Compact computer cooling system and computer
By using heat conduction plates and cross-flow fans to form a U-shaped cooling air duct in computer equipment, the problem of poor heat dissipation effect in miniaturized equipment is solved, and efficient heat dissipation of compact computers is achieved, suitable for high-performance computers and game consoles.
Patent Information
- Application Number
- CN202422340957.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-09-24
AI Technical Summary
The prior art heat dissipation solutions have low space utilization and poor heat dissipation effects in miniaturized computing devices, making it difficult to meet the needs of high-heat generation equipment.
The heat conducting plate is used to bond the heat source, and combine the heat sink group and the cross-flow fan to form a U-shaped heat dissipation air duct, which can achieve efficient heat dissipation through the air inlet and outlet holes. The main board, heat conducting plate and heat dissipation fan are reasonably laid out to form a compact computer heat dissipation system.
It realizes efficient heat dissipation in compact computer equipment, reduces the number of fans, improves space utilization and heat dissipation effect, and is suitable for high-performance computers and game consoles.
Smart Images
Figure CN223065716U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of computer heat dissipation, and particularly relates to a compact computer heat dissipation system and a computer. Background Art
[0002] With the popularization and application of large model artificial intelligence technology, the computing power demand of devices has reached a new height. While the computing power of devices has increased significantly, there has been a significant increase in power consumption, which poses a huge challenge to the heat dissipation capacity of devices, especially for miniaturized computing devices with limited space. Traditional heat dissipation solutions are difficult to meet the requirements. The existing heat dissipation solutions adopt a stacked heat dissipation design with multiple fans, resulting in low space utilization and poor heat dissipation effect. Content of the Utility Model
[0003] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art. The first object is to provide a compact computer heat dissipation system with a compact structure and good heat dissipation effect.
[0004] The second object of the utility model is to provide a computer with a compact structure and good heat dissipation effect.
[0005] The technical solution adopted by the utility model is as follows: The described compact computer heat dissipation system includes a housing, a cavity is arranged in the housing, a main board, a heat conducting plate and a heat dissipation fan are arranged in the cavity, the main board has a heat source, the heat conducting plate is attached to the heat source, a heat sink group is arranged on the heat conducting plate, the heat dissipation fan is located at the side end of the heat sink group, air inlet holes and air outlet holes are formed in the housing, and the air inlet holes and the air outlet holes are both communicated with the heat dissipation fan to form a heat dissipation air duct, and the heat sink group is located in the heat dissipation air duct.
[0006] Further, the cavity is separated into a heat exchange area and a component area by the heat conducting plate, the heat exchange area and the component area are respectively located at the upper end and the lower end of the heat conducting plate, and the heat dissipation fan is located between the side end of the heat conducting plate and the inner wall of the cavity.
[0007] Further, the heat conducting plate is inclined, and the heat exchange area and / or the component area is / are trapezoidal spaces.
[0008] Further, the heat dissipation fan is close to the corner of the cavity, a wind guide cover is arranged between the heat dissipation fan and the corner of the cavity, and the heat dissipation air duct is a U-shaped air duct.
[0009] Further, the heat dissipation fan is a cross-flow fan.
[0010] Further, the heat sink group includes a plurality of heat sinks, the plurality of heat sinks are arranged at intervals, and the lower ends of all of them are arranged on the heat conducting plate.
[0011] Further, a boss is provided at the bottom of the heat conducting plate, and the heat conducting plate is attached to the heat source through the boss.
[0012] Further, the heat conducting plate is a plurality of heat pipes or a VC heat pipe plate.
[0013] Further, the housing includes an upper housing and a lower housing. The upper housing is arranged at the upper end of the lower housing. The air inlet holes are located on both sides of the lower housing, and the air outlet holes are located on one side of the upper housing.
[0014] In addition, the present utility model further provides a computer, which includes the compact computer cooling system described above.
[0015] The beneficial effects of the present utility model are as follows:
[0016] Compared with the deficiencies of the prior art, in the present utility model, the heat conducting plate is attached to the heat source, and the heat is quickly and evenly conducted to the heat sink group. By connecting the air inlet holes and the air outlet holes to the cooling fan to form a cooling air duct, the air flow generated by the rotation of the cooling fan is directed to the outside to achieve equipment cooling. Therefore, the present utility model can achieve good heat dissipation effect with only one cooling fan, and does not need to use multiple fans for combined heat dissipation as in the prior art. Moreover, by reasonably arranging the main board, the heat conducting plate and the cooling fan in the cavity, a computer device with a compact internal structure and a small volume is formed, which is especially suitable for high-performance computers and game consoles with high heat generation, making the compact computer cooling system have the advantages of a compact structure and good heat dissipation effect. Description of the Drawings
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.
