Wafer carrier

Abstract

The utility model relates to the field of semiconductors, and discloses a wafer carrier, which comprises a first mounting plate and a second mounting plate, and is characterized in that a plurality of mounting grooves are correspondingly formed in opposite sides of the first mounting plate and the second mounting plate and are used for bearing wafers; the first adjusting mechanism and the second adjusting mechanism are oppositely arranged in the height direction of the bearing assembly and used for adjusting the distance between the first mounting plate and the second mounting plate and locking the relative position of the first mounting plate and the second mounting plate. The wafer carrier is used for solving the problem that an existing wafer carrier can only adapt to wafers of one size, the distance between a first mounting plate and a second mounting plate in the width direction of a bearing assembly is controlled through a first adjusting mechanism and a second adjusting mechanism, and it is guaranteed that the distance between the first mounting plate and the second mounting plate in the height direction of the bearing assembly is equal everywhere; and the wafer carrier is locked at a specified position, so that the wafer carrier is adaptive to wafers of different sizes, and the adaptability of the wafer carrier is improved.

Description

Technical Field

[0001] This application belongs to the field of semiconductors, and particularly relates to a wafer carrier. Background Art

[0002] A wafer carrier, also known as a wafer transport box, is a professional packaging device used in the semiconductor industry to transport wafers safely and stably. As the core material for semiconductor chip manufacturing, wafers need to be frequently transported between different process steps, production lines, and from the wafer fab to the packaging and testing factory. In this process, the wafer transport box plays a crucial role.

[0003] The adaptability of existing wafer carriers is relatively low, and a single wafer carrier can only be adapted to accommodate wafers of one size. Summary of the Utility Model

[0004] An embodiment of this application provides a wafer carrier that can adapt the wafer carrier to wafers of multiple sizes and improve the adaptability.

[0005] An embodiment of this application provides a wafer carrier, including: a bearing assembly, including a first mounting plate and a second mounting plate arranged oppositely, a plurality of mounting grooves are correspondingly formed on the opposite sides of the first mounting plate and the second mounting plate, the plurality of mounting grooves are arranged side by side along the height direction of the bearing assembly, and the mounting grooves are used for bearing wafers; an adjusting assembly, including a first adjusting mechanism and a second adjusting mechanism arranged oppositely along the height direction of the bearing assembly, for adjusting the distance between the first mounting plate and the second mounting plate and locking the relative positions of the first mounting plate and the second mounting plate.

[0006] According to the wafer carrier provided by this application, the first adjusting mechanism includes a guiding structure, a sliding structure, and a locking structure, the guiding structure and the sliding structure are slidably matched along the width direction of the bearing assembly, and the locking structure is used for locking the guiding structure and the sliding structure;

[0007] The guiding structure and the sliding structure are respectively connected to the first mounting plate and the second mounting plate and are disposed between the first mounting plate and the second mounting plate.

[0008] According to the wafer carrier provided by this application, the sliding structure includes a first sliding plate and a second sliding plate arranged oppositely, the first sliding plate is connected to the first mounting plate, and the second sliding plate is connected to the second mounting plate;

[0009] The guiding structure includes a first guide rail, a part of the first guide rail is connected to the first sliding plate, and the other part is slidably matched with the second sliding plate;

[0010] Along the length direction of the first guide rail, the locking structure is in limit cooperation with the first sliding plate and the second sliding plate.

[0011] According to the wafer carrier provided by the present application, the locking structure includes a connecting plate and two groups of limiting columns, and the two groups of limiting columns are installed on one side of the connecting plate;

[0012] The first sliding plate is provided with a first limiting hole, and the second sliding plate is provided with a second limiting hole. One group of the limiting columns is in plug-in cooperation with the first limiting hole, and the other group of the limiting columns is in plug-in cooperation with the second limiting hole.

[0013] According to the wafer carrier provided by the present application, the guiding structure includes at least two of the first guide rails along the extending direction of the installation groove.

[0014] According to the wafer carrier provided by the present application, along the length direction of the first guide rail, the first sliding plate is provided with multiple groups of the first limiting holes at intervals, and / or the second sliding plate is provided with multiple groups of the second limiting holes at intervals. The two groups of limiting columns cooperate with the first limiting holes and the second limiting holes at different positions for locking the first mounting plate and the second mounting plate with different spacings.

