Reflow soldering equipment
By setting up a pressure relief device in the reflow soldering equipment, the problem of residual high pressure in the cooling pipeline is solved, ensuring the safety and reliability of equipment maintenance, and reducing the risk of disassembling parts.
Patent Information
- Application Number
- CN202421808817.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-07-29
AI Technical Summary
In reflow soldering equipment, after the cooling device is disconnected from the coolant source, there is still high pressure residue in the cooling pipeline, resulting in a risk of leakage when disassembling parts, affecting the safety and life of the equipment.
Pressure relief devices are provided in the reflow soldering equipment, including a pressure gauge, a control valve and a reservoir, which reduces the pressure in the pipeline by measuring the cooling fluid pressure and releasing the cooling fluid at high pressure to ensure safe disassembly.
The safety disassembly of cooling device components is realized, the risk of equipment failure and safety hazards of operators is reduced, and the safety and reliability of equipment maintenance is improved.
Smart Images
Figure CN223070600U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a reflow soldering device, particularly a reflow soldering device for performing reflow soldering operations on electronic components. Background Art
[0002] Reflow soldering devices are used to perform soldering operations on components such as mechanical or electronic components (e.g., circuit boards, chips, etc.). The soldering operation is accompanied by heating and high temperatures, and generates harmful gases. Therefore, a cooling device for cooling the high-temperature components in the reflow soldering device and the gases generated by soldering is provided inside the reflow soldering device. The cooling device mainly includes cooling pipes through which a coolant flows, as well as components such as cooling coils, pipe joints, and valves on the cooling pipes. The cooling pipes are connected to a coolant source through a coolant inlet and a coolant outlet provided on the equipment housing, such as an industrial pressure water supply facility inside a municipality or a factory.
[0003] Repairing or maintaining the components inside the reflow soldering device, particularly the components of the cooling device, requires disassembling these components. Even if the cooling device is disconnected from the industrial pressure water supply facility, there is still a relatively high fluid pressure remaining in the cooling device. In this case, it is still risky for an operator to remove or disconnect the cooling pipes or their connections to other components. For example, there may be a leakage of high-pressure coolant. The leaked industrial pressure water may cause short circuits, corrosion, etc. of the electrical components inside the equipment, which not only poses challenges to the safe operation of the operator but also affects the service life of the equipment components. Summary of the Utility Model
[0004] The purpose of this application is to accurately measure and release the coolant pressure in the cooling pipes of the cooling device under the above circumstances.
[0005] This purpose is achieved by the reflow soldering device of this application. The reflow soldering device of this application includes: a housing and a cooling device provided inside the housing. The cooling device includes a coolant inlet and a coolant outlet provided on the housing, and adjacent first and second cooling sections connected in series between the coolant inlet and the coolant outlet. The first cooling section and the second cooling section are in fluid communication with each other through an intermediate pipe section. The reflow soldering device further includes a pressure relief device. The pressure relief device includes a pressure gauge configured to measure the pressure of the coolant in the intermediate pipe section, a reservoir, and a control valve configured to control the flow of the coolant in the intermediate pipe section to the reservoir. The pressure gauge is provided on the intermediate pipe section.
[0006] In one embodiment, the control valve is provided on the intermediate pipe section, the reservoir, or an additional pipe section that fluidly connects the intermediate pipe section and the reservoir.
[0007] In one embodiment, the reservoir further includes an overflow port for partially discharging the coolant when the reservoir is filled with coolant, and an actuator for controlling the opening and closing of the overflow port.
[0008] In one embodiment, the reflow soldering device further includes a temporary container for receiving the coolant from the overflow port.
[0009] In one embodiment, the reservoir has a cylindrical structure, and the control valve, the overflow port, and the actuator are all provided on the cover of the reservoir. In one embodiment, the reservoir is provided inside the box body, or is provided outside the box body and connected to the control valve through a hose. In one embodiment, the actuator is a button provided on the top wall of the reservoir.
[0010] In one embodiment, the reservoir is detachably mounted on the box wall of the box body or on a cross beam fixed to the box wall through a mounting plate.
