Etching processing device of PCB (Printed Circuit Board)
By introducing a lifting swing frame and an etching frame structure into the etching processing device, the problem of low etching efficiency in the prior art is solved, and the simultaneous efficient etching of multiple substrates is achieved, and the contact effect between the etching liquid and the substrate surface is improved.
Patent Information
- Application Number
- CN202421677282.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-07-16
AI Technical Summary
The existing PCB circuit board etching processing device performs chemical etching through manual standing soaking, resulting in low etching efficiency of the etching liquid on the copper foil layer on the substrate surface.
An etching processing device is designed, including an electric lifting swing frame and an etching frame, equipped with arc hook grooves, damping anti-slip layer and extrusion screw pins, to achieve stable damping and extrusion positioning of the substrate, and to improve the contact efficiency between the etching liquid and the substrate through reciprocating swing.
The etching efficiency of the etching liquid on the surface of the copper foil layer of the PCB circuit board substrate is improved, and the substrate is avoided slipping during the etching process, thereby achieving efficient etching of multiple substrates at the same time.
Smart Images
Figure CN223067281U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB circuit board etching processing, in particular to an etching processing device for a PCB circuit board. Background Art
[0002] PCB circuit boards are widely used in various electronic devices, such as computers and peripheral devices, communication devices, electronic devices, medical devices, and automotive electronics.
[0003] The manufacturing process of a PCB circuit board is as follows: First, use EDA software for circuit design and layout, then transfer the designed circuit pattern to a substrate. Next, remove the unnecessary copper foil through chemical etching to form a conductive path. Then, drill vias and mounting holes at the required positions. Next, coat a layer of metal on the pads and conductive layers, then apply a solder mask. Next, print identification information and symbols. Finally, testing is required.
[0004] When a PCB circuit board is chemically etched, first coat a layer of photosensitive material on the substrate. Use an exposure machine to expose the photosensitive material on the substrate according to the circuit pattern in the Gerber file. After the exposure is completed, perform a developing process. The unexposed photosensitive material will be dissolved and removed, while the photosensitive material in the exposed area will be cured and remain on the substrate, forming a negative image of the circuit pattern. Then, place the developed substrate into an etching tank and use a chemical etching solution to etch the substrate. The etching solution will dissolve the copper foil layer not covered by the photosensitive material to form a positive image of the circuit pattern. After the etching is completed, it is only necessary to remove the remaining photosensitive material.
[0005] Currently, for the existing etching processing device for PCB circuit boards, generally, workers wear special gloves and directly hold the PCB circuit board and immerse it statically in an etching tank with an etching solution for chemical etching. This static immersion method will greatly reduce the etching efficiency of the etching solution for the copper foil layer on the substrate surface.
[0006] The above problems are widespread and urgently need to be improved. Content of the Utility Model
[0007] The purpose of the utility model is to solve the above-mentioned disadvantages existing in the prior art, and to propose an etching processing device for a PCB circuit board.
[0008] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0009] Design an etching processing device for a PCB circuit board, including an etching tank. A control box is provided on the side wall of the etching tank, and a control switch is provided on the control box. A first cylinder and a second cylinder are provided on the side wall of the etching tank. An elevating swing frame is provided above the etching tank. An etching placement frame is provided on the elevating swing frame. The etching placement frame is provided with a top arc surface and an arc hook groove. A damping anti-slip layer is provided in the arc hook groove. An extrusion screw pin is provided on the etching placement frame. A pin cap handle and an extrusion round head are provided on the extrusion screw pin. A first bracket is provided on the first cylinder, and a second bracket is provided on the second cylinder. An angle motor is provided on the first bracket, and a swing rod is provided on the angle motor.
[0010] Further, the front view cross-section of the elevating swing frame is a U-shaped structure. The outer wall of the swing rod is fixedly arranged with the elevating swing frame. The size of the top view of the elevating swing frame is not larger than the size of the top view of the opening of the etching tank.
[0011] Further, there are four groups of symmetrically arranged etching placement frames, and each group has two symmetrically arranged ones. The overall structure of the etching placement frame is in the shape of a hook character.
[0012] Further, the extrusion screw pin is threadedly connected to the etching placement frame. The pin cap handle is arranged on the outer end face of the extrusion screw pin. The extrusion round head is integrally in a cylindrical structure and is arranged on the inner end face of the extrusion screw pin.
[0013] Further, the damping anti-slip layer is evenly laid along the inner groove wall surface of the arc hook groove. The damping anti-slip layer is a silicone cushion layer structure with a thickness of 15 to 20 microns.
[0014] Further, the top arc surface is arranged at the bending corner of the etching placement frame, and a smooth layer is arranged on the surface of the top arc surface.
[0015] Further, a bearing is embedded in the second bracket. One end of the swing rod is fixedly arranged with the motor shaft of the angle motor, and the other end of the swing rod is fixedly sleeved with the bearing.
