Wafer supporting piece and wafer heater

Abstract

The utility model provides a wafer supporting member and a wafer heater, the wafer supporting member movably penetrates through a heating disc, the supporting member comprises a supporting main body, the supporting main body is provided with a supporting end and a connecting part, the supporting end is located at one end of the supporting main body, the connecting part is located at one side far away from the supporting end, and the supporting end is connected with the connecting part. The supporting end is used for supporting a wafer; the weight increasing piece is arranged on the connecting part and used for increasing the weight of the supporting body. According to the wafer supporting member provided by the utility model, the weight increasing member is arranged on the supporting main body to increase the self weight of the supporting main body, so that the supporting member provided by the embodiment of the utility model is arranged on the heating disc, and the situation that the heights of a plurality of supporting members are different when the supporting members move up and down is avoided; and the friction resistance between the supporting main body and the heating disc can be effectively overcome, the phenomenon of needle skipping or needle clamping is avoided, and the stability during wafer transmission is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a support for a wafer and a wafer heater. Background Art

[0002] Chemical Vapor Deposition (CVD) mainly deposits thin films by heating, so the heater is one of the core components in the process module. There are several thimble holes in the heater for receiving thimbles. The thimble and the heater can move relative to each other, so that the wafer can be transferred from the robot arm to the heater plate surface, and vice versa, the wafer can be transferred from the heater plate surface to the robot arm.

[0003] Currently, most of the heater modules in CVD on the market are designed as follows: the heater can move up and down, and the thimble does not move. When the heater rises to the process position, the thimble sinks inside the heater, and at this time, the wafer lies flat on the upper surface of the heater. When the heater descends to the transfer position, the thimble is pushed up by the bottom support block to protrude from the upper surface of the heater, so as to lift the wafer, making the wafer separate from the upper surface of the heater. Since there is a clearance fit between the thimble hole and the thimble, when the clearance is too large, the thimble may tilt severely in the thimble hole, which may cause the upper surfaces of several thimbles not to be on the same plane, resulting in the wafer tilting and slipping. In addition, when some thimbles tilt severely, most of the weight of the wafer will press on the tilted thimbles, causing friction between the thimble and the step surface, and the problem of thimble jumping will occur. These problems will prevent the wafer from being transferred normally and pose a risk of fragmentation. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a support for a wafer and a wafer heater, which avoids the situation that the heights of multiple supports are different when moving up and down, and improves the stability of wafer transfer.

[0005] To achieve the above purpose, in the first aspect, the utility model provides a support for a wafer, the support is movably inserted through the heating plate, and the support includes:

[0006] A support main body, having a support end and a connection part, the support end is located at one end of the support main body, the connection part is located on the side far from the support end, and the support end is used for supporting the wafer;

[0007] A weight increasing member, arranged on the connection part, for increasing the weight of the support main body.

[0008] The beneficial effects of the support member provided by the present utility model are as follows: By providing a weight-increasing member on the support main body to increase the self-weight of the support main body, when the support member in this embodiment is provided on the heating plate, the situation where the heights of multiple support members are different during up and down movement is avoided, and the frictional resistance between the support main body and the heating plate can be effectively overcome, avoiding the occurrence of needle jumping or needle jamming phenomena, and improving the stability during wafer transfer.

[0009] In some embodiments, the weight-increasing member has a connection hole, and the connection hole penetrates through the weight-increasing member and is coaxially arranged with the weight-increasing member;

[0010] The connecting portion is inserted into the connection hole and is detachably connected to the weight-increasing member. The beneficial effects are as follows: By detachably arranging the weight-increasing member on the connecting portion, it is convenient for the installation and disassembly of the weight-increasing member in the reaction chamber.

[0011] In some embodiments, the support member further includes a connecting pin;

[0012] A pin hole is formed in the side wall of the connecting portion;

[0013] The connecting pin is inserted into the pin hole so that the weight-increasing member is located between the support end and the connecting pin.

