Integrated circuit packaging shell

Abstract

The utility model provides an integrated circuit packaging shell, which comprises a packaging shell, a packaging base, a heat-conducting silicone grease layer and heat-conducting fins, honeycomb radiating holes are arranged at the front end and the rear end of the packaging shell in a penetrating manner, a rectangular groove is arranged at the upper end of the packaging shell, a heat-conducting fin is horizontally fixed at the lower end in the rectangular groove, and the packaging base is packaged at the lower end of the packaging shell. A chip mounting seat is mounted at the upper end of the packaging base, and an integrated circuit chip is mounted at the upper end of the interior of the chip mounting seat, so that the problem that the buffer frame and the shell cannot well protect the integrated circuit chip in the buffer frame and the shell due to the fact that a first vent hole and a second vent hole of an original device are large is solved; according to the utility model, the heat-conducting silicone grease layer with the protection structure is designed to replace the integrated circuit chip to be leaked to the outside, so that the heat-conducting silicone grease layer has a good protection function on the integrated circuit chip, and can conduct and dissipate heat transferred by the integrated circuit chip to ensure a good heat dissipation effect of the heat-conducting silicone grease layer.

Description

Technical Field

[0001] The utility model relates to an integrated circuit packaging shell, belonging to the technical field of packaging equipment. Background Art

[0002] An integrated circuit is a miniature electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected and made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function; all the components have formed a whole in structure, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. After the integrated circuit is produced, it needs to be packaged in a packaging shell to protect the integrated circuit.

[0003] Publication No.: CN220652003U, mentions an integrated circuit packaging shell, which can dissipate heat inside the shell through the heat sink, first ventilation holes, second ventilation holes and heat dissipation holes. Heat can also go out from the first ventilation holes, second ventilation holes and heat dissipation holes, thereby improving the heat dissipation performance of the integrated circuit packaging shell. However, in actual use, due to the large openings of the first ventilation holes and the second ventilation holes, the buffer frame and the shell cannot provide good protection for the integrated circuit chip inside. Now, an integrated circuit packaging shell is urgently needed to solve the above-mentioned problems. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the utility model is to provide an integrated circuit packaging shell to solve the problems raised in the above-mentioned background technology. The utility model designs a thermally conductive silicone grease layer with a protective structure to replace the integrated circuit chip to leak to the outside world, so that it can not only play a good protective function for the integrated circuit chip, but also conduct and dissipate the heat transferred by the integrated circuit chip to ensure its good heat dissipation effect.

[0005] In order to achieve the above-mentioned purpose, the utility model is realized through the following technical scheme: an integrated circuit packaging shell, comprising a packaging shell, a packaging base, a thermal grease layer and thermal fins, the packaging shell is penetrated with honeycomb heat dissipation holes at the front and rear ends, a rectangular groove is opened at the upper end of the packaging shell, a thermal conductive sheet is horizontally fixed at the lower end of the rectangular groove, the packaging base is packaged at the lower end of the packaging shell, a chip mounting seat is installed at the upper end of the packaging base, an integrated circuit chip is installed at the upper end of the chip mounting seat, a plurality of thermal conductive fins are provided, and a plurality of the thermal conductive fins are installed at the lower end of the thermal conductive sheet, the thermal grease layer is arranged at the upper end of the integrated circuit chip, and a protective frame is arranged at the lower edge of the thermal grease layer.

[0006] Further, the protective frame is wrapped around the upper edge of the integrated circuit chip.

[0007] Further, the lower ends of multiple heat conducting fins are all attached to the heat conducting silicone grease layer.

[0008] Further, multiple heat conducting fins are all located between multiple honeycomb heat dissipation holes.

[0009] Further, small mounting bolts are installed around the upper end of the encapsulation base.

[0010] Further, a buffer pad groove is formed at the lower end of the encapsulation base, and a buffer pad is installed inside the buffer pad groove.

[0011] Advantages of the present utility model: An integrated circuit encapsulation shell of the present utility model. Because the present utility model adds honeycomb heat dissipation holes, heat conducting fins, a heat conducting silicone grease layer, a protective frame and a heat conducting sheet, through our design improvement and actual use, it shows that the structure of this device is reasonable, the practicability is good. A heat conducting silicone grease layer with a protective structure is designed to replace the leakage of the integrated circuit chip to the outside, so that while it can play a good protective function for the integrated circuit chip, it can also conduct and dissipate the heat transmitted by the integrated circuit chip to ensure its good heat dissipation effect. Description of the Drawings

[0012] By reading the detailed description of the non-restrictive embodiments with reference to the following drawings, other features, purposes and advantages of the present utility model will become more obvious:

[0013] Figure 1 It is a three-dimensional schematic diagram of the overall structure of an integrated circuit encapsulation shell of the present utility model;

[0014] Figure 2 It is a cross-sectional schematic diagram of an integrated circuit encapsulation shell of the present utility model;

[0015] Figure 3 It is a three-dimensional structure schematic diagram of the heat conducting fins of an integrated circuit encapsulation shell of the present utility model;

[0016] In the figure: 1 - encapsulation shell, 2 - honeycomb heat dissipation hole, 3 - heat conducting fin, 4 - heat conducting silicone grease layer, 5 - protective frame, 6 - integrated circuit chip, 7 - chip mounting seat, 8 - pin, 9 - encapsulation base, 10 - buffer pad, 11 - small mounting bolt, 12 - rectangular groove, 13 - heat conducting sheet. Specific Embodiments

