Wafer jig

Abstract

The utility model relates to a wafer jig which comprises a bearing part and a frame part, the bearing part is provided with a first surface and a groove structure formed by recessing the first surface in a first direction, the projection of the groove structure in the first direction is of an annular structure, and the groove structure divides the first surface into a plurality of bearing surfaces which are spaced from one another. The projection of the frame piece in the first direction is of an annular structure, and a containing space is defined by the frame piece. The frame part is detachably fixed to the peripheral side of the groove structure or the bearing part so that the projection of at least one bearing face in the first direction can be located in the containing space. In the embodiment of the invention, the wafer jig can bear wafers of different specifications and sizes, and meanwhile, the position stability of the wafers in related process steps can be enhanced by arranging the frame piece.

Description

Technical Field

[0001] The present application relates to the technical field of wafer production equipment, and in particular to a wafer fixture. Background Art

[0002] During the production and manufacturing process of wafers, certain process steps need to ensure the position stability of the wafer. For example, when a wafer needs to be cut into multiple chips, it is also necessary to ensure the position stability of the wafer during the cutting process. At the same time, since wafers of different specifications have different sizes, correspondingly, different sizes of carriers need to be used. In the actual operation process, when carrying and positioning wafers of different specifications, it is necessary to frequently change the carrier, which adds a certain burden to the technicians. Utility Model Content

[0003] The wafer fixture provided in the embodiment of the present application can carry wafers of different specifications and sizes, and can also enhance the position stability of the wafer in related process steps by setting a frame member.

[0004] The embodiment of the present application provides a wafer fixture, including:

[0005] A bearing member, having a first surface in a first direction and a groove structure formed by the depression of the first surface, wherein the projection of the groove structure in the first direction is an annular structure, and the groove structure divides the first surface into a plurality of bearing surfaces spaced apart from each other;

[0006] A frame member, wherein the projection of the frame member in the first direction is an annular structure and encloses a receiving space;

[0007] The frame member is detachably fixed to the groove structure or the outer peripheral side of the bearing member, so that a projection of at least one of the bearing surfaces in the first direction is located within the accommodating space.

[0008] In some embodiments, it further comprises a positioning member, wherein a plurality of positioning members are provided and are spaced apart inside the groove structure, the positioning member contacts the frame member, each positioning member is provided with a first positioning hole, and the first positioning hole is connected to the negative pressure structure;

[0009] The hardness of the positioning member is smaller than the hardness of the bearing member.

[0010] In some embodiments, the frame member includes a main body and an extension portion, the main body is fixed inside the groove structure, the extension portion is connected to a side of the main body away from the groove bottom surface of the groove structure, and the main body and the extension portion together enclose the accommodation space;

[0011] In a direction parallel to the first direction and away from the body portion, the orthographic projection of the outer contour of the extension portion on the first surface gradually increases.

[0012] In some embodiments, in a direction parallel to the first direction and away from the body portion, the orthographic projection of the inner contour of the extension portion on the first surface gradually increases.

[0013] In some embodiments, the side surface of the body portion facing away from the groove bottom surface of the groove structure includes a first sub-surface and a second sub-surface connected to each other. The orthographic projections of the first sub-surface and the second sub-surface on the first surface are both annular structures, and the second sub-surface is disposed on a side of the first sub-surface away from the accommodation space;

[0014] The extension portion is connected to the second sub-surface.

[0015] In some embodiments, the side wall of the groove structure on a side facing the first sub-surface includes a first inclined portion. In a direction parallel to the first direction and away from the body portion, the distance between the first inclined portion and the body portion gradually increases.

[0016] In some embodiments, the side wall of the groove structure on a side facing the second sub-surface includes a second inclined portion. In a direction parallel to the first direction and away from the body portion, the distance between the second inclined portion and the body portion gradually increases.

[0017] In some embodiments, it further includes positioning members. A plurality of the positioning members are provided and are spaced apart inside the groove structure, and the positioning members are in contact with the body portion;

[0018] The sum of the distance dimension by which the positioning member protrudes from the groove bottom surface of the groove structure in the first direction and the dimension of the body portion in the first direction is greater than the depth dimension of the groove structure in the first direction.