[0014] In some embodiments, a receiving groove is formed at the bottom of the weight-increasing member, and the connection hole communicates with the receiving groove;

[0015] The connecting pin is inserted into the pin hole and is located in the receiving groove. The beneficial effects are as follows: By forming a receiving groove at the bottom of the weight-increasing member so that the connecting pin is located in the receiving groove, the fixing effect on the weight-increasing member can be ensured.

[0016] In some embodiments, the notch of the receiving groove has a chamfer structure. The beneficial effects are as follows: By providing a chamfer structure at the notch of the receiving groove, it is convenient to place the connecting pin in the receiving groove.

[0017] In some embodiments, the weight-increasing member is of a cylindrical structure, and the receiving groove is of a circular groove structure. The beneficial effects are as follows: By making the weight-increasing member of a cylindrical structure and setting the receiving groove as a circular groove structure, the uniformity of weight distribution when weighing the support main body can be ensured.

[0018] In some embodiments, the support member further includes a locking member;

[0019] An opening is formed in the side wall of the weight-increasing member, and the opening extends to the connection hole to divide a part of the weight-increasing member into a first connecting portion and a second connecting portion;

[0020] The locking member is connected to the first connecting portion and the second connecting portion to fix the weight increasing member to the connecting portion.

[0021] In some embodiments, the support member further includes an abutting member, and the abutting member is threadedly connected to the connecting portion so that the weight increasing member is located between the support end and the abutting member.

[0022] In some embodiments, the support member further includes a snap ring, and a card slot is formed in the snap ring;

[0023] A receiving groove is formed at the bottom of the weight increasing member, and the connecting hole communicates with the receiving groove;

[0024] An annular groove is formed in the outer side wall of the connecting portion;

[0025] The snap ring is snap-fitted with the annular groove through the card slot, and the snap ring is located in the receiving groove.

[0026] In a second aspect, an embodiment of the present invention provides a wafer heater, including a heating plate, a base, a lifting mechanism, and the support member as described above;

[0027] The lifting mechanism is disposed on the base and connected to the heating plate for driving the heating plate to move up and down;

[0028] A plurality of the support members are disposed through the heating plate at intervals and in a ring shape;

[0029] When the lifting mechanism drives the heating plate to descend, one end of the support member away from the support end abuts against the base so that the support end protrudes from the heating surface of the heating plate.

[0030] The beneficial effect of the wafer heater provided by the present invention is that: by providing the support member provided by the present invention on the wafer heater, the situation that the heights of a plurality of support members are different when moving up and down is avoided, and the frictional resistance between the support main body and the heating plate can be effectively overcome, avoiding the occurrence of needle jumping or needle jamming, and improving the stability during wafer transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic structural diagram of a support member according to a first embodiment provided by the present invention;

[0032] Figure 2 is a schematic structural diagram of a support member according to a second embodiment provided by the present invention;

[0033] Figure 3 is a schematic structural diagram of a weight increasing member in the second embodiment provided by the present invention;

[0034] Figure 4Schematic diagram of the support member according to the third embodiment provided by the present utility model;

[0035] Figure 5 Schematic diagram of the support member according to the fourth embodiment provided by the present utility model;

[0036] Figure 6 Schematic diagram of the wafer heater according to the embodiment provided by the present utility model;

[0037] Figure 7 Cross-sectional view of the heating plate along its axial direction according to the embodiment provided by the present utility model.

[0038] Reference numerals:

[0039] Support member 1, support main body 11, support end 111, connecting portion 112, pin hole 113, annular groove 114, weight member 12, connecting hole 121, receiving groove 122, opening 124, first connecting portion 125, second connecting portion 126, connecting pin 13, locking member 14, abutting member 15, snap ring 16, card slot 161, heating plate 2, through hole 21, receiving hole 22, base 3, abutting block 4. Detailed implementation manners

[0040] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the present utility model. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present utility model. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art in the field to which the present utility model belongs. The words such as "including" used herein mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. The "connection" described herein can be a direct connection or an indirect connection, that is, a connection through an intermediate object, unless otherwise specified.

