Clamping type wafer rotating mechanism with safe claw opening device

Abstract

The utility model provides a clamping type wafer rotating mechanism with a safe claw opening device, which comprises a rotating part, a circular support and a protection part, the circular support is arranged above the rotating part and is connected with the rotating part, and the protection part is arranged outside the rotating part and the circular support; a plurality of clamping jaw assemblies used for supporting and clamping wafers are arranged on the circumferential part of the outer side of the circular support at equal intervals, and claw opening assemblies in one-to-one correspondence with the clamping jaw assemblies are arranged on the protection part; the wafer rotating mechanism further comprises a safe claw opening device. Whether the angle of the rotating shaft reaches the preset correct position or not during claw opening is monitored through the safety claw opening device, if the angle of the rotating shaft deviates, the safety claw opening device triggers the machine table to give an alarm, the wafer taking action of the mechanical arm is stopped, and the risk of wafer fragmentation caused by angle errors is effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a clamping type wafer rotating mechanism with a safety claw opening device. Background Art

[0002] In the precision process of semiconductor manufacturing, the wet cleaning link is crucial. It conducts a meticulous treatment on the wafer surface through chemical solutions to thoroughly remove tiny impurities, photoresist residues, and other potential contaminants. If these contaminants are not effectively removed, they may have an adverse impact on the performance of semiconductor devices. Therefore, wet cleaning not only ensures the ultra-cleanliness of the wafer surface but also lays the foundation for subsequent key process steps such as lithography, etching, or chemical vapor deposition. In this link, the clamping and rotating mechanism of a single wafer plays a crucial role. The design of this mechanism must ensure that the wafer can be firmly clamped while preventing any displacement or tilt in the cleaning tank, which is essential for achieving a uniform cleaning effect.

[0003] However, in some existing wet stripping machine models, such as the PR STRIPPER machine SC-509 model, there are some technical challenges in its clamping mechanism during the automated operation process. Especially when the robotic arm performs the actions of picking up and placing the wafer, if the claws fail to open in a timely or correct manner, it may cause irreversible physical damage to the wafer or even generate fragments. Such damage will not only reduce the cleaning effect of the wafer and affect its performance in subsequent processes but may also lead to the scrapping of the wafer, thus increasing production costs and affecting the overall production efficiency. Summary of the Utility Model

[0004] To solve all or part of the above problems in the prior art, the utility model provides a clamping type wafer rotating mechanism with a safety claw opening device. By installing the safety claw opening device, it is ensured that the angle of the rotating shaft is correct during the claw opening process, thereby reducing the operation risk and avoiding wafer damage or fragmentation caused by incorrect angles.

[0005] To achieve the above object, the utility model provides the following technical solutions:

[0006] A clamping type wafer rotating mechanism with a safety jaw opening device, comprising a rotating part, a circular bracket and a protective part. The circular bracket is arranged above the rotating part and connected to the rotating part. The protective part is arranged outside the rotating part and the circular bracket. A plurality of jaw assemblies for supporting and clamping wafers are equidistantly arranged on the outer circumferential part of the circular bracket. An opening jaw assembly corresponding to each jaw assembly is arranged on the protective part. The wafer rotating mechanism further includes a safety jaw opening device. By means of the safety jaw opening device, it is monitored whether the angle of the rotating shaft reaches a preset correct position during jaw opening. If the angle of the rotating shaft deviates, the safety jaw opening device will trigger an alarm of the machine tool and stop the wafer picking action of the robotic arm, effectively avoiding the risk of wafer fragmentation caused by incorrect angles.

[0007] The jaw assembly includes a connected bearing block, a clamping block and a start switch. The start switch opens or closes the clamping block. At least one support protrusion for supporting the wafer and at least one limit protrusion for preventing the wafer from sliding are further arranged on the bearing block. The overall design enhances the reliability of the wafer rotating mechanism and reduces production interruptions or reject rates caused by improper clamping. The support protrusions on the bearing block provide a stable support point for the wafer, maintaining the level and stability of the wafer during transfer. The function of the limit protrusions is to prevent the wafer from sliding in the clamped state, increasing the safety of the wafer during the operation process.

[0008] The opening jaw assembly touches the start switch of the jaw assembly. The jaw assembly does not clamp the wafer, and the circular bracket is at a preset jaw opening angle. The opening jaw assembly disengages from touching the start switch of the jaw assembly, and the jaw assembly clamps the wafer. When the circular bracket rotates to the preset jaw opening angle, the opening jaw assembly will touch the start switch of the jaw assembly to ensure that the jaw assembly can accurately release the wafer, avoiding accidental clamping or damage to the wafer.