[0019] In some embodiments, the body portion is in contact with the groove bottom surface of the groove structure, and the dimension of the body portion in the first direction is greater than the depth dimension of the groove structure in the first direction.

[0020] In some embodiments, the groove structure at least divides the first surface into a first bearing surface and a second bearing surface. The orthographic projection of the first bearing surface in the first direction is inside the orthographic projection of the groove structure in the first direction, and the orthographic projection of the groove structure in the first direction is inside the orthographic projection of the outer contour of the second bearing surface in the first direction;

[0021] The first bearing surface and the second bearing surface are symmetrically distributed about the same point.

[0022] According to the wafer fixture provided by the present application, the carrier bears the wafer and the frame member. The wafer can be located inside the accommodation space formed by the frame member, so as to facilitate connecting the wafer and the frame member, and then using the frame member to ensure the position stability of the wafer in subsequent processes. At the same time, a groove structure is provided on the carrier. On the one hand, the frame member can be positioned to a certain extent in the form of a recess, so as to determine the initial position of the frame member on the carrier; on the other hand, the first surface on the carrier is separated by the groove structure to form a plurality of bearing surfaces. By using the relationship between the groove structure and the bearing surfaces, the bearing and positioning between the frame member and the wafer are realized. At the same time, the frame member can also be connected to the outer peripheral side of the carrier, so that the carrier can correspond to at least two different sizes of frame members, and the bearing surfaces can also correspond to at least two different sizes of wafers, so as to improve the applicability of the wafer fixture and facilitate technicians to bear wafers of different sizes. Description of the Drawings

[0023] The features, advantages and technical effects of the exemplary embodiments of the present application will be described below with reference to the drawings.

[0024] Figure 1 An isometric structural view of a carrier and a positioning member in a wafer fixture provided in some embodiments of the present application;

[0025] Figure 2 A top view structural view of a carrier and a positioning member in a wafer fixture provided in some embodiments of the present application;

[0026] Figure 3 A structural view of the relative positions of a frame member and a wafer in a wafer fixture provided in some embodiments of the present application;

[0027] Figure 4 A structural view of a wafer on a wafer fixture provided in some embodiments of the present application;

[0028] Figure 5 A cross-sectional structural view of a wafer on a wafer fixture provided in some embodiments of the present application;

[0029] Figure 6 For Figure 5 A partial enlarged view of part A in

[0030] Figure 7 A cross-sectional structural view of a wafer on a wafer fixture provided in some other embodiments of the present application;

[0031] Figure 8 For Figure 7 A partial enlarged view of part B in

[0032] Marking Description:

[0033] 100, Wafer;

[0034] 10, Carrier; 11, Groove structure; 111, First inclined portion; 112, Second inclined portion; 12, Second positioning hole; 13, Third positioning hole;

[0035] 20, Frame member; 21, Accommodating space; 22, Body portion; 221, First sub - surface; 222, Second sub - surface; 23, Extension portion;

[0036] 30, Positioning member; 31, First positioning hole;

[0037] M1, First surface; M11, First bearing surface; M12, Second bearing surface; M13, Third bearing surface;

[0038] X, First direction.

[0039] In the drawings, like parts are designated by like reference numerals. The drawings are not drawn to scale. Detailed implementation manners

[0040] The features and exemplary embodiments of each aspect of the present application will be described in detail below. For the purpose of making the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0041] It should be noted that, in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non - exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, elements defined by the statement "comprising..." do not exclude the presence of additional identical elements in the process, method, article or device comprising the said elements.

[0042] In the process of wafer production and manufacturing, certain process steps require ensuring the position stability of the wafer. Exemplarily, when the wafer needs to be cut into multiple chips, it is also necessary to ensure the position stability of the wafer during the cutting process. At the same time, since wafers of different specifications have different sizes, correspondingly different-sized carrier tools need to be used. In the actual operation process, when carrying and positioning wafers of different specifications, it is necessary to frequently replace the carrier tools, which causes certain trouble to the technicians.

