Adjustable support, wafer detection device and end effector

Abstract

The utility model discloses an adjustable support, a wafer detection device and an end effector, and relates to the technical field of semiconductor equipment, the adjustable support comprises a support main body, the support main body is provided with a mobile end, and the mobile end is slidably arranged on the wafer detection device; a mounting space is formed in the support main body, the mounting space penetrates through the moving end, and the mounting space is used for allowing a sensor to penetrate through and driving the sensor to move synchronously. The wafer carrying device is used for carrying wafers. The method at least can solve the problem that when the size of the transferred wafer changes, a tedious Mapping support replacement step still needs to be carried out.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular, to an adjustable bracket, a wafer detection device, and an end effector. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. A wafer is a carrier for manufacturing integrated circuits and is the most commonly used semiconductor material. It is classified into specifications such as 6 inches and 8 inches according to its diameter. In recent years, in order to meet the needs of semiconductor manufacturing, wafers with a diameter of 12 inches or even larger have been developed. As the size of the wafer continues to increase, the requirements for the wafer manufacturing process also continue to improve.

[0003] When transferring a wafer, it is first necessary to know the position and state of the wafer in the wafer cassette and the processing position, and then it is possible to control the manipulator and the wafer suction fingers to move accurately. Currently, the position of the wafer is mainly detected by a transmissive sensor or a reflective sensor. The sensor is fixed to a Mapping bracket, and the Mapping bracket is further fixed to the end of the manipulator. Therefore, when in use, it is necessary to select a Mapping bracket equipped with a suitable type of sensor for installation and deployment.

[0004] In the prior art, the transmitter and receiver in the transmissive sensor are respectively and fixedly installed on the Mapping bracket. Therefore, for wafers of each size specification, a Mapping bracket of a specific model specification needs to be separately configured for it. This results in a cumbersome step of replacing the Mapping bracket when the size of the wafer to be transferred changes.

[0005] Therefore, it is necessary to provide a new adjustable bracket, a wafer detection device, and an end effector to solve the above problems existing in the prior art. Summary of the Invention

[0006] The purpose of the present invention is to provide an adjustable bracket, a wafer detection device, and an end effector, which can at least solve the following technical problems:

[0007] 1. Solve the problem that the sensor and the cable are easily damaged during the adjustment process for matching wafers of multiple sizes in the prior art;

[0008] 2. Solve the problem that the optical fiber cable needs to be adjusted when the bracket body moves in the prior art;

[0009] 3. Solve the problem that the adjustment process is cumbersome for the end effector to adapt to wafers of multiple sizes for sweeping in the prior art.

[0010] To achieve the above purpose, the technical solution of the present invention is as follows:

[0011] An adjustable bracket is used for being installed on a wafer detection device. It is characterized in that the adjustable bracket includes a bracket main body which has a mobile end, and the mobile end is slidably arranged on the wafer detection device;

[0012] An installation space is formed inside the bracket main body, and the installation space penetrates through the mobile end. The installation space is used for threading a sensor and driving the sensor to move synchronously. The bracket main body has a detection end. The installation space includes a mutually communicated accommodation channel and a wire threading channel. The accommodation channel is used for arranging the sensor; the accommodation channel penetrates through the detection end, and the wire threading channel penetrates through the mobile end.

[0013] By adopting the above technical solution, the bracket main body slides on the wafer detection device and drives the sensor to move. During the movement of the bracket main body and the sensor, it is not necessary to remove the sensor, reducing the possibility of damage to the sensor or its cable caused by disassembly or installation of the sensor; the accommodation channel and the wire threading channel are respectively used for threading the sensor and its cable, so that the cable is not exposed outside the bracket main body, reducing the possibility of damage to the sensor and its cable.

[0014] Optionally, the end of the sensor extends outside the detection end, and a protection part is fixedly arranged at the detection end.

[0015] By adopting the above technical solution, the protection part protects the part of the sensor extending outside the detection end, reducing the possibility of damage caused by collision of the part of the sensor extending outside the detection end.

