Polishing device for silicon-based oxide layer of power semiconductor chip

Abstract

The utility model discloses a power semiconductor chip silicon-based oxide layer polishing device which comprises an operation table, a rotary connecting shaft is rotatably connected to the surface of one side of the operation table in a penetrating mode, a polishing disc is fixedly connected to the top of the rotary connecting shaft, and a first power assembly for driving the rotary connecting shaft to rotate is installed on the lower surface of the operation table. And the upper surface of the other side of the operation table is fixedly connected with a fixed rectangular plate. According to the automatic polishing device, a second servo motor is started, an output shaft of the second servo motor drives a threaded rotating rod to rotate, a lifting connecting frame drives a discharging disc to descend, and the to-be-polished face of an object makes contact with a polishing disc; and then a first servo motor is started, an output shaft of the first servo motor drives a rotary connecting shaft to rotate, so that the rotary connecting shaft drives a grinding disc to rotate, the object is ground, manual cleaning is not needed, the working efficiency is improved, and the cleaning effect is also guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding, in particular to a grinding device for a silicon-based oxide layer of a power semiconductor chip. Background Art

[0002] At present, due to the limited environmental storage conditions on the surface of the power semiconductor chip, an oxide layer is easily generated. The generation of this oxide layer will affect the key electrical performance of the power semiconductor chip and shorten its service life; and the silicon-based oxide layer is difficult to remove. The existing treatment method is to manually remove it by coating a chemical agent on the surface of the oxide layer. The defects of this method include: the chemical agent has a special smell and is harmful to the human body; the manual removal is inefficient and the removal effect is also poor. Therefore, a grinding device has been developed. Summary of the Utility Model

[0003] The purpose of the utility model is to solve the defects existing in the prior art, and a grinding device for a silicon-based oxide layer of a power semiconductor chip is proposed.

[0004] To achieve the above purpose, the utility model adopts the following technical scheme: a grinding device for a silicon-based oxide layer of a power semiconductor chip, including an operating table, a rotating connection shaft is rotatably connected through one side surface of the operating table, a grinding disc is fixedly connected to the top of the rotating connection shaft, a first power component for driving the rotating connection shaft to rotate is installed on the lower surface of the operating table, a fixed rectangular plate is fixedly connected to the upper surface of the other side of the operating table, a fixed column is fixedly connected to the upper surface of the fixed rectangular plate, a lifting connection frame is sleeved on the outer surface of the fixed column, a second power component for driving the lifting connection frame to lift is installed on the upper surface of the fixed rectangular plate, a blowing component is arranged on the upper surface of the lifting connection frame, a vertical installation rod is fixedly connected to the lower surface of the lifting connection frame, and a feeding component is connected to the bottom of the vertical installation rod.

[0005] As a further description of the above technical solution:

[0006] The first power component includes a mounting frame fixedly connected to the lower surface of the operating table, a first servo motor is fixedly connected to the upper surface of the mounting frame, and the output shaft of the first servo motor is fixedly connected to the bottom end of the rotating connection shaft.

[0007] As a further description of the above technical solution:

[0008] The second power component includes a second servo motor fixedly connected to the upper surface of the fixed rectangular plate, a threaded rotating rod is fixedly connected to the output shaft of the second servo motor, and the lifting connection frame is threadedly connected to the outer surface of the threaded rotating rod.

[0009] As a further description of the above technical solution:

[0010] The blowing component includes a hair dryer fixedly connected to the upper surface of the lifting connecting frame. A connecting pipe is fixedly connected to the air outlet of the hair dryer, and a blowing nozzle is fixedly connected to the end of the connecting pipe away from the hair dryer.

[0011] As a further description of the above technical solution:

[0012] The feeding component includes a feeding tray fixedly connected to the bottom of the installation vertical rod. A feeding groove is formed on the lower surface of the feeding tray. Two symmetrically arranged U-shaped mounting seats are fixedly connected to the outer surface of the feeding tray. A pushing cylinder is fixedly connected to one side of the U-shaped mounting seat, and a movable ejector rod is fixedly connected to the piston end of the pushing cylinder. The movable ejector rod extends into the feeding groove.

[0013] As a further description of the above technical solution:

[0014] A receiving tray is installed on the upper surface of the operating table, and the rotating connecting shaft penetrates through the receiving tray.