[0009] The safety jaw opening device is at least one set of opposed photoelectric sensors. Each set of opposed photoelectric sensors includes a transmitter and a receiver. The opposed photoelectric sensors achieve non-contact detection by emitting and receiving light, with a simple structure, easy to integrate into the existing system, and convenient for maintenance.

[0010] Four of the opening jaw assemblies are evenly and equidistantly arranged on the protective part, and the opening jaw assemblies in the opposite directions are in a set. The symmetrical layout of the opening jaw assemblies helps to achieve symmetrical force, reducing wafer deformation or damage caused by uneven force.

[0011] The safety jaw-opening device is two sets of opposed photoelectric sensors. The first set of opposed photoelectric sensors is arranged at the middle position of one set of jaw-opening assemblies and is blocked by the corresponding jaw assemblies. The second set of opposed photoelectric sensors is arranged at the side position of the other set of jaw-opening assemblies and is not blocked by the corresponding jaw assemblies. Through the cooperation of the two sets of opposed photoelectric sensors, it can accurately monitor whether the jaw assemblies are in the correct opening and closing states, and can effectively reduce production interruptions or scrap rates caused by misoperations or equipment failures.

[0012] When the circular bracket is at the preset jaw-opening angle, the first set of opposed photoelectric sensors is blocked by the jaw assemblies and cannot receive signals, while the second set of opposed photoelectric sensors is located at the side of the jaw assemblies and can receive signals. This layout ensures that the wafer can be safely released only when the jaw-opening angle is correct. If the jaws fail to open correctly due to an incorrect angle, an abnormality will be detected and the machine will be alarmed, preventing possible debris and damage.

[0013] The safety jaw-opening device is at least one pressure sensor, and the pressure sensor is arranged on the jaw-opening assembly; when the circular bracket is at the preset jaw-opening angle, the pressure sensor on the jaw-opening assembly touches the switch of the jaw assembly. The pressure sensor can accurately monitor whether the jaw assembly touches the switch, ensuring that the jaw assembly is triggered at the correct angle and realizing the safe release of the wafer.

[0014] The rotating part includes a driving part, a transmission part and a rotating shaft which are connected. One end of the transmission part is connected to the driving part, the other end is connected to the rotating shaft, and the other end of the rotating shaft is connected to the circular bracket. It provides efficient and stable power transmission.

[0015] The circular bracket adopts a hollow design. A plurality of spraying components are arranged on the rotating part below the circular bracket, and a vacuum suction component for adsorbing the wafer is arranged on the circular bracket. The hollow design allows the spraying components to directly clean the wafer. The setting of the vacuum suction component ensures the stable adsorption of the wafer during rotation or cleaning, preventing the wafer from sliding or shifting.

[0016] The utility model has at least the following beneficial effects:

[0017] 1) By introducing a safety jaw-opening device, this wafer rotation mechanism can ensure that during the clamping and releasing process of the wafer, the rotation axis angle only performs the wafer-picking operation when it reaches the preset correct position. When an angle deviation is detected, the device will immediately trigger a machine alarm and stop the wafer-picking action of the robotic arm, thus effectively avoiding wafer damage or debris generation caused by improper operation or equipment failure. This active safety mechanism significantly improves the safety of the wafer during production and transfer, ensuring the integrity and reliability of high-value products during the manufacturing process.

[0018] 2) In conjunction with the use of through-beam photoelectric sensors or pressure sensors, it provides real-time monitoring and abnormal alarm functions, ensuring the accurate positioning of the wafer during clamping and releasing, and preventing wafer damage or debris generation caused by angle deviation or equipment failure. Moreover, the precise cooperation between the jaw assembly and the jaw-opening assembly, and the circular bracket with a hollow design in combination with the spraying component and the vacuum suction component further ensure the stability of the wafer during cleaning and rotation, preventing the wafer from sliding or shifting, and improving the operation accuracy and stability of the entire clamping-type wafer rotation mechanism. Brief Description of the Drawings

[0019] To more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following-described drawings are only some embodiments of the present invention, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0020] Figure 1 It is a schematic structural diagram of a clamping-type wafer rotation mechanism with a safety jaw-opening device according to an embodiment of the present invention.

[0021] Reference Numerals: 1 - circular bracket; 2 - protective part; 3 - jaw assembly; 4 - jaw-opening assembly; 5 - through-beam photoelectric sensor; 6 - spraying component; 7 - vacuum suction component. Detailed Embodiments

[0022] The following will clearly and completely describe the technical solutions in the specific embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0023] The following describes the implementation of the present invention in detail in combination with specific embodiments.

