiving groove 15.

[0069] Specifically, in this embodiment, a receiving groove 15 is provided on the back of the bottom plate 1. An RFID chip is installed in the receiving groove 15 and is installed inside the bottom plate 1 through the cover plate 14. The function of the RFID chip is to assign a coded identity to each cartridge, facilitating the tracing of production process data.

[0070] Among them, the RFID chip (Radio Frequency Identification), that is, the radio frequency identification chip, is an automatic identification technology that uses radio waves for non-contact two-way communication. Using it to code the cartridges can not only meet the coding requirements but also not affect the overall size of the cartridges.

[0071] In the above embodiments, the differences between the various embodiments are mainly described. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a more optimal embodiment. Considering the simplicity of the text, they will not be elaborated here.

[0072] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A material box, applied to stacked materials, characterized in that Comprising: A bottom plate (1) and a plurality of baffle components (2) arranged on the periphery of the bottom plate (1), and the plurality of baffle components (2) are used to confine the laminated material inside the bottom plate (1); The baffle component (2) includes a side baffle (21) and a flexible film (22), the flexible film (22) is tensioned inside the side baffle (21), and an air gap (23) is left between the flexible film (22) and the side baffle (21).

2. The cartridge according to claim 1, wherein The flexible film (22) is made of polyvinyl chloride, polytetrafluoroethylene, polytetrafluoroethylene or PET.

3. The cartridge according to claim 1, characterized in that, The size of the air gap (23) is 1 mm to 6 mm.

4. The cartridge according to claim 1, characterized in that, The baffle component (2) further includes a pressing block (24), and the pressing block (24) is arranged on the outer side of the side baffle (21) for tensioning and fixing the flexible film (22).

5. The cartridge according to claim 1, wherein, The baffle component (2) further includes a soft pad (25), the soft pad (25) is arranged on the upper part of the inner side of the side baffle (21), and the material hardness of the soft pad (25) is less than that of the side baffle (21).

6. The cartridge according to claim 5, wherein The soft pad (25) is made of rubber, polyurethane or foam, and the side baffle (21) is made of POM, PEEK, resin fiberglass board or metal.

7. The cartridge according to claim 1, wherein It further includes a backing plate (3), and the backing plate (3) is stacked on the bottom plate (1) for placing the laminated material.

8. The cartridge according to claim 7, characterized in that, A plurality of spaced diversion grooves (31) are arranged on one side of the backing plate (3) facing away from the bottom plate (1).

9. The cartridge according to claim 7, wherein, It further includes a sensor, and the sensor is used to detect whether there is a laminated material on the backing plate (3); through holes (32) are arranged at the centers of the backing plate (3) and the bottom plate (1), and the through holes (32) are used to avoid the sensor.

10. The cartridge according to claim 1, characterized in that, A plurality of groups of limiting structures are arranged on the bottom plate (1), and each group of limiting structures corresponds to one baffle component (2); Each group of limiting structures includes a plurality of limiting bars (11), and the plurality of limiting bars (11) are spaced along the inner and outer directions of the bottom plate (1) respectively for limiting the position of the baffle component (2) on the bottom plate (1).

11. The cartridge according to claim 10, characterized in that, Each group of limiting structures further includes a limiting groove (12), the limiting groove (12) is located on one side of the plurality of limiting bars (11) and extends along the inner and outer directions, and the limiting groove (12) is used for assembling the baffle component (2).

12. The cartridge according to claim 1, wherein, It further includes an RFID chip, and the RFID chip can be used to encode the material box and can send the encoded information externally; A receiving groove (15) is arranged on one side of the bottom plate (1) facing away from the baffle component (2), and a cover plate (14) is arranged on the receiving groove (15), and the RFID chip is fixed on the cover plate (14) and is located in the receiving groove (15).