Adsorption assembly and wafer detection equipment

Abstract

The utility model provides an adsorption assembly and wafer detection equipment. The adsorption assembly comprises a first adapter, a suction nozzle and at least one second adapter, any two of the first adapter, the suction nozzle and the at least one second adapter can be detachably connected; and the first adapter is selectively connected with the suction nozzle or is connected with the suction nozzle through at least one second adapter. When the adsorption assembly is applied to the wafer detection equipment, the first adapter piece is directly connected with the suction nozzle, or the first adapter piece is connected with the suction nozzle through a proper number of second adapter pieces, so that the wafer detection equipment adapts to various wafers with different sizes; and the general applicability of the wafer detection equipment is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production equipment, and particularly relates to an adsorption component and a wafer detection device. Background Art

[0002] During the semiconductor chip processing, it is necessary to use a wafer detection device to detect the back surface for defects. During the defect detection process, the wafer is adsorbed by an adsorption device on the wafer detection device. The sizes of wafers in different batches are different. However, the adsorption devices in the prior art can only adsorb wafers of a certain size and cannot be compatible with wafers of different sizes, resulting in limited application scope of the wafer detection device. Summary of the Utility Model

[0003] The purpose of the utility model is to provide an adsorption component and a wafer detection device to adapt to the defect detection of wafers of different sizes.

[0004] To achieve the above purpose, the utility model provides an adsorption component, including a first adapter, a suction nozzle and at least one second adapter; any two of the first adapter, the suction nozzle and at least one second adapter can be detachably connected;

[0005] The first adapter is selectively connected to the suction nozzle or connected to the suction nozzle through at least one second adapter.

[0006] Optionally, a first joint part is formed on each of the first adapter and each second adapter, and a second joint part is formed on each second adapter and the suction nozzle. The second joint part can be detachably connected to the first joint part; the first joint part and the second joint part on the same second adapter are respectively arranged at opposite ends of the corresponding second adapter.

[0007] Optionally, one of the first joint part and the second joint part includes a plugging groove, and the other includes a plugging block, and the plugging block is used for at least partially inserting into the plugging groove.

[0008] Optionally, through holes extending through along a preset direction are arranged on the groove wall of the plugging groove. The through holes are communicated with the plugging groove, and the preset direction intersects or is skew to the axis of the plugging groove;

[0009] The adsorption assembly includes a first anti - detachment structure, which is arranged corresponding to the insertion slot and can move along the preset direction to partially enter the insertion slot or withdraw from the insertion slot through the through - hole; when the first anti - detachment structure is partially located in the insertion slot, the first anti - detachment structure cooperates with the part of the insertion block located in the insertion slot to prevent the insertion block from detaching from the insertion slot; when the first anti - detachment structure withdraws from the insertion slot, the insertion block located in the insertion slot is allowed to detach from the insertion slot.

[0010] Optionally, a second anti - detachment structure is formed on the insertion block and is configured to cooperate with the first anti - detachment structure.

[0011] Optionally, the second anti - detachment structure is a groove, and the notch of the groove is parallel to the axis of the insertion block.

[0012] Optionally, an internal thread is provided on the inner wall of the through - hole, and the first anti - detachment structure is a threaded structural member.

[0013] Optionally, the first anti - detachment structure is an elastic member, which is configured to withdraw from the insertion slot and store elastic potential energy when subjected to an external force, and release the elastic potential energy and partially enter the insertion slot when the external force is cancelled.

[0014] Optionally, an air passage extending through is provided on the suction nozzle, and the air passage has opposite first and second openings; the first opening is used to connect to a negative pressure source.

[0015] Optionally, the axis of the first opening is perpendicular to the axis of the second opening.