[0024] In the embodiments of the present invention, with reference to Figure 1As shown, a clamping-type wafer rotating mechanism with a safety jaw-opening device is provided, which includes a rotating part, a circular bracket 1 and a protective part 2. It also includes a safety jaw-opening device, whose main function is to judge whether the rotating mechanism rotates to a preset jaw-opening angle. The rotating part is the core of the whole mechanism and is responsible for the rotation of the wafer. The circular bracket 1 is used to carry the wafer, is arranged above the rotating part and is connected to the rotating part to ensure its stable position during rotation. The protective part 2 is located on the periphery of the rotating part and the circular bracket 1, providing additional protection and safety mechanisms. At the same time, when the wafer is being cleaned, the protective part 2 rises to form a protective barrier to prevent liquid splashing from causing potential damage or contamination to the equipment or the wafer. A plurality of jaw components 3 are equidistantly arranged on the outer circumferential part of the circular bracket 1. Their main function is to support and clamp the wafer during the rotation of the wafer to ensure the stability of the wafer during processing. The protective part 2 is provided with jaw-opening components 4 corresponding to the jaw components 3, and these components are responsible for clamping or releasing the wafer under specific conditions. The operation of the whole mechanism is controlled by a PLC system to achieve automation and precise control. The PLC system can monitor the angular position of the rotating mechanism and send a signal to the jaw-opening component 4 when the preset angle is reached to perform the action of releasing the wafer.

[0025] Specifically, in this embodiment, the circular bracket 1 adopts a hollow design. A plurality of spraying components 6 are configured on the rotating part below the circular bracket 1. These components are evenly distributed below the circular bracket 1 and are responsible for applying precise cleaning liquid to the surface of the wafer during the cleaning process to ensure the overall cleanliness of the wafer surface. The circular bracket 1 is also integrated with a vacuum suction component 7, which is used to firmly adsorb the wafer to prevent any sliding or displacement during rotation or processing. The jaw component 3 includes a connected bearing block, a clamping block and a start switch. The start switch is responsible for opening or closing the clamping block to achieve the clamping and release of the wafer. The bearing block is specially designed with support protrusions and limit protrusions to support the wafer and prevent its sliding during processing. The rotating part includes a connected driving part, a transmission part and a rotating shaft. One end of the transmission part is connected to the driving part, the other end is connected to the rotating shaft, and the other end of the rotating shaft is connected to the circular bracket 1 to form a stable and precise rotating system.

[0026] The general operation process of this wafer rotation mechanism is as follows: Before the mechanism starts, the jaw assembly 3 remains in the open state, corresponding one by one to the jaw opening assembly 4. The jaw opening assembly 4 maintains this state by touching the start switch of the jaw assembly 3. When performing wafer cleaning, the wafer is accurately placed at the designated position on the circular bracket 1, and the wafer is adsorbed by the vacuum suction component 7 until the required adsorption strength is reached to ensure the stability of the wafer during rotation. Then the mechanism starts, and at the same time, the protection part 2 rises to prevent liquid splashing during the cleaning process. As the protection part 2 rises, the jaw opening assembly 4 automatically disengages from the start switch, and the jaw assembly 3 then closes to firmly hold the wafer. The rotation part drives the circular bracket 1 to rotate, and the spraying component 6 synchronously sprays the cleaning liquid to thoroughly clean the surface of the wafer. After the cleaning is completed, the rotation part decelerates the circular bracket 1 to a stop and rotates it to the preset jaw opening angle. The protection part 2 descends, and the jaw opening assembly 4 touches the start switch of the jaw assembly 3 again to release the wafer. At this time, the wafer that has been cleaned is safely taken out of the mechanism by the robotic arm. The entire process is intelligently controlled by the PLC system.

[0027] During the operation of the wafer rotation mechanism, it is inevitable that hardware components such as driving parts, transmission parts, or rotating shafts gradually age or are damaged due to long-term use. These potential faults may cause the rotating shaft to fail to reach the predetermined angle, thereby affecting the normal opening and closing of the jaw assembly 3, and ultimately may cause chip problems when the robotic arm picks up the wafer. To prevent such risks, the present utility model adds a safety jaw opening device on the protection part 2. This device can trigger an alarm on the machine through the PLC system when detecting an abnormal angle and automatically stop all operation processes, thus avoiding losses caused by improper operation. This immediate response mechanism not only improves the safety of the entire operation but also protects production efficiency and product quality by preventing possible chip problems.