[0041] In view of the problems existing in the prior art, the embodiments of the present utility model provide a support member for a wafer. The support member is movably inserted through the heating plate and is used to lift the wafer on the heating plate to cooperate with a manipulator to transfer the wafer. Refer to Figure 1As shown, the support member 1 includes a support body 11 and a weight increasing member 12. The support body 11 has a support end 111 and a connection portion 112. The support end 111 is located at one end of the support body 11, and the connection portion 112 is located on the side away from the support end 111 and close to the other end of the support body 11. The support end 111 is used to support the wafer. The weight increasing member 12 is provided on the connection portion 112 for increasing the weight of the support body 11. It can be understood that in order to ensure the uniformity when increasing the weight of the support body 11, the structure of the weight increasing member 12 can be symmetrically arranged along the axis of the support body 11. For example, the weight increasing member 12 has a cylindrical structure.

[0042] In this embodiment, by providing the weight increasing member 12 on the support body 11, the self-weight of the support body 11 is increased. Therefore, when the support member 1 in this embodiment is installed on the heating plate 2, the situation where the heights of multiple support members 1 are different when moving up and down is avoided, and the frictional resistance between the support body 11 and the heating plate 2 can be effectively overcome, avoiding the occurrence of needle jumping or needle jamming, and improving the stability during wafer transfer.

[0043] Reference Figure 1 As shown, in some embodiments, the weight increasing member 12 has a connection hole 121. The connection hole 121 penetrates through the weight increasing member 12 and is coaxially arranged with the weight increasing member 12. The connection portion 112 is inserted through the connection hole 121 and is detachably connected to the weight increasing member 12.

[0044] In this embodiment, by detachably arranging the weight increasing member 12 on the connection portion 112, it is convenient for the installation and disassembly of the weight increasing member 12 in the reaction chamber.

[0045] Reference Figure 1 As shown, in some specific embodiments, a pin hole 113 is formed on the side wall of the connection portion 112. The support member 1 further includes a connection pin 13. The connection pin 13 is inserted through the pin hole 113 so that the weight increasing member 12 is located between the support end 111 and the connection pin 13.

[0046] In this embodiment, the specific steps for installing the weight increasing member 12 on the connection portion 112 are as follows:

[0047] First, insert the connection portion 112 through the connection hole 121 so that the weight increasing member 12 is located between the support end 111 and the pin hole 113, and then insert the connection pin 13 through the pin hole 113 to limit the position of the weight increasing member 12.

[0048] Furthermore, a receiving groove 122 is formed at the bottom of the weight increasing member 12. The connection hole 121 communicates with the receiving groove 122, and the connection pin 13 is inserted through the pin hole 113 and located in the receiving groove 122.

[0049] In this embodiment, the receiving groove 122 is a circular groove structure, and the length of the connection pin 13 is less than the inner diameter of the receiving groove 122. By forming the receiving groove 122 at the bottom of the weight increasing member 12, the function of receiving and limiting the connection pin 13 is achieved, preventing the connection pin 13 from falling out of the pin hole 113, thereby ensuring the reliability of the connection of the weight increasing member 12.

[0050] In some embodiments, the notch of the receiving groove 122 has a chamfer structure to facilitate the installation of the connection pin 13 in the receiving groove 122.

[0051] Reference Figure 2 and Figure 3 As shown in the figure, in some embodiments, the support member 1 includes a locking member 14. An opening 124 is formed on the side wall of the weight increasing member 12, and the opening 124 extends to the connection hole 121 to divide a part of the weight increasing member 12 into a first connection portion 125 and a second connection portion 126 that are spaced apart from each other. The locking member 14 is connected to the first connection portion 125 and the second connection portion 126 to fix the weight increasing member 12 to the connection portion 112.

