Wave crest jig

Abstract

The utility model relates to the field of circuit board welding production, and discloses a wave crest jig which comprises a carrier plate, a pressing plate and a leveling piece, and the carrier plate is provided with a containing groove used for containing and positioning a circuit board; the pressing plate is detachably connected with the carrier plate and is provided with an elastic abutting assembly, and the elastic abutting assembly is used for being pressed on an electronic component of the circuit board; and the flattening piece is connected with the carrier plate and / or the pressing plate and comprises a flattening surface, the flattening surface is positioned between the pressing plate and the groove bottom of the accommodating groove, and the flattening piece is used for limiting the substrate of the circuit board between the flattening surface and the groove bottom surface of the accommodating groove in the thickness direction. The wave crest jig provided by the utility model can solve the problem of how to improve the smoothness of the circuit board in the wave crest welding process.

Description

Technical Field

[0001] The utility model relates to the field of circuit board soldering production, and particularly relates to a wave crest jig. Background Art

[0002] A circuit board generally includes a substrate and electronic components. Currently, after the pins of the electronic components are inserted into the substrate, generally, a wave soldering device is used to fill liquid tin between the pins and the jacks of the substrate to form solder joints, thereby soldering and fixing the electronic components on the substrate.

[0003] During the wave soldering process, in order to prevent the electronic components from falling out of the jacks of the substrate, the prior art provides a wave soldering furnace through-jig. The wave soldering furnace through-jig includes a first jig and a second jig. The second jig is detachably connected to the first jig, and a plurality of elastic abutting components are provided on the surface of the second jig facing the first jig. The elastic abutting component includes an abutting column and a compression spring, and the compression spring is connected between the second jig and the abutting column. Before wave soldering, first, the substrate with inserted electronic components is placed on the first jig, then the second jig is detachably connected to the first jig, and each electronic component is tightly abutted against the substrate through the elastic abutting component, so as to limit the electronic components on the substrate. Then, the wave soldering furnace through-jig is sent into the tin furnace of the wave soldering device for soldering operation. During the soldering process, the elastic abutting component makes the abutting column tightly abut against the corresponding electronic component through the elastic force of the compression spring, effectively preventing the electronic components from falling out of the jacks of the substrate.

[0004] The wave soldering furnace through-jig can limit the position of the electronic components through the elastic force of the compression spring. However, in order to prevent the elastic abutting component from overpressing and damaging the electronic components, the elastic force of the compression spring is generally designed to be small, resulting in a small abutting force of the elastic abutting component on the circuit board. The abutting position of the elastic abutting component is prone to change in force, making it difficult to limit the circuit board to maintain flatness. As a result, the circuit board is prone to arching and deforming under high temperature, especially for large-area circuit boards, the flatness is more likely to deteriorate, resulting in the deviation of the preset soldering positions on the circuit board, thereby affecting the soldering quality of the circuit board. Summary of the Utility Model

[0005] (1) Technical Problems to be Solved

[0006] The utility model provides a wave crest jig, which can at least solve the technical problem of how to improve the flatness of the circuit board during the wave soldering process.

[0007] (2) Technical Solutions

[0008] To solve the above technical problems, the utility model provides the following technical solutions: A wave crest jig, comprising:

[0009] A carrier plate, the carrier plate is provided with a receiving groove for accommodating and positioning the circuit board;

[0010] A pressing plate, detachably connected to the carrier plate, and provided with an elastic abutting component, the elastic abutting component being used to press on the electronic components of the circuit board;

[0011] A flattening member, connected to the carrier plate and / or the pressing plate, and including a flattening surface located between the pressing plate and the bottom of the receiving groove, the flattening member being used to limit the substrate of the circuit board between the flattening surface and the bottom surface of the receiving groove in the thickness direction.

[0012] Further provided, the aforementioned circuit board is provided with a relief hole, the flattening member includes a first rod portion and a second rod portion fixedly connected, the second rod portion passes through the relief hole and is screwed to the carrier plate, and a stepped surface facing the bottom of the receiving groove is formed between the first rod portion and the second rod portion, and the stepped surface is configured as the flattening surface.

[0013] Further provided, the aforementioned first rod portion passes through the pressing plate and is circumferentially rotatably connected to the pressing plate.