[0028] In this embodiment, there are four jaw assemblies 3, and four jaw opening assemblies 4 are evenly and equidistantly arranged on the protection part 2, with the jaw opening assemblies 4 in the opposite directions being a group. The safety jaw opening device is two groups of opposed photoelectric sensors 5. Each group of opposed photoelectric sensors 5 includes a transmitter and a receiver to monitor whether the angle of the rotating shaft is within the predetermined range. The first group of opposed photoelectric sensors 5 is arranged at the middle position of a group of jaw opening assemblies 4 and will be blocked by the corresponding jaw assembly 3. The second group of opposed photoelectric sensors 5 is arranged at the side position of the other group of jaw opening assemblies 4 and is not blocked by the corresponding jaw assembly 3. Before the mechanism starts, both groups of opposed photoelectric sensors 5 are arranged at a height lower than the jaw assembly 3, so as to monitor the state of the jaw assembly 3 through the signal change of the photoelectric sensors during the start and execution of the wafer rotation mechanism.

[0029] After the wafer cleaning is completed, the circular bracket 1 rotates to a specific jaw-opening angle according to a preset program. At this time, the protective part 2 also descends back to its initial position. At this angle, due to the positional relationship, the first group of opposed photoelectric sensors 5 will be blocked by the jaw assembly 3, so they cannot receive the optical signal emitted by the transmitter. At the same time, since the second group of opposed photoelectric sensors 5 are arranged on the side position, they will not be blocked by the ascending protective part 2 or the jaw assembly 3, so they can receive the optical signal normally. This state indicates that the jaw assembly 3 has been correctly opened by the jaw-opening assembly 4, and the wafer is in a released state, and the next wafer-picking operation can be carried out. When the rotating shaft has a slight angular deviation, but this deviation has not exceeded the width of the jaw assembly 3, the second group of opposed photoelectric sensors 5 will be blocked by the jaw assembly 3 and cannot receive the optical signal emitted by the transmitter. At this time, the PLC system will detect this abnormal situation in real time and immediately trigger the alarm mechanism to prevent the risk of wafer fragmentation that may be caused by the failure of the jaw assembly 3 to open in time. If the angular deviation of the rotating shaft exceeds the width of the jaw assembly 3, the first group of opposed photoelectric sensors 5 will receive the optical signal, which is also an abnormal situation. After the PLC system detects this signal, it will also immediately trigger the alarm mechanism to avoid fragmentation caused by the failure of the jaw assembly 3 to correctly release the clamped wafer. Through this design, the wafer rotating mechanism can react in time when the angle of the rotating shaft is abnormal. Through the intelligent control of the PLC system, once an angular abnormality is detected, it can trigger an alarm and stop the operation in time, effectively avoiding the risk of wafer fragmentation caused by improper operation, thereby improving the safety and reliability of the entire system.

[0030] In other specific embodiments, the safety jaw opening device can also be a pressure sensor. In this design, the safety jaw opening device uses a pressure sensor instead of a photoelectric inductor to monitor the state of the jaw assembly 3. At least one pressure sensor is arranged on a jaw opening assembly 4 to sense whether the jaw assembly 3 is in the correct opening and closing state. After the wafer cleaning is completed, the circular bracket 1 rotates to a specific jaw opening angle according to a preset program, and at this time, the protection part 2 also descends back to the initial position. At this position, the pressure sensor on the jaw opening assembly 4 should touch the start switch on the jaw assembly 3. If the angle of the rotating shaft is offset, resulting in the failure of the jaw opening assembly 4 to correctly correspond to the jaw assembly 3 when the protection part 2 descends back to the initial position, one or more pressure sensors will not be able to sense the expected pressure value, and the system will identify this abnormality and trigger an alarm. The pressure sensor can accurately capture the pressure change during the touch and convert this mechanical signal into an electrical signal, and then send it to the PLC system. After receiving the signal from the pressure sensor, the PLC system will judge whether the jaw assembly 3 is in the correct open or closed state according to the change of the signal, ensuring the safety of the operation. If the pressure value detected by the pressure sensor does not match the preset value, the PLC system will immediately identify it as an abnormal situation and activate the alarm mechanism to prevent the risk of wafer fragmentation that may be caused by improper operation of the jaw assembly 3. Through the intelligent control of the PLC system, automatic monitoring and response are achieved, ensuring that the wafer rotating mechanism can operate safely and accurately at any time, and improving the safety and reliability of the entire system.