[0016] An etching processing device for a PCB circuit board proposed by the present utility model has the following beneficial effects:
[0017] 1. By providing an elevating swing frame that can be electrically lifted on the etching tank, and arranging four groups of etching placement frame structures with arc hook grooves on the elevating swing frame, and providing a control box with a control switch on the etching tank, the present utility model realizes the simultaneous etching of four substrates and the simultaneous reciprocating swing at a certain rotation angle, improving the effective contact between the surface copper foil layer of the four substrates and the etching solution and the etching. Overall, the etching efficiency of the etching solution for the surface copper foil layer of the substrate of the PCB circuit board is improved.
[0018] 2. The utility model realizes stable damped extrusion positioning of the substrate hooked on the etching rack by threadedly arranging extrusion screw pins on the etching rack, arranging extrusion round heads on the extrusion screw pins, and arranging a damping anti-slip layer structure on the inner wall surface of the arc-shaped hook groove, so as to avoid the situation that the substrate slips off the etching rack during reciprocating swing etching. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 is a three-dimensional schematic diagram of the overall structure of the utility model;
[0020] Figure 2 is of the utility model Figure 1 is a partial enlarged view of the etching rack structure at A in
[0021] Figure 3 is a top view schematic diagram of the overall structure of the utility model;
[0022] Figure 4 is of the utility model Figure 3 is a sectional view taken along the line B-B in
[0023] Figure 5 is of the utility model Figure 4 is a partial enlarged view of the extrusion screw pin structure at C in
[0024] Figure 6 is a block diagram of the utility model.
[0025] In the figure: 1 etching tank; 11 control box; 12 control switch; 2 first cylinder; 21 first bracket; 22 angle motor; 3 second cylinder; 31 second bracket; 32 bearing; 4 swing rod; 41 lifting swing frame; 5 etching rack; 51 top arc surface; 511 smooth layer; 52 arc-shaped hook groove; 53 damping anti-slip layer; 6 extrusion screw pin; 61 pin cap handle; 62 extrusion round head. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.
[0027] Referring to Figures 1-6, An etching processing device for a PCB circuit board, including an etching tank 1. A control box 11 is provided on the side wall of the etching tank 1. A control switch 12 is provided on the control box 11. A first cylinder 2 and a second cylinder 3 are provided on the side wall of the etching tank 1. An elevating and swinging frame 41 is provided above the etching tank 1. An etching placement frame 5 is provided on the elevating and swinging frame 41. The etching placement frame 5 is provided with a top arc surface 51 and an arc hook groove 52. A damping anti-slip layer 53 is provided in the arc hook groove 52. An extrusion screw pin 6 is provided on the etching placement frame 5. A pin cap handle 61 and an extrusion round head 62 are provided on the extrusion screw pin 6. A first bracket 21 is provided on the first cylinder 2. A second bracket 31 is provided on the second cylinder 3. An angle motor 22 is provided on the first bracket 21. A swinging rod 4 is provided on the angle motor 22. Two buttons are preset on the control switch 12 to respectively realize the power-on and power-off of the PLC.
[0028] A PLC is preset in the control box 11, and the PLC can control the synchronous opening and closing of the first cylinder 2 and the second cylinder 3 and the opening and closing of the angle motor 22.
[0029] The substrate described in this patent is the substrate used in the process of manufacturing a PCB circuit board, which is prior art. Installation holes need to be drilled before etching to facilitate hanging on the etching placement frame 5 later.
[0030] The front view cross-section of the elevating and swinging frame 41 is a U-shaped structure. The outer wall of the swinging rod 4 is fixedly arranged with the elevating and swinging frame 41. The size of the top view of the elevating and swinging frame 41 is not larger than the size of the opening top view of the etching tank 1, ensuring that the elevating and swinging frame 41, the etching placement frame 5, and the substrate as a whole are fully immersed in the etching tank 1.
[0031] The etching placement frames 5 are four groups in symmetry, and each group has two symmetrically arranged ones, realizing the effect of etching four substrates simultaneously while swinging.
[0032] The overall structure of the etching placement frame 5 is in the shape of a hook character, enabling the substrate to be directly and conveniently hung on the etching placement frame 5 through the preset installation holes on it.
[0033] The extrusion screw pin 6 is threadedly connected to the etching placement frame 5. The pin cap handle 61 is arranged on the outer end face of the extrusion screw pin 6. The extrusion round head 62 is a cylindrical structure as a whole and is arranged on the inner end face of the extrusion screw pin 6. The extrusion round head 62 is made of silica gel material, has damping friction elasticity, and can perform damping friction positioning on the surface of the substrate to avoid slipping during swinging.
[0034] The damping anti-slip layer 53 is evenly laid along the inner groove wall surface of the arc hook groove 52. The damping anti-slip layer 53 is a silicone cushion layer structure with a thickness of 15 to 20 microns. The silicone cushion layer structure has excellent weather resistance, and at the same time has excellent damping anti-elasticity and resistance to high and low temperatures, further ensuring the extrusion anti-slip positioning of the extrusion round head 62 and the damping anti-slip layer 53 on the surface of the substrate to avoid slipping during swinging.