[0016] Optionally, a fixing part is fixedly arranged on the mobile end, and a fixing piece is threaded through the fixing part. The fixing piece is used for connecting with the wafer detection device to fix the bracket main body.

[0017] By adopting the above technical solution, the fixing piece is connected with the wafer detection device, thereby fixing the bracket main body on the wafer detection device, facilitating the fixing and positioning of the bracket main body.

[0018] Optionally, at least one connecting hole is formed in the bracket main body, the connecting hole communicates with the accommodation channel, and a connecting part is threaded through the connecting hole, and the connecting part is used for fixing the sensor.

[0019] By adopting the above technical solution, the connecting part is threaded through the connecting hole and abuts against the side wall of the sensor, thereby fixing the sensor in the accommodation channel, reducing the possibility of change in the position of the sensor.

[0020] A wafer detection device is installed on an end effector. The end effector includes an installation main body. The wafer detection device includes a sensor and a bracket main body;

[0021] There are at least two of the bracket bodies, and they are arranged oppositely. The two bracket bodies are slidably arranged on the mounting body;

[0022] The bracket body includes the accommodation channel and the wire threading channel. The sensor is inserted into the accommodation channel, and the cable of the sensor passes through the wire threading channel and extends to the mounting body and is connected to the signal amplifier inside it;

[0023] In the working state, the multiple bracket bodies approach or move away from each other. The bracket body drives the sensor to move synchronously, and at the same time drives the cable of the sensor to move.

[0024] By adopting the above technical solution, the cable of the sensor passes through the wire threading channel and extends into the mounting body. The bracket body drives the sensor and the cable of the sensor to move synchronously. During the movement, it is not necessary to remove the sensor and the cable of the sensor, reducing the possibility of damage to the sensor or the cable of the sensor during disassembly or installation. At the same time, the bracket body moves to adjust the distance between the two bracket bodies, facilitating adaptation to wafers of different sizes.

[0025] Optionally, a sliding groove is formed on the mounting body, and the bracket body is slidably arranged on the inner wall of the sliding groove so that at least two oppositely arranged bracket bodies approach or move away from each other.

[0026] By adopting the above technical solution, a sliding groove is formed on the mounting body, and the bracket body slides in the sliding groove. During the sliding process, the sensor and the cable of the sensor will not be interfered, so it is not necessary to remove the sensor and the cable of the sensor during the sliding process, reducing the possibility of damage to the sensor or the cable of the sensor during disassembly or installation.

[0027] Optionally, the sensor has a transmitting end and a receiving end. The transmitting end and the receiving end are respectively fixedly arranged in the two accommodation channels. The transmitting end and the receiving end both extend to the outside of the accommodation channel, and the transmitting end and the receiving end are arranged oppositely.

[0028] By adopting the above technical solution, both the transmitting end and the receiving end extend to the outside of the accommodation channel, facilitating the signal receiving and transmitting process.

[0029] Optionally, a fixing member is further provided on the bracket body, and a fixing hole is formed on the mounting body. The fixing member passes through the fixing hole to position the bracket body.

[0030] By adopting the above technical solution, the fixing member is inserted into the fixing hole, thereby fixing the position of the bracket body, facilitating the adjustment of the distance between adjacent bracket bodies to adapt to wafers of different sizes.

[0031] Optionally, the wafer detection device further includes a covering member that moves synchronously with the mobile end to shield the sliding groove and separate the interior of the mounting body from the outside;

[0032] The covering member has at least one blocking portion disposed along the length direction of the sliding groove. The sliding groove has two opposite extreme positions in its own length direction. During the movement of the bracket body between the two extreme positions, the blocking portion always shields the sliding groove.

[0033] By adopting the above technical solution, the covering member covers the sliding groove, reducing the possibility of dust, foreign objects, etc. entering the interior of the mounting body.