[0011] In one embodiment, a filter element is installed in the reservoir, which has a central hole for receiving the coolant from the intermediate pipe section and is configured to allow the coolant to flow through to filter out impurities therein.
[0012] In one embodiment, the first cooling section or the second cooling section is configured in one of the following forms: a single straight or bent pipe fitting; a part formed by a plurality of pipe fittings arranged in series and / or in parallel; a cooling coil; a cooler in a non-pipe fitting form.
[0013] In one embodiment, the first cooling section and the second cooling section are respectively a first cooling coil and a second cooling coil, and the first cooling coil and the second cooling coil are respectively detachably fixed to the box wall or the cross beam of the box body through mounting brackets.
[0014] In one embodiment, the pressure relief device further includes a switch provided on the intermediate pipe section, the switch is arranged close to the coolant inlet side, and the reservoir is arranged close to the coolant outlet side, and the pressure gauge is arranged between the switch and the reservoir.
[0015] According to the present application, a pressure relief device is provided inside the reflow soldering device. The pressure relief device includes a pressure gauge, a control valve, and a reservoir. After disconnecting the cooling device inside the reflow soldering device from an external coolant source, the reading of the pressure gauge can accurately reflect the coolant pressure inside the cooling device. When the coolant pressure exceeds the safety threshold, the pressure inside the cooling pipeline can be released by operating the control valve until the coolant pressure drops to the safety threshold or below, providing a safe operating environment for the operator to operate, specifically to disassemble the components of the cooling device. Description of the Drawings
[0016] The foregoing advantages and features of the present application, as well as other advantages, features and details, will be disclosed in the detailed description given below with reference to the accompanying drawings, enabling those skilled in the art to understand well.
[0017] Figure 1 A schematic diagram showing a part of a reflow soldering apparatus according to the present application.
[0018] Figure 2 A schematic diagram of an example of a reservoir of a reflow soldering apparatus. Specific Embodiments
[0019] The present application will be described in detail below in conjunction with exemplary embodiments of the accompanying drawings. The focus of the present application is on the improvement of the cooling device in the reflow soldering apparatus. Therefore, only the components associated with the cooling device are schematically shown in the reflow soldering apparatus in the drawings, and other functional components of the reflow soldering apparatus are omitted to avoid confusion. Those skilled in the art should understand that the components shown in the drawings do not necessarily exist in all embodiments of the present application, and the components not shown in the drawings may exist in some embodiments. In addition, the exemplary embodiments shown in the drawings are only used to illustrate the principle of the present application and do not limit the protection scope of the present application.
[0020] In the description of the present application, terms such as "first", "second", "third", etc. are used only to distinguish the same or similar components or features, and are not intended to impose any other limitations (such as order, importance, etc.). In this description, there is no quantifier modification in front of the features or elements, and the number of the features or elements is not clearly specified, indicating that the feature or element can be one or more, or includes at least one of the features or elements.
[0021] In the description of the application, the term "connection" and similar expressions should be understood in a broad sense. For example, unless it is clearly stated whether the connection is "direct connection" or "indirect connection", the connection can be a direct connection or an indirect connection via one or more intermediate components. Unless further specified, the connection can be a non-detachable connection, a detachable connection, or the two components can be integrally formed. When referring to the connection between the pipeline components of the cooling device, "fluid communication" should be understood, that is, the connection between the two components enables the coolant to communicate and flow between the components. For those of ordinary skill in the art, the specific meanings of the above terms in the application can be understood according to the specific situation.
[0022] Figure 1It shows a part of a reflow soldering device according to an exemplary embodiment of the present application. The reflow soldering device can be used for the reflow soldering process of various components. For example, the components can be mechanical components or electrical components such as packaged electronic chips. For example, the exemplary reflow soldering device of the present application can be a full hot air reflow oven, but the present application can be applied to any reflow soldering devices with different configurations, different forms, and different models having the same requirements.