[0043] In view of this, please refer to Figures 1 to 4 , an embodiment of the present application provides a wafer jig, including a carrier 10 and a frame 20. The carrier 10 has a first surface M1 in the first direction X and a groove structure 11 formed by recessing from the first surface M1. The projection of the groove structure 11 in the first direction X is in a ring structure, and the groove structure 11 divides the first surface M1 into a plurality of spaced-apart carrier surfaces. The projection of the frame 20 in the first direction X is in a ring structure, and the frame 20 encloses to form an accommodation space 21. The frame 20 is detachably fixed to the groove structure 11 or the outer peripheral side of the carrier 10, so that the projection of at least one carrier surface in the first direction X is located inside the accommodation space 21.

[0044] In some process steps where the wafer 100 needs to ensure position stability, the wafer 100 can be connected to the frame 20 with a specific shape, and the frame 20 is used to assist in positioning the wafer 100 to complete the corresponding process steps. The frame 20 can enhance the positioning effect of the wafer 100 while not affecting the normal process operation of the wafer 100.

[0045] Further, the way to connect the wafer 100 to the frame 20 can be to use an adhesive film to paste. First, the wafer 100 is adhered through the adhesive film, and then the adhesive film is bonded to the frame 20 to realize the connection between the wafer 100 and the frame 20. Or, after the wafer 100 and the frame 20 are preliminarily positioned, a specific mechanical structure can also be used to connect the wafer 100 and the frame 20.

[0046] In the wafer jig provided by the embodiment of the present application, by connecting the wafer 100 to the frame 20, the position stability of the wafer 100 in the subsequent process is improved. At the same time, on the one hand, the carrier 10 can ensure the initial relative position relationship between the wafer 100 and the frame 20, and on the other hand, it can also adapt to wafers 100 and frames 20 of different sizes, so as to facilitate the technicians to connect the wafer 100 to the frame 20. In the present application, for the convenience of description, the connection method of bonding the wafer 100 and the frame 20 with an adhesive film is taken as an example to describe the relevant structures in the wafer jig.

[0047] The wafer fixture provided by the embodiment of the present application includes a carrier 10 and a frame member 20. The projection of the frame member 20 in the first direction X is in a ring structure and encloses an accommodation space 21. The wafer 100 can be located inside the accommodation space 21, and the carrier 10 carries the wafer 100 and the frame member 20. Subsequently, a paste film is covered on the wafer 100 and a part of the frame member 20 to bond the wafer 100 and the frame member 20, completing the connection between the wafer 100 and the frame member 20. Based on the actual operation process, wafers 100 have different sizes, and the sizes of different frame members 20 can be set according to the size of the wafer 100.

[0048] Further, the carrier 10 has a first surface M1 in the first direction X and a groove structure 11 formed by inward depression from the first surface M1. The projection of the groove structure 11 in the first direction X is in a ring structure, and the frame member 20 is detachably fixed inside the groove structure 11. The groove structure 11 is formed by inward depression from the first surface M1, and the frame member 20 is positioned to a certain extent in the form of depression to determine the preliminary position of the frame member 20 on the carrier 10.

[0049] The groove structure 11 divides the first surface M1 into a plurality of spaced-apart bearing surfaces. When the frame member 20 is fixed to the groove structure 11, the projection of at least one bearing surface in the first direction X is inside the accommodation space 21. That is to say, the wafer 100 is in the area of the bearing surface on the carrier 10, and the frame member 20 is in the area of the groove structure 11 on the carrier 10. The relative position relationship between the wafer 100 and the frame member 20 is determined by the arrangement of the groove structure 11 on the first surface M1, facilitating the subsequent connection.

[0050] At the same time, the frame member 20 can also be connected to the outer peripheral side of the carrier 10 so that the entire first surface M1 is inside the accommodation space 21, which is applicable to wafers 100 with larger sizes. It can be understood that the wafer 100 has a first size and a second size, and the first size is smaller than the second size. Correspondingly, the frame member 20 also has a first size and a second size. The groove structure 11 divides the first surface M1 into at least a first bearing surface M11 and a second bearing surface M12. The positive projection of the first bearing surface M11 in the first direction X is inside the positive projection of the groove structure 11 in the first direction X, and the positive projection of the groove structure 11 in the first direction X is inside the positive projection of the outer contour of the second bearing surface M12 in the first direction X.