[0015] According to the wafer carrier provided by the present application, on one side of the second sliding plate close to the installation groove, there is a first guiding pipe protruding from the surface of the second sliding plate, and the first guiding pipe is in plug-in cooperation with the first guide rail.

[0016] According to the wafer carrier provided by the present application, the second adjusting mechanism includes a second guiding pipe and a second guide rail. The second guiding pipe is in plug-in cooperation with the second guide rail. The second guiding pipe is connected to the second sliding plate, and the second guide rail is connected to the first sliding plate. The second guide rail is parallel to the first guide rail.

[0017] According to the wafer carrier provided by the present application, a first handle is rotatably connected to one side of the first sliding plate facing away from the installation groove, and a second handle is rotatably connected to one side of the second sliding plate facing away from the installation groove.

[0018] According to the wafer carrier provided by the present application, it further includes a blocking component, and the blocking component is angularly connected to one side of one of the first mounting plate and the second mounting plate for limiting the wafer in the installation groove along the extending direction of the installation groove.

[0019] The wafer carrier according to the embodiment of the present application controls the distance between the first mounting plate and the second mounting plate along the width direction of the carrying component through the first adjusting mechanism and the second adjusting mechanism, ensures that the distance between the first mounting plate and the second mounting plate is equal everywhere along the height direction of the carrying component, and locks it at a specified position, so that the wafer carrier can adapt to wafers of different sizes and improve the adaptability of the wafer carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0021] Figure 1 FIG. shows a schematic structural diagram of a wafer carrier provided by some embodiments of the present application;

[0022] Figure 2 FIG. shows a schematic structural diagram of a wafer carrier with a hidden locking structure;

[0023] Figure 3 is Figure 2 a bottom view of the wafer carrier shown;

[0024] Figure 4 FIG. shows an exploded schematic diagram of a sliding structure provided by some embodiments of the present application;

[0025] Figure 5 is Figure 4 a partial enlarged view at A in;

[0026] Figure 6 FIG. shows a schematic structural diagram of a locking structure provided by some embodiments of the present application;

[0027] Figure 7 is Figure 2 a top view of the wafer carrier shown in.

[0028] Reference numerals:

[0029] 100: Bearing component; 101: First mounting plate; 102: Second mounting plate; 103: Mounting groove; 200: Adjusting component; 201: First sliding plate; 202: Second sliding plate; 203: First guide rail; 204: Connecting plate; 205: Limit post; 206: Third handle; 207: First guiding pipe; 208: First guiding cavity; 210: First adjusting mechanism; 215: Guiding structure; 211: Sliding structure; 212: Locking structure; 213: First limiting hole; 214: Second limiting hole; 220: Second adjusting mechanism; 221: Second guiding pipe; 226: First handle; 222: Second guide rail; 223: Second handle; 224: First rib plate; 225: First notch; 227: Second rib plate; 228: Second notch; 300: Blocking component; 301: Blocking plate; 302: Blocking frame; 303: Concave area. Detailed implementation manners

[0030] The features and exemplary embodiments of various aspects of the present application will be described in detail below. To make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application.

[0031] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the said element.

[0032] A wafer carrier is used to carry multiple wafers. Throughout the entire production cycle of wafers, the wafer carrier is required to participate, such as for wafer transfer within a wafer manufacturing factory, which can ensure rapid and precise operations of wafers on a highly automated production line. It is used for transportation between different processes in wafer manufacturing, such as lithography, etching, deposition, cleaning, etc. The wafer carrier can effectively prevent physical damage and contamination of wafers during the process conversion. Through its robust and durable design and material selection, such as PFA, PP, PEEK, etc., the wafer carrier can effectively prevent physical damage such as scratches and fractures of wafers during handling, storage, and processing.

[0033] The conventional sizes of wafers are 6 inches, 8 inches, 12 inches, etc. Existing wafer carriers can only be used to carry wafers of one size, resulting in low utilization and adaptability.

[0034] To solve the problems of the existing technology, an embodiment of the present application provides a wafer carrier. First, the wafer carrier provided by the embodiment of the present application will be introduced below.

[0035] Figure 1 The structural schematic diagram of the wafer carrier provided by some embodiments of the present application is shown.