[0018] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;
[0019] Figure 2 is an exploded schematic diagram of the present utility model;
[0020] Figure 3 is an exploded schematic diagram of the main board, the heat conducting plate and the heat sink group of the present utility model;
[0021] Figure 4 is a plane structural schematic diagram inside the present utility model.
[0022] The reference numerals are as follows:
[0023] 1. Housing; 2. Cavity; 3. Main board; 5. Heat conducting plate; 6. Cooling fan; 7. Heat source; 8. Heat sink group; 9. Air inlet hole; 10. Air outlet hole; 11. Heat dissipation air duct; 12. Heat exchange area; 13. Component area; 15. Air guide cover; 16. Boss; 17. Upper shell; 18. Lower shell; 24. Hardware device.
[0024] The realization, functional features and advantages of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments
[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0026] It should be noted that all directional indications in the embodiments of the present utility model, such as up, down, left, right, front, back, clockwise, counterclockwise, etc., are only used to explain the relative position relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0027] In addition, the descriptions involving "first", "second", etc. in the present utility model are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between various embodiments may be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.
[0028] As Figures 1 to 4 shown, in this embodiment, the present utility model includes a housing 1, a cavity 2 is arranged in the housing 1, a main board 3, a heat conducting plate 5 and a cooling fan 6 are arranged in the cavity 2, the main board 3 has a heat source 7, the heat conducting plate 5 is attached to the heat source 7, a heat sink group 8 is arranged on the heat conducting plate 5, the cooling fan 6 is located at the side end of the heat sink group 8, an air inlet hole 9 and an air outlet hole 10 are opened on the housing 1, the air inlet hole 9 and the air outlet hole 10 are both communicated with the cooling fan 6 to form a heat dissipation air duct 11, and the heat sink group 8 is located in the heat dissipation air duct 11.
[0029] Among them, the heat source 7 includes computer core heat generating components such as a central processing unit and a graphics processing unit located on the main board 3; the heat conducting plate 5 is attached to the heat source 7 welded to the main board 3 to achieve uniform heat conduction; the heat sink group 8 is composed of a large number of heat sinks uniformly welded to the heat conducting plate 5 to achieve heat dissipation; the cooling fan 6 is located on one side of the heat sink group 8, and it generates a wide airflow passing through the heat sink group 8 to direct the heat to the outside of the housing 1.
[0030] It should be noted that by connecting the air inlet hole 9 and the air outlet hole 10 to the cooling fan 6 to form a heat dissipation air duct 11, cold air is input into the interior of the housing 1 through the air inlet hole 9, and further takes away the heat of the heat sink group 8 under the action of the cooling fan 6, and the hot air is discharged through the air outlet hole 10.
[0031] Compared with the deficiencies of the prior art, in the present utility model, the heat conducting plate 5 is attached to the heat source 7 to quickly and uniformly conduct the heat to the heat sink group 8, and by connecting the air inlet hole 9 and the air outlet hole 10 to the cooling fan 6 to form a heat dissipation air duct 11, the airflow generated by the rotation of the cooling fan 6 is directed to the outside to achieve equipment cooling. Therefore, the present utility model can have a good heat dissipation effect with only one cooling fan 6, and does not need to use multiple fans for combined heat dissipation as in the prior art. Moreover, by reasonably arranging the main board 3, the heat conducting plate 5 and the cooling fan 6 in the cavity 2, a computer device with a compact internal structure and a small volume is formed, which is especially suitable for high-performance computers and game consoles with high heat generation, making the compact computer heat dissipation system have the advantages of a compact structure and a good heat dissipation effect.
[0032] It is worth mentioning that the layout scheme proposed in this application has good single-axis unity, and different heat dissipation scales can be obtained by adjusting the axial length, which helps to enrich the product positioning, categories and application scenarios. During the adjustment of the heat dissipation scale, the adjustable parameters include the length of the heat conducting plate 5, the length or number of the cooling fans 6, and the number of heat sinks in the heat sink group 8.