[0034] An end effector for wafer handling includes a mounting body, a finger portion, and a wafer detection device. The finger portion and the wafer detection device are respectively connected to two ends of the mounting body; the finger portion is used for clamping a wafer, and the wafer detection device is used for detecting the state of the wafer.

[0035] By adopting the above technical solution, during the wafer handling process, the finger portion transports the wafer, and the wafer detection device detects the wafer. At the same time, by adjusting the position of the bracket body, the wafer detection device can be adapted to wafers of different sizes.

[0036] The beneficial effects of the adjustable bracket, wafer detection device, and end effector provided by the present invention are as follows:

[0037] 1. The bracket body slides on the wafer detection device and drives the sensor to move. During the movement of the bracket body and the sensor, it is not necessary to remove the sensor, thus solving the problem in the prior art that the sensor and the cable are easily damaged during the adjustment process for matching wafers of multiple sizes;

[0038] 2. When corresponding to wafers of different sizes, it is only necessary to slide the bracket body in the sliding groove, without the need for cumbersome replacement steps of the wafer detection device, and at the same time solving the problem in the prior art that the optical fiber cable needs to be adjusted when the bracket body moves;

[0039] 3. Adjust the position between the two bracket bodies to adapt to wafer sweeping of multiple sizes, such as 4 inches, 6 inches, and 8 inches, solving the problem of cumbersome adjustment process during wafer sweeping. Description of the Drawings

[0040] Figure 1 Schematic structural diagram of the bracket body according to an embodiment of the present invention;

[0041] Figure 2 Cross-sectional view of the bracket body according to an embodiment of the present invention;

[0042] Figure 3 Schematic diagram of the main structure of the end effector according to an embodiment of the present invention;

[0043] Figure 4 Schematic diagram of the cover according to an embodiment of the present invention;

[0044] Figure 5 Schematic diagram of the application scenario according to an embodiment of the present invention.

[0045] Reference numerals:

[0046] 100, bracket main body; 110, mobile end; 120, detection end; 130, installation space; 131, accommodation channel; 132, wire threading channel; 140, protection part; 150, fixing part; 151, fixing member; 160, connection hole; 161, connection part; 200, sensor; 210, transmitting end; 220, receiving end; 300, installation main body; 310, sliding groove; 320, fixing hole; 330, cover; 331, cylindrical part; 332, blocking part; 400, finger part; 500, wafer cassette. Detailed implementation manners

[0047] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art in the technical field to which the present invention belongs. The words such as "including" used herein mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects.

[0048] The following will further elaborate on the detailed implementation manners of the present invention with reference to the accompanying drawings.

[0049] Refer to Figure 1 and Figure 2, embodiments of the present invention provide an adjustable bracket, which is used to be installed on a wafer detection device for detecting the position of a wafer. The adjustable bracket includes a bracket main body 100, which is in a long strip shape, and both ends of the bracket main body 100 are a mobile end 110 and a detection end 120 respectively, that is, the bracket main body 100 has a mobile end 110 and a detection end 120. The mobile end 110 is slidably arranged on the wafer detection device. At the same time, an installation space 130 is opened inside the installation main body 300, and both ends of the installation space 130 penetrate through the mobile end 110 and the detection end 120 respectively, that is, the length direction of the installation space 130 is the same as the length direction of the bracket main body 100. The installation space 130 is used to pass through the sensor 200, and at the same time, the cable of the sensor 200 is also placed in the installation space 130. The bracket main body 100 slides on the wafer detection device, driving the sensor 200 and its cable to move synchronously. In this process, it is not necessary to take out the sensor 200, reducing the possibility of damage to the sensor 200 during the removal or installation process.