[0036] As Figure 1 shown, an embodiment of the present application provides a wafer carrier including: The bearing assembly 100 includes a first mounting plate 101 and a second mounting plate 102 which are oppositely arranged. A plurality of mounting grooves 103 are correspondingly formed on the opposite sides of the first mounting plate 101 and the second mounting plate 102. The plurality of mounting grooves 103 are arranged side by side along the height direction of the bearing assembly 100. The mounting grooves 103 are used to carry wafers; The adjusting assembly 200 includes a first adjusting mechanism 210 and a second adjusting mechanism 220 which are oppositely arranged along the height direction of the bearing assembly 100, and is used to adjust the distance between the first mounting plate 101 and the second mounting plate 102 and lock the relative positions of the first mounting plate 101 and the second mounting plate 102.

[0037] Specifically, the carrier assembly 100 includes a first mounting plate 101 and a second mounting plate 102 which are oppositely arranged. A plurality of mounting grooves 103 are correspondingly formed on the opposite sides of the first mounting plate 101 and the second mounting plate 102. The number of the mounting grooves 103 on the first mounting plate 101 and the second mounting plate 102 can be equal. Taking the first mounting plate 101 as an example, the mounting grooves 103 are etched and formed by extending in the depth direction of the first mounting plate 101 away from the second mounting plate 102 and along the length direction of the first mounting plate 101. One mounting groove 103 of the first mounting plate 101 and one mounting groove 103 of the second mounting plate 102 jointly accommodate a wafer, and the diameter of the wafer can be less than or equal to the length of the first mounting plate 101 and the second mounting plate 102. The plurality of mounting grooves 103 are arranged side by side in the height direction of the carrier assembly 100, so that when a plurality of wafers are placed in the mounting grooves 103, they are parallel to each other and spaced apart vertically.

[0038] The first adjusting mechanism 210 and the second adjusting mechanism 220 are arranged up and down in the height direction of the carrier assembly 100. That is to say, the first adjusting mechanism 210 and the second adjusting mechanism 220 are the upper and lower parts along the height direction of the first mounting plate 101. The two ends of the first adjusting mechanism 210 and the second adjusting mechanism 220 are respectively connected to the first mounting plate 101 and the second mounting plate 102, and the mounting grooves 103 are located between the first adjusting mechanism 210 and the second adjusting mechanism 220. Before the wafer is installed in the mounting groove 103, it is necessary to adjust the distance between the first mounting plate 101 and the second mounting plate 102 through the first adjusting mechanism 210 and the second adjusting mechanism 220, so that the distance between the first mounting plate 101 and the second mounting plate 102 is equal everywhere along the height direction, and the distance between the first mounting plate 101 and the second mounting plate 102 is convenient for accommodating wafers of a specified size. After the distance between the first mounting plate 101 and the second mounting plate 102 is adjusted, it is locked to keep the wafer carrier in a stable state, and then the wafer is installed in the mounting groove 103.

[0039] Among them, the adjusting assembly 200 can be adjusted steplessly or stepwise. For example, the first adjusting mechanism 210 and the second adjusting mechanism 220 can be locked at any distance between the first mounting plate 101 and the second mounting plate 102. Or, the first adjusting mechanism 210 and the second adjusting mechanism 220 can only be locked at a specified distance between the first mounting plate 101 and the second mounting plate 102.

[0040] Furthermore, as Figure 1As shown, in a specific embodiment of the present application, the first adjustment mechanism 210 includes a guiding structure 215, a sliding structure 211, and a locking structure 212. The guiding structure 215 and the sliding structure 211 are slidably engaged along the width direction of the carrier assembly 100, and the locking structure 212 is used to lock the guiding structure 215 and the sliding structure 211. The guiding structure 215 and the sliding structure 211 are respectively connected to the first mounting plate 101 and the second mounting plate 102, and are disposed between the first mounting plate 101 and the second mounting plate 102.

[0041] Among them, the guiding structure 215 and the sliding structure 211 are slidably engaged along the width direction of the carrier assembly 100, and the distance between the first mounting plate 101 and the second mounting plate 102 is adjusted by the expansion and contraction of the guiding structure 215 and the sliding structure 211. Among them, the guiding structure 215 and the sliding structure 211 can be a split structure or an integral structure. For example, they can be a telescopic cylinder or a guide rail slider. The guiding structure 215 and the sliding structure 211 are respectively connected to the first mounting plate 101 and the second mounting plate 102. For example, the guiding structure 215 is fixedly connected to the first mounting plate 101, and the sliding structure 211 is fixedly connected to the second mounting plate 102. When the sliding structure 211 slides along the guiding structure 215, the second mounting plate 102 approaches or moves away from the first mounting plate 101 in parallel. The guiding structure 215 and the sliding structure 211 are disposed between the first mounting plate 101 and the second mounting plate 102, effectively controlling the overall size of the wafer carrier and reducing the occupied space. And, the sizes of the guiding structure 215 and the sliding structure 211 are reduced as much as possible to simplify the structure.