[0052] In this embodiment, a countersunk hole is formed on the first connection portion 125, and a threaded hole corresponding to the countersunk hole is formed on the second connection portion 126. The locking member 14 is a fixing bolt, and the fixing bolt passes through the countersunk hole and is threadedly connected to the threaded hole. By tightening the fixing bolt, the first connection portion 125 and the second connection portion 126 are brought closer to each other, thereby fixing the weight increasing member 12 to the connection portion 112.

[0053] Reference Figure 4 As shown in the figure, in some embodiments, the support member 1 includes an abutting member 15. The abutting member 15 is threadedly connected to the connection portion 112 so that the weight increasing member 12 is located between the support end 111 and the abutting member 15.

[0054] In this embodiment, an external thread structure is provided on the outer side wall of the connection portion 112, and a threaded hole is formed on the abutting member 15. By rotating the abutting member 15, the abutting member 15 is fixed to the connection portion 112. It can be understood that the diameter of the abutting member 15 is greater than the inner diameter of the connection hole 121, thereby realizing the abutment of the weight increasing member 12.

[0055] Further, a receiving groove 122 is formed at the bottom of the weight increasing member 12, and the connection hole 121 communicates with the receiving groove 122. When the abutting member 15 is threadedly connected to the connecting portion 112, a part of the abutting member 15 is located in the receiving groove 122.

[0056] In this embodiment, the receiving groove 122 is a circular groove structure and is coaxially arranged with the weight increasing member 12. The abutting member 15 is a cylindrical structure, and its diameter is smaller than the inner diameter of the receiving groove 122.

[0057] Reference Figure 5 As shown, in some embodiments, the support member 1 further includes a snap ring 16. An arc-shaped slot 161 is formed on the snap ring 16. A receiving groove 122 is formed at the bottom of the weight increasing member 12, and the connection hole 121 communicates with the receiving groove 122. An annular groove 114 is formed on the outer side wall of the connecting portion 112. The snap ring 16 is snap-connected to the annular groove 114 through the slot 161, and the snap ring 16 is located in the receiving groove 122.

[0058] In this embodiment, the specific steps for installing the weight increasing member 12 on the connecting portion 112 are as follows:

[0059] First, pass the connecting portion 112 through the connection hole 121 so that the weight increasing member 12 is located between the support end 111 and the annular groove 114. Then, snap the snap ring 16 onto the annular groove 114. Next, move the weight increasing member 12 downward so that the snap ring 16 is located in the receiving groove 122, thereby realizing the limitation of the position of the weight increasing member 12.

[0060] In some embodiments, an internal thread structure may also be provided on the inner side wall of the connection hole 121, and an external thread structure matching the internal thread structure is provided on the outer side wall of the connecting portion 112, so that the weight increasing member 12 is directly threadedly connected to the connecting portion 112.

[0061] Reference Figure 6 And Figure 7 As shown, in another embodiment provided by the present utility model, a wafer heater is provided, which includes a heating plate 2, a base 3, a lifting mechanism, and the support member 1 disclosed in the above embodiment. Wherein, the lifting mechanism is arranged on the base 3 and is connected to the heating plate 2 for driving the heating plate 2 to lift. A plurality of through holes 21 are annularly and spacedly formed on the heating plate 2, and the support member 1 is inserted into each through hole 21. When the lifting mechanism drives the heating plate 2 to descend, one end of the support member 1 away from the support end 111 abuts against the base 3, so that the support end 111 protrudes from the heating surface of the heating plate 2, thereby enabling the wafer to be lifted from the heating surface.

[0062] In this embodiment, by providing the support member 1 on the wafer heater, the situation where the heights of multiple support members 1 are different when moving up and down is avoided, and the frictional resistance between the support body 11 and the heating plate 2 can be effectively overcome, avoiding the occurrence of needle jumping or needle jamming phenomena, and improving the stability during wafer transfer.