[0017] In order to make the technical means, creative features, achieved purposes and effects of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0018] Please refer toFigures 1 - 3 , the present utility model provides a technical solution: an integrated circuit package housing, including a package housing 1, a package base 9, a thermal grease layer 4, and heat dissipation fins 3. Honeycomb heat dissipation holes 2 are penetrated through both the front and rear ends of the package housing 1. A rectangular groove 12 is opened at the upper end of the package housing 1. A heat conducting sheet 13 is horizontally fixed at the lower end inside the rectangular groove 12. The package base 9 is encapsulated at the lower end of the package housing 1. A chip mounting seat 7 is installed at the upper end of the package base 9. An integrated circuit chip 6 is installed at the upper end inside the chip mounting seat 7. A plurality of heat dissipation fins 3 are provided, and all the plurality of heat dissipation fins 3 are installed at the lower end of the heat conducting sheet 13. The thermal grease layer 4 is provided at the upper end of the integrated circuit chip 6. A protective frame 5 is provided at the lower edge of the thermal grease layer 4. This design solves the problem that in the original device, due to the relatively large openings of the first ventilation hole and the second ventilation hole, the buffer frame and the housing cannot provide good protection for the integrated circuit chip inside.

[0019] As the first embodiment of the present utility model: The protective frame 5 wraps around the upper edge of the integrated circuit chip 6. By adding the protective frame 5, the upper side edge of the integrated circuit chip 6 can be shielded and protected. The lower ends of all the plurality of heat dissipation fins 3 are in contact with the thermal grease layer 4. By adding the thermal grease layer 4 with high thermal conductivity and excellent heat conduction performance, in cooperation with the plurality of heat dissipation fins 3, the heat generated when the integrated circuit chip 6 works can be quickly conducted. All the plurality of heat dissipation fins 3 are located between the plurality of honeycomb heat dissipation holes 2. By adding the plurality of honeycomb heat dissipation holes 2, it is convenient for the heat at the plurality of heat dissipation fins 3 to dissipate.

[0020] Small mounting bolts 11 are installed around the upper end of the package base 9. By adding the small mounting bolts 11, it is convenient to install the package base 9. A buffer pad groove is opened at the lower end of the package base 9, and a buffer pad 10 is installed inside the buffer pad groove. By adding the buffer pad 10, when the package housing 1 and the package base 9 are stressed, it can buffer them.

[0021] As the second embodiment of the present utility model: The added protective frame 5 can shield and protect the upper side edge of the integrated circuit chip 6, preventing the integrated circuit chip 6 from being exposed through the heat dissipation holes. At the same time, the thermal grease layer 4 has high thermal conductivity and excellent heat conduction performance. In cooperation with the plurality of heat dissipation fins 3, the heat generated when the integrated circuit chip 6 works can be quickly conducted. The opening of the plurality of honeycomb heat dissipation holes 2 facilitates the dissipation of the heat at the plurality of heat dissipation fins 3, thereby realizing a good heat dissipation function.

[0022] The foregoing has shown and described the basic principles, main features and advantages of the present utility model. For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and without departing from the spirit or basic features of the present utility model, the present utility model can be implemented in other specific forms. Therefore, in any aspect, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, it is intended to embrace all changes that fall within the meaning and scope of the equivalent elements of the claims in the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

[0023] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An integrated circuit package housing, comprising a package housing (1), a package base (9), a thermal grease layer (4), and a heat sink fin (3), characterized in that: The encapsulation housing (1) is provided with honeycomb heat dissipation holes (2) penetrating through both the front and rear ends. A rectangular groove (12) is formed at the upper end of the encapsulation housing (1), and a heat conducting sheet (13) is horizontally fixed at the lower end inside the rectangular groove (12). The encapsulation base (9) is encapsulated at the lower end of the encapsulation housing (1). A chip mounting seat (7) is installed at the upper end of the encapsulation base (9). An integrated circuit chip (6) is installed at the upper end inside the chip mounting seat (7). A plurality of heat conducting fins (3) are provided, and all of the plurality of heat conducting fins (3) are installed at the lower end of the heat conducting sheet (13). A heat conducting silicone grease layer (4) is arranged at the upper end of the integrated circuit chip (6), and a protective frame (5) is arranged at the lower end edge of the heat conducting silicone grease layer (4).

2. The integrated circuit package housing according to claim 1, wherein: The protective frame (5) wraps around the upper end edge of the integrated circuit chip (6).

3. An integrated circuit package housing according to claim 1, characterized in that: The lower ends of all of the plurality of heat conducting fins (3) are in contact with the heat conducting silicone grease layer (4).

4. An integrated circuit package housing according to claim 1, characterized in that: All of the plurality of heat conducting fins (3) are located between a plurality of honeycomb heat dissipation holes (2).

5. An integrated circuit package housing according to claim 1, characterized in that: Small mounting bolts (11) are installed around the upper end of the encapsulation base (9).

6. The integrated circuit package housing according to claim 1, wherein: A buffer pad groove is formed at the lower end of the encapsulation base (9), and a buffer pad (10) is installed inside the buffer pad groove.

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