[0014] Further provided, the aforementioned flattening member includes a first rod portion, the first rod portion passes through and is screwed to the pressing plate, and the bottom surface of the first rod portion is configured as the flattening surface.

[0015] Further provided, the aforementioned flattening member further includes a handle portion, and the first rod portion is connected to the handle portion.

[0016] Further provided, the electronic components on the aforementioned circuit board include a first electronic component with pin headers and a second electronic component without pin headers;

[0017] The elastic abutting component includes:

[0018] A first pressing block and a second pressing block, both the first pressing block and the second pressing block are slidably connected to the pressing plate, the first pressing block corresponds to the position of the first electronic component and is provided with a relief recess for accommodating the pin headers, and the second pressing block corresponds to the position of the second electronic component;

[0019] A first elastic member, the first elastic member connects the first pressing block and the pressing plate and drives the first pressing block to displace towards the carrier plate so that the first pressing block tightly abuts against the corresponding first electronic component;

[0020] A second elastic member, the second elastic member connects the second pressing block and the pressing plate and drives the second pressing block to displace towards the carrier plate so that the second pressing block tightly abuts against the corresponding second electronic component.

[0021] Further provided, a fixing member is rotatably connected to the aforementioned carrier plate, and the rotation connection part of the fixing member is located outside the notch of the receiving groove. Among them, when a part of the fixing member rotates above the notch of the receiving groove, the circuit board is limited within the receiving groove.

[0022] Further, a positioning structure is provided between the pressing plate and the carrier plate. The positioning structure includes a plurality of positioning seats and positioning columns. The positioning seats are provided with positioning holes. The positions of the positioning columns correspond to the positioning holes, and they are inserted and matched. A limiting surface is provided on the positioning column. The limiting surface faces the bottom of the receiving groove and abuts against the positioning seat to limit the positions of the pressing plate and the carrier plate in the height direction.

[0023] (III) Beneficial Effects

[0024] Compared with the prior art, a wave soldering jig provided by the present utility model has the following beneficial effects:

[0025] When the wave soldering jig provided by the present utility model is used, first, the circuit board is placed in the receiving groove of the carrier plate. Then, the pressing plate is detachably connected to the carrier plate, so that the elastic abutting assembly presses against the electronic components of the circuit board to limit the electronic components from detaching from the circuit board. Finally, the flattening member is connected to the carrier plate and / or the pressing plate, and the position of the substrate of the circuit board in the thickness direction is limited between the flattening surface and the bottom surface of the receiving groove. Then, the wave soldering jig can be sent into the tin furnace of the wave soldering equipment for welding operation. After the welding is completed, the flattening member and the pressing plate can be disassembled in sequence, the welded circuit board is taken out of the receiving groove, and the next circuit board to be welded is replaced. In this way, during the welding process, the wave soldering jig can limit the position of the substrate in the thickness direction between the flattening surface and the bottom surface of the receiving groove through the cooperation of the carrier plate and the flattening member. Moreover, since the flattening member is connected to the carrier plate and / or the pressing plate, compared with the elastic abutting assembly, the position of the flattening surface is less likely to change during the wave soldering process, and it is more capable of restricting the substrate from arching and deforming beyond the limits of the flattening surface and the bottom surface of the receiving groove, thereby effectively improving the flatness of the circuit board during the wave soldering process, especially for large-area circuit boards, to ensure the welding quality of the circuit board. Description of the Drawings

[0026] Figure 1 Is a perspective view of the wave soldering jig loading the circuit board in the embodiment;

[0027] Figure 2 Is an exploded view of the wave soldering jig without loading the circuit board in the embodiment;

[0028] Figure 3 Is a sectional view of the wave soldering jig loading the circuit board in the embodiment;

[0029] Figure 4 Is Figure 3 An enlarged schematic view of part A in

[0030] Figure 5 Is Figure 3 An enlarged schematic view of part B in

[0031] Reference Numerals in the Drawings:

[0032] 1. Carrier board; 11. Receiving groove; 12. Welding interface; 13. Screwing hole; 14. Guide block; 15. Concave part;

[0033] 2. Pressing plate;