[0016] To achieve the above object, the present utility model also provides a wafer inspection device, which includes a housing, a positioning plate, the adsorption assembly as described above, a light source, and an image acquisition element:

[0017] The housing is a hollow structure with an inner cavity, and a material inlet and outlet communicating with the inner cavity is further provided on the housing;

[0018] The positioning plate, the adsorption assembly, the light source, and the image acquisition element are all arranged in the inner cavity;

[0019] The positioning plate is arranged corresponding to the material inlet and outlet and is connected to the housing; positioning holes are provided on the positioning plate;

[0020] The number of the adsorption assemblies is multiple, and the multiple adsorption assemblies are located on the same side of the positioning plate and are arranged at intervals along the circumferential direction of the positioning holes;

[0021] The first adapter of the adsorption component is connected to the positioning plate, and the suction nozzle is located at one end of the first adapter close to the axis of the positioning hole;

[0022] Both the light source and the image acquisition element are located on the side of the positioning plate away from the adsorption component;

[0023] The light source is configured to provide illumination for the area where the positioning hole is located;

[0024] The image acquisition element is configured to acquire an image of the wafer located at the positioning hole and adsorbed by the adsorption component.

[0025] Compared with the prior art, the adsorption component and the wafer detection device of the present invention have the following advantages:

[0026] The aforementioned adsorption component includes a first adapter, a suction nozzle and at least one second adapter; any two of the first adapter, the suction nozzle and at least one second adapter can be detachably connected; the first adapter is selectively connected to the suction nozzle or connected to the suction nozzle through at least one second adapter. When the adsorption component is applied to the wafer detection device, by directly connecting the first adapter to the suction nozzle or connecting the first adapter to the suction nozzle through an appropriate number of second adapters, the wafer detection device can be adapted to various wafers of different sizes, improving the general applicability of the wafer detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings are used to better understand the present invention and do not constitute an improper limitation to the present invention. Among them:

[0028] Figure 1 is a schematic structural diagram of the wafer detection device provided by the first embodiment of the present invention;

[0029] Figure 3 is a schematic structural diagram of the adsorption component of the wafer detection device provided by the first embodiment of the present invention. In the figure, the first adapter is connected to the suction nozzle through two second adapters;

[0030] Figure 4 is Figure 3 an exploded view of the shown adsorption component;

[0031] Figure 5 is an application scenario diagram of the wafer detection device provided by the first embodiment of the present invention. In the figure, the wafer detection device detects a 12-inch wafer;

[0032] Figure 6FIG. 0 is a schematic diagram of the application scenario of the wafer inspection device provided by the first embodiment of the present invention. In the figure, the wafer inspection device inspects an 8-inch wafer;

[0033] Figure 7 FIG. 4 is a schematic diagram of the application scenario of the wafer inspection device provided by the first embodiment of the present invention. In the figure, the wafer inspection device inspects a 6-inch wafer;

[0034] Figure 2 FIG. 8 is a schematic diagram of a partial structure of the wafer inspection device provided by an embodiment of the present invention;

[0035] Figure 8 FIG. 12 is a cross-sectional view of the adsorption assembly of the wafer inspection device provided by the first embodiment of the present invention;

[0036] Figure 9 FIG. 16 is a partial cross-sectional view of the adsorption assembly of the wafer inspection device provided by the first embodiment of the present invention. In the figure, the second joint on the suction nozzle is connected to the first joint on an adapter;

[0037] Figure 10 FIG. 20 is a partial cross-sectional view of the adsorption assembly of the wafer inspection device provided by the first embodiment of the present invention. In the figure, the second joint on the suction nozzle is disconnected from the first joint on an adapter;

[0038] Figure 11 FIG. 24 is a partial cross-sectional view of the adsorption assembly of the wafer inspection device provided by the second embodiment of the present invention. In the figure, the second joint on the suction nozzle is connected to the first joint on an adapter;

[0039] Figure 12 FIG. 28 is a partial cross-sectional view of the adsorption assembly of the wafer inspection device provided by the second embodiment of the present invention. In the figure, the second joint on the suction nozzle is disconnected from the first joint on an adapter;

[0040] Figure 13 FIG. 32 is a schematic diagram of adsorption assemblies of different specifications of the wafer inspection device provided by the third embodiment of the present invention;

[0041] Figure 14 FIG. 36 is a cross-sectional view of the adsorption assembly of the wafer inspection device provided by the third embodiment of the present invention

[0042] Figure 15 FIG. 40 is a schematic diagram of the application scenario of the wafer inspection device provided by the third embodiment of the present invention. In the figure, the wafer inspection device inspects a 6-inch wafer;

[0043] Figure 16FIG. 0 is a schematic diagram of the application scenario of the wafer inspection equipment provided by the third embodiment of the present utility model. In the figure, the wafer inspection equipment inspects an 8-inch wafer;

[0044] Figure 17 FIG. 4 is a schematic diagram of the application scenario of the wafer inspection equipment provided by the third embodiment of the present utility model. In the figure, the wafer inspection equipment inspects a 12-inch wafer.