[0051] The first bearing surface M11 correspondingly bears the wafer 100 of the first size. The frame member 20 of the first size can be located inside the groove structure 11, so as to realize the bearing and positioning between the wafer 100 of the first size and the frame member 20. When bearing the wafer 100 of the second size, the wafer 100 of the second size can cover the groove structure 11 and contact the second bearing surface M12. The first bearing surface M11 and the second bearing surface M12 jointly bear the wafer 100 of the second size. The frame member 20 can be connected to the outer peripheral side of the bearing member 10, so as to realize the bearing and positioning between the wafer 100 of the second size and the frame member 20.

[0052] Alternatively, in some embodiments, the bearing member 10 may be provided with a plurality of groove structures 11. The plurality of groove structures 11 at least divide the first surface M1 into a first bearing surface M11, a second bearing surface M12 and a third bearing surface M13, so as to be applicable to wafers 100 of more different sizes.

[0053] In summary, in the embodiments of the present application, the bearing member 10 bears the wafer 100 and the frame member 20. The wafer 100 can be located inside the accommodation space 21 formed by the frame member 20, so as to facilitate the connection between the wafer 100 and the frame member 20, and thus use the frame member 20 to ensure the position stability of the wafer 100 in subsequent processes. At the same time, the groove structure 11 is provided on the bearing member 10. On the one hand, the frame member 20 can be positioned to a certain extent in a recessed form to determine the initial position of the frame member 20 on the bearing member 10. On the other hand, the first surface M1 on the bearing member 10 is divided into a plurality of bearing surfaces by the groove structure 11, and the relationship between the groove structure 11 and the bearing surfaces is used to realize the bearing and positioning between the frame member 20 and the wafer 100. At the same time, the frame member 20 can also be connected to the outer peripheral side of the bearing member 10, so that the bearing member 10 can correspond to at least two different sizes of frame members 20, and the bearing surfaces can also correspond to at least two different sizes of wafers 100, so as to improve the applicability of the wafer fixture and facilitate technicians to bear wafers 100 of different sizes.

[0054] In some embodiments, the wafer fixture further includes positioning members 30. A plurality of positioning members 30 are provided. The plurality of positioning members 30 are spaced apart and arranged inside the groove structure 11. The positioning members 30 are in contact with the frame member 20. Each positioning member 30 is provided with a first positioning hole 31, and the first positioning hole 31 communicates with a negative pressure structure. The hardness of the positioning member 30 is less than the hardness of the bearing member 10.

[0055] The positioning member 30 is used to fix the position of the frame member 20 inside the groove structure 11. A plurality of positioning members 30 are provided, and the plurality of positioning members 30 are arranged at intervals inside the groove structure 11. The side of the positioning member 30 facing away from the bottom surface of the groove structure 11 contacts the frame member 20. The plurality of positioning members 30 form multi-point support positioning for the frame member 20 to achieve stable support for the frame member 20.

[0056] Further, each positioning member 30 is provided with a first positioning hole 31 communicating with the negative pressure structure. When the frame member 20 is supported by the positioning member 30, the frame member 20 can be adsorbed through the first positioning hole 31 and the negative pressure structure to fix the position of the frame member 20 inside the groove structure 11.

[0057] In the embodiment of the present application, in order to further improve the positioning effect of the positioning member 30 on the frame member 20, the hardness of the positioning member 30 is less than the hardness of the bearing member 10. During the positioning contact process with the frame member 20, the positioning member 30 can reduce the degree of rigid contact with the frame member 20 compared with the bearing member 10, which is convenient for positioning the frame member 20. Exemplarily, the bearing member 10 is made of metal material, and the positioning member 30 is made of plastic material.

[0058] In other embodiments, the positioning member 30 and the frame member 20 can be fixed by snap connection or by plug connection.

[0059] In some embodiments, the frame member 20 includes a body portion 22 and an extension portion 23. The body portion 22 is fixed inside the groove structure 11, and the extension portion 23 is connected to the side of the body portion 22 facing away from the bottom surface of the groove structure 11. The body portion 22 and the extension portion 23 jointly enclose an accommodation space 21. In the direction parallel to the first direction X and away from the body portion 22, the outer contour of the extension portion 23 gradually increases in the positive projection on the first surface M1.