[0023] Figure 1 It shows a part of the cabinet 10 of the exemplary reflow soldering device and the cooling device 20 inside the cabinet 10. Those skilled in the art understand that although not shown in the figure, the cabinet 10 also includes modules, subsystems, or components with various other functions besides the cooling function. For example, a heating module, an air circulation module, a support device, a flux application device, a soldering component, etc. A closable cabinet cover (not shown in the figure) is also installed on the cabinet 10.
[0024] The cooling device 20 includes a cooling pipe 21, which extends from a coolant inlet 22 on or outside the cabinet 10 through the cabinet wall 12 into the interior of the device, exchanges heat with the components inside the cabinet 10 and the high-temperature gas generated during soldering to provide a cooling effect, then passes through the cabinet wall 12 and extends out of the reflow soldering device, and finally terminates at a coolant outlet 24 on or outside the cabinet 10. The coolant inlet 22 and the coolant outlet 24 can be connected to a coolant source to supply coolant to the cooling device 20 inside the cabinet 10 and discharge the coolant. For example, the coolant is process cooling water, and the coolant source is a municipal or in-company water supply facility. Figure 1 It also shows a controller 15 for controlling the entire cooling device 20.
[0025] Inside the cabinet 10, the cooling pipe 21 of the cooling device 20 can include a plurality of "cooling sections", and these cooling sections are successively and serially connected along the flow path of the coolant from the coolant inlet 22 to the coolant outlet 24 to form the entire flow path or the cooling pipe 21. The term "cooling section" can refer to a generally straight or curved pipe fitting (such as a general "main" cooling pipe part); it can also refer to a part formed by a combination of a plurality of generally straight or curved pipe fittings, such as a series or parallel combination of a plurality of pipe fittings, such as the section formed by the illustrated cooling coils 25 and 35; it can also refer to other non-pipe-fitting forms of cooler devices arranged between two cooling sections composed of pipe fittings. Each cooling section of the cooling pipe 21 is connected by pipe joints known in the art.
[0026] In the illustrated example, the first cooling coil 25 and the second cooling coil 35 are two typical cooling sections in the cooling section of the cooling pipe 21. The first cooling coil 25 and the second cooling coil 35 are connected to each other and in fluid communication through an intermediate section 45 in the form of a pipe fitting. The pressure relief device 30 of the present application is provided on the intermediate pipe section 45. In the illustrated example, the first cooling coil 25 is arranged closer to the coolant inlet 22 side, and the second cooling coil 35 is arranged closer to the coolant outlet 24 side.
[0027] Specifically, the pressure relief device 30 includes a switch 32, a pressure gauge 34, a control valve 42( Figure 2 ), and a reservoir 38. The components of the pressure relief device 30 are arranged on the intermediate section 45 such that the switch 32 is closer to the first cooling coil 25, i.e., closer to the coolant inlet 22 side, the reservoir 38 is closer to the second cooling coil 35, i.e., closer to the coolant outlet 24 side, and the pressure gauge 34 is arranged between the switch 32 and the reservoir 38. Those skilled in the art understand that this is not restrictive, and the relative arrangement relationship between the components of the pressure relief device 30 can be changed without affecting the function of the pressure relief device 30. The switch 32 and the reservoir 38 can be interchanged to be arranged closer to the coolant outlet 24 and the coolant inlet 22 respectively.
[0028] The switch 32 is configured to close the intermediate pipe section 45 as needed when disassembling other components of the pressure relief device 30. The pressure gauge 34 is configured to measure the coolant pressure in the intermediate pipe section 45 or the cooling pipe 21. The control valve 42 is used to control the fluid communication between the intermediate pipe section 45 and the reservoir 38 to allow or prevent the coolant in the intermediate pipe section 45 from entering the reservoir 38 when pressure relief is needed or not needed. Although shown in the figure, the control valve 42 is provided on the reservoir 38, but it can be provided on the intermediate pipe section 45 or on an additional pipeline connecting the intermediate pipe section 45 and the reservoir 38 as long as it can achieve the control of the fluid communication between the intermediate pipe section 45 and the reservoir 38.