[0050] During the installation process of the sensor 200, the sensor 200 and its cable require different sizes of space. Refer to Figure 1 and Figure 2 , the installation space 130 includes a receiving channel 131 and a wire threading channel 132. At the same time, the receiving channel 131 is communicated with the wire threading channel 132. The cross-sections of the receiving channel 131 and the wire threading channel 132 along the length direction of the bracket main body 100 can be circular or polygonal, as long as they are adapted to the shape of the sensor 200. In this embodiment, the cross-sections of the receiving channel 131 and the wire threading channel 132 along the length direction of the bracket main body 100 are both circular. The diameters of the receiving channel 131 and the wire threading channel 132 can be the same or different. In this embodiment, the diameters of the receiving channel 131 and the wire threading channel 132 are selected to be different. In order to adapt to the sensor 200 and its cable, the specific diameter selection method is that the diameter of the receiving channel 131 is larger than the diameter of the wire threading channel 132. The receiving channel 131 penetrates through the detection end 120 and is used to fix the sensor 200, and the wire threading channel 132 penetrates through the mobile end 110 and is used to pass through the cable of the sensor 200. One end of the sensor 200 extends to the outside of the detection end 120, and a protection part 140 is fixedly arranged on the detection end 120. The fixing method can be welding, bolt fixing or integral molding, etc. In this embodiment, it is preferably selected that the protection part 140 is fixedly arranged on the detection end 120 by integral molding. The protection part 140 is in a block shape, and the length of the part of the sensor 200 extending to the outside of the receiving space is less than the length of the protection part 140 in the length direction of the bracket main body 100, so that the protection part 140 can protect the sensor 200 and reduce the possibility of damage to the end of the sensor 200 due to collision.

[0051] During the sliding process of the bracket body 100, it is necessary to connect the bracket body 100 to the wafer detection device. Refer to Figure 1 , a fixing part 150 is fixedly arranged on the mobile end 110 of the bracket body 100. The fixing method can be welding, bolt fixing or integral molding, etc. In this embodiment, it is preferably selected that the fixing part 150 is fixedly arranged on the mobile end 110 by integral molding. The fixing part 150 is in a block shape, and a fixing member 151 is penetrated through the fixing part 150. The fixing member 151 can move along the length direction of the bracket body 100 on the fixing part 150 and is connected to the wafer detection device, so as to fix the bracket body 100 and the wafer detection device and play a positioning role at the same time. Specifically in this embodiment, the fixing member 151 is a bolt, that is, the fixing part 150 and the wafer detection device are connected by bolt fixing, so as to achieve the effects of fixing and positioning.

[0052] After the sensor 200 is inserted into the accommodation space, it is necessary to ensure that the sensor 200 does not move in the accommodation space. Refer to Figure 1 and Figure 2 , connection holes 160 are formed in the bracket body 100. At least one connection hole 160 is formed, and two or more can also be selected. In this embodiment, two connection holes 160 are selected. The axial direction of the connection holes 160 is perpendicular to the length direction of the bracket body 100. At the same time, the connection holes 160 communicate with the accommodation channel 131. A connection part 161 is penetrated through the connection holes 160. The connection part 161 can move axially in the connection holes 160 and extend into the accommodation channel 131 to fix the position of the sensor 200. Specifically in this embodiment, the connection part 161 is a bolt and is threadedly connected to the inner side wall of the connection holes 160. Rotate the connection part 161 to adjust the position of the end of the connection part 161 in the connection holes 160, so that the end of the connection part 161 abuts against the side wall of the sensor 200 to fix the position of the sensor 200, reducing the possibility of the position change of the sensor 200; in addition, the sensor 200 is a fiber optic sensor 200, and a transmissive sensor 200 can be selected, or a reflective sensor 200 can also be selected. In this embodiment, the sensor 200 is selected as a transmissive sensor 200.