[0015] The present utility model has the following beneficial effects:

[0016] 1. Compared with the prior art, for the power semiconductor chip silicon-based oxide layer grinding device, when the second servo motor is started, the output shaft of the second servo motor drives the threaded rotating rod to rotate, so that the lifting connecting frame drives the feeding tray to descend, making the surface to be ground of the object contact the grinding disc; then the first servo motor is started, and the output shaft of the first servo motor drives the rotating connecting shaft to rotate, so that the rotating connecting shaft drives the grinding disc to rotate, thereby grinding the object. There is no need for manual cleaning, which improves the operation efficiency and ensures the cleaning effect.

[0017] 2. Compared with the prior art, for the power semiconductor chip silicon-based oxide layer grinding device, when the hair dryer is started, the blowing nozzle blows air towards the grinding disc, blowing the waste chips on the surface of the grinding disc into the receiving tray, reducing the accumulation of waste chips on the surface of the grinding disc, which is beneficial to the grinding operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a perspective view of a power semiconductor chip silicon-based oxide layer grinding device proposed by the present utility model;

[0019] Figure 2 is a front view of a power semiconductor chip silicon-based oxide layer grinding device proposed by the present utility model;

[0020] Figure 3 is a schematic diagram of the lifting connecting frame of a power semiconductor chip silicon-based oxide layer grinding device proposed by the present utility model.

[0021] Legend Explanation:

[0022] 1. Operating table; 2. Rotating connecting shaft; 3. Grinding disc; 4. Mounting frame; 5. First servo motor; 6. Scrap collection tray; 7. Fixed rectangular plate; 8. Fixed column; 9. Second servo motor; 10. Threaded rotating rod; 11. Lifting connecting frame; 12. Hair dryer; 13. Connecting pipe; 14. Air blowing nozzle; 15. Mounting vertical rod; 16. Feeding tray; 17. U-shaped mounting seat; 18. Pushing cylinder; 19. Moving ejector rod; 20. Feeding groove. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0024] Referring to Figures 1 to 3 , a silicon-based oxide layer grinding device for a power semiconductor chip provided by the present invention includes an operating table 1. A rotating connecting shaft 2 is rotatably connected through one side surface of the operating table 1. A grinding disc 3 is fixedly connected to the top of the rotating connecting shaft 2. A scrap collection tray 6 is installed on the upper surface of the operating table 1. The rotating connecting shaft 2 penetrates through the scrap collection tray 6. The scrap collection tray 6 facilitates the collection of the waste chips after grinding and is convenient for subsequent manual centralized treatment;

[0025] A first power component for driving the rotation of the rotating connecting shaft 2 is installed on the lower surface of the operating table 1. The first power component includes a mounting frame 4 fixedly connected to the lower surface of the operating table 1. A first servo motor 5 is fixedly connected to the upper surface of the mounting frame 4. The output shaft of the first servo motor 5 is fixedly connected to the bottom end of the rotating connecting shaft 2;

[0026] A fixed rectangular plate 7 is fixedly connected to the upper surface of the other side of the operating table 1. A fixed column 8 is fixedly connected to the upper surface of the fixed rectangular plate 7. A lifting connecting frame 11 is sleeved on the outer surface of the fixed column 8. A second power component for driving the lifting of the lifting connecting frame 11 is installed on the upper surface of the fixed rectangular plate 7. The second power component includes a second servo motor 9 fixedly connected to the upper surface of the fixed rectangular plate 7. The output shaft of the second servo motor 9 is fixedly connected to a threaded rotating rod 10. The lifting connecting frame 11 is threadedly connected to the outer surface of the threaded rotating rod 10;

[0027] In order to achieve the purpose of blowing off the waste chips, a blowing component is arranged on the upper surface of the lifting connecting frame 11. The blowing component includes a hair dryer 12 fixedly connected to the upper surface of the lifting connecting frame 11. An air outlet of the hair dryer 12 is fixedly connected to a connecting pipe 13. One end of the connecting pipe 13 away from the hair dryer 12 is fixedly connected to an air blowing nozzle 14;

[0028] To achieve the purpose of clamping and fixing, a mounting vertical rod 15 is fixedly connected to the lower surface of the lifting connecting frame 11. The bottom of the mounting vertical rod 15 is connected with a feeding component. The feeding component includes a feeding tray 16 fixedly connected to the bottom of the mounting vertical rod 15. A feeding groove 20 is formed on the lower surface of the feeding tray 16. The surface of the object to be polished should be exposed outside the feeding groove 20. Two symmetrically arranged U-shaped mounting seats 17 are fixedly connected to the outer surface of the feeding tray 16. A pushing cylinder 18 is fixedly connected to one side of the U-shaped mounting seat 17. The piston end of the pushing cylinder 18 is fixedly connected with a movable ejector rod 19, and the movable ejector rod 19 extends into the feeding groove 20.