[0060] After bonding the wafer 100 on the bearing member 10 and the frame member 20, considering the problem of removing the bonded frame member 20 and the wafer 100 later, the structure of the frame member 20 is correspondingly set. The frame member 20 includes a body portion 22 and an extension portion 23. The plane formed by the body portion 22 is parallel to the plane formed by the wafer 100 and the bearing surface. The extension portion 23 and the body portion 22 jointly enclose an accommodation space 21. The extension portion 23 is connected to the side of the body portion 22 facing away from the bottom surface of the groove structure 11, so as to facilitate the operation of the technical personnel on the extension portion 23, thereby removing the frame member 20.

[0061] Further, in a direction parallel to the first direction X and away from the body portion 22, the orthographic projection of the outer contour of the extension portion 23 on the first surface M1 gradually increases. That is to say, the extending direction of the extension portion 23 intersects with the first direction X, forming a space with a certain inclination degree between the extension portion 23 and the carrier 10. Technicians can use this space to pick up the extension portion 23. The technicians only need to insert the picking tool into this control space. There is an overlap between the picking tool and the extension portion 23 in the first direction X. The technicians only need to move the picking tool along the first direction X to complete the picking of the frame member 20, which is more convenient for the technicians to pick up the frame member 20 compared to the extension portion 23 being arranged parallel to the first direction X.

[0062] Considering that the adhesive film needs to paste the wafer 100 and the frame member 20 from the side of the accommodation space 21 away from the carrier 10, in some embodiments, in a direction parallel to the first direction X and away from the body portion 22, the orthographic projection of the inner contour of the extension portion 23 on the first surface M1 gradually increases. It is equivalent to that in a direction parallel to the first direction X and away from the body portion 22, the opening of the accommodation space 21 gradually increases, which can facilitate the adhesive film to enter the accommodation space 21, thereby facilitating the adhesion of the adhesive film to the wafer 100 inside the accommodation space 21.

[0063] In some embodiments, please refer to Figures 5 to 6 , the side surface of the body portion 22 facing away from the bottom surface of the groove structure 11 includes a first sub-surface 221 and a second sub-surface 222 that are connected to each other. The orthographic projections of the first sub-surface 221 and the second sub-surface 222 on the first surface M1 are both annular structures. The second sub-surface 222 is disposed around the side of the first sub-surface 221 away from the accommodation space 21, and the extension portion 23 is connected to the second sub-surface 222.

[0064] In order to improve the pasting effect of the adhesive film on the frame member 20, the adhesive film can be pasted on a part of the body portion 22. Specifically, the side surface of the body portion 22 facing away from the bottom surface of the groove structure 11 includes a first sub-surface 221 and a second sub-surface 222 that are connected to each other. The first sub-surface 221 is close to the accommodation space 21, and the second sub-surface 222 is far away from the accommodation space 21. The extension portion 23 is connected to the second sub-surface 222. While setting the extension portion 23, the first sub-surface 221 is exposed. At the same time, the first sub-surface 221 is also close to the accommodation space 21, so that the adhesive film can directly cover and paste the first sub-surface 221 while pasting the wafer 100, thereby improving the pasting effect of the adhesive film on the frame member 20.

[0065] In some embodiments, please refer to Figures 5 to 6The side wall of the groove structure 11 facing the first sub-surface 221 includes a first inclined portion 111, and the distance between the first inclined portion 111 and the main body 22 gradually increases in the direction parallel to the first direction X and away from the main body 22. Through the above arrangement, a certain degree of concave area is formed between the main body 22 and the bearing surface, and when the adhesive paper extends along the concave area, it extends toward the side away from the wafer 100 in the first direction X, which can increase the contact force between the adhesive paper and the wafer 100, thereby improving the adhesive effect of the adhesive paper on the wafer 100.