[0053] An embodiment of the present invention also provides a wafer detection device. Refer to Figure 1 , Figure 2 and Figure 3, The wafer detection device is used to detect wafers. The wafer detection device is for installation on an end effector. The wafer detection device is the Mapping bracket. The end effector includes a mounting body 300. The wafer detection device includes a sensor 200 and the above-mentioned bracket body 100. In the wafer detection device, there are at least two bracket bodies 100. Specifically, in this embodiment, two bracket bodies 100 are selected as an example in the wafer detection device. The two bracket bodies 100 are arranged oppositely. At the same time, the two bracket bodies 100 are both slidably arranged on the mounting body 300. It can be selected that one bracket body 100 can slide and the other bracket body 100 does not move, or both bracket bodies 100 can slide. In this embodiment, it is selected that both bracket bodies 100 can slide. The two bracket bodies 100 approach or move away from each other, so that the distance between the two bracket bodies 100 can adapt to wafers of different sizes. The sensor 200 is inserted into the accommodation channel 131. The cable of the sensor 200 extends into the interior of the mounting body 300 after passing through the wire threading channel 132 and is connected to the signal amplifier inside the mounting body 300. In the working state, the movement of the bracket body 100 drives the sensor 200 and its cable to move synchronously. During this process, it is not necessary to remove and reinstall the sensor 200 and its cable, reducing the possibility of damage to the sensor 200 and its cable during disassembly or installation.

[0054] To facilitate the sensor 200 and its cable not being removed during the movement of the bracket body 100, referring to Figure 1 and Figure 3, a sliding groove 310 is formed in the installation main body 300. The sliding groove 310 is horizontally arranged, and both bracket main bodies 100 are slidably arranged on the inner wall of the sliding groove 310. One or two sliding grooves 310 can be selected. When there is one sliding groove 310, the two bracket main bodies 100 are slidably arranged in the same sliding groove 310. In this embodiment, two sliding grooves 310 are selected, and the two sliding grooves 310 respectively correspond to the two bracket main bodies 100, so that the two oppositely arranged bracket main bodies 100 can approach or separate from each other. The two sliding grooves 310 are located in the same horizontal plane, and the length directions of the two sliding grooves 310 are parallel to each other. When the two bracket main bodies 100 slide in the two sliding grooves 310, the two bracket main bodies 100 move away from or close to each other, which is convenient for adapting to wafers of different sizes. At the same time, the sensor 200 has a transmitting end 210 and a receiving end 220. The transmitting end 210 and the receiving end 220 are respectively fixedly arranged in the two accommodating channels 131, and the parts of the transmitting end 210 and the receiving end 220 extending outside the accommodating channels 131 are oppositely arranged. The sensor 200 can identify the placement position, placement state of the wafer, and whether there is wafer stacking, tilting, or missing. In addition, the shape of the sliding groove 310 can be selected as rectangular or waist-shaped. In this embodiment, the shape of the sliding groove 310 is preferably waist-shaped, that is, the sliding groove 310 is in the shape of a waist-shaped groove, which is convenient for the movement of the two bracket main bodies 100. During the movement of the bracket main body 100, the cable of the sensor 200 extends into the installation main body 300 through the sliding groove 310, and it is not necessary to remove the sensor 200 and its cable during the movement, which not only simplifies the adjustment steps but also avoids damage to the sensor 200 during disassembly or installation. At the same time, fixing holes 320 are formed in the installation main body 300. One or more fixing holes 320 can be formed. In this embodiment, multiple fixing holes 320 are selected, and the multiple fixing holes 320 respectively correspond to the two sliding grooves 310, and the connecting direction of the axes of the multiple fixing holes 320 is parallel to the length direction of the sliding groove 310. During the movement of the bracket main body 100, the fixing member 151 is inserted into different fixing holes 320, thereby connecting the bracket main body 100 and the installation main body 300. In this embodiment, the fixing member 151 is threadedly connected to the inner wall of the fixing hole 320. By connecting the fixing member 151 in different fixing holes 320, the distance between the two bracket main bodies 100 is adapted to wafers of different sizes, such as 4-inch, 6-inch, and 8-inch wafers.