[0034] 3. Elastic abutting component; 31. Second pressing block; 32. Second elastic member; 33. First pressing block; 331. Yielding concave part; 34. First elastic member;

[0035] 4. Flattening member; 41. Flattening surface; 42. First rod portion; 43. Second rod portion; 44. Handle portion;

[0036] 5. Fixing member;

[0037] 6. Positioning structure; 61. Positioning seat; 611. Positioning hole; 62. Positioning post; 621. Limiting surface;

[0038] 7. Detachable structure; 71. Card seat; 711. Card slot; 72. Claw;

[0039] 8. Circuit board; 81. Second electronic component; 82. First electronic component; 821. Pin; 83. Yielding hole;

[0040] 9. Flattening space. Specific embodiments

[0041] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0042] The present invention provides a wave soldering jig for solving the problem of how to improve the flatness of the circuit board 8 during wave soldering.

[0043] Refer to Figure 1 、 Figure 3 and Figure 4 as shown, Figure 1 is a perspective view of the wave soldering jig loading the circuit board in the embodiment, Figure 3 is a sectional view of the wave soldering jig loading the circuit board in the embodiment, Figure 4 is Figure 3 an enlarged schematic view of part A in, and the wave soldering jig includes a carrier board 1, a pressing plate 2 and a flattening member 4.

[0044] The carrier board 1 has a receiving groove 11 for receiving and positioning the circuit board 8.

[0045] The pressing plate 2 is detachably connected to the carrier plate 1, and an elastic abutting component 3 is installed on the pressing plate 2. The elastic abutting component 3 is used to press on the electronic components of the circuit board 8, so as to limit the electronic components at the corresponding plugging positions of the circuit board 8 for subsequent welding.

[0046] The flattening member 4 is connected to the carrier plate 1 and / or the pressing plate 2, and the flattening member 4 includes a flattening surface 41. The flattening surface 41 is located between the pressing plate 2 and the bottom of the receiving groove 11. The flattening member 4 is used to limit the substrate of the circuit board 8 between the flattening surface 41 and the bottom surface of the receiving groove 11 in the thickness direction.

[0047] When the wave soldering jig provided by the above technical solution is used, first, the circuit board 8 is placed into the receiving groove 11 of the carrier plate 1. Then, the pressing plate 2 is detachably connected to the carrier plate 1, so that the elastic abutting component 3 abuts against the electronic components of the circuit board 8 to limit the electronic components from detaching from the circuit board 8. Finally, the flattening member 4 is connected to the carrier plate 1 and / or the pressing plate 2, and the position of the substrate of the circuit board 8 in the thickness direction is limited between the flattening surface 41 and the bottom surface of the receiving groove 11. Then, the wave soldering jig can be sent into the tin furnace of the wave soldering equipment for welding operations. After welding, the flattening member 4 and the pressing plate 2 can be disassembled in sequence, the welded circuit board 8 is taken out of the receiving groove 11, and the next circuit board 8 to be welded is replaced. In this way, during the welding process, the wave soldering jig can limit the position of the substrate between the flattening surface 41 and the bottom surface of the receiving groove 11 through the cooperation of the carrier plate 1 and the flattening member 4. Moreover, the flattening member 4 is connected to the carrier plate 1 and / or the pressing plate 2. Compared with the elastic abutting component 3, the flattening member 4 can bear more force, so that the position of the flattening surface 41 is less likely to change during the wave soldering process, and it can better limit the substrate from arching and deforming beyond the limits of the flattening surface 41 and the bottom surface of the receiving groove 11, thereby effectively improving the flatness of the circuit board 8 during the wave soldering process, especially for large-area circuit boards 8, to ensure the welding quality of the circuit board 8.

[0048] Since the position near the center of the circuit board 8 or the position where the elastic abutting components 3 are less distributed is more likely to arch and deform when heated, therefore, the position of the above-mentioned flattening member 4 can be distributed at these more easily deformed positions, which can better improve the flatness of the circuit board 8 during the wave soldering process. And the more the number of the above-mentioned flattening members 4 and the larger the area of the flattening surface 41, the more the flatness of the circuit board 8 can be improved.