[0035] The top arc surface 51 is arranged at the bent corner of the etching rack 5. A smooth layer 511 is arranged on the surface of the top arc surface 51. The smooth layer 511 is a graphite powder density coating layer, with a smooth and flat surface, which improves the smoothness of the substrate passing through its preset mounting holes through the top arc surface 51 and being hooked in the arc hook groove 52.
[0036] A bearing 32 is embedded in the second bracket 31. One end of the swing rod 4 is fixedly arranged on the motor shaft of the angle motor 22, and the other end of the swing rod 4 is fixedly sleeved with the bearing 32. The bearing 32 is a thrust ball bearing, which has a large axial load bearing capacity and avoids the lateral slippage of the swing rod 4.
[0037] Working mode: First, respectively sleeved four substrates preset with mounting holes on the arc hook grooves 52 of the four groups of etching racks 5. Then, clockwise rotate the pin cap handle 61 to drive the extrusion screw pin 6 to rotate clockwise. Through the threaded transmission with the etching rack 5, drive the extrusion screw pin 6 to move inwards. When the extrusion round head 62 and the damping anti-slip layer 53 both perform damping and stable extrusion positioning on the surface of the substrate, stop rotating the pin cap handle 61. At this time, it can avoid the situation that the substrate slips off the etching rack 5 during the reciprocating swing etching.
[0038] Next, press the button on the control switch 12. The PLC in the control box 11 will control the telescopic rods of the first cylinder 2 and the second cylinder 3 to retract downward, driving the lifting swing frame 41 and the etching rack 5 with four substrates hanging thereon to move downward as a whole. After all four substrates are immersed in the etching tank 1, the PLC in the control box 11 will control to stop the first cylinder 2 and the second cylinder 3 and start the angle motor 22. The motor shaft of the angle motor 22 will drive the swing rod 4 to rotate reciprocally along a certain rotation angle, and then drive the etching rack 5 to swing reciprocally at a certain swing angle through the lifting swing frame 41, so as to etch the copper foil layers on the four substrates simultaneously, thereby overall improving the etching efficiency of the etching solution for the copper foil layer on the surface of the substrate of the PCB circuit board.
[0039] The above is only the preferred specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present utility model.
Claims
1. An etching processing device for a PCB circuit board, comprising an etching tank (1), characterized in that: A control box (11) is provided on the side wall of the etching box (1). A control switch (12) is provided on the control box (11). A first cylinder (2) and a second cylinder (3) are provided on the side wall of the etching box (1). A lifting and swinging frame (41) is provided above the etching box (1). An etching placement frame (5) is provided on the lifting and swinging frame (41). The etching placement frame (5) is provided with a top arc surface (51) and an arc hook groove (52). A damping anti-slip layer (53) is provided in the arc hook groove (52). An extrusion screw pin (6) is provided on the etching placement frame (5). A pin cap handle (61) and an extrusion round head (62) are provided on the extrusion screw pin (6). A first bracket (21) is provided on the first cylinder (2). A second bracket (31) is provided on the second cylinder (3). An angle motor (22) is provided on the first bracket (21). A swinging rod (4) is provided on the angle motor (22).
2. An etching processing device for a PCB circuit board according to claim 1, characterized in that: The front view cross-section of the lifting and swinging frame (41) is a U-shaped structure. The outer wall of the swinging rod (4) is fixedly arranged with the lifting and swinging frame (41). The size of the top view surface of the lifting and swinging frame (41) is not larger than the size of the opening top view surface of the etching box (1).
3. An etching processing device for a PCB circuit board according to claim 1, characterized in that: The etching placement frames (5) are four groups in symmetry, and each group consists of two symmetrically arranged ones. The overall structure of the etching placement frame (5) is in the shape of a hooked character.
4. An etching processing device for a PCB circuit board according to claim 1, characterized in that: The extrusion screw pin (6) is threadedly connected to the etching placement frame (5). The pin cap handle (61) is arranged on the outer end surface of the extrusion screw pin (6). The extrusion round head (62) is a cylindrical structure as a whole and is arranged on the inner end surface of the extrusion screw pin (6).
5. An etching processing device for a PCB circuit board according to claim 1, characterized in that: The damping anti-slip layer (53) is evenly laid along the inner groove wall surface of the arc hook groove (52). The damping anti-slip layer (53) is a silicone cushion layer structure with a thickness of 15 to 20 microns.
6. The etching processing device for a PCB circuit board according to claim 1, characterized in that: The top arc surface (51) is arranged at the bending corner of the etching placement frame (5). A smooth layer (511) is arranged on the surface of the top arc surface (51).
7. An etching processing device for a PCB circuit board according to claim 1, characterized in that: A bearing (32) is embedded in the second bracket (31). One end of the swinging rod (4) is fixedly arranged with the motor shaft of the angle motor (22). The other end of the swinging rod (4) is fixedly sleeved with the bearing (32).