[0045] [Description of the attached drawing reference numerals is as follows]:

[0046] 1 - housing, 11 - inner cavity, 12 - material inlet and outlet, 2 - positioning plate, 21 - positioning plate, 3, 3' - adsorption assembly, 31 - first adapter, 32 - suction nozzle, 321, 30' - air passage, 3211, 31' - first opening, 3212, 32' - second opening, 33 - second adapter, 34 - first anti - detachment structure, 301 - first joint, 302 - second joint, 303 - through hole, 304 - groove, 4 - light source, 5 - image acquisition element, 6 - connecting piece, 7 - joint pipe, 71 - pipe body, 72 - pipe joint, 8 - quick - connect fitting. Detailed implementation manners

[0047] The following uses specific examples to illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific implementation manners. Each detail in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model. It should be noted that the diagrams provided in this embodiment only illustrate the basic concept of the present utility model in a schematic manner. Therefore, only the components related to the present utility model are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0048] In addition, each of the following description embodiments has one or more technical features. However, this does not mean that those using the present utility model must implement all the technical features in any one embodiment at the same time, or can only separately implement some or all of the technical features in different embodiments. In other words, on the premise that implementation is possible, those skilled in the art can, according to the disclosure of the present utility model and depending on design specifications or implementation requirements, selectively implement some or all of the technical features in any one embodiment, or selectively implement the combination of some or all of the technical features in multiple embodiments, thereby increasing the flexibility when implementing the present utility model.

[0049] As used in this specification, the singular forms "a", "an", and "the" include plural referents, and the plural form "plural" includes more than two referents, unless the context clearly dictates otherwise. As used in this specification, the term "or" is generally used in the sense of including "and / or", unless the context clearly dictates otherwise, and the terms "mounted", "connected", "coupled" should be construed broadly. For example, it may be a fixed connection, a detachable connection, or an integral connection. It may be a mechanical connection or an electrical connection. It may be directly connected or indirectly connected through an intermediate medium, and may be the communication between two components or the interaction relationship between two components. The relational terms such as "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly specify the quantity of the indicated technical features. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0050] The purpose of the present utility model is to provide an adsorption assembly and a wafer inspection device including the adsorption assembly. By reasonably designing the configuration of the adsorption assembly, the wafer inspection device applying the adsorption assembly can be adapted to the defect inspection of wafers of different specifications, and the general applicability of the wafer inspection device can be improved.

[0051] To make the purpose, advantages and features of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are all in very simplified forms and use non-precise scales, only for the purpose of facilitating and clearly assisting in explaining the purpose of the embodiments of the present utility model. The same or similar reference numerals in the drawings represent the same or similar components.

[0052] <Example 1>

[0053] Figure 1 Shows a schematic structural diagram of the wafer inspection device provided in this embodiment. As Figure 1As shown in the figure, the wafer inspection device includes a housing 1, a positioning plate 2, an adsorption assembly 3, a light source 4, and an image acquisition element 5. Among them, the housing 1 is a hollow structure with an inner cavity 11, and the housing 1 is provided with a material inlet / outlet 12 communicating with the inner cavity 11. The positioning plate 2, the adsorption assembly 3, the light source 4, and the image acquisition element 5 are all arranged in the inner cavity 11. Among them, the positioning plate 2 is connected to the housing 1 and is arranged corresponding to the material inlet / outlet 12. The positioning plate 2 is provided with positioning holes 21, and the positioning holes 21 penetrate through the positioning plate 2. The number of the adsorption assemblies 3 is multiple, and the multiple adsorption assemblies 3 are located on the same side of the positioning plate 2 and are arranged at intervals along the circumferential direction of the positioning holes 21, preferably arranged at equal intervals. The light source 4 and the image acquisition element 5 are both located on the side of the positioning plate 2 away from the adsorption assembly 3. The light source 4 is configured to provide light to the area where the positioning holes 21 are located, and the image acquisition element 5 is configured to acquire an image of the material located at the positioning holes 21.