[0033] Such as Figure 4As shown, in some embodiments, the cavity 2 is separated by the heat conduction plate 5 into a heat exchange area 12 and a component area 13. The heat exchange area 12 and the component area 13 are respectively located at the upper end and the lower end of the heat conduction plate 5. The cooling fan 6 is located between the side end of the heat conduction plate 5 and the inner wall of the cavity 2. Among them, in addition to conducting heat, the heat conduction plate 5 also plays a role in separating the space, separating the cavity 2 into the heat exchange area 12 and the component area 13; the component area 13 is used to accommodate hardware devices 24 such as the main board 3, memory, hard disk, connectors, and slots; the heat exchange area 12 provides an air flow channel for the heat sink group 8. Specifically, when the heat dissipation air duct 11 flows, first, the cold air enters the component area 13 through the air inlet hole 9, and then is redirected through the cooling fan 6 and enters the heat exchange area 12, thereby taking away the heat of the heat sink group 8 and discharging the hot air through the air outlet hole 10.
[0034] As Figure 4 shown, in some embodiments, the heat conduction plate 5 is inclined, and the heat exchange area 12 and / or the component area 13 is a trapezoidal space. Specifically, the inclined heat conduction plate 5 divides the interior of the device into two complementary spaces, namely the heat exchange area 12 and the component area 13 in the shape of a trapezoidal space. Among them, the trapezoidal space has a high side and a low side. In the component area 13, this feature can be used to layout the components from high to low in height to maximize the use of space; in the heat exchange area 12, the expanding channel of the trapezoidal space can smooth the air flow, reduce the generation of turbulence, thereby reducing noise and improving the heat dissipation efficiency.
[0035] It should be noted that the preferred inclination angle of the heat conduction plate 5 is 7 degrees. Compared with the traditional rectangular space, setting the heat exchange area 12 and / or the component area 13 as a trapezoidal space has the following advantages:
[0036] It allows higher components to be arranged on the higher side of the trapezoidal space and shorter components to be arranged on the lower side of the trapezoidal space, reducing the barrel effect caused by the different heights of the components, optimizing the internal layout, and achieving higher space utilization; the expanding air flow channel helps to smooth the high-speed air flow generated by the cooling fan 6, reduce the generation of turbulence and noise, and improve the fan efficiency.
[0037] As Figure 2 and Figure 4 shown, in some embodiments, the cooling fan 6 is close to the corner of the cavity 2, and a wind guide cover 15 is arranged between the cooling fan 6 and the corner of the cavity 2. The heat dissipation air duct 11 is a U-shaped air duct. Specifically, through the mutual spatial position relationship of the heat conduction plate 5, the cooling fan 6, the wind guide cover 15, the heat exchange area 12 and the component area 13, the air flow is redirected inside the cavity 2 to form a U-shaped air duct, which can cool multiple heat sources 7 inside the device, thereby achieving comprehensive device cooling.
[0038] In some embodiments, the cooling fan 6 is a cross-flow fan. Specifically, the cooling fan 6 is a cross-flow fan, and the broad airflow generated by the cross-flow fan can evenly cover the entire heat sink group 8 to improve the heat dissipation efficiency.
[0039] As Figure 3 shown, in some embodiments, the heat sink group 8 includes a plurality of heat sinks. The plurality of heat sinks are spaced apart from each other, and their lower ends are all disposed on the heat conducting plate 5. Specifically, the plurality of heat sinks are welded to the heat conducting plate 5.
[0040] As Figure 2 shown, in some embodiments, a boss 16 is provided at the bottom of the heat conducting plate 5, and the heat conducting plate 5 is attached to the heat source 7 through the boss 16. Specifically, through the provision of the boss 16, the bottom of the heat conducting plate 5 can be closely attached to the heat source 7 to achieve uniform heat conduction.
[0041] In some embodiments, the heat conducting plate 5 is a plurality of heat pipes or a VC heat spreader. Specifically, the heat conducting plate 5 can be a plurality of heat pipes; or, the heat conducting plate 5 can be a VC heat spreader (Vapor Chamber). This technology transfers heat through the phase change of the working liquid in a closed cavity to achieve efficient heat conduction and temperature uniformity performance. Of course, the heat conducting plate 5 can also be other heat conducting structures, which can also be within the scope of implementation of the present utility model.