[0066] In some embodiments, the body 22 abuts against the positioning member 30. The sum of the distance dimension of the positioning member 30 protruding from the bottom surface of the groove of the groove structure 11 in the first direction X and the dimension of the body 22 in the first direction X is greater than the depth dimension of the groove structure 11 in the first direction X. It can be understood that when the frame member 20 is inside the groove structure 11, the body 22 contacts the positioning member 30, and the side surface of the body 22 facing away from the positioning member 30 protrudes from the bearing surface in the first direction X, and a certain height difference is formed between the surface of the body 22 and the bearing surface. When the wafer 100 is placed on the bearing surface, the side of the wafer 100 facing away from the bearing surface is flush with the side of the body 22 protruding from the bearing surface, thereby ensuring the bonding effect of the adhesive film on the wafer 100 and the frame member 20.

[0067] In some embodiments, see Figures 7 to 8 The main body 22 is partially located inside the groove structure 11, the side walls of the main body 22 are in contact with the side walls of the groove structure 11, and the extension 23 is entirely outside the groove structure 11. The contact between the main body 22 and the groove structure 11 is used to preliminarily limit the position of the frame member 20 on the carrier 10.

[0068] In some embodiments, the body part 22 abuts against the bottom surface of the groove of the groove structure 11, and the dimension of the body part 22 in the first direction X is greater than the depth dimension of the groove structure 11 in the first direction X. It can be understood that when the frame member 20 is inside the groove structure 11, the body part 22 contacts the bottom surface of the groove of the groove structure 11, and the side surface of the body part 22 facing away from the positioning member 30 protrudes from the bearing surface in the first direction X, and a certain height difference is formed between the surface of the body part 22 and the bearing surface. When the wafer 100 is placed on the bearing surface, the side of the wafer 100 facing away from the bearing surface is flush with the side of the body part 22 protruding from the bearing surface, thereby ensuring the bonding effect of the adhesive film on the wafer 100 and the frame member 20.

[0069] Furthermore, a first positioning hole 31 is provided inside the groove structure 11, the first positioning hole 31 penetrates the carrier 10, and the first positioning hole 31 communicates with the negative pressure structure. The first positioning hole 31 and the negative pressure structure are used to adsorb the body 22 to fix the frame 20 inside the groove structure 11.

[0070] In some embodiments, the side wall of the groove structure 11 facing the second sub-surface 222 includes a second inclined portion 112. In a direction parallel to the first direction X and away from the body portion 22, the distance between the second inclined portion 112 and the body portion 22 gradually increases. The second inclined portion 112 contacts the epitaxial portion 23, and the inclination direction of the second inclined portion 112 is the same as the inclination direction of the epitaxial portion 23. By providing the second inclined portion 112, a guiding effect can be generated on the frame member 20 entering the groove structure 11, facilitating the positioning of the frame member 20 by the groove structure 11.

[0071] In some embodiments, referring to Figures 1 to 2 , a plurality of second positioning holes 12 penetrating the carrier member 10 are provided on the bearing surface. The plurality of second positioning holes 12 are spaced apart on the bearing surface, and the plurality of second positioning holes 12 are all communicated with the negative pressure structure. The second positioning holes 12 are used for adsorbing and positioning the wafer 100.

[0072] When the wafer 100 is inside the accommodation space 21 formed by the frame member 20, a gap is provided between the wafer 100 and the inner side wall of the frame member 20. During the process of pasting the wafer 100 with the paste film, part of the paste film can contact the bearing surface, which is equivalent to part of the paste film extending to the periphery of the wafer 100, and the contact force between the paste film above the wafer 100 and the wafer 100 can be increased, thereby improving the pasting effect on the wafer 100.

[0073] Furthermore, a plurality of third positioning holes 13 penetrating the carrier member 10 are further provided on the bearing surface. The plurality of third positioning holes 13 are spaced apart on the bearing surface, and the plurality of third positioning holes 13 are all communicated with the negative pressure structure. The third positioning holes 13 are used for adsorbing the paste film. At the same time, the third positioning holes 13 are arranged in a ring around the periphery of the second positioning holes 12, and the distribution density of the third positioning holes 13 is greater than the distribution density of the second positioning holes 12, so as to increase the adsorption force on the paste film, strengthen the acting force between the paste film, the wafer 100 and the frame member 20, and improve the bonding effect.