[0054] More specifically, the positioning plate 2 is horizontally arranged, and the adsorption assembly 3 is connected to the upper surface of the positioning plate 2. The plane where the material inlet / outlet 12 is located is a vertical plane, and the upper edge of the material inlet / outlet is higher than the adsorption assembly 3. The material is a wafer, and the wafer enters the inner cavity 11 from the material inlet / outlet 12 and reaches above the positioning holes 21. When the wafer drops onto the adsorption assembly 3, the wafer is adsorbed by the adsorption assembly 3 and positioned at the positioning holes 21. After that, the image acquisition element 5 can acquire an image of the wafer. Those skilled in the art know that the image of the wafer is used for defect analysis. When the adsorption assembly 3 releases the adsorption of the wafer that has been imaged, the wafer is allowed to leave the inner cavity 11 from the material inlet / outlet 12. It should be understood that the setting mode of the light source 4 and the setting mode of the image acquisition element 5 are such that the light-emitting range of the light source 4 can cover the wafer located at the positioning holes 21, and the light source 4 does not interfere with the image acquisition range of the image acquisition element 5 (such as Figure 2 ) shall prevail. The specific setting mode is the content that those skilled in the art can know, and will not be elaborated here.

[0055] In this embodiment, the structure of the adsorption assembly 3 is as Figure 3 and Figure 4As shown, it includes a first adapter 31, a nozzle 32, and at least one second adapter 33. The first adapter 31 can be connected to the positioning plate 2 through a connecting member 6, and the connecting member 6 is, for example, a screw. Any two of the first adapter 31, the nozzle 32, and at least one of the second adapters 33 can be detachably connected. That is, the first adapter 31 can be detachably connected to the nozzle 32, the first adapter 31 can be detachably connected to any one of the second adapters 33, any two of the second adapters 33 can be detachably connected, and any one of the second adapters 33 can be detachably connected to the nozzle 32. That is to say, the adsorption assembly 3 is a combined structure, and the first adapter 31 can be directly connected to the nozzle 32, or can be connected to the nozzle 32 through at least one of the second adapters 33. It should be noted that when the first adapter 31 is connected to the nozzle 32, the arrangement direction of the two is the radial direction of the positioning hole 21, and the nozzle 32 is located at one end of the first adapter 31 close to the axis of the positioning hole 21. In other words, by changing the number of the second adapters 33 located between the nozzle 32 and the first adapter 31, the size of the adsorption assembly 3 in the radial direction of the positioning hole 21 can be adjusted.

[0056] In this way, when using the wafer detection device to detect the wafer for defects, the size of the adsorption assembly 3 in the radial direction of the positioning hole 21 can be adjusted to adapt to wafers of different sizes. For example, in some embodiments, when detecting a 12-inch wafer, as Figure 5 shown, the first adapter 31 is directly connected to the nozzle 32 so that the size of the adsorption assembly 3 in the radial direction of the positioning hole 21 is adapted to the 12-inch wafer; when detecting an 8-inch wafer, as Figure 6 shown, by arranging a plurality of the second adapters 33 between the first adapter 31 and the nozzle 32, the size of the adsorption assembly 3 in the radial direction of the positioning hole 21 is increased so that it is adapted to the size of the 8-inch wafer; when detecting a 6-inch wafer, as Figure 7 shown, the number of the second adapters 33 located between the first adapter 31 and the nozzle 32 is further increased to continue to increase the size of the adsorption assembly 3 in the radial direction of the positioning hole 21 so that it is adapted to the size of the 6-inch wafer. In non-limiting embodiments, when detecting an 8-inch wafer, one second adapter 33 is arranged between the first adapter 31 and the nozzle 32, and when detecting a 6-inch wafer, two second adapters 33 are arranged between the first adapter 31 and the nozzle 32.