[0063] In some embodiments, a contact block 4 is provided on the base 3 corresponding to the support member 1. The upper surface of the contact block 4 is a contact surface. When the lifting mechanism drives the heating plate 2 to descend, the end of the support member 1 away from the support end 111 abuts against the contact surface.

[0064] In this embodiment, the contact block 4 is detachably provided on the base 3.

[0065] In some embodiments, a plurality of receiving holes 22 are formed in the heating surface. The receiving holes 22 are coaxially arranged with the through holes 21 and communicate with the through holes 21. The inner diameter of the receiving holes 22 is larger than the inner diameter of the through holes 21. The length of the receiving holes 22 is greater than the length of the support portion. The diameter of the support portion is smaller than the inner diameter of the receiving groove 122 and larger than the inner diameter of the through holes 21.

[0066] Therefore, when the lifting mechanism drives the heating plate 2 to ascend, the support portion is located in the receiving hole 22 and abuts against one end of the through hole 21, avoiding the detachment of the support member 1, and when the support portion is located in the receiving hole 22, it avoids interfering with the wafer on the heating surface.

[0067] As described above, the above is only the specific implementation manner of the embodiments of the present application, but the protection scope of the embodiments of the present application is not limited thereto. Any change or replacement within the technical scope disclosed in the embodiments of the present application should be covered by the protection scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application should be subject to the protection scope of the claims.

Claims

1. A support for a wafer, wherein the support is movably disposed through a hot plate, characterized in that, The support member includes: A support main body having a support end and a connection portion. The support end is located at one end of the support main body, and the connection portion is located on a side away from the support end and close to the other end of the support main body. The support end is used for supporting a wafer. A weight increasing member disposed on the connection portion for increasing the weight of the support main body.

2. The support member of the wafer according to claim 1, wherein, The weight increasing member has a connection hole which penetrates the weight increasing member and is coaxially arranged with the weight increasing member. The connection portion is inserted through the connection hole and is detachably connected to the weight increasing member.

3. The support member for a wafer according to claim 2, wherein, It further includes a connection pin. A pin hole is formed in the side wall of the connection portion. The connection pin is inserted through the pin hole so that the weight increasing member is located between the support end and the connection pin.

4. The support member of the wafer according to claim 3, characterized in that, A receiving groove is formed at the bottom of the weight increasing member, and the connection hole communicates with the receiving groove. The connection pin is inserted through the pin hole and is located in the receiving groove.

5. The support member of the wafer according to claim 4, wherein The notch of the receiving groove has a chamfer structure.

6. The support member for a wafer according to claim 4, wherein, The weight increasing member is of a cylindrical structure, and the receiving groove is of a circular groove structure.

7. The support member of the wafer according to claim 2, characterized in that, It further includes a locking member. An opening is formed in the side wall of the weight increasing member, and the opening extends to the connection hole to divide a part of the weight increasing member into a first connection portion and a second connection portion. The locking member is connected to the first connection portion and the second connection portion to fix the weight increasing member on the connection portion.

8. The support member of the wafer according to claim 2, characterized in that, It further includes an abutting member which is threadedly connected to the connection portion so that the weight increasing member is located between the support end and the abutting member.

9. The support member of the wafer according to claim 2, wherein, It further includes a snap ring, and a clamping groove is formed in the snap ring. A receiving groove is formed at the bottom of the weight increasing member, and the connection hole communicates with the receiving groove. An annular groove is formed in the outer side wall of the connection portion. The snap ring is clamped with the annular groove through the clamping groove, and the snap ring is located in the receiving groove.

10. A wafer heater, characterized in that, It includes a heating plate, a base, a lifting mechanism and the support member according to any one of claims 1 to 9. The lifting mechanism is disposed on the base and is connected to the heating plate for driving the heating plate to lift. A plurality of the support members are inserted through the heating plate at intervals and in a ring shape. When the lifting mechanism drives the heating plate to descend, one end of the support member away from the support end abuts against the base so that the support end protrudes from the heating surface of the heating plate.

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