[0031] The present utility model significantly improves the safety and reliability of the wafer rotating mechanism in automated production by introducing an innovative safety jaw opening device. Through the intelligent control of the PLC system and the application of a photoelectric inductor or a pressure sensor, this mechanism can accurately monitor and ensure that the wafer is released at the correct preset angle of the rotating shaft, effectively avoiding operation errors or fragmentation risks caused by angle deviation. When detecting an abnormal angle, the safety jaw opening device can immediately trigger the alarm mechanism and automatically stop all operation processes. This proactive response mechanism not only improves the safety of the operation but also protects the production efficiency and product quality by preventing possible fragmentation problems. The present utility model not only improves the safety and efficiency in the wafer processing process but also significantly enhances the product quality through its innovative safety mechanism and automated control, reduces potential production losses, and creates greater economic value and market competitiveness for the enterprise.

[0032] It should be noted that for those of ordinary skill in the art of this technology, without departing from the principle of the present utility model, several improvements and modifications can be made to the present utility model, and these improvements and modifications also fall within the scope of protection of the claims of the present utility model.

Claims

1. A clamping type wafer rotating mechanism with a safety claw opening device, characterized in that, It includes a rotating part, a circular bracket (1) and a protective part (2). The circular bracket (1) is arranged above the rotating part and is connected to the rotating part. The protective part (2) is arranged outside the rotating part and the circular bracket (1). A plurality of jaw assemblies (3) for supporting and clamping a wafer are equidistantly arranged on the outer circumferential part of the circular bracket (1). An opening jaw assembly (4) corresponding to each jaw assembly (3) is arranged on the protective part (2). The wafer rotating mechanism further includes a safety opening jaw device.

2. The wafer rotation mechanism according to claim 1, wherein The jaw assembly (3) includes a connected bearing block, a clamping block and a start switch. The start switch opens or closes the clamping block. At least one support protrusion for supporting the wafer and at least one limit protrusion for preventing the wafer from sliding are further arranged on the bearing block.

3. The wafer rotation mechanism according to claim 2, wherein The opening jaw assembly (4) touches the start switch of the jaw assembly (3), the jaw assembly (3) does not clamp the wafer, and the circular bracket (1) is at a preset opening jaw angle. The opening jaw assembly (4) disengages from touching the start switch of the jaw assembly (3), and the jaw assembly (3) clamps the wafer.

4. The wafer rotation mechanism according to claim 3, wherein The safety opening jaw device is at least one set of opposed photoelectric sensors (5). Each set of opposed photoelectric sensors (5) includes a transmitter and a receiver.

5. The wafer rotation mechanism according to claim 4, wherein Four of the opening jaw assemblies (4) are evenly and equidistantly arranged on the protective part (2), and the opening jaw assemblies (4) in opposite directions are a set.

6. The wafer rotation mechanism according to claim 5, characterized in that, The safety opening jaw device is two sets of opposed photoelectric sensors (5). The first set of opposed photoelectric sensors (5) is arranged at the middle position of a set of the opening jaw assemblies (4) and is blocked by the corresponding jaw assembly (3). The second set of opposed photoelectric sensors (5) is arranged at the side position of the other set of the opening jaw assemblies (4) and is not blocked by the corresponding jaw assembly (3).

7. The wafer rotation mechanism according to claim 6, characterized in that, When the circular bracket (1) is at a preset opening jaw angle, the first set of opposed photoelectric sensors (5) is blocked by the jaw assembly (3) and cannot receive signals, and the second set of opposed photoelectric sensors (5) is located at the side of the jaw assembly (3) and can receive signals.

8. The wafer rotation mechanism according to claim 3, wherein The safety opening jaw device is at least one pressure sensor. The pressure sensor is arranged on the opening jaw assembly (4). When the circular bracket (1) is at a preset opening jaw angle, the pressure sensor on the opening jaw assembly (4) touches the switch of the jaw assembly (3).

9. The wafer rotation mechanism according to claim 1, wherein The rotating part includes a connected driving part, a transmission part and a rotating shaft. One end of the transmission part is connected to the driving part, the other end is connected to the rotating shaft, and the other end of the rotating shaft is connected to the circular bracket (1).

10. The wafer rotation mechanism according to claim 1, characterized in that, The circular bracket (1) adopts a hollow design. A plurality of spraying components (6) are arranged on the rotating part below the circular bracket (1), and a vacuum suction component (7) for adsorbing the wafer is arranged on the circular bracket (1).

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