[0057] Furthermore, please continue to refer to Figure 4, a first joint portion 301 is formed on each of the first adapter 31 and each of the second adapters 33, and a second joint portion 302 is formed on each of the suction nozzles 32 and each of the second adapters 33. For the same second adapter 33, the first joint portion 301 and the second joint portion 302 thereon are located at opposite ends of the second adapter 33. The structure of the second joint portion 302 is matched with the structure of the first joint portion 301 so that the second joint portion 302 can be detachably connected to the first joint portion 301. Thus, the first adapter 31 can be connected to the second joint portion 302 on the suction nozzle 32 through the first joint portion 301 thereon, realizing the connection between the first adapter 31 and the suction nozzle 32; the first adapter 31 can be connected to the second joint portion 302 on any one of the second adapters 33 through the first joint portion 301 thereon, realizing the connection between the first adapter 31 and the second adapter 33; one second adapter 33 can be connected to the second joint portion 302 on another second adapter 33 through the first joint portion 301 thereon, realizing the connection between the two second adapters 33; any one of the second adapters 33 can be connected to the second joint portion 302 on the suction nozzle 32 through the first joint portion 301 thereon, realizing the connection between the second adapter 33 and the suction nozzle 32.

[0058] Optionally, in Figure 4 the embodiment shown, the first joint portion 301 is a plug-in groove, and the second joint portion 302 is a plug-in block. Thus, when the plug-in block is at least partially inserted into the plug-in groove, the first joint portion 301 is connected to the second joint portion 302, and when the plug-in block is pulled out of the plug-in groove, the first joint portion 301 is disconnected from the second joint portion 302. In an alternative embodiment, the first joint portion may be a plug-in block, and the second joint portion is correspondingly a plug-in groove (not shown in the figure). It should be noted that when the first adapter 31 is connected to the suction nozzle 32, the plug-in block and the plug-in groove both extend along the arrangement direction of the first adapter 31 and the suction nozzle 32. Therefore, the axes of the plug-in block and the plug-in groove both refer to the arrangement direction of the first adapter 31 and the suction nozzle 32.

[0059] Furthermore, to improve the connection stability between the first joint portion 301 and the second joint portion 302, as Figures 8 to 10 shown, the adsorption assembly 3 further includes a first anti-disengagement structure 34. The first anti-disengagement structure 34 is disposed at the plug-in groove and is used to cooperate with the part of the plug-in block located in the plug-in groove to prevent the plug-in block from disengaging from the plug-in groove. Figure 9 In Figure 10The adapter shown in the figure may be the second adapter 33 or the first adapter ( Figure 9 and Figure 10 not marked in the figure).

[0060] Please continue to refer to Figures 8 to 10 and in combination with Figure 4 , a through hole 303 extending through along a preset direction is provided on the groove wall of the socket groove. The preset direction intersects or is skew to the axial direction of the socket groove, and the through hole 303 communicates with the socket groove. The first anti-disengagement structure 34 is disposed at the through hole 303 and can move along the axial direction of the through hole 303 (i.e., the preset direction) to partially extend into or withdraw from the socket groove through the through hole 303. Moreover, when the first anti-disengagement structure 34 is partially located in the socket groove, the first anti-disengagement structure 34 can interact with the part of the plug block located in the socket groove to prevent the plug block from disengaging from the socket groove, so that the first joint head 301 and the second joint head 302 are stably connected.

[0061] Specifically, internal threads are provided on the hole wall of the through hole 303, and the first anti-disengagement structure 34 is a threaded structural member that is threadedly connected to the through hole 303. Therefore, by rotating the first anti-disengagement structure 34 in the first direction, the first anti-disengagement structure 34 can move along the axis of the through hole 303 towards the axis of the socket groove and partially extend into the socket groove. Conversely, when the first anti-disengagement structure 34 is rotated in the second direction opposite to the first direction, the first anti-disengagement structure 34 can move along the axial direction of the through hole 303 away from the axis of the socket groove to withdraw from the socket groove. One of the first direction and the second direction is the clockwise direction and the other is the counterclockwise direction.

