Printing device for side metallization of chip attenuator

Abstract

A printing device for side face metallization of a sheet type attenuator comprises a printing machine, a working table arranged on the printing machine, a base arranged on the working table and a clamping jig detachably arranged on the base and used for clamping the sheet type attenuator, and an installation groove used for installing the clamping jig is formed in the base. The clamping jig comprises a carrier plate, a product groove extending downwards from the top face of the carrier plate, a plurality of buffer strips arranged in the product groove at intervals and a positioning mechanism arranged in the product groove, and an installation area used for installing the sheet type attenuator is formed between every two adjacent buffer strips. According to the plate type attenuator end coating device, the structure of the clamping jig is limited, the positioning mechanism is arranged to be matched with the multiple buffering strips to arrange and fix the plate type attenuators, then the plate type attenuators are fed into a printing machine to be subjected to side face end coating, and the problem that in the prior art, manual end coating is inconsistent is solved; and side face end coating can be conducted in batches, and the working efficiency is effectively improved.

Description

Technical Field

[0001] The utility model belongs to the field of preparation of chip attenuators, and particularly relates to a printing device for side metallization of chip attenuators. Background Art

[0002] When side metallization of chip components is usually carried out, the manual end coating method is usually adopted. Such a testing method requires frequent product picking and slurry replacement. Manual operation is complex and the product is easily damaged, which is not conducive to mass production and needs further improvement. Summary of the Invention

[0003] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a printing device for side metallization of chip attenuators.

[0004] The utility model adopts the following technical scheme:

[0005] A printing device for side metallization of chip attenuators includes a printing machine, a workbench surface arranged on the printing machine, a base arranged on the workbench surface, and a clamping fixture detachably arranged on the base for clamping chip attenuators. An installation groove for installing the clamping fixture is arranged on the base; the clamping fixture includes a carrier plate, a product groove extending downward from the top surface of the carrier plate, a plurality of buffer strips arranged at intervals in the product groove, and a positioning mechanism arranged in the product groove. An installation area for installing chip attenuators is formed between adjacent two buffer strips, and the positioning mechanism fixes the plurality of buffer strips and the plurality of chip attenuators in the product groove.

[0006] Further, the positioning mechanism includes a positioning block movably arranged in the product groove, two strip-shaped positioning holes arranged at intervals on the positioning block and extending along its moving direction, two positioning screw holes arranged at intervals in the product groove and extending downward and opposite to the two strip-shaped positioning holes, and two positioning bolts respectively passing through the two strip-shaped positioning holes and cooperating with the opposite positioning screw holes.

[0007] Further, it also includes a guiding member arranged between the base and the carrier plate. The guiding member includes two guiding columns oppositely arranged at both ends of the installation groove and extending upward, and two guiding holes arranged at intervals on the carrier plate and respectively cooperating with the two guiding columns.

[0008] Further, it also includes a fixing mechanism arranged between the carrier plate and the base. The fixing mechanism includes a locking mechanism arranged between the base and the carrier plate and a negative pressure adsorption mechanism arranged on the base for fixing the carrier plate.

[0009] Further, the locking mechanism is arranged in a matrix with a plurality of first locking holes in the installation groove, a plurality of second locking holes arranged on the carrier plate and respectively opposite to the plurality of first locking holes, and a plurality of locking bolts respectively passing through the second locking holes and cooperating with the opposite first locking holes.

[0010] Further, the second locking hole is a counterbore.

[0011] Further, the negative pressure adsorption mechanism includes a negative pressure hole extending downward from the bottom surface of the installation groove, a negative pressure source connected to the negative pressure hole, an adsorption groove provided on the bottom surface of the installation groove around the negative pressure hole, and an air inlet provided in the adsorption groove and extending downward to be connected to the negative pressure source.

[0012] Further, the base is detachably arranged on the workbench surface through a bolt assembly.

[0013] Further, the base further includes two relief grooves provided on opposite sides of the installation groove, and the depth of the installation groove is greater than the depth of the relief groove.

[0014] As can be seen from the above description of the present utility model, compared with the prior art, the beneficial effects of the present utility model are as follows: By defining the structure of the clamping fixture, the present application arranges and fixes the chip attenuator through the positioning mechanism in cooperation with multiple buffer strips, and then sends it into the printing machine for side-end coating, solving the problem of inconsistent manual end coating in the prior art, and can perform side-end coating in batches, effectively improving work efficiency; The overall structure is simple, effectively simplifying the metallization process of the chip attenuator, ensuring the consistency of the metallized appearance of the product, and reducing the quality and efficiency problems caused by manual operation; In addition, the positioning block can be movably located in the product groove, so that the clamping fixture can match products of multiple models and has better compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of the printing device;

[0016] Figure 2 It is an assembly schematic diagram of the base and the loading fixture;

[0017] Figure 3 It is an exploded schematic diagram of the base and the loading fixture;

[0018] Figure 4 It is a schematic structural diagram of the loading fixture;

[0019] Figure 5 It is an exploded schematic diagram of the loading fixture;