[0055] Since the sliding groove 310 penetrates the side wall of the installation main body 300, in order to prevent dust, foreign objects, etc. from entering the interior of the installation main body 300, referring to Figure 1 , Figure 3 and Figure 4, the wafer inspection device further includes a cover 330. The cover 330 can move synchronously with the mobile end 110 and is used to shield the sliding groove 310, separating the inside and outside of the mounting body 300. The cover 330 has a cylindrical portion 331 and at least one blocking portion 332. In this embodiment, there are two selected blocking portions 332, and the two blocking portions 332 are respectively fixedly arranged at both ends of the cylindrical portion 331. The cylindrical portion 331 is fixedly connected to the blocking portion 332. The cylindrical portion 331 is slidably arranged in the sliding groove 310, that is, the outer wall of the cylindrical portion 331 is slidably connected to the inner wall of the sliding groove 310, so that one blocking portion 332 is placed outside the mounting body 300 and the other blocking portion 332 is placed inside the mounting body 300, that is, the cover 330 is snap-fitted in the sliding groove 310. The blocking portion 332 is arranged along the length direction of the sliding groove 310. The sliding groove 310 has two opposite extreme positions in its own length direction, that is, both ends of the length direction of the sliding groove 310. The bracket body 100 moves between the two extreme positions and drives the cover 330 to move synchronously during the movement. When the side wall of the cylindrical portion 331 abuts against any extreme position of the sliding groove 310, the bracket body 100 and the cover 330 stop moving. During this process, the blocking portion 332 always keeps the state of shielding the sliding groove 310, so that the inside and outside of the mounting body 300 are always separated; at the same time, the blocking portion 332 placed outside the mounting body 300 is fixedly arranged on the mobile end 110 by means of bolts, so that the bracket body 100 and the cover 330 can move synchronously. The inside of the cylindrical portion 331 is hollow, and the inside of the cylindrical portion 331 communicates with the wire threading channel 132. The cable of the sensor 200 extends into the mounting body 300 after passing through the wire threading channel 132 and the inside of the cylindrical portion 331; in addition, the shape of the blocking portion 332 is the same as that of the sliding groove 310, both are waist-shaped, and during the synchronous movement of the bracket body 100 and the cover, the blocking portion 332 always ensures that the sliding groove 310 is blocked, reducing the possibility of dust, foreign objects, etc. entering the inside of the mounting body 300; the outer wall of the cylindrical portion 331 has at least two anti-rotation surfaces. The two anti-rotation surfaces are parallel to each other, and the two anti-rotation surfaces respectively fit against the two inner walls of the sliding groove. The anti-rotation surfaces are mainly used to prevent the cover 330 from rotating to ensure the shielding effect of the cover 330.

[0056] An embodiment of the present invention further provides an end effector, which is used on a manipulator device and is mainly used for handling wafers. Refer to Figure 3 and Figure 5, the end effector includes a mounting body 300, a finger part 400 and the above wafer detection device. The finger part 400 and the wafer detection device are respectively connected to two ends of the mounting body 300. The finger part 400 is used for clamping the wafer, and the wafer detection device is used for detecting the state of the wafer. During the working process, the wafer detection device is used to monitor the wafers in the wafer cassette in the vertical direction. By adjusting the distance between the two support bodies 100, the wafer detection device can be adapted to wafers of different sizes, avoiding interference between the support body 100 and the side wall of the wafer cassette, realizing that the same end effector is compatible with wafers of different sizes. And when adjusting the distance between the two support bodies 100, there is no need to repeatedly disassemble or install the sensor 200 and its cable. During the working process, the two support bodies 100 extend into the wafer cassette 500 without interference with the side wall of the wafer cassette 500.

[0057] The implementation principle of an adjustable support, a wafer detection device and an end effector of the present application is that a sliding groove 310 is opened on the mounting body 300. When the support body 100 slides in the sliding groove 310, the sensor 200 and its cable slide synchronously with the support body 100. During this process, the sensor 200 and its cable will not be interfered, so that when adjusting the distance between the two support bodies 100, there is no need to repeatedly disassemble or install the sensor 200 and its cable, reducing the possibility of damage to the sensor 200 and its cable.

[0058] Although the embodiments of the present invention have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the present invention described in the claims. Moreover, the present invention described herein can have other embodiments and can be implemented or realized in various ways.