[0062] Furthermore, a second anti-disengagement structure that cooperates with the first anti-disengagement structure is formed on the plug block. The second anti-disengagement structure is, for example, a groove 304, and the notch of the groove 304 is parallel to the axis of the plug block. When the plug block is at least partially inserted into the socket groove, the groove 304 is located in the socket groove, and the notch of the groove 304 at least partially coincides with the through hole 303 so that the groove 304 can accommodate the part of the first anti-disengagement structure 34 located in the socket groove.

[0063] Therefore, the operation for connecting the first joint portion 301 to the second joint portion 302 is as follows: on the premise that the first anti-disengagement structure 34 exits the insertion slot, insert the insertion block into the insertion slot, and make the notch of the groove 304 coincide with the through hole 303 at least partially. Then, rotate the first anti-disengagement structure 34 along the first direction so that the first anti-disengagement structure 34 partially extends into the insertion slot and is received in the groove 304. At this time, the first anti-disengagement structure 34 and the groove 304 together form a limiting structure that prevents the insertion block from disengaging from the insertion slot.

[0064] The operation for disconnecting the first joint portion 301 from the second joint portion 302 is as follows: first, rotate the first anti-disengagement structure 34 along the second direction so that the first anti-disengagement structure 34 exits the insertion slot. At this time, the first anti-disengagement structure 34 also exits the groove 304. Then, pull out the insertion block from the insertion slot.

[0065] It can be understood that when rotating the first anti-disengagement structure 34 along the second direction, the rotation of the first anti-disengagement structure 34 can be stopped as long as the first anti-disengagement structure 34 exits the insertion slot, without disassembling the first anti-disengagement structure 34 from the through hole 303.

[0066] Alternatively, the second anti-disengagement structure is not formed on the insertion block. In this case, when the first anti-disengagement structure 34 is partially located in the insertion slot and the insertion block is at least partially located in the insertion slot, pressing the insertion block with the first anti-disengagement structure 34 to apply a squeezing force along the preset direction to the insertion block can also achieve the purpose of preventing the insertion block from disengaging from the insertion slot.

[0067] Optionally, as Figures 8 to 10 shown, an air passage 321 is formed on the suction nozzle 32, and the air passage 321 has two opposite openings, namely a first opening 3211 and a second opening 3212 (as Figure 3As shown, the first opening 3211 is connected to a negative pressure source. When the adsorption assembly 3 is connected to the positioning plate 2, the second opening 3212 is located on the surface of the nozzle 32 away from the light source 4 and the image acquisition element 5. It can be understood that when the negative pressure source is activated, negative pressure is formed at the second opening 3212 and the wafer can be adsorbed. In this embodiment, the air passage 321 of the adsorption assembly 3 is only located on the nozzle 32 and does not involve the first adapter 31 and the second adapter 33. The advantage of this arrangement is that when assembling the first adapter 31 and the nozzle 32, or assembling the first adapter 31, at least one second adapter 33, and the nozzle 32, there is no need to consider the airtightness problem of the air passage 321 at the connection positions of each component, effectively ensuring the adsorption effect of the adsorption assembly 3. In practice, the first opening 3211 is intercepted from the negative pressure source through a connecting pipe 7. The connecting pipe 7 includes a pipe body 71 and a pipe joint 72. The pipe body 71 is connected to the first opening 3211 through the pipe joint 72.

[0068] Further preferably, the axis of the first opening 3211 is perpendicular to the axis of the second opening 3212, and the axis of the first opening 3211 is parallel to the positioning plate 2, and the axis of the second opening 3212 is perpendicular to the positioning plate 2. Thus, the arrangement direction of the connecting pipe 7 and the adsorption assembly 3 is perpendicular to the axis of the second opening 3212 and parallel to the positioning plate 2. Further, it is preferably that the side of the connecting pipe 7 away from the positioning plate 2 does not protrude from the surface of the side of the adsorption assembly 3 away from the positioning plate 2. In the case where the positioning plate 2 is horizontally arranged and the adsorption assembly 3 is connected to the upper surface of the positioning plate 2, the second opening 3212 is located on the upper surface of the nozzle 32, and the upper edge of the connecting pipe 7 is not higher than the upper edge of the adsorption assembly 3. In this way, when the adsorption assembly 3 adsorbs the wafer to position the wafer in the positioning hole 21, or when the wafer is moved away from the positioning hole 21, the wafer will not collide with the connecting pipe 7.