[0042] Figure 2 The structural schematic diagram of a wafer carrier showing a hidden locking structure 212 is shown. Figure 3 is Figure 2 the bottom view of the wafer carrier shown.

[0043] As Figure 2 and Figure 3 shown, in a specific embodiment of the present application, the sliding structure 211 includes a first sliding plate 201 and a second sliding plate 202 which are oppositely arranged. The first sliding plate 201 is connected to the first mounting plate 101, and the second sliding plate 202 is connected to the second mounting plate 102. The guiding structure 215 includes a first guide rail 203. A part of the first guide rail 203 is connected to the first sliding plate 201, and the other part is slidably engaged with the second sliding plate 202. Along the length direction of the first guide rail 203, the locking structure 212 is in limit cooperation with the first sliding plate 201 and the second sliding plate 202.

[0044] The sliding structure 211 includes a first sliding plate 201 and a second sliding plate 202 which are oppositely arranged. The plate surfaces of the first sliding plate 201 and the second sliding plate 202 are parallel. The first sliding plate 201 includes two opposite ends in the width direction. One end is fixedly connected to the first mounting plate 101, and the other end extends towards the second sliding plate 202 in the width direction and is suspended. Similarly, the second sliding plate 202 includes two opposite ends in the width direction. One end is fixedly connected to the second mounting plate 102, and the other end extends towards the first sliding plate 201 in the width direction and is suspended.

[0045] A part of the first guide rail 203 is connected to the first sliding plate 201, and the other part is in sliding fit with the second sliding plate 202. Specifically, the first guide rail 203 is disposed on the side of the first sliding plate 201 close to the second adjusting mechanism 220. The upper surface of a part of the first guide rail 203 is fixedly connected to the first sliding plate 201. The end of the first guide rail 203 can also be fixedly connected to the first mounting plate 101. The first guide rail 203 extends towards the second sliding plate 202 and is in sliding fit with the second sliding plate 202. For example, the second sliding plate 202 can be etched with a sliding groove in the thickness and width directions to be in sliding fit with the first guide rail 203, or a sliding groove can be protruded on the upper surface of the second sliding plate 202 to be in sliding fit with the first guide rail 203.

[0046] In addition, in other embodiments of the present application, the guiding structure 215 includes at least two first guide rails 203 along the extending direction of the mounting groove 103. That is to say, in the length direction of the first sliding plate 201, namely the length direction of the first mounting plate 101, a plurality of parallel first guide rails 203 are arranged at intervals. For example, two first guide rails 203. A plurality of first guide rails 203 are all in sliding fit with the second sliding plate 202 to ensure that the distances between the first mounting plate 101 and the second mounting plate 102 in the length direction are equal everywhere.

[0047] The locking structure 212 and the limiting fit of the first sliding plate 201 and the second sliding plate 202 realize the locking of the relative positions of the first mounting plate 101 and the second mounting plate 102. Of course, in other embodiments of the present application, the locking structure 212 can also be in limiting fit with the first sliding plate 201 and the first guide rail 203 to realize the locking of the relative positions of the first mounting plate 101 and the second mounting plate 102.

[0048] Figure 4 The exploded view of the sliding structure 211 provided by some embodiments of the present application is shown; Figure 5 is Figure 4 the partial enlarged view at A in

[0049] Such as Figure 4 and Figure 5As shown, in an alternative embodiment of the present application, on one side of the second sliding plate 202 close to the installation groove 103, a first guiding pipe 207 protruding from the surface of the second sliding plate 202 is provided, and the first guiding pipe 207 is in plug-in fit with the first guiding rail 203.

[0050] To ensure that the first sliding plate 201 and the second sliding plate 202 are coplanar, the first guiding pipe 207 and the first guiding rail 203 are placed on the same side of the second sliding plate 202. To improve the stability and guiding accuracy of the sliding fit between the second sliding plate 202 and the first guiding rail 203, the first guiding pipe 207 is protrudingly provided on the surface of the first sliding plate 201. The four walls of the first guiding pipe 207 enclose to form a first guiding cavity 208, and the first guiding rail 203 is plugged into the first guiding cavity 208 to achieve the sliding fit between the second sliding plate 202 and the first guiding rail 203. A bottom wall is provided on the side of the first guiding pipe 207 facing away from the second sliding plate 202, which has a supporting effect on the first guiding rail 203.