Claims

1. An adjustable bracket for mounting on a wafer inspection device, characterized in that, The adjustable bracket includes a bracket body (100), and the bracket body (100) has a mobile end (110), and the mobile end (110) is slidably arranged on the wafer detection device; An installation space (130) is formed inside the bracket body (100), the installation space (130) penetrates through the mobile end (110), and the installation space (130) is used for threading a sensor (200) and driving the sensor (200) to move synchronously; the bracket body (100) has a detection end (120), and the installation space (130) includes a communicating accommodation channel (131) and a wire threading channel (132), and the accommodation channel (131) is used for arranging the sensor (200); the accommodation channel (131) penetrates through the detection end (120), and the wire threading channel (132) penetrates through the mobile end (110).

2. The adjustable bracket according to claim 1, wherein, The end of the sensor (200) extends outside the detection end (120), and a protection part (140) is fixedly arranged at the detection end (120).

3. The adjustable bracket according to claim 1, wherein, A fixing part (150) is fixedly arranged on the mobile end (110), and a fixing piece (151) is threaded through the fixing part (150), and the fixing piece (151) is used for connecting with the wafer detection device to fix the bracket body (100).

4. The adjustable bracket according to claim 1, characterized in that At least one connection hole (160) is formed in the bracket body (100), the connection hole (160) communicates with the accommodation channel (131), and a connection part (161) is threaded through the connection hole (160), and the connection part (161) is used for fixing the sensor (200).

5. A wafer inspection device is installed on an end effector, and the end effector includes a mounting body (300), characterized in that, The wafer detection device includes a sensor (200), and the bracket body (100) according to any one of claims 1-4; At least two bracket bodies (100) are provided and are arranged oppositely, and the two bracket bodies (100) are both slidably arranged on the installation body (300); The bracket body (100) includes the accommodation channel (131) and the wire threading channel (132), the sensor (200) is threaded through the accommodation channel (131), and the cable of the sensor (200) passes through the wire threading channel (132) and extends to the installation body (300) and is connected to a signal amplifier inside it; In the working state, multiple bracket bodies (100) approach or move away from each other, the bracket body (100) drives the sensor (200) to move synchronously, and at the same time drives the cable of the sensor (200) to move.

6. The wafer inspection device according to claim 5, wherein A sliding groove (310) is formed in the installation body (300), and the bracket body (100) is slidably arranged on the inner wall of the sliding groove (310) so that at least two oppositely arranged bracket bodies (100) approach or move away from each other.

7. The wafer inspection device according to claim 5, wherein The sensor (200) has a transmitting end (210) and a receiving end (220). The transmitting end (210) and the receiving end (220) are respectively fixedly arranged in the two accommodation channels (131). The transmitting end (210) and the receiving end (220) both extend to the outside of the accommodation channels (131), and the transmitting end (210) and the receiving end (220) are arranged oppositely.

8. The wafer inspection device according to claim 5, wherein, A fixing member (151) is further provided on the bracket main body (100). A fixing hole (320) is formed on the mounting main body (300). The fixing member (151) passes through the fixing hole (320) to position the bracket main body (100).

9. The wafer inspection apparatus according to claim 6, wherein, The wafer detection device further includes a covering member (330) that moves synchronously with the mobile end (110) to shield the sliding groove (310) and separate the inside of the mounting main body (300) from the outside. The covering member (330) has at least one blocking portion (332). The blocking portion (332) is arranged along the length direction of the sliding groove (310). The sliding groove (310) has two opposite extreme positions in its own length direction. During the movement of the bracket main body (100) between the two extreme positions, the blocking portion (332) always shields the sliding groove (310).

10. An end effector, characterized in that, It includes a mounting main body (300), a finger portion (400) and the wafer detection device according to any one of claims 5-9. The finger portion (400) and the wafer detection device are respectively connected to two ends of the mounting main body (300). The finger portion (400) is used for clamping the wafer, and the wafer detection device is used for detecting the state of the wafer.

Images