[0069] <Embodiment 2>

[0070] Figure 11 And Figure 12 shows a partial cross-sectional view of the adsorption assembly provided in this embodiment. As Figure 11 And Figure 12As shown, the difference between this embodiment and the first embodiment lies in the structure of the first anti - detachment structure 34, and the groove 304 is an essential structure. Specifically, in this embodiment, the wall of the through - hole 303 can be a smooth curved surface, and the member provided with the insertion groove is connected with the first anti - detachment structure. The first anti - detachment structure 34 is an elastic member and is configured to have a predetermined shape. Moreover, when the first anti - detachment structure 34 is not subjected to an external force, the first anti - detachment structure 34 partially extends into the insertion groove from the through - hole 303. When the first anti - detachment structure 34 is subjected to an external force, the first anti - detachment structure 34 deforms and stores elastic potential energy, and withdraws from the insertion groove from the through - hole 303. It can be understood that when the external force is cancelled, the first anti - detachment structure 34 releases the elastic potential energy, resumes to the predetermined shape, and partially extends into the insertion groove from the through - hole 303 again.

[0071] Thus, in this embodiment, the operation of connecting the first joint part 301 and the second joint part 302 is as follows: First, apply an external force to the first anti - detachment structure 34 so that the first anti - detachment structure 34 withdraws from the insertion groove, then insert the insertion block into the insertion groove, and make the notch of the groove 304 partially coincide with the through - hole 303. After that, stop applying the external force to the first anti - detachment structure so that the first anti - detachment structure 34 partially enters the insertion groove and inserts into the groove 304. The operation of disconnecting the first joint part 301 and the second joint part 302 is: Apply an external force to the first anti - detachment structure 34 so that the first anti - detachment structure 34 withdraws from the insertion groove, and then pull out the insertion block from the insertion groove.

[0072] It can be understood that if the first joint part 301 includes the insertion groove, the first anti - detachment structure 34 is provided on the first adapter 31. If the second joint part 302 includes the insertion groove, the first anti - detachment structure 34 is provided on the nozzle 32. The second adapter 33 forms both the first joint part 301 and the second joint part 302. Therefore, the first anti - detachment structure is provided on the second adapter 33.

[0073] <Embodiment Three>

[0074] The difference between this embodiment and the first embodiment lies in the configuration of the adsorption assembly. Specifically, please refer to Figure 13 , in this embodiment, the wafer detection device includes a variety of adsorption assemblies 3' with different specifications. Each specification of the adsorption assembly 3' is an integral member, and the axial lengths of the adsorption assemblies 3' with different specifications are different. Continuing to refer to Figure 13 and combining with Figure 14As shown, an air passage 30' is provided on each specification of the adsorption component 3'. The air passage 30' extends along the axial direction of the adsorption component 3' and has opposite first opening 31' and second opening 32'. The axis of the first opening 31' is perpendicular to the axis of the second opening 32'. The first opening 31' is used to communicate with a negative pressure source through a quick connector 8. Each specification of the adsorption component 3' can be detachably connected to the positioning plate 2 through a connecting piece 7. When the adsorption component 3' is connected to the positioning plate 2, the second opening 32' is closer to the axis of the positioning hole 2 than the first opening 31' and is located on the surface of the adsorption component 3' on the side away from the light source 4 and the image acquisition element 5.

[0075] Therefore, when the wafer detection device is working, it selectively connects to one specification of the adsorption component 3' according to the size of the wafer to be detected. In a specific embodiment, as Figure 13 shown, the wafer detection device includes three specifications of the adsorption component 3', which are respectively called the first adsorption component (not marked in the figure), the second adsorption component (not marked in the figure), and the third adsorption component (not marked in the figure). Among them, the first adsorption component has the largest axial length and can be adapted to 6-inch wafers. The third adsorption component has the smallest axial length and can be adapted to 12-inch wafers. The second adsorption component has an axial length between the first adsorption component and the second adsorption component and can be adapted to 8-inch wafers.