[0029] Combined with Figure 2 , the reservoir 38 has a container body 52 defining a certain volume and including a top wall 54. The top wall 54 can be integral with the container body 52 or a cover member attached to the container body 52. The above-mentioned control valve 42 is configured to fluidly connect the intermediate pipe section 45 and the reservoir 38 (volume) to control (to allow / prevent) the coolant in the intermediate pipe section 45 from entering the volume of the reservoir 38. An overflow port 44 and an actuator 46 for controlling the opening / closing of the overflow port 44 are provided on the top wall 54. The actuator 46 is configured to be actuated by an operator when the reservoir 38 is already full of coolant but the cooling pipe 21 needs to further release more coolant to allow a part of the coolant in the reservoir 38 to flow out through the overflow port 44.
[0030] During the normal operation of the reflow soldering equipment, the switch 32 in the pressure relief device 30 is in the closed state, which is a normally open switch, while the control valve 42 of the liquid reservoir 38 is in the normally closed state. The intermediate pipe section 45 provided with the pressure relief device 30 only allows the coolant to flow through. The coolant in the cooling device 20 does not enter the liquid reservoir 38.
[0031] When the reflow soldering equipment is being repaired, the operator first cuts off the connection between the cooling device 20 and the external water supply facility, that is, disconnects the coolant inlet 22 and the coolant outlet 24.
[0032] Then, the operator checks the pressure gauge 34 to view the coolant pressure in the cooling pipe 21 of the cooling device 20 inside the reflow soldering equipment. When the pressure shown on the pressure gauge 34 is higher than the safety threshold (for example, 30 PSI), the operator opens the control valve 42 of the liquid reservoir 38 to discharge the coolant in the intermediate pipe section 45 into the liquid reservoir 38, and the pressure in the cooling pipe 21 of the cooling device 20 decreases accordingly.
[0033] When the volume of the liquid reservoir 38 is filled with coolant (for example, the reading of the pressure gauge 34 remains unchanged within a period of time), if the pressure reading shown on the pressure gauge 34 is still higher than the safety threshold, the operator can activate the actuator 46 to partially discharge the coolant in the liquid reservoir 38 through the overflow port 44. Figure 1 A temporary container 60 for receiving the coolant discharged from the liquid reservoir 38 via the overflow port 44 is shown, such as a water receiving basin or a bucket. In this way, the coolant in the intermediate pipe section 45 can continue to be discharged into the liquid reservoir 38. Until the pressure reading shown on the pressure gauge 34 drops below the safety threshold or lower, for example, until the pressure shown on the pressure gauge 34 approaches 0. At this time, the operator can safely disassemble the components on the cooling device 20, such as the cooling coil 25 or 35, or other components such as the joints on the cooling pipe 21, for repair or replacement, etc., without any safety hazards.
[0034] The working principle of the pressure relief device 30 is described above. In the case where the above functions can be achieved, each component of the pressure relief device 30 can have any suitable specific structure and arrangement.
[0035] In the illustrated embodiment, any change in the relative arrangement relationship between the components of the pressure relief device 30 does not affect the function of the pressure relief device 30.
[0036] The switch 32 of the pressure relief device 30 can be omitted.
[0037] In the illustrated embodiment, the actuator 46 is configured as a button attached to the top wall 54 of the reservoir 38, and pressing the button by an operator causes the overflow port 44 of the reservoir 38 to open. The overflow port 44 closes when the operator releases the button. Those skilled in the art can change the specific structure and form of the actuator 46 as needed, as long as the above functions can be achieved. For example, the control valve 42 can also have any possible structure and installation position.
[0038] In the illustrated embodiment, the reservoir 38 has Figure 2 an exemplary structure, for example, having a generally cylindrical container body 52. The top wall 54 can be an integral cover of the container body 52 or a separate covering member attached thereto. Although not clearly visible in the figure, those skilled in the art can understand that a filtering element can be provided inside the container body 52. For example, a cylindrical or tubular filtering element is disposed inside the container body 52, and the filtering element can have a central hole to receive the coolant from the intermediate pipe section 45. The coolant flows downward and radially outward from the central hole of the filtering element or penetrates through the filtering element, and the particulate impurities in the coolant are trapped inside the filtering element. The filtered coolant can be discharged from the reservoir 38 via the overflow port 44 of the reservoir 38. The filtering element can be removable for removal, cleaning, or replacement when needed.