[0049] Both the bottom of the receiving groove 11 and the pressing plate 2 are provided with welding interfaces 12 for exposing the positions to be welded on the circuit board 8, so that the welding equipment can perform welding operations on the circuit board 8 on the carrier plate 1.

[0050] Refer to Figure 5 as shown in Figure 5 For Figure 3An enlarged schematic view at position B in the figure. A flat space 9 is formed between the flat surface 41 and the bottom surface of the receiving groove 11, and the substrate of the circuit board 8 is restricted within the flat space 9. That is, the flat space 9 can restrict the degree of deformation of the substrate, and the size of the flat space 9 can be set according to the dimensional quality requirements of the substrate thickness, so as to control the flatness of the substrate within the quality requirements, thereby ensuring the quality of the circuit board 8.

[0051] Refer to Figure 2 、 Figure 3 and Figure 4 as shown in Figure 2 Fig. is an exploded view of the wave soldering jig without the circuit board 8 loaded in the embodiment. In one embodiment of the flat member 4, the flat member 4 includes a first rod portion 42 and a second rod portion 43. The first rod portion 42 and the second rod portion 43 are fixedly connected by welding or integral connection. The circuit board 8 has a relief hole 83. The second rod portion 43 passes through the relief hole 83 and is screwed to the carrier plate 1. A stepped surface is formed between the first rod portion 42 and the second rod portion 43, and this stepped surface faces the bottom of the receiving groove 11 and is configured as the flat surface 41. Thus, since the second rod portion 43 is screwed to the carrier plate 1, by rotating the second rod portion 43, the distance between the flat surface 41 and the bottom surface of the receiving groove 11 (i.e., the size of the flat space 9) can be adjusted, so that the flat surface 41 is just in a position where it gently contacts or does not contact the substrate of the circuit board 8, so as to prevent the flat surface 41 from overpressing and damaging the surface of the substrate. If the substrate is deformed by heat, the flat space 9 can restrict the degree of deformation of the substrate, making it difficult for the substrate to arch and deform beyond the limit of the flat surface 41, especially at the position of the substrate opposite to the flat surface 41, thereby controlling the flatness of the substrate within the quality requirements.

[0052] Refer to Figure 2 and Figure 4 as shown in the figure. The bottom of the above-mentioned receiving groove 11 has a screw hole 13. The screw hole 13 has the same number as the relief hole 83 and is opposite in position. The screw hole 13 is used for screwing with the second rod portion 43.

[0053] Refer to Figure 2 、 Figure 3 and Figure 4 as shown in the figure. On the basis of the above-mentioned embodiment, the first rod portion 42 passes through the pressing plate 2 and is circumferentially rotatably connected to the pressing plate 2. Thus, the pressing plate 2 can restrict the axial position of the first rod portion 42, and thereby can restrict the axial position of the flat member 4, so as to ensure that the flat surface 41 is parallel to the surface of the circuit board 8 and improve the flattening effect of the flat member 4.

[0054] In an embodiment of the flattening member 4, the flattening member 4 includes a first rod portion 42. The first rod portion 42 penetrates and is screwed to the pressing plate 2, and the bottom surface of the first rod portion 42 is configured as a flattening surface 41. Thus, since the first rod portion 42 is screwed to the pressing plate 2, by rotating the first rod portion 42, the distance between the flattening surface 41 and the bottom surface of the receiving groove 11 (i.e., the size of the flattening space 9) can be adjusted, so that the flattening surface 41 is just located at a position where it gently contacts or does not contact the substrate of the circuit board 8, so as to prevent the flattening surface 41 from overpressing and damaging the surface of the substrate. If the substrate is deformed by heat, the flattening space 9 can limit the degree of deformation of the substrate, especially the position of the substrate opposite to the flattening surface 41, thereby controlling the flatness of the substrate within the quality requirements.

[0055] Refer to Figure 1 and Figure 2 As shown, on the basis of the above embodiment, the flattening member 4 further includes a handle portion 44. The first rod portion 42 and the handle portion 44 are connected by means of integral connection or pin shaft connection. Thus, the handle portion 44 can facilitate the rotation of the flattening member 4, thereby facilitating the adjustment of the distance between the flattening surface 41 and the bottom surface of the receiving groove 11.