[0051] In addition, in another alternative embodiment of the present application, as Figure 5 shown, the first guiding cavity 208 of the first guiding pipe 207 is a stepped cavity in the height direction, and the corresponding first guiding rail 203 is a stepped structure in the thickness direction to be plugged and matched with the stepped cavity of the first guiding pipe 207. The stepped structure of the first guiding rail 203 is beneficial to reducing the shaking between the first mounting plate 101 and the second mounting plate 102 and improving the stability.

[0052] Continuing to refer to Figure 1 and Figure 4 , in some embodiments of the present application, the second adjusting mechanism 220 includes a second guiding pipe 221 and a second guiding rail 222. The second guiding pipe 221 is in plug-in fit with the second guiding rail 222. The second guiding pipe 221 is connected to the second sliding plate 202, the second guiding rail 222 is connected to the first sliding plate 201, and the second guiding rail 222 is parallel to the first guiding rail 203.

[0053] The second guiding pipe 221 includes two opposite ends in the length direction. One end is fixedly connected to the second sliding plate 202, and the other end extends and is suspended towards the first sliding plate 201. The second guiding pipe 221 has a second guiding cavity in the length direction, and the opening of the second guiding cavity faces the second guiding rail 222. The second guiding rail 222 includes two opposite ends in the length direction. One end is fixedly connected to the first sliding plate 201, and the other end extends and is suspended towards the second guiding pipe 221. The second guiding rail 222 slides in the second guiding cavity. The guiding cooperation between the second guiding pipe 221 and the second guiding rail 222 can ensure the stable movement of the first mounting plate 101 and the second mounting plate 102 during the spacing adjustment. It can avoid the crosstalk in the length direction of the first mounting plate 101 and cause the distortion of the wafer.

[0054] Further, the second adjusting mechanism 220 includes at least two second guide rails 222 and two cooperating second guide pipes 221 along the extending direction of the installation groove 103.

[0055] Figure 6 FIG. shows a schematic structural diagram of the locking structure 212 provided in some embodiments of the present application.

[0056] As Figure 2 and Figure 6 shown, in other embodiments of the present application, the locking structure 212 includes a connecting plate 204 and two groups of limiting posts 205, and the two groups of limiting posts 205 are installed on one side of the connecting plate 204; the first sliding plate 201 is provided with a first limiting hole 213, and the second sliding plate 202 is provided with a second limiting hole 214. One group of limiting posts 205 is inserted and matched with the first limiting hole 213, and the other group of limiting posts 205 is inserted and matched with the second limiting hole 214.

[0057] In order to lock the first sliding plate 201 and the second sliding plate 202 through the cooperation of the limiting posts 205 and the limiting holes, the first sliding plate 201 and the second sliding plate 202 can be coplanar, the lengths of the two groups of limiting posts 205 are the same, and the depths of the first limiting hole 213 and the second limiting hole 214 can also be the same, thereby reducing the manufacturing difficulty. Of course, in other embodiments of the present application, the first sliding plate 201 and the second sliding plate 202 may not be coplanar, and the two groups of limiting posts 205 may have different lengths.

[0058] The two groups of limiting posts 205 are arranged along the length direction of the first guide rail 203, so as to cooperate with the first limiting hole 213 of the first sliding plate 201 and the second limiting hole 214 of the second sliding plate 202 to lock the first mounting plate 101 and the second mounting plate 102 in the width direction.

[0059] For example, each group of limiting posts 205 includes at least two limiting posts 205 arranged along the length direction of the first sliding plate 201. The corresponding first sliding plate 201 includes at least two first limiting holes 213 arranged along the length direction of the first sliding plate 201, and the second sliding plate 202 includes at least two second limiting holes 214 arranged along the length direction of the second sliding plate 202. The cooperation of the limiting posts 205 with the first limiting hole 213 and the second limiting hole 214 can lock in the length direction of the first mounting plate 101 and the second mounting plate 102, improving the locking stability of the locking structure 212. When the limiting posts 205 are inserted and matched with the first limiting hole 213 and the second limiting hole 214, the connecting plate 204 may be in contact with or parallel to the first sliding plate 201 and the second sliding plate 202.