[0076] Therefore, as Figure 15 shown, when using the wafer detection device to detect defects on a 6-inch wafer, the first adsorption component is connected to the positioning plate 2 to adsorb the wafer. As Figure 16 shown, when using the wafer detection device to detect defects on an 8-inch wafer, the second adsorption component is connected to the positioning plate 2 to adsorb the wafer. As Figure 17 shown, when using the wafer detection device to detect defects on a 12-inch wafer, the third adsorption component is connected to the positioning plate 2 to adsorb the wafer.

[0077] Although the present invention is disclosed as above, it is not limited thereto. Those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. An adsorption component, characterized in that, It includes a first adapter, a suction nozzle, and at least one second adapter; any two of the first adapter, the suction nozzle, and at least one second adapter can be detachably connected; The first adapter is selectively connected to the suction nozzle or connected to the suction nozzle through at least one second adapter.

2. The adsorption assembly according to claim 1, wherein First joint heads are formed on the first adapter and each second adapter, and second joint heads are formed on each second adapter and the suction nozzle. The second joint head can be detachably connected to the first joint head; the first joint head and the second joint head located on the same second adapter are arranged at opposite ends of the corresponding second adapter.

3. The adsorption assembly according to claim 2, characterized in that, One of the first joint head and the second joint head includes a plugging groove, and the other includes a plugging block, and the plugging block is used to at least partially insert into the plugging groove.

4. The adsorption assembly according to claim 3, wherein Through holes extending through along a preset direction are provided on the wall of the plugging groove. The through holes communicate with the plugging groove, and the preset direction intersects or is skew to the axis of the plugging groove; The adsorption assembly includes a first anti - detachment structure. The first anti - detachment structure is arranged corresponding to the plugging groove and can move along the preset direction to partially enter or exit the plugging groove from the through hole; when the first anti - detachment structure is partially located in the plugging groove, the first anti - detachment structure cooperates with the part of the plugging block located in the plugging groove to prevent the plugging block from detaching from the plugging groove; when the first anti - detachment structure exits the plugging groove, the plugging block located in the plugging groove is allowed to detach from the plugging groove.

5. The adsorption assembly according to claim 4, characterized in that, A second anti - detachment structure cooperating with the first anti - detachment structure is formed on the plugging block.

6. The adsorption assembly according to claim 5, wherein The second anti - detachment structure is a groove, and the notch of the groove is parallel to the axis of the plugging block.

7. The adsorption assembly according to claim 4 or 6, characterized in that, Internal threads are provided on the wall of the through hole, and the first anti - detachment structure is a threaded structural member.

8. The adsorption assembly according to claim 6, wherein The first anti - detachment structure is an elastic member and is configured to exit the plugging groove and store elastic potential energy when acted by an external force, release the elastic potential energy when the external force is cancelled, and partially enter the plugging groove.

9. The adsorption assembly according to claim 1, characterized in that A through - extending air passage is provided on the suction nozzle. The air passage has opposite first opening and second opening; the first opening is used to connect to a negative pressure source.

10. The adsorption assembly according to claim 9, wherein, The axis of the first opening is perpendicular to the axis of the second opening.

11. A wafer inspection device, characterized in that, It includes a housing, a positioning plate, an adsorption assembly according to any one of claims 1 - 10, a light source, and an image acquisition element: The housing is a hollow structure with an inner cavity, and a material inlet and outlet communicating with the inner cavity is further provided on the housing; The positioning plate, the adsorption assembly, the light source, and the image acquisition element are all arranged in the inner cavity; The positioning plate is arranged corresponding to the material inlet and outlet and is connected to the housing; positioning holes are provided on the positioning plate; The number of the adsorption assemblies is multiple. The multiple adsorption assemblies are located on the same side of the positioning plate and are arranged at intervals along the circumference of the positioning holes; The first adapter of the adsorption assembly is connected to the positioning plate, and the suction nozzle is located at one end of the first adapter close to the axis of the positioning hole; Both the light source and the image acquisition element are located on the side of the positioning plate away from the adsorption assembly; The light source is configured to provide illumination for the area where the positioning hole is located; The image acquisition element is configured to acquire an image of the wafer located at the positioning hole and adsorbed by the adsorption assembly.

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