[0056] Refer to Figure 1 , Figure 2 , Figure 3 and Figure 5As shown, in one embodiment of the elastic abutment assembly 3, the elastic abutment assembly 3 includes a second pressing block 31, a second elastic member 32, a first pressing block 33 and a first elastic member 34. The electronic components on the circuit board 8 include a first electronic component 82 with a pin header 821 and a second electronic component 81 without a pin header 821. The first pressing block 33 and the second pressing block 31 are both slidably connected to the pressing plate 2, the first pressing block 33 corresponds to the position of the first electronic component 82, the second pressing block 31 corresponds to the position of the second electronic component 81, and the first pressing block 33 has a recessed portion 331 for accommodating the pin header 821, and the recessed portion 331 prevents the first pressing block 33 from contacting the pin header 821. The first elastic member 34 connects the first pressing block 33 and the pressing plate 2 by abutting or bonding, and drives the first pressing block 33 to move toward the carrier 1, so that the first pressing block 33 is tightly abutted against the corresponding first electronic component 82. The second elastic member 32 connects the second pressing block 31 and the pressing plate 2 by abutting or bonding, and drives the second pressing block 31 to move toward the carrier 1, so that the second pressing block 31 is tightly abutted against the corresponding second electronic component 81. It can be seen that the elastic abutting component 3 can limit the first electronic component 82 with the pin row 821 and the second electronic component 81 without the pin row 821, wherein the pin row 821 of the first electronic component 82 is relatively soft and is easily bent and deformed under pressure. Therefore, the elastic abutting component 3 can limit the first electronic component 82 through the first pressing block 33, and can also avoid the first pressing block 33 from directly contacting the pin row 821, thereby bending and damaging the pin row 821. The second electronic component 81 is less likely to be damaged under pressure than the first electronic component 82. Therefore, the elastic abutting component 3 directly abuts against the second electronic component 81 through the second pressing block 31 to ensure a stable limiting effect on the second electronic component 81.

[0057] The first elastic member 34 and the second elastic member 32 may both be compression springs.

[0058] See also Figure 1 , Figure 2 and Figure 3 As shown, in one embodiment of the carrier 1, a fixing member 5 is rotatably connected to the carrier 1, and the rotatable connection of the fixing member 5 is located outside the notch of the receiving groove 11. When part of the fixing member 5 is rotated to above the notch of the receiving groove 11, the circuit board 8 is confined in the receiving groove 11 and cannot be moved out. It can be seen that the carrier 1 can quickly lock and unlock the carrier 1 and the circuit board 8 by rotating the fixing member 5 so that part of the fixing member 5 is rotated to above the notch of the receiving groove 11 or completely outside the notch of the receiving groove 11. The operation is simple and time-saving, and the fixing member 5 can effectively ensure that the circuit board 8 will not be separated from the carrier 1 during the welding process, and the circuit board 8 is not easily damaged. In this embodiment, the fixing member 5 is block-shaped.

[0059] See also Figure 1 and Figure 2As shown, in an embodiment of the carrier board 1, a plurality of guiding blocks 14 are fixed on the carrier board 1 by means of screwing or bonding. The guiding blocks 14 are located around the notch of the receiving groove 11 and are used to guide the circuit board 8 into the receiving groove 11 and cooperate with the receiving groove 11 to limit the installation position of the circuit board 8.

[0060] Refer to Figure 1 and Figure 2 As shown, in an embodiment where the pressing plate 2 and the carrier board 1 are detachably connected, there is a positioning structure 6 between the pressing plate 2 and the carrier board 1. The positioning structure 6 includes a plurality of positioning seats 61 and positioning columns 62. The positioning seats 61 have positioning holes 611. The positions of the positioning columns 62 correspond to those of the positioning holes 611 and are inserted and matched. There is a limiting surface 621 on the positioning column 62. The limiting surface 621 faces the bottom of the receiving groove 11 and abuts against the positioning seat 61 to limit the positions of the pressing plate 2 and the carrier board 1 in the height direction. In this way, the cooperation of the positioning seat 61 and the positioning column 62 can limit the left-right and front-back installation positions of the pressing plate 2 relative to the carrier board 1. Combining with the limiting surface 621 can limit the up-down installation position of the pressing plate 2 relative to the carrier board 1, avoiding the elastic abutting component 3 on the pressing plate 2 from overpressing on the electronic components of the circuit board 8, thereby damaging the circuit board 8. In summary, the installation position of the pressing plate 2 relative to the carrier board 1 can be positioned through the positioning structure 6.