[0060] In addition, a third handle 206 is provided on the side of the connecting plate 204 facing away from the limiting posts 205, facilitating the taking of the locking structure 212.

[0061] Figure 7 ForFigure 2 Top view of the shown wafer carrier.

[0062] As Figure 7 shown, in an embodiment of the present application, along the length direction of the first guide rail 203, the first slide plate 201 is provided with multiple groups of first limiting holes 213 at intervals, and / or, the second slide plate 202 is provided with multiple groups of second limiting holes 214 at intervals. Two groups of limiting posts 205 cooperate with the first limiting holes 213 and the second limiting holes 214 at different positions for locking the first mounting plate 101 and the second mounting plate 102 with different spacings.

[0063] In order to realize the spacing adjustment of a locking structure 212 to adapt to various wafer sizes, multiple groups of first limiting holes 213 are provided at intervals on the first slide plate 201, and / or, multiple groups of second limiting holes 214 are provided at intervals on the second slide plate 202. The limiting posts 205 cooperate with the first limiting holes 213 or the second limiting holes 214 at different positions to realize the locking of the relative positions of the first mounting plate 101 and the second mounting plate 102.

[0064] Among them, multiple limiting posts 205 can also be provided on the connecting plate 204 along the length direction of the first guide rail 203 to be inserted and cooperated with multiple groups of first limiting holes 213 at the same time.

[0065] As Figure 7 shown, in some embodiments of the present application, a first handle 226 is rotatably connected to the side of the first slide plate 201 facing away from the mounting groove 103, and a second handle 223 is rotatably connected to the side of the second slide plate 202 facing away from the mounting groove 103. By simultaneously lifting the first handle 226 and the second handle 223, the transfer of the wafer carrier is realized.

[0066] The rotatable connection of the first handle 226 and the second handle 223 can realize that when the first handle 226 and the second handle 223 are not in use, the first handle 226 and the second handle 223 are rotated to fit the first slide plate 201 and the second slide plate 202, reducing the height of the wafer carrier and avoiding interference with other structures.

[0067] Specifically, taking the structure of the second handle 223 on the second slide plate 202 as an example, a first group of rib plates and a second group of rib plates are further provided on one side of the second handle 223 of the second slide plate 202. The first group of rib plates includes two first rib plates 224 arranged in parallel. One end of the second handle 223 is placed between the two first rib plates 224 and is rotatably connected to the two first rib plates 224. The first rib plate 224 on the side close to the second group of rib plates in the first group of rib plates has a first notch 225 for accommodating one side of the second handle 223 when the second handle 223 is attached to the second slide plate 202. The second group of rib plates is arranged at intervals along the length direction of the second mounting plate 102 with respect to the first group of rib plates. The second group of rib plates includes two second rib plates 227 arranged in parallel. The other end of the second handle 223 is placed between the two second rib plates 227 and is rotatably connected to the two second rib plates 227. The second rib plate 227 on the side close to the first group of rib plates in the second group of rib plates has a second notch 228 for accommodating the other side of the second handle 223 when the second handle 223 is attached to the second slide plate 202.

[0068] Wherein, in an embodiment of the present application, the first rib plate 224 and the second rib plate 227 correspond to the first guiding pipeline 207 in the height direction. The first slide plate 201 has a structure symmetrical to that of the second slide plate 202. Therefore, the first rib plate 224 and the second rib plate 227 on the first slide plate 201 correspond to the first guide rail 203 in the height direction, which will not be elaborated here.

[0069] The second limiting holes 214 can be opened on the first rib plate 224 and the second rib plate 227. Similarly, the first limiting holes 213 can be opened on the first rib plate and the second rib plate of the first slide plate 201.

[0070] As Figure 2 and Figure 7 shown, in some alternative embodiments of the present application, the wafer carrier further includes a blocking component 300. The blocking component 300 is angularly connected to one side of one of the first mounting plate 101 and the second mounting plate 102 for limiting the wafer in the mounting groove 103 along the extending direction of the mounting groove 103.

[0071] For example, a recessed area 303 is provided on one side in the length direction of the first slide plate 201. The blocking component 300 is connected to the first mounting plate 101 and is placed in the recessed area 303. The blocking component 300 is at the same height as the first mounting plate 101 in the height direction and protrudes from the first mounting plate 101 in the width direction of the carrier component 100 to limit the wafer in the mounting groove 103.