[0074] In some embodiments, considering the accurate adsorption of wafers 100 of different sizes, the first bearing surface M11 and the second bearing surface M12 are symmetrically distributed about the same point. When the second positioning holes 12 adsorb the middle region of the first-size wafer 100 in a partial area on the first bearing surface M11, due to the above arrangement, when adsorbing the second-size wafer 100, the second positioning holes 12 are still in the middle region of the second-size wafer 100. By using the coincidence of the center of the first bearing surface M11 and the center of the second bearing surface M12, the bearing centers of the first-size wafer 100 and the second-size wafer 100 are also made to coincide, facilitating the stable adsorption of wafers 100 of different sizes by the second positioning holes 12.

[0075] Although the present utility model has been described with reference to the preferred embodiments, various modifications thereof can be made and components thereof can be replaced with equivalents without departing from the scope of the present utility model. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any manner. The present utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A wafer fixture, characterized in that, include: A bearing member, having a first surface in a first direction and a groove structure formed by the depression of the first surface, wherein the projection of the groove structure in the first direction is an annular structure, and the groove structure divides the first surface into a plurality of bearing surfaces spaced apart from each other; A frame member, wherein the projection of the frame member in the first direction is an annular structure and encloses a receiving space; The frame member is detachably fixed to the groove structure or the outer peripheral side of the bearing member, so that a projection of at least one of the bearing surfaces in the first direction is located within the accommodating space.

2. The wafer fixture according to claim 1, wherein It also includes a positioning member, wherein a plurality of positioning members are provided and are spaced apart inside the groove structure, the positioning member contacts the frame member, each positioning member is provided with a first positioning hole, and the first positioning hole is connected to the negative pressure structure; The hardness of the positioning member is smaller than the hardness of the bearing member.

3. The wafer fixture according to claim 1, wherein, The frame member includes a main body and an extension part, wherein the main body is fixed inside the groove structure, and the extension part is connected to a side of the main body away from the groove bottom surface of the groove structure, and the main body and the extension part together enclose the accommodation space; In a direction parallel to the first direction and away from the main body, an orthographic projection of an outer contour of the extension portion on the first surface gradually increases.

4. The wafer fixture according to claim 3, wherein, In a direction parallel to the first direction and away from the main body, an orthographic projection of an inner contour of the extension portion on the first surface gradually increases.

5. The wafer fixture according to claim 3, wherein, The side surface of the main body facing away from the groove bottom surface of the groove structure includes a first sub-surface and a second sub-surface connected to each other, the orthographic projections of the first sub-surface and the second sub-surface on the first surface are both annular structures, and the second sub-surface is arranged on the side of the first sub-surface facing away from the accommodation space; The extension portion is connected to the second sub-surface.

6. The wafer fixture according to claim 5, wherein The side wall of the groove structure facing the first sub-surface includes a first inclined portion, and the distance between the first inclined portion and the main body portion gradually increases in a direction parallel to the first direction and away from the main body portion.

7. The wafer fixture according to claim 5, characterized in that, The side wall of the groove structure facing the second sub-surface includes a second inclined portion, and the distance between the second inclined portion and the main body portion gradually increases in a direction parallel to the first direction and away from the main body portion.

8. The wafer jig according to claim 3, wherein, It also includes a positioning member, wherein a plurality of positioning members are provided and are spaced apart inside the groove structure, and the positioning member abuts against the main body; The sum of a distance dimension of the positioning member protruding from the groove bottom surface of the groove structure in the first direction and a dimension of the main body in the first direction is greater than a depth dimension of the groove structure in the first direction.

9. The wafer jig according to claim 3, wherein, The main body portion abuts against the bottom surface of the groove structure, and a dimension of the main body portion in the first direction is greater than a depth dimension of the groove structure in the first direction.

10. The wafer jig according to claim 1, wherein The groove structure divides the first surface into at least a first bearing surface and a second bearing surface. The positive projection of the first bearing surface in the first direction is inside the positive projection of the groove structure in the first direction, and the positive projection of the groove structure in the first direction is inside the positive projection of the outer contour of the second bearing surface in the first direction; The first bearing surface and the second bearing surface are symmetrically distributed about the same point.

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