[0061] Refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment where the pressing plate 2 and the carrier board 1 are detachably connected, the pressing plate 2 and the carrier board 1 are connected by a detachable structure 7. The detachable structure 7 includes a clamping seat 71 and a clamping claw 72. The clamping seat 71 has a clamping groove 711 for clamping the clamping claw 72. In this way, the pressing plate 2 and the carrier board 1 can be quickly detached and connected through the detachable structure 7, and the operation is simple and time-saving, thereby improving the production efficiency of the circuit board 8.

[0062] Refer to Figure 1 and Figure 2 As shown, in an embodiment of the carrier board 1, the carrier board 1 has a recess 15, and the recess 15 communicates with the notch of the receiving groove 11, which is convenient for taking out the circuit board 8 placed in the receiving groove 11.

[0063] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirits of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wave crest fixture, characterized in that, Comprising: A carrier board, which is provided with a receiving groove for receiving and positioning a circuit board; A pressing plate, detachably connected to the carrier board, and provided with an elastic abutting component, which is used to press on the electronic components of the circuit board; A flattening member, connected to the carrier board and / or the pressing plate, and including a flattening surface, the flattening surface being located between the pressing plate and the bottom of the receiving groove, and the flattening member being used to limit the substrate of the circuit board between the flattening surface and the bottom surface of the receiving groove in the thickness direction.

2. The wave crest fixture according to claim 1, characterized in that, The circuit board is provided with a relief hole, the flattening member includes a first rod portion and a second rod portion fixedly connected, the second rod portion penetrates through the relief hole and is screwed to the carrier board, and a stepped surface facing the bottom of the receiving groove is formed between the first rod portion and the second rod portion, and the stepped surface is configured as the flattening surface.

3. The wave crest jig according to claim 2, wherein, The first rod portion penetrates through the pressing plate and is circumferentially rotatably connected to the pressing plate.

4. A wave crest jig according to claim 1, characterized in that, The flattening member includes a first rod portion, the first rod portion penetrates through and is screwed to the pressing plate, and the bottom surface of the first rod portion is configured as the flattening surface.

5. A wave crest jig according to any one of claims 2-4, characterized in that, The flattening member further includes a handle portion, and the first rod portion is connected to the handle portion.

6. The wave crest jig according to claim 1, characterized in that, The electronic components on the circuit board include a first electronic component having pin headers and a second electronic component without pin headers; The elastic abutting component includes: A first pressing block and a second pressing block, both the first pressing block and the second pressing block are slidably connected to the pressing plate, the first pressing block corresponds to the position of the first electronic component and is provided with a relief recess for receiving the pin headers, and the second pressing block corresponds to the position of the second electronic component; A first elastic member, the first elastic member connects the first pressing block and the pressing plate, and drives the first pressing block to displace towards the carrier board, so that the first pressing block tightly abuts against the corresponding first electronic component; A second elastic member, the second elastic member connects the second pressing block and the pressing plate, and drives the second pressing block to displace towards the carrier board, so that the second pressing block tightly abuts against the corresponding second electronic component.

7. A wave crest jig according to claim 1, characterized in that, A fixing member is rotatably connected to the carrier board, and the rotation connection position of the fixing member is outside the opening of the receiving groove. Wherein, when a part of the fixing member rotates above the opening of the receiving groove, the circuit board is restricted within the receiving groove.

8. A wave crest jig according to claim 1, characterized in that, A positioning structure is provided between the pressing plate and the carrier board, the positioning structure includes a plurality of positioning seats and positioning columns, the positioning seats are provided with positioning holes, the positioning columns are opposite to the positioning holes in position and are inserted and matched, and a limiting surface is provided on the positioning columns, the limiting surface faces the bottom of the receiving groove and abuts against the positioning seats to limit the positions of the pressing plate and the carrier board in the height direction.

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