[0042] As Figure 2 shown, in some embodiments, the housing 1 includes an upper housing 17 and a lower housing 18. The upper housing 17 is disposed at the upper end of the lower housing 18. The air inlet holes 9 are located on both sides of the lower housing 18, and the air outlet holes 10 are located on one side of the upper housing 17.
[0043] During cooling, heat is quickly conducted to the heat conducting plate 5 attached to the heat source 7, and is absorbed by the heat sink group 8 on the heat conducting plate 5 and dissipated into the heat exchange area 12. The airflow generated by the rotation of the cooling fan 6 located on one side of the heat sink group 8 conducts the heat out of the housing 1 to complete the cooling of the main heat source.
[0044] The working process of the U-shaped air duct: Cold air enters the cavity 2 through the air inlet holes 9 located in the lower housing 18, and first provides comprehensive cooling for numerous components in the component area 13. Then, under the action of the cooling fan 6 and the air guide cover 15, it is accelerated and turned, and blows towards the heat sink group 8, taking away a large amount of heat generated by the heat source 7 in the heat exchange area 12, and finally discharging the hot air out through the air outlet holes 10 located in the upper housing 17.
[0045] In addition, the present utility model further provides a computer, which includes the compact computer cooling system described above. Specifically, for the specific structure of the compact computer cooling system, reference may be made to the above embodiments. Since the compact computer cooling system adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated herein one by one.
[0046] The above are only the preferred embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent structural transformation made by using the content of the specification and drawings of the present utility model under the inventive concept of the present utility model, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present utility model.
Claims
1. A compact computer cooling system, characterized in that: It includes a housing (1), a cavity (2) is arranged in the housing (1), a main board (3), a heat conducting plate (5) and a cooling fan (6) are arranged in the cavity (2), the main board (3) has a heat source (7), the heat conducting plate (5) is attached to the heat source (7), a heat sink group (8) is arranged on the heat conducting plate (5), the cooling fan (6) is located at the side end of the heat sink group (8), air inlet holes (9) and air outlet holes (10) are formed in the housing (1), and the air inlet holes (9) and the air outlet holes (10) are both communicated with the cooling fan (6) to form a heat dissipation air duct (11), and the heat sink group (8) is located in the heat dissipation air duct (11).
2. The compact computer cooling system according to claim 1, characterized in that: The cavity (2) is separated into a heat exchange area (12) and a component area (13) by the heat conducting plate (5), the heat exchange area (12) and the component area (13) are respectively located at the upper end and the lower end of the heat conducting plate (5), and the cooling fan (6) is located between the side end of the heat conducting plate (5) and the inner wall of the cavity (2).
3. The compact computer cooling system according to claim 2, characterized in that: The heat conducting plate (5) is inclined, and the heat exchange area (12) and / or the component area (13) is / are trapezoidal spaces.
4. A compact computer cooling system according to claim 3, characterized in that: The cooling fan (6) is close to the corner of the cavity (2), a wind guide cover (15) is arranged between the cooling fan (6) and the corner of the cavity (2), and the heat dissipation air duct (11) is a U-shaped air duct.
5. The compact computer cooling system according to claim 4, wherein: The cooling fan (6) is a cross-flow fan.
6. The compact computer cooling system according to claim 1, characterized in that: The heat sink group (8) includes a plurality of heat sinks, the plurality of heat sinks are arranged at intervals, and the lower ends of all of them are arranged on the heat conducting plate (5).
7. A compact computer cooling system according to claim 1, characterized in that: A boss (16) is arranged at the bottom of the heat conducting plate (5), and the heat conducting plate (5) is attached to the heat source (7) through the boss (16).
8. A compact computer cooling system according to claim 7, wherein: The heat conducting plate (5) is a plurality of heat pipes or a VC heat spreader.
9. A compact computer cooling system according to any one of claims 1 - 8, characterized in that: The housing (1) includes an upper shell (17) and a lower shell (18), the upper shell (17) is arranged at the upper end of the lower shell (18), the air inlet holes (9) are located on both sides of the lower shell (18), and the air outlet holes (10) are located on one side of the upper shell (17).
10. A computer, characterized in that: It includes a compact computer heat dissipation system according to any one of claims 1-9.