[0039] The reservoir 38 can be configured to be supported by the cabinet wall of the cabinet 10 itself or any wall or beam attached to the cabinet wall. For example, as shown in the figure, the reservoir 38 is fastened to the cross beam 18 attached to the cabinet wall 12 by the mounting device 50. Figure 2 An example of the mounting device 50 is given. The mounting device 50 includes a generally L-shaped mounting plate 62, and the mounting plate 62 includes a fixing portion 64 attached to the cross beam 18 and an attaching portion 66 attached to the reservoir 38. The attachment of the fixing portion 64 to the cross beam 18 and the attachment of the attaching portion 66 to the reservoir 38 can both be achieved by bolt connection, but are not limited to bolt connection. Any mechanical part method known in the art can be used.
[0040] Optionally, the reservoir 38 of the present application can be detachable. The reflow soldering equipment of the present application can be provided with either the reservoir 38 or the temporary container 60 or both as shown in the figure. The reservoir 38 can be disposed outside the reflow soldering equipment to be connected to the control valve 42 of the pressure relief device 30 through a hose.
[0041] In the illustrated example, each cooling coil 25 or 35 of the cooling device 20 is attached to the cross beam 18 by means of respective mounting brackets 58. The mounting brackets 58 for each cooling coil may be the same or different. In the case of achieving the mounting or fixing function, the mounting brackets 58 may be composed of any possible number or structural form of rods, plates, etc., which will not be described in detail and limited here. The cooling coils 25 or 35 are not limited to being fixed or attached to the same cross beam 18 as the liquid reservoir 38, but may be attached or fixed to the wall of the housing 10 itself or different internal beams or brackets. Optionally, when the internal pipe section of the cooling device 20 is rigid enough, the mounting brackets 58 may not be provided, and the liquid reservoir 38 of the pressure relief device 30 may also be suspended without additional fixing or support.
[0042] Although in the illustrated example, the pressure relief device 30 is arranged between two cooling sections in the form of cooling coils, the position of the pressure relief device 30 can be changed as required. The pressure relief device can be arranged between any two adjacent cooling sections along the flow direction of the coolant.
[0043] As shown in the figure, advantageously, the pressure relief device 30 can be arranged near the bottom of the reflow soldering equipment to facilitate the discharge of the coolant.
[0044] As described above, the present application provides a reflow soldering equipment integrated with a pressure relief function. The reflow soldering equipment of the present application realizes the accurate measurement of the coolant pressure in the cooling pipeline of the internal cooling device of the reflow soldering furnace by arranging a pressure relief device 30 including a pressure gauge 34 and a control valve 42. Compared with inferring the pressure in the internal cooling pipeline of the housing by relying on the readings of an external flow meter, the obtained pressure data is more reliable.
[0045] Based on the coordinated cooperation of the pressure relief device 30 and the liquid reservoir 38, the present application realizes the safe pressure relief function with a simple structure and low cost, ensuring the safety of the maintenance environment of the reflow soldering equipment. The pressure relief device 30 of the present application includes a pressure gauge 34 to provide accurate pressure readings. When the pressure reading is higher than the safety threshold, the operator can operate the control valve 42 to connect the cooling pipeline of the cooling device with the liquid reservoir 38 to discharge the coolant, realizing the discharge and pressure reduction of the coolant when the pressure is too high, and reducing the accident risk during the maintenance of the reflow soldering equipment. The liquid reservoir 38 of the pressure relief device 30 provides an overflow port controllable by the operator, providing an overflow protection effect.