[0029] Working principle:

[0030] During use, place the object to be polished into the feeding groove 20 on the lower surface of the feeding tray 16 with the surface to be polished facing down. Then start the two pushing cylinders 18. The piston ends of the pushing cylinders 18 drive the movable ejector rods 19 to move, so that the two movable ejector rods 19 approach each other to clamp the object. Then start the second servo motor 9. The output shaft of the second servo motor 9 drives the threaded rotating rod 10 to rotate, so that the lifting connecting frame 11 drives the feeding tray 16 to descend, making the surface to be polished of the object contact the polishing disc 3.

[0031] Then start the first servo motor 5. The output shaft of the first servo motor 5 drives the rotating connecting shaft 2 to rotate, so that the rotating connecting shaft 2 drives the polishing disc 3 to rotate, thereby polishing the object. At the same time, start the hair dryer 12, so that the blowing nozzle 14 blows air towards the polishing disc 3, blowing the waste chips on the surface of the polishing disc 3 into the material receiving tray 6, reducing the accumulation of waste chips on the surface of the polishing disc 3 and facilitating the polishing operation.

[0032] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A silicon-based oxide layer polishing device for a power semiconductor chip, comprising an operating table (1), characterized in that: One side surface of the operating table (1) is rotatably connected through a rotating connecting shaft (2). A grinding disc (3) is fixedly connected to the top of the rotating connecting shaft (2). A first power assembly for driving the rotation of the rotating connecting shaft (2) is installed on the lower surface of the operating table (1). A fixed rectangular plate (7) is fixedly connected to the upper surface of the other side of the operating table (1). A fixed vertical column (8) is fixedly connected to the upper surface of the fixed rectangular plate (7). A lifting connecting frame (11) is sleeved on the outer surface of the fixed vertical column (8). A second power assembly for driving the lifting of the lifting connecting frame (11) is installed on the upper surface of the fixed rectangular plate (7). A blowing assembly is arranged on the upper surface of the lifting connecting frame (11). A mounting vertical rod (15) is fixedly connected to the lower surface of the lifting connecting frame (11). A feeding assembly is connected to the bottom of the mounting vertical rod (15).

2. The silicon-based oxide layer grinding device for a power semiconductor chip according to claim 1, characterized in that: The first power assembly includes a mounting frame (4) fixedly connected to the lower surface of the operating table (1). A first servo motor (5) is fixedly connected to the upper surface of the mounting frame (4). The output shaft of the first servo motor (5) is fixedly connected to the bottom end of the rotating connecting shaft (2).

3. A silicon-based oxide layer polishing device for a power semiconductor chip according to claim 1, characterized in that: The second power assembly includes a second servo motor (9) fixedly connected to the upper surface of the fixed rectangular plate (7). The output shaft of the second servo motor (9) is fixedly connected to a threaded rotating rod (10). The lifting connecting frame (11) is threadedly connected to the outer surface of the threaded rotating rod (10).

4. A silicon-based oxide layer polishing device for a power semiconductor chip according to claim 1, characterized in that: The blowing assembly includes a blower (12) fixedly connected to the upper surface of the lifting connecting frame (11). A connecting pipe (13) is fixedly connected to the air outlet of the blower (12). One end of the connecting pipe (13) away from the blower (12) is fixedly connected to a blowing nozzle (14).

5. A silicon-based oxide layer polishing device for a power semiconductor chip according to claim 1, characterized in that: The feeding assembly includes a feeding tray (16) fixedly connected to the bottom of the mounting vertical rod (15). A feeding groove (20) is formed on the lower surface of the feeding tray (16). Two symmetrically arranged U-shaped mounting seats (17) are fixedly connected to the outer surface of the feeding tray (16). A pushing cylinder (18) is fixedly connected to one side of the U-shaped mounting seat (17). The piston end of the pushing cylinder (18) is fixedly connected to a movable ejector rod (19). The movable ejector rod (19) extends into the feeding groove (20).

6. A silicon-based oxide layer polishing device for a power semiconductor chip according to claim 1, characterized in that: A receiving tray (6) is installed on the upper surface of the operating table (1). The rotating connecting shaft (2) penetrates through the receiving tray (6).

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