[0020] Figure 6 It is a schematic diagram of the state of the loading fixture loading the chip attenuator;

[0021] In the figure, 1 - printing press, 2 - workbench surface, 3 - base, 4 - clamping fixture, 5 - guiding member, 6 - fixing mechanism, 7 - chip attenuator, 31 - mounting groove, 32 - relief groove, 41 - carrier plate, 42 - product groove, 43 - buffer strip, 44 - positioning mechanism, 441 - positioning block, 442 - strip-shaped positioning hole, 443 - positioning screw hole, 444 - positioning bolt, 45 - mounting area, 51 - guiding column, 52 - guiding hole, 61 - locking mechanism, 611 - first locking hole, 612 - second locking hole, 62 - negative pressure adsorption mechanism, 621 - negative pressure hole, 622 - adsorption groove, 623 - air inlet. Specific embodiments

[0022] The present utility model will be further described below through specific embodiments.

[0023] Referring to Figures 1 to 6 As shown, a printing device for side metallization of a chip attenuator includes a printing press 1, a workbench surface 2 disposed on the printing press 1, a base 3 disposed on the workbench surface 2, a clamping fixture 4 detachably disposed on the base 3 for clamping the chip attenuator 7, a guiding member 5 disposed between the base 3 and the clamping fixture 4, and a fixing mechanism 6 disposed between the clamping fixture 4 and the base 3. Among them, the printing press 1 is a commonly used device in the field of preparing chip attenuators, and its specific structure and working principle will not be further elaborated here.

[0024] The workbench surface 2 is movably disposed on the printing press 1 to drive the clamping fixture 4 clamping the chip attenuator 7 to move into the printing press 1 for side-end coating of the chip attenuator 7. Specifically, a lead screw-nut pair and a servo motor can be disposed in the printing press 1 to drive the workbench surface 2 to move back and forth. Since how the workbench surface 2 moves is not the inventive point of this application, it will not be further elaborated here.

[0025] The base 3 is detachably disposed on the workbench surface 2, and includes a mounting groove 31 extending downward from its top surface for mounting the clamping fixture 4 and two relief grooves 32 disposed on opposite sides of the mounting groove 31. The depth of the mounting groove 31 is greater than the depth of the relief groove 32. Through the two relatively disposed relief grooves 32, it is convenient to take out the clamping fixture 4. Specifically, the base 3 is detachably disposed on the workbench surface 2 through a bolt assembly.

[0026] The clamping fixture 4 includes a carrier plate 41, a product groove 42 extending downward from the top surface of the carrier plate 41, a plurality of buffer bars 43 spaced in the product groove 42, and a positioning mechanism 44 arranged in the product groove 42. Among them, an installation area 45 for installing the chip attenuator 7 is formed between two adjacent buffer bars 43. The positioning mechanism 44 fixes the plurality of buffer bars 43 and the plurality of chip attenuators 7 in the product groove 42, and then sends them into the printing machine 1 for side-end coating, so as to simplify the metallization process, ensure the consistency of the product metallization appearance, and reduce the quality and efficiency problems caused by manual operation. In addition, by arranging the buffer bars 43 among the two-arranged chip attenuators 7, it can ensure that the orderly arranged chip attenuators 7 will not collide and rub against each other, thereby damaging the chip attenuator 7.

[0027] The positioning mechanism 44 includes a positioning block 441 movably arranged in the product groove 42, two strip-shaped positioning holes 442 spaced on the positioning block 441 and extending along its moving direction, two positioning screw holes 443 spaced in the product groove 42 and extending downward and opposite to the two strip-shaped positioning holes 442, and two positioning bolts respectively passing through the two strip-shaped positioning holes 442 and cooperating with the opposite positioning screw holes 443. By arranging the strip-shaped positioning holes 442 on the positioning block 441, it can move within the moving range to match a variety of chip attenuators 7, and can meet the increase and decrease of the printing quantity within a certain range, making the clamping fixture 4 have better compatibility.

[0028] The guiding member 5 is arranged between the base 3 and the carrier plate 41, and includes two guiding columns 51 oppositely arranged at both ends of the installation groove 31 and extending upward, and two guiding holes 52 spaced on the carrier plate 41 and respectively cooperating with the two guiding columns 51. Through the cooperation of the guiding column 51 and the guiding hole 52, the clamping fixture 4 can be quickly installed at a predetermined position.

[0029] The fixing mechanism 6 is arranged between the carrier plate 41 and the base 3, and includes a locking mechanism 61 arranged between the base 3 and the carrier plate 41 and a negative pressure adsorption mechanism 62 arranged on the base 3 for fixing the carrier plate 41. Through the cooperation of the negative pressure adsorption mechanism 62 and the locking mechanism 61, the clamping fixture 4 is stably fixed on the base 1.