[0072] Specifically, the blocking component 300 includes a blocking plate 301 and a blocking frame 302. The blocking plate 301 is connected to the first mounting plate 101 and extends along the length direction of the first mounting plate 101. The lengths of the first mounting plate 101 and the blocking plate 301 are equal to the length of the second mounting plate 102. The blocking frame 302 is placed in the recessed area 303. One end of the blocking frame 302 is rotatably connected to the side of the blocking plate 301 facing away from the first mounting plate 101, and the other end extends towards the second mounting plate 102. The blocking frame 302 can be formed by bending a metal pipe, and the blocking frame 302 and the blocking plate 301 can be perpendicularly arranged.

[0073] As described above, the foregoing is only a specific embodiment of the present application. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application.

Claims

1. A wafer carrier, characterized in that, Comprising: A carrying component, including a first mounting plate and a second mounting plate which are oppositely arranged. On the opposite sides of the first mounting plate and the second mounting plate, a plurality of mounting grooves are correspondingly provided. The plurality of mounting grooves are arranged side by side along the height direction of the carrying component, and the mounting grooves are used for carrying wafers. An adjusting component, including a first adjusting mechanism and a second adjusting mechanism which are oppositely arranged along the height direction of the carrying component, for adjusting the distance between the first mounting plate and the second mounting plate and locking the relative positions of the first mounting plate and the second mounting plate.

2. The wafer carrier according to claim 1, characterized in that, The first adjusting mechanism includes a guiding structure, a sliding structure and a locking structure. The guiding structure and the sliding structure are slidably matched along the width direction of the carrying component, and the locking structure is used for locking the guiding structure and the sliding structure. The guiding structure and the sliding structure are respectively connected to the first mounting plate and the second mounting plate and are disposed between the first mounting plate and the second mounting plate.

3. The wafer carrier according to claim 2, wherein The sliding structure includes a first sliding plate and a second sliding plate which are oppositely arranged. The first sliding plate is connected to the first mounting plate, and the second sliding plate is connected to the second mounting plate. The guiding structure includes a first guide rail. A part of the first guide rail is connected to the first sliding plate, and the other part is slidably matched with the second sliding plate. Along the length direction of the first guide rail, the locking structure is in limit cooperation with the first sliding plate and the second sliding plate.

4. The wafer carrier according to claim 3, characterized in that, The locking structure includes a connecting plate and two groups of limiting columns. The two groups of limiting columns are installed on one side of the connecting plate. The first sliding plate is provided with a first limiting hole, and the second sliding plate is provided with a second limiting hole. One group of limiting columns is in plug-in cooperation with the first limiting hole, and the other group of limiting columns is in plug-in cooperation with the second limiting hole.

5. The wafer carrier according to claim 3, wherein, The guiding structure includes at least two first guide rails along the extending direction of the mounting groove.

6. The wafer carrier according to claim 4, wherein, Along the length direction of the first guide rail, the first sliding plate is provided with multiple groups of the first limiting holes at intervals, and / or the second sliding plate is provided with multiple groups of the second limiting holes at intervals. The two groups of limiting columns are in cooperation with the first limiting holes and the second limiting holes at different positions for locking the first mounting plate and the second mounting plate at different distances.

7. The wafer carrier according to claim 3, wherein, On the side of the second sliding plate close to the mounting groove, a first guiding pipe protruding from the surface of the second sliding plate is provided, and the first guiding pipe is in plug-in cooperation with the first guide rail.

8. The wafer carrier according to any one of claims 3 to 7, characterized in that, The second adjusting mechanism includes a second guiding pipe and a second guide rail. The second guiding pipe is in plug-in cooperation with the second guide rail. The second guiding pipe is connected to the second sliding plate, and the second guide rail is connected to the first sliding plate. The second guide rail is parallel to the first guide rail.

9. The wafer carrier according to claim 3, characterized in that, A first handle is rotatably connected to the side of the first sliding plate facing away from the mounting groove, and a second handle is rotatably connected to the side of the second sliding plate facing away from the mounting groove.

10. The wafer carrier according to claim 1, wherein It further includes a blocking component. The blocking component is angularly connected to one side of one of the first mounting plate and the second mounting plate for limiting the wafer in the mounting groove along the extending direction of the mounting groove.

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