[0046] In summary, by providing the pressure relief device 30, the reflow soldering equipment of the present application improves the safe operating environment for the reflow soldering equipment, especially for the disassembly or repair of the components of its cooling device. When the residual pressure in the cooling pipeline measured by the pressure gauge 34 is too high, the residual pressure can be gradually released in a controlled manner first, and then the components can be disassembled, effectively avoiding the situation that the disassembly of the components of the cooling device is difficult due to the excessive (residual) pressure in the cooling pipeline and the possible harm to the operators.
[0047] The principle of the present application has been described above with reference to the examples in the drawings. Without departing from the principle of the present application, those skilled in the art can modify the specific features and structural details. All modifications are considered to fall within the protection scope of the present application.
Claims
1. A reflow soldering device, comprising: a box body (10) and a cooling device (20) arranged inside the box body (10), the cooling device (20) including a coolant inlet (22) and a coolant outlet (24) arranged on the box body (10) and a first cooling section and a second cooling section adjacent to each other connected in series between the coolant inlet (22) and the coolant outlet (24) therebetween. It is characterized in that the first cooling section and the second cooling section are in fluid communication with each other through an intermediate pipe section (45). The reflow soldering device further includes a pressure relief device (30), the pressure relief device (30) including a pressure gauge (34) configured to measure the pressure of the coolant in the intermediate pipe section (45), a liquid reservoir (38), and a control valve (42) configured to control the flow of the coolant in the intermediate pipe section (45) to the liquid reservoir (38), and the pressure gauge (34) is arranged on the intermediate pipe section (45).
2. The reflow soldering equipment according to claim 1, wherein The control valve (42) is arranged on the intermediate pipe section (45), the liquid reservoir (38), or an additional pipe section that fluidly connects the intermediate pipe section (45) and the liquid reservoir (38).
3. The reflow soldering equipment according to claim 1, characterized in that The liquid reservoir (38) further includes an overflow port (44) for partially discharging the coolant when the liquid reservoir (38) is filled with coolant and an actuator (46) for controlling the opening and closing of the overflow port (44).
4. The reflow soldering apparatus according to claim 3, characterized in that, The reflow soldering device further includes a temporary container (60) for receiving the coolant from the overflow port (44).
5. The reflow soldering equipment according to claim 4, characterized in that At least one of the following: The liquid reservoir (38) has a cylindrical structure, and the control valve (42), the overflow port (44), and the actuator (46) are all arranged on the cover of the liquid reservoir (38); The liquid reservoir (38) is arranged inside the box body (10), or is arranged outside the box body (10) and connected to the control valve (42) through a hose; The actuator (46) is a button arranged on the top wall (54) of the liquid reservoir (38).
6. The reflow soldering equipment according to claim 3, characterized in that, The liquid reservoir (38) is detachably mounted on the box body wall of the box body (10) or a cross beam (18) fixed to the box body wall through a mounting plate (62).
7. The reflow soldering equipment according to any one of claims 1-6, characterized in that, A filter element is installed in the liquid reservoir (38), which has a central hole for receiving the coolant from the intermediate pipe section (45) and is configured to allow the coolant to flow through to filter impurities therein.
8. The reflow soldering equipment according to any one of claims 1-6, characterized in that, The first cooling section or the second cooling section is configured in one of the following forms: A single straight or bent pipe fitting; A part formed by arranging a plurality of pipe fittings in series and / or in parallel; Cooling coils (25, 35); A cooler in a non-pipe fitting form.
9. The reflow soldering apparatus according to claim 6, wherein, The first cooling section and the second cooling section are respectively a first cooling coil (25) and a second cooling coil (35), and the first cooling coil (25) and the second cooling coil (35) are respectively detachably fixed to the box body wall of the box body (10) or the cross beam (18) through mounting brackets (58).
10. The reflow soldering equipment according to any one of claims 1-6, characterized in that, The pressure relief device (30) further includes a switch (32) disposed on the intermediate pipe section (45), the switch (32) is arranged closer to the coolant inlet (22) side, and the liquid reservoir (38) is arranged closer to the coolant outlet (24) side, and the pressure gauge (34) is disposed between the switch (32) and the liquid reservoir (38).