[0030] The locking mechanism 61 includes a plurality of first locking holes 611 arranged in a matrix in the installation groove 31, a plurality of second locking holes 612 arranged on the carrier plate 41 and respectively opposite to the plurality of first locking holes 611, and a plurality of locking bolts respectively passing through the second locking holes 612 and cooperating with the opposite first locking holes 611. Through the cooperation of the locking bolts and the first locking holes 611, the carrier plate 41 and the base 3 are stably connected; specifically, the second locking holes 612 are counterbored holes.

[0031] The negative pressure adsorption mechanism 62 includes a negative pressure hole 621 extending downward from the bottom surface of the installation groove 31, a negative pressure source connected to the negative pressure hole, an adsorption groove 622 provided on the bottom surface of the installation groove 31 and surrounding the negative pressure hole 621, and an air inlet 623 provided in the adsorption groove 622 and extending downward to be connected to the negative pressure source. Through the cooperation between the negative pressure hole 621 and the adsorption groove 622, the carrier plate 41 can be stably adsorbed and fixed in the installation groove 31, and then locked by the locking mechanism 61, improving the stability of the connection between the carrier plate 41 and the base 3. During operation, the locking mechanism 616 and / or the negative pressure adsorption mechanism 62 can also be selected according to requirements to fix the carrier plate 41 in the installation groove 31, making the clamping fixture 4 have better compatibility.

[0032] In this application, by defining the structure of the clamping fixture 4, a positioning mechanism 44 is provided to cooperate with a plurality of buffer strips 43 to arrange and fix the chip attenuator 7, and then it is sent into the printing machine 1 for side-end coating, solving the problem of inconsistent manual end coating in the prior art, and side-end coating can be carried out in batches, effectively improving work efficiency. The overall structure is simple, effectively simplifying the metallization process of the chip attenuator, ensuring the consistency of the metallized appearance of the product, and reducing the quality and efficiency problems caused by manual operation. In addition, the positioning block 441 is movably located in the product groove 42, enabling the clamping fixture 4 to match products of various models and having better compatibility.

[0033] The above are only the preferred embodiments of the present invention, so the scope of implementation of the present invention cannot be limited thereby. That is, equivalent changes and modifications made according to the scope of the present invention application and the content of the specification should still fall within the scope covered by the present invention application.

Claims

1. A printing device for side metallization of a chip attenuator, characterized in that: It includes a printing press, a workbench surface provided on the printing press, a base provided on the workbench surface, and a clamping fixture detachably provided on the base for clamping a chip attenuator. An installation groove for installing the clamping fixture is provided on the base; the clamping fixture includes a carrier plate, a product groove extending downward from the top surface of the carrier plate, a plurality of buffer strips spaced in the product groove, and a positioning mechanism provided in the product groove. An installation area for installing the chip attenuator is formed between adjacent two of the buffer strips, and the positioning mechanism fixes the plurality of buffer strips and the plurality of chip attenuators in the product groove.

2. The printing device for side metallization of a chip attenuator according to claim 1, wherein: The positioning mechanism includes a positioning block movably provided in the product groove, two strip-shaped positioning holes spaced on the positioning block and extending along its moving direction, two positioning screw holes spaced in the product groove and extending downward and opposite to the two strip-shaped positioning holes, and two positioning bolts respectively passing through the two strip-shaped positioning holes and mating with the opposite positioning screw holes.

3. The printing device for side metallization of a chip attenuator according to claim 1, characterized in that: It further includes a guiding member provided between the base and the carrier plate. The guiding member includes two guiding columns oppositely provided at both ends of the installation groove and extending upward, and two guiding holes spaced on the carrier plate and respectively mating with the two guiding columns.

4. A printing device for side metallization of a chip attenuator according to claim 1, characterized in that: It further includes a fixing mechanism provided between the carrier plate and the base. The fixing mechanism includes a locking mechanism provided between the base and the carrier plate and a negative pressure adsorption mechanism provided on the base for fixing the carrier plate.

5. The printing device for side metallization of a chip attenuator according to claim 4, wherein: The locking mechanism is arranged in a matrix with a plurality of first locking holes in the installation groove, a plurality of second locking holes provided on the carrier plate and respectively opposite to the plurality of first locking holes, and a plurality of locking bolts respectively passing through the second locking holes and mating with the opposite first locking holes.

6. The printing device for side metallization of a chip attenuator according to claim 5, wherein: The second locking holes are counterbores.

7. A printing device for side metallization of a chip attenuator according to claim 4, characterized in that: The negative pressure adsorption mechanism includes a negative pressure hole extending downward from the bottom surface of the installation groove, a negative pressure source connected to the negative pressure hole, an adsorption groove provided on the bottom surface of the installation groove and surrounding the negative pressure hole, and an air inlet provided in the adsorption groove and extending downward and connected to the negative pressure source.

8. A printing device for side metallization of a chip attenuator according to claim 1, characterized in that: The base is detachably provided on the workbench surface through a bolt assembly.

9. The printing device for side metallization of a chip attenuator according to claim 1, characterized in that: The base further includes two relief grooves provided on opposite sides of the installation groove, and the depth of the installation groove is greater than the